CN1310298C - 使用整合式度量的串级控制方法及装置 - Google Patents
使用整合式度量的串级控制方法及装置 Download PDFInfo
- Publication number
- CN1310298C CN1310298C CNB028190742A CN02819074A CN1310298C CN 1310298 C CN1310298 C CN 1310298C CN B028190742 A CNB028190742 A CN B028190742A CN 02819074 A CN02819074 A CN 02819074A CN 1310298 C CN1310298 C CN 1310298C
- Authority
- CN
- China
- Prior art keywords
- semiconductor wafer
- processing
- metric data
- data
- tandem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 136
- 239000004065 semiconductor Substances 0.000 claims abstract description 219
- 238000012545 processing Methods 0.000 claims abstract description 126
- 230000008569 process Effects 0.000 claims abstract description 105
- 238000005516 engineering process Methods 0.000 claims description 43
- 238000005259 measurement Methods 0.000 claims description 41
- 230000008878 coupling Effects 0.000 claims description 16
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 238000013500 data storage Methods 0.000 claims description 15
- 238000011112 process operation Methods 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 203
- 238000004519 manufacturing process Methods 0.000 description 43
- 238000006243 chemical reaction Methods 0.000 description 12
- 238000007405 data analysis Methods 0.000 description 10
- 238000003973 irrigation Methods 0.000 description 10
- 230000002262 irrigation Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000011217 control strategy Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012940 design transfer Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003012 network analysis Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/020,551 US6756243B2 (en) | 2001-10-30 | 2001-10-30 | Method and apparatus for cascade control using integrated metrology |
US10/020,551 | 2001-10-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1561541A CN1561541A (zh) | 2005-01-05 |
CN1310298C true CN1310298C (zh) | 2007-04-11 |
Family
ID=21799234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028190742A Expired - Lifetime CN1310298C (zh) | 2001-10-30 | 2002-08-09 | 使用整合式度量的串级控制方法及装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6756243B2 (zh) |
EP (1) | EP1451867A2 (zh) |
JP (1) | JP2005508090A (zh) |
CN (1) | CN1310298C (zh) |
TW (1) | TWI221627B (zh) |
WO (1) | WO2003038888A2 (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6708075B2 (en) * | 2001-11-16 | 2004-03-16 | Advanced Micro Devices | Method and apparatus for utilizing integrated metrology data as feed-forward data |
TWI266249B (en) * | 2002-05-16 | 2006-11-11 | Mosel Vitelic Inc | Statistical process control method and system thereof |
US7254453B2 (en) * | 2002-11-21 | 2007-08-07 | Advanced Micro Devices, Inc. | Secondary process controller for supplementing a primary process controller |
US6868301B1 (en) * | 2003-02-11 | 2005-03-15 | Kla-Tencor Corporation | Method and application of metrology and process diagnostic information for improved overlay control |
US6907369B1 (en) * | 2003-05-02 | 2005-06-14 | Advanced Micro Devices, Inc. | Method and apparatus for modifying design constraints based on observed performance |
JP2004335750A (ja) * | 2003-05-08 | 2004-11-25 | Tokyo Electron Ltd | 処理スケジュール作成方法 |
US7482178B2 (en) * | 2003-08-06 | 2009-01-27 | Applied Materials, Inc. | Chamber stability monitoring using an integrated metrology tool |
JP4880888B2 (ja) * | 2003-09-09 | 2012-02-22 | セイコーインスツル株式会社 | 半導体装置の製造方法 |
JP4880889B2 (ja) * | 2003-09-09 | 2012-02-22 | セイコーインスツル株式会社 | 半導体装置の製造方法 |
US20060079983A1 (en) * | 2004-10-13 | 2006-04-13 | Tokyo Electron Limited | R2R controller to automate the data collection during a DOE |
US20060136444A1 (en) * | 2004-12-17 | 2006-06-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for integrated information service |
US20080051930A1 (en) * | 2006-07-10 | 2008-02-28 | Oh Hilario L | Scheduling method for processing equipment |
WO2008008727A2 (en) * | 2006-07-10 | 2008-01-17 | Applied Materials, Inc. | Scheduling method for processing equipment |
US7522968B2 (en) * | 2006-07-10 | 2009-04-21 | Applied Materials, Inc. | Scheduling method for processing equipment |
US7525673B2 (en) * | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Optimizing selected variables of an optical metrology system |
US7526354B2 (en) * | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Managing and using metrology data for process and equipment control |
JP5213322B2 (ja) * | 2006-10-05 | 2013-06-19 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置並びにプログラムを記憶する記憶媒体 |
US7639351B2 (en) * | 2007-03-20 | 2009-12-29 | Tokyo Electron Limited | Automated process control using optical metrology with a photonic nanojet |
US7567353B2 (en) * | 2007-03-28 | 2009-07-28 | Tokyo Electron Limited | Automated process control using optical metrology and photoresist parameters |
US7372583B1 (en) * | 2007-04-12 | 2008-05-13 | Tokyo Electron Limited | Controlling a fabrication tool using support vector machine |
US9760020B2 (en) | 2012-11-21 | 2017-09-12 | Kla-Tencor Corporation | In-situ metrology |
SG11201903730XA (en) * | 2016-11-14 | 2019-05-30 | Kla Tencor Corp | Lithography systems with integrated metrology tools having enhanced functionalities |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5698989A (en) * | 1994-10-06 | 1997-12-16 | Applied Materilas, Inc. | Film sheet resistance measurement |
US5987398A (en) * | 1998-04-30 | 1999-11-16 | Sony Corporation | Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable |
WO1999061320A1 (en) * | 1998-05-22 | 1999-12-02 | Asm America, Inc. | Stackable cassette for use with wafer cassettes |
US6197604B1 (en) * | 1998-10-01 | 2001-03-06 | Advanced Micro Devices, Inc. | Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3377958A (en) * | 1965-06-16 | 1968-04-16 | Marx & Co Louis | Lane change for raceway toy |
JPH0639755Y2 (ja) * | 1989-10-25 | 1994-10-19 | 株式会社トミー | レーシングゲーム用軌道装置 |
JP3599631B2 (ja) * | 1993-03-09 | 2004-12-08 | 株式会社ルネサステクノロジ | 欠陥検査方法及び欠陥検査装置 |
JPH0729958A (ja) * | 1993-07-14 | 1995-01-31 | Hitachi Ltd | 半導体製造装置 |
US6408220B1 (en) * | 1999-06-01 | 2002-06-18 | Applied Materials, Inc. | Semiconductor processing techniques |
JP4524720B2 (ja) * | 1999-12-28 | 2010-08-18 | ルネサスエレクトロニクス株式会社 | プロセス制御装置 |
-
2001
- 2001-10-30 US US10/020,551 patent/US6756243B2/en not_active Expired - Lifetime
-
2002
- 2002-08-09 CN CNB028190742A patent/CN1310298C/zh not_active Expired - Lifetime
- 2002-08-09 JP JP2003541045A patent/JP2005508090A/ja active Pending
- 2002-08-09 EP EP02765970A patent/EP1451867A2/en not_active Withdrawn
- 2002-08-09 WO PCT/US2002/025402 patent/WO2003038888A2/en active Application Filing
- 2002-10-14 TW TW091123542A patent/TWI221627B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5698989A (en) * | 1994-10-06 | 1997-12-16 | Applied Materilas, Inc. | Film sheet resistance measurement |
US5987398A (en) * | 1998-04-30 | 1999-11-16 | Sony Corporation | Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable |
WO1999061320A1 (en) * | 1998-05-22 | 1999-12-02 | Asm America, Inc. | Stackable cassette for use with wafer cassettes |
US6197604B1 (en) * | 1998-10-01 | 2001-03-06 | Advanced Micro Devices, Inc. | Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication |
Also Published As
Publication number | Publication date |
---|---|
CN1561541A (zh) | 2005-01-05 |
JP2005508090A (ja) | 2005-03-24 |
WO2003038888A2 (en) | 2003-05-08 |
EP1451867A2 (en) | 2004-09-01 |
TWI221627B (en) | 2004-10-01 |
US20030082837A1 (en) | 2003-05-01 |
WO2003038888A3 (en) | 2003-10-30 |
US6756243B2 (en) | 2004-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1310298C (zh) | 使用整合式度量的串级控制方法及装置 | |
CN100352030C (zh) | 使用集成度量数据作为前馈数据的方法与装置 | |
US6360133B1 (en) | Method and apparatus for automatic routing for reentrant process | |
US6810296B2 (en) | Correlating an inline parameter to a device operation parameter | |
CN1672253A (zh) | 过程控制系统用的动态目标设定方法及装置 | |
CN100578747C (zh) | 用于模型预测的动态适应性取样率 | |
CN101048711A (zh) | 根据加权主成分分析的错误侦测系统与方法 | |
US6304999B1 (en) | Method and apparatus for embedded process control framework in tool systems | |
US6622061B1 (en) | Method and apparatus for run-to-run controlling of overlay registration | |
US6954883B1 (en) | Method and apparatus for performing fault detection using data from a database | |
CN1816905A (zh) | 用于刻蚀工艺的前馈和反馈晶片到晶片控制方法 | |
CN101416132A (zh) | 用于制造数据索引的方法及装置 | |
US6645780B1 (en) | Method and apparatus for combining integrated and offline metrology for process control | |
CN1529835A (zh) | 使用基线控制脚本控制工具的方法和装置 | |
CN1714322A (zh) | 用以补充主要过程控制器的辅助过程控制器 | |
CN1412622A (zh) | 设备管理系统和方法、半导体曝光设备及其管理方法、半导体器件的制造方法 | |
CN1892522A (zh) | 收集及处理从制程机台撷取的电子数据的系统、制造系统 | |
US6571371B1 (en) | Method and apparatus for using latency time as a run-to-run control parameter | |
CN1837997A (zh) | 蚀刻作业管理系统及方法及使用此方法所制作的电子装置 | |
US6788988B1 (en) | Method and apparatus using integrated metrology data for pre-process and post-process control | |
US6834211B1 (en) | Adjusting a trace data rate based upon a tool state | |
US6823231B1 (en) | Tuning of a process control based upon layer dependencies | |
US6912436B1 (en) | Prioritizing an application of correction in a multi-input control system | |
CN1685494A (zh) | 互连阶段的工艺控制 | |
US7797073B1 (en) | Controlling processing of semiconductor wafers based upon end of line parameters |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ADVANCED MICRO DEVICES INC Free format text: FORMER OWNER: ADVANCED MICRO DEVICES INC. Effective date: 20100709 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: CALIFORNIA, USA TO: GRAND CAYMAN ISLAND RITISH CAYMAN ISLANDS |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100709 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES Inc. Address before: California, USA Patentee before: ADVANCED MICRO DEVICES, Inc. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210310 Address after: California, USA Patentee after: Lattice chip (USA) integrated circuit technology Co.,Ltd. Address before: Greater Cayman Islands, British Cayman Islands Patentee before: GLOBALFOUNDRIES Inc. |
|
CX01 | Expiry of patent term |
Granted publication date: 20070411 |
|
CX01 | Expiry of patent term |