JP2005508090A - 組み込み計測法を使用したカスケード制御の方法および装置 - Google Patents

組み込み計測法を使用したカスケード制御の方法および装置 Download PDF

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Publication number
JP2005508090A
JP2005508090A JP2003541045A JP2003541045A JP2005508090A JP 2005508090 A JP2005508090 A JP 2005508090A JP 2003541045 A JP2003541045 A JP 2003541045A JP 2003541045 A JP2003541045 A JP 2003541045A JP 2005508090 A JP2005508090 A JP 2005508090A
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JP
Japan
Prior art keywords
semiconductor wafer
processing
measurement data
obtaining
cascade
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Pending
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JP2003541045A
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English (en)
Japanese (ja)
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JP2005508090A5 (enExample
Inventor
ジェイ. パサディン アレクサンダー
エイ. ボード クリストファー
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Advanced Micro Devices Inc
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Advanced Micro Devices Inc
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Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2005508090A publication Critical patent/JP2005508090A/ja
Publication of JP2005508090A5 publication Critical patent/JP2005508090A5/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54453Marks applied to semiconductor devices or parts for use prior to dicing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Drying Of Semiconductors (AREA)
JP2003541045A 2001-10-30 2002-08-09 組み込み計測法を使用したカスケード制御の方法および装置 Pending JP2005508090A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/020,551 US6756243B2 (en) 2001-10-30 2001-10-30 Method and apparatus for cascade control using integrated metrology
PCT/US2002/025402 WO2003038888A2 (en) 2001-10-30 2002-08-09 Method and apparatus for cascade control using integrated metrology

Publications (2)

Publication Number Publication Date
JP2005508090A true JP2005508090A (ja) 2005-03-24
JP2005508090A5 JP2005508090A5 (enExample) 2006-01-05

Family

ID=21799234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003541045A Pending JP2005508090A (ja) 2001-10-30 2002-08-09 組み込み計測法を使用したカスケード制御の方法および装置

Country Status (6)

Country Link
US (1) US6756243B2 (enExample)
EP (1) EP1451867A2 (enExample)
JP (1) JP2005508090A (enExample)
CN (1) CN1310298C (enExample)
TW (1) TWI221627B (enExample)
WO (1) WO2003038888A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091816A (ja) * 2006-10-05 2008-04-17 Tokyo Electron Ltd 基板処理方法及びプログラムを記憶する記憶媒体
JP2019534482A (ja) * 2016-11-14 2019-11-28 ケーエルエー コーポレイション 一体型メトロロジツールを有する機能性が強化されたリソグラフィシステム

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6708075B2 (en) * 2001-11-16 2004-03-16 Advanced Micro Devices Method and apparatus for utilizing integrated metrology data as feed-forward data
TWI266249B (en) * 2002-05-16 2006-11-11 Mosel Vitelic Inc Statistical process control method and system thereof
US7254453B2 (en) * 2002-11-21 2007-08-07 Advanced Micro Devices, Inc. Secondary process controller for supplementing a primary process controller
US6868301B1 (en) * 2003-02-11 2005-03-15 Kla-Tencor Corporation Method and application of metrology and process diagnostic information for improved overlay control
US6907369B1 (en) * 2003-05-02 2005-06-14 Advanced Micro Devices, Inc. Method and apparatus for modifying design constraints based on observed performance
JP2004335750A (ja) * 2003-05-08 2004-11-25 Tokyo Electron Ltd 処理スケジュール作成方法
US7482178B2 (en) * 2003-08-06 2009-01-27 Applied Materials, Inc. Chamber stability monitoring using an integrated metrology tool
JP4880888B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
JP4880889B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
US20060079983A1 (en) * 2004-10-13 2006-04-13 Tokyo Electron Limited R2R controller to automate the data collection during a DOE
US20060136444A1 (en) * 2004-12-17 2006-06-22 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for integrated information service
US7526354B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Managing and using metrology data for process and equipment control
US20080051930A1 (en) * 2006-07-10 2008-02-28 Oh Hilario L Scheduling method for processing equipment
US7525673B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Optimizing selected variables of an optical metrology system
WO2008008727A2 (en) * 2006-07-10 2008-01-17 Applied Materials, Inc. Scheduling method for processing equipment
US7522968B2 (en) * 2006-07-10 2009-04-21 Applied Materials, Inc. Scheduling method for processing equipment
US7639351B2 (en) * 2007-03-20 2009-12-29 Tokyo Electron Limited Automated process control using optical metrology with a photonic nanojet
US7567353B2 (en) * 2007-03-28 2009-07-28 Tokyo Electron Limited Automated process control using optical metrology and photoresist parameters
US7372583B1 (en) 2007-04-12 2008-05-13 Tokyo Electron Limited Controlling a fabrication tool using support vector machine
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology
EP4155822A1 (en) * 2021-09-28 2023-03-29 ASML Netherlands B.V. Metrology method and system and lithographic system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729958A (ja) * 1993-07-14 1995-01-31 Hitachi Ltd 半導体製造装置
JP2000315712A (ja) * 1993-03-09 2000-11-14 Hitachi Ltd 半導体デバイスの生産方法
JP2001189247A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp プロセス制御装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377958A (en) * 1965-06-16 1968-04-16 Marx & Co Louis Lane change for raceway toy
JPH0639755Y2 (ja) * 1989-10-25 1994-10-19 株式会社トミー レーシングゲーム用軌道装置
EP0706209A3 (en) 1994-10-06 1996-12-27 Applied Materials Inc Thin film resistance measurement
US5987398A (en) 1998-04-30 1999-11-16 Sony Corporation Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable
US6162006A (en) 1998-05-22 2000-12-19 Asm America, Inc. Stackable cassette for use with wafer cassettes
US6197604B1 (en) 1998-10-01 2001-03-06 Advanced Micro Devices, Inc. Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315712A (ja) * 1993-03-09 2000-11-14 Hitachi Ltd 半導体デバイスの生産方法
JPH0729958A (ja) * 1993-07-14 1995-01-31 Hitachi Ltd 半導体製造装置
JP2001189247A (ja) * 1999-12-28 2001-07-10 Mitsubishi Electric Corp プロセス制御装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091816A (ja) * 2006-10-05 2008-04-17 Tokyo Electron Ltd 基板処理方法及びプログラムを記憶する記憶媒体
JP2019534482A (ja) * 2016-11-14 2019-11-28 ケーエルエー コーポレイション 一体型メトロロジツールを有する機能性が強化されたリソグラフィシステム

Also Published As

Publication number Publication date
WO2003038888A2 (en) 2003-05-08
US6756243B2 (en) 2004-06-29
US20030082837A1 (en) 2003-05-01
CN1310298C (zh) 2007-04-11
EP1451867A2 (en) 2004-09-01
CN1561541A (zh) 2005-01-05
TWI221627B (en) 2004-10-01
WO2003038888A3 (en) 2003-10-30

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