JP2005508090A - 組み込み計測法を使用したカスケード制御の方法および装置 - Google Patents
組み込み計測法を使用したカスケード制御の方法および装置 Download PDFInfo
- Publication number
- JP2005508090A JP2005508090A JP2003541045A JP2003541045A JP2005508090A JP 2005508090 A JP2005508090 A JP 2005508090A JP 2003541045 A JP2003541045 A JP 2003541045A JP 2003541045 A JP2003541045 A JP 2003541045A JP 2005508090 A JP2005508090 A JP 2005508090A
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- JP
- Japan
- Prior art keywords
- semiconductor wafer
- processing
- measurement data
- obtaining
- cascade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 189
- 238000000691 measurement method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 claims abstract description 227
- 238000012545 processing Methods 0.000 claims abstract description 164
- 230000008569 process Effects 0.000 claims abstract description 111
- 238000005259 measurement Methods 0.000 claims description 167
- 238000004886 process control Methods 0.000 claims description 8
- 230000004044 response Effects 0.000 claims description 8
- 235000012431 wafers Nutrition 0.000 description 160
- 238000004519 manufacturing process Methods 0.000 description 68
- 238000007405 data analysis Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000013515 script Methods 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000033772 system development Effects 0.000 description 1
- 230000026676 system process Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/020,551 US6756243B2 (en) | 2001-10-30 | 2001-10-30 | Method and apparatus for cascade control using integrated metrology |
| PCT/US2002/025402 WO2003038888A2 (en) | 2001-10-30 | 2002-08-09 | Method and apparatus for cascade control using integrated metrology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005508090A true JP2005508090A (ja) | 2005-03-24 |
| JP2005508090A5 JP2005508090A5 (enExample) | 2006-01-05 |
Family
ID=21799234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003541045A Pending JP2005508090A (ja) | 2001-10-30 | 2002-08-09 | 組み込み計測法を使用したカスケード制御の方法および装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6756243B2 (enExample) |
| EP (1) | EP1451867A2 (enExample) |
| JP (1) | JP2005508090A (enExample) |
| CN (1) | CN1310298C (enExample) |
| TW (1) | TWI221627B (enExample) |
| WO (1) | WO2003038888A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091816A (ja) * | 2006-10-05 | 2008-04-17 | Tokyo Electron Ltd | 基板処理方法及びプログラムを記憶する記憶媒体 |
| JP2019534482A (ja) * | 2016-11-14 | 2019-11-28 | ケーエルエー コーポレイション | 一体型メトロロジツールを有する機能性が強化されたリソグラフィシステム |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6708075B2 (en) * | 2001-11-16 | 2004-03-16 | Advanced Micro Devices | Method and apparatus for utilizing integrated metrology data as feed-forward data |
| TWI266249B (en) * | 2002-05-16 | 2006-11-11 | Mosel Vitelic Inc | Statistical process control method and system thereof |
| US7254453B2 (en) * | 2002-11-21 | 2007-08-07 | Advanced Micro Devices, Inc. | Secondary process controller for supplementing a primary process controller |
| US6868301B1 (en) * | 2003-02-11 | 2005-03-15 | Kla-Tencor Corporation | Method and application of metrology and process diagnostic information for improved overlay control |
| US6907369B1 (en) * | 2003-05-02 | 2005-06-14 | Advanced Micro Devices, Inc. | Method and apparatus for modifying design constraints based on observed performance |
| JP2004335750A (ja) * | 2003-05-08 | 2004-11-25 | Tokyo Electron Ltd | 処理スケジュール作成方法 |
| US7482178B2 (en) * | 2003-08-06 | 2009-01-27 | Applied Materials, Inc. | Chamber stability monitoring using an integrated metrology tool |
| JP4880888B2 (ja) * | 2003-09-09 | 2012-02-22 | セイコーインスツル株式会社 | 半導体装置の製造方法 |
| JP4880889B2 (ja) * | 2003-09-09 | 2012-02-22 | セイコーインスツル株式会社 | 半導体装置の製造方法 |
| US20060079983A1 (en) * | 2004-10-13 | 2006-04-13 | Tokyo Electron Limited | R2R controller to automate the data collection during a DOE |
| US20060136444A1 (en) * | 2004-12-17 | 2006-06-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for integrated information service |
| US7526354B2 (en) * | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Managing and using metrology data for process and equipment control |
| US20080051930A1 (en) * | 2006-07-10 | 2008-02-28 | Oh Hilario L | Scheduling method for processing equipment |
| US7525673B2 (en) * | 2006-07-10 | 2009-04-28 | Tokyo Electron Limited | Optimizing selected variables of an optical metrology system |
| WO2008008727A2 (en) * | 2006-07-10 | 2008-01-17 | Applied Materials, Inc. | Scheduling method for processing equipment |
| US7522968B2 (en) * | 2006-07-10 | 2009-04-21 | Applied Materials, Inc. | Scheduling method for processing equipment |
| US7639351B2 (en) * | 2007-03-20 | 2009-12-29 | Tokyo Electron Limited | Automated process control using optical metrology with a photonic nanojet |
| US7567353B2 (en) * | 2007-03-28 | 2009-07-28 | Tokyo Electron Limited | Automated process control using optical metrology and photoresist parameters |
| US7372583B1 (en) | 2007-04-12 | 2008-05-13 | Tokyo Electron Limited | Controlling a fabrication tool using support vector machine |
| US9760020B2 (en) | 2012-11-21 | 2017-09-12 | Kla-Tencor Corporation | In-situ metrology |
| EP4155822A1 (en) * | 2021-09-28 | 2023-03-29 | ASML Netherlands B.V. | Metrology method and system and lithographic system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0729958A (ja) * | 1993-07-14 | 1995-01-31 | Hitachi Ltd | 半導体製造装置 |
| JP2000315712A (ja) * | 1993-03-09 | 2000-11-14 | Hitachi Ltd | 半導体デバイスの生産方法 |
| JP2001189247A (ja) * | 1999-12-28 | 2001-07-10 | Mitsubishi Electric Corp | プロセス制御装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3377958A (en) * | 1965-06-16 | 1968-04-16 | Marx & Co Louis | Lane change for raceway toy |
| JPH0639755Y2 (ja) * | 1989-10-25 | 1994-10-19 | 株式会社トミー | レーシングゲーム用軌道装置 |
| EP0706209A3 (en) | 1994-10-06 | 1996-12-27 | Applied Materials Inc | Thin film resistance measurement |
| US5987398A (en) | 1998-04-30 | 1999-11-16 | Sony Corporation | Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable |
| US6162006A (en) | 1998-05-22 | 2000-12-19 | Asm America, Inc. | Stackable cassette for use with wafer cassettes |
| US6197604B1 (en) | 1998-10-01 | 2001-03-06 | Advanced Micro Devices, Inc. | Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication |
| US6408220B1 (en) * | 1999-06-01 | 2002-06-18 | Applied Materials, Inc. | Semiconductor processing techniques |
-
2001
- 2001-10-30 US US10/020,551 patent/US6756243B2/en not_active Expired - Lifetime
-
2002
- 2002-08-09 EP EP02765970A patent/EP1451867A2/en not_active Withdrawn
- 2002-08-09 JP JP2003541045A patent/JP2005508090A/ja active Pending
- 2002-08-09 CN CNB028190742A patent/CN1310298C/zh not_active Expired - Lifetime
- 2002-08-09 WO PCT/US2002/025402 patent/WO2003038888A2/en not_active Ceased
- 2002-10-14 TW TW091123542A patent/TWI221627B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315712A (ja) * | 1993-03-09 | 2000-11-14 | Hitachi Ltd | 半導体デバイスの生産方法 |
| JPH0729958A (ja) * | 1993-07-14 | 1995-01-31 | Hitachi Ltd | 半導体製造装置 |
| JP2001189247A (ja) * | 1999-12-28 | 2001-07-10 | Mitsubishi Electric Corp | プロセス制御装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008091816A (ja) * | 2006-10-05 | 2008-04-17 | Tokyo Electron Ltd | 基板処理方法及びプログラムを記憶する記憶媒体 |
| JP2019534482A (ja) * | 2016-11-14 | 2019-11-28 | ケーエルエー コーポレイション | 一体型メトロロジツールを有する機能性が強化されたリソグラフィシステム |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003038888A2 (en) | 2003-05-08 |
| US6756243B2 (en) | 2004-06-29 |
| US20030082837A1 (en) | 2003-05-01 |
| CN1310298C (zh) | 2007-04-11 |
| EP1451867A2 (en) | 2004-09-01 |
| CN1561541A (zh) | 2005-01-05 |
| TWI221627B (en) | 2004-10-01 |
| WO2003038888A3 (en) | 2003-10-30 |
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