CN1310298C - 使用整合式度量的串级控制方法及装置 - Google Patents

使用整合式度量的串级控制方法及装置 Download PDF

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Publication number
CN1310298C
CN1310298C CNB028190742A CN02819074A CN1310298C CN 1310298 C CN1310298 C CN 1310298C CN B028190742 A CNB028190742 A CN B028190742A CN 02819074 A CN02819074 A CN 02819074A CN 1310298 C CN1310298 C CN 1310298C
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China
Prior art keywords
semiconductor wafer
processing
metric data
data
tandem
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Expired - Lifetime
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CNB028190742A
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English (en)
Chinese (zh)
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CN1561541A (zh
Inventor
A·J·帕萨丁
C·A·博德
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GlobalFoundries US Inc
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Advanced Micro Devices Inc
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Publication of CN1561541A publication Critical patent/CN1561541A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
  • Drying Of Semiconductors (AREA)
CNB028190742A 2001-10-30 2002-08-09 使用整合式度量的串级控制方法及装置 Expired - Lifetime CN1310298C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/020,551 2001-10-30
US10/020,551 US6756243B2 (en) 2001-10-30 2001-10-30 Method and apparatus for cascade control using integrated metrology

Publications (2)

Publication Number Publication Date
CN1561541A CN1561541A (zh) 2005-01-05
CN1310298C true CN1310298C (zh) 2007-04-11

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Family Applications (1)

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CNB028190742A Expired - Lifetime CN1310298C (zh) 2001-10-30 2002-08-09 使用整合式度量的串级控制方法及装置

Country Status (6)

Country Link
US (1) US6756243B2 (enExample)
EP (1) EP1451867A2 (enExample)
JP (1) JP2005508090A (enExample)
CN (1) CN1310298C (enExample)
TW (1) TWI221627B (enExample)
WO (1) WO2003038888A2 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6708075B2 (en) * 2001-11-16 2004-03-16 Advanced Micro Devices Method and apparatus for utilizing integrated metrology data as feed-forward data
TWI266249B (en) * 2002-05-16 2006-11-11 Mosel Vitelic Inc Statistical process control method and system thereof
US7254453B2 (en) * 2002-11-21 2007-08-07 Advanced Micro Devices, Inc. Secondary process controller for supplementing a primary process controller
US6868301B1 (en) * 2003-02-11 2005-03-15 Kla-Tencor Corporation Method and application of metrology and process diagnostic information for improved overlay control
US6907369B1 (en) * 2003-05-02 2005-06-14 Advanced Micro Devices, Inc. Method and apparatus for modifying design constraints based on observed performance
JP2004335750A (ja) * 2003-05-08 2004-11-25 Tokyo Electron Ltd 処理スケジュール作成方法
US7482178B2 (en) * 2003-08-06 2009-01-27 Applied Materials, Inc. Chamber stability monitoring using an integrated metrology tool
JP4880888B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
JP4880889B2 (ja) * 2003-09-09 2012-02-22 セイコーインスツル株式会社 半導体装置の製造方法
US20060079983A1 (en) * 2004-10-13 2006-04-13 Tokyo Electron Limited R2R controller to automate the data collection during a DOE
US20060136444A1 (en) * 2004-12-17 2006-06-22 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for integrated information service
US7526354B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Managing and using metrology data for process and equipment control
US20080051930A1 (en) * 2006-07-10 2008-02-28 Oh Hilario L Scheduling method for processing equipment
US7525673B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Optimizing selected variables of an optical metrology system
WO2008008727A2 (en) * 2006-07-10 2008-01-17 Applied Materials, Inc. Scheduling method for processing equipment
US7522968B2 (en) * 2006-07-10 2009-04-21 Applied Materials, Inc. Scheduling method for processing equipment
JP5213322B2 (ja) * 2006-10-05 2013-06-19 東京エレクトロン株式会社 基板処理方法及び基板処理装置並びにプログラムを記憶する記憶媒体
US7639351B2 (en) * 2007-03-20 2009-12-29 Tokyo Electron Limited Automated process control using optical metrology with a photonic nanojet
US7567353B2 (en) * 2007-03-28 2009-07-28 Tokyo Electron Limited Automated process control using optical metrology and photoresist parameters
US7372583B1 (en) 2007-04-12 2008-05-13 Tokyo Electron Limited Controlling a fabrication tool using support vector machine
US9760020B2 (en) 2012-11-21 2017-09-12 Kla-Tencor Corporation In-situ metrology
CN109923480B (zh) * 2016-11-14 2024-05-07 科磊股份有限公司 具有具备增强功能性的集成型计量工具的光刻系统
EP4155822A1 (en) * 2021-09-28 2023-03-29 ASML Netherlands B.V. Metrology method and system and lithographic system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698989A (en) * 1994-10-06 1997-12-16 Applied Materilas, Inc. Film sheet resistance measurement
US5987398A (en) * 1998-04-30 1999-11-16 Sony Corporation Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable
WO1999061320A1 (en) * 1998-05-22 1999-12-02 Asm America, Inc. Stackable cassette for use with wafer cassettes
US6197604B1 (en) * 1998-10-01 2001-03-06 Advanced Micro Devices, Inc. Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3377958A (en) * 1965-06-16 1968-04-16 Marx & Co Louis Lane change for raceway toy
JPH0639755Y2 (ja) * 1989-10-25 1994-10-19 株式会社トミー レーシングゲーム用軌道装置
JP3599631B2 (ja) * 1993-03-09 2004-12-08 株式会社ルネサステクノロジ 欠陥検査方法及び欠陥検査装置
JPH0729958A (ja) * 1993-07-14 1995-01-31 Hitachi Ltd 半導体製造装置
US6408220B1 (en) * 1999-06-01 2002-06-18 Applied Materials, Inc. Semiconductor processing techniques
JP4524720B2 (ja) * 1999-12-28 2010-08-18 ルネサスエレクトロニクス株式会社 プロセス制御装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5698989A (en) * 1994-10-06 1997-12-16 Applied Materilas, Inc. Film sheet resistance measurement
US5987398A (en) * 1998-04-30 1999-11-16 Sony Corporation Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable
WO1999061320A1 (en) * 1998-05-22 1999-12-02 Asm America, Inc. Stackable cassette for use with wafer cassettes
US6197604B1 (en) * 1998-10-01 2001-03-06 Advanced Micro Devices, Inc. Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication

Also Published As

Publication number Publication date
WO2003038888A2 (en) 2003-05-08
US6756243B2 (en) 2004-06-29
US20030082837A1 (en) 2003-05-01
EP1451867A2 (en) 2004-09-01
JP2005508090A (ja) 2005-03-24
CN1561541A (zh) 2005-01-05
TWI221627B (en) 2004-10-01
WO2003038888A3 (en) 2003-10-30

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Effective date: 20100709

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Patentee after: GLOBALFOUNDRIES Inc.

Address before: California, USA

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Effective date of registration: 20210310

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Patentee after: Lattice chip (USA) integrated circuit technology Co.,Ltd.

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Granted publication date: 20070411

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