JP2020141114A5 - - Google Patents
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- Publication number
- JP2020141114A5 JP2020141114A5 JP2019038082A JP2019038082A JP2020141114A5 JP 2020141114 A5 JP2020141114 A5 JP 2020141114A5 JP 2019038082 A JP2019038082 A JP 2019038082A JP 2019038082 A JP2019038082 A JP 2019038082A JP 2020141114 A5 JP2020141114 A5 JP 2020141114A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- push
- unit
- dicing tape
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (1)
（ｂ）前記突上げユニットで前記ダイを突き上げて前記コレットで前記ダイをピックアップする工程と、
を備え、
前記（ｂ）工程は、前記突上げユニットの特性を再現させる剥離モデルに対して、前記ダイの前記ダイシングテープからの剥離量と前記ダイ全体の曲げ応力の目標値に前記剥離モデルの出力を追従するようにフィードバック制御し、前記剥離モデルへの制御入力である突上げ量を前記突上げユニットの前記ブロックの突上げ量として前記ダイを突き上げる半導体装置の製造方法。
(A) The dicing tape is held in a semiconductor manufacturing apparatus having a plurality of blocks in contact with the dicing tape and including a push-up unit for pushing up the die from under the dicing tape and a collet for adsorbing the die. comprising the steps of loading the wafer ring,
A step of picking up the die with the collet (b) pushing up the die in the tossing unit,
Equipped with
In the step (b), the output of the peeling model follows the target values of the peeling amount of the die from the dicing tape and the bending stress of the entire die with respect to the peeling model that reproduces the characteristics of the push-up unit. A method for manufacturing a semiconductor device in which the die is pushed up by feedback control so as to perform, and the push-up amount which is a control input to the peeling model is used as the push-up amount of the block of the push-up unit.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019038082A JP7237655B2 (en) | 2019-03-01 | 2019-03-01 | Semiconductor manufacturing equipment and semiconductor device manufacturing method |
| TW109101654A TWI743655B (en) | 2019-03-01 | 2020-01-17 | Semiconductor manufacturing device and semiconductor device manufacturing method |
| CN202010118139.1A CN111640702B (en) | 2019-03-01 | 2020-02-25 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
| KR1020200023361A KR102316869B1 (en) | 2019-03-01 | 2020-02-26 | Semiconductor manufacturing device and manufacturing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019038082A JP7237655B2 (en) | 2019-03-01 | 2019-03-01 | Semiconductor manufacturing equipment and semiconductor device manufacturing method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020141114A JP2020141114A (en) | 2020-09-03 |
| JP2020141114A5 true JP2020141114A5 (en) | 2022-01-11 |
| JP7237655B2 JP7237655B2 (en) | 2023-03-13 |
Family
ID=72280762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019038082A Active JP7237655B2 (en) | 2019-03-01 | 2019-03-01 | Semiconductor manufacturing equipment and semiconductor device manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7237655B2 (en) |
| KR (1) | KR102316869B1 (en) |
| CN (1) | CN111640702B (en) |
| TW (1) | TWI743655B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112992699B (en) * | 2021-02-01 | 2024-03-22 | 上海易卜半导体有限公司 | Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assembly |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10189690A (en) * | 1996-12-26 | 1998-07-21 | Hitachi Ltd | Pick-up device and method of semiconductor chip |
| KR100278137B1 (en) | 1997-09-04 | 2001-01-15 | 가나이 쓰도무 | Method of mounting semiconductor device and system thereof, method of manufacturing semiconductor device isolator and IC card |
| JP2000323437A (en) * | 1999-05-12 | 2000-11-24 | Sony Corp | Semiconductor chip separating device |
| JP2000353710A (en) * | 1999-06-14 | 2000-12-19 | Toshiba Corp | Manufacture of pellet pickup device and semiconductor device |
| JP4574251B2 (en) | 2003-09-17 | 2010-11-04 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| US20050274457A1 (en) * | 2004-05-28 | 2005-12-15 | Asm Assembly Automation Ltd. | Peeling device for chip detachment |
| TWI463580B (en) * | 2007-06-19 | 2014-12-01 | Renesas Electronics Corp | Manufacturing method of semiconductor integrated circuit device |
| JP5583475B2 (en) * | 2010-05-19 | 2014-09-03 | キヤノンマシナリー株式会社 | Pickup device |
| JP2012059829A (en) * | 2010-09-07 | 2012-03-22 | Elpida Memory Inc | Peeling device for semiconductor chip, die-bonding apparatus, peeling method for semiconductor chip, and method of manufacturing semiconductor device |
| JP2013214683A (en) | 2012-04-04 | 2013-10-17 | Mitsubishi Electric Corp | Semiconductor chip pickup device |
| JP2014109511A (en) | 2012-12-03 | 2014-06-12 | Canon Machinery Inc | Positioning method, positioning device, and die bonder |
| JP6349496B2 (en) * | 2014-02-24 | 2018-07-04 | 株式会社新川 | Semiconductor die pickup apparatus and pickup method |
| JP2017034117A (en) * | 2015-08-03 | 2017-02-09 | 日立化成株式会社 | Dicing/die-bonding integrated tape |
| WO2017188203A1 (en) * | 2016-04-28 | 2017-11-02 | リンテック株式会社 | Method for producing semiconductor chip equipped with protective film, and method for producing semiconductor device |
| JP6797569B2 (en) * | 2016-06-13 | 2020-12-09 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and manufacturing method of semiconductor equipment |
| WO2018061103A1 (en) * | 2016-09-28 | 2018-04-05 | 富士機械製造株式会社 | Wafer feeding apparatus and component mounting apparatus |
| TWI685046B (en) * | 2017-03-24 | 2020-02-11 | 日商新川股份有限公司 | Picking device and picking method |
-
2019
- 2019-03-01 JP JP2019038082A patent/JP7237655B2/en active Active
-
2020
- 2020-01-17 TW TW109101654A patent/TWI743655B/en active
- 2020-02-25 CN CN202010118139.1A patent/CN111640702B/en active Active
- 2020-02-26 KR KR1020200023361A patent/KR102316869B1/en active IP Right Grant
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