JP2020136527A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP2020136527A JP2020136527A JP2019029393A JP2019029393A JP2020136527A JP 2020136527 A JP2020136527 A JP 2020136527A JP 2019029393 A JP2019029393 A JP 2019029393A JP 2019029393 A JP2019029393 A JP 2019029393A JP 2020136527 A JP2020136527 A JP 2020136527A
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Abstract
Description
<半導体装置の平面視における全体構造>
まず半導体装置の平面視における全体構造について図1を用いて説明する。
次に、本実施の形態における半導体装置に含まれる絶縁ゲート型電界効果トランジスタとしてpチャネルLDMOS(pLDMOS)トランジスタを例に挙げて、その構成について図2〜図6を用いて説明する。なお以下において平面視とは、半導体基板SUBの第1面FSに対して直交する方向から見た視点を意味する。
次に、n型拡張領域NOLおよびp型パンチスルー防止層ISOの深さ方向(第1面FSから第2面SSに向かう方向)の不純物濃度分布について図4および図5を用いて説明する。またn型拡張領域NOLおよびp-エピタキシャル領域PEPの横方向(第1面FSに沿う方向)の不純物濃度分布について図6を用いて説明する。
次に、本実施の形態の半導体装置の製造方法について図7〜図15を用いて説明する。図7〜図15は、図3の断面に対応する断面を示している。
図11に示されるように、半導体基板SUBの第1面FSにn型不純物が選択的にイオン注入される。これにより半導体基板SUBの第1面FSに、n型ボディ領域NWLが形成される。n型ボディ領域NWLは、n型拡張領域NOLの第1面FS側に位置し、n型拡張領域NOLと接するように形成される。
次に、上記pLDMOSトランジスタLPTを有するBiC−DMOSの構成について図16を用いて説明する。
次に、本実施の形態の作用効果について、本発明者が行った検討とともに説明する。
次に、実施の形態2における半導体装置の構成について図21および図22を用いて説明する。
Claims (10)
- 絶縁ゲート型電界効果トランジスタを有する半導体装置であって、
互いに対向する第1面および第2面を有する半導体基板と、
前記絶縁ゲート型電界効果トランジスタの形成領域内の前記半導体基板に配置され、かつフローティング電位を有する第1導電型の埋込領域と、
前記埋込領域の前記第1面側に配置された第2導電型の分離領域と、
前記分離領域の前記第1面側に配置された第2導電型のドリフト領域と、
前記分離領域の前記第1面側に配置され、前記分離領域によって前記埋込領域と分離され、かつ前記ドリフト領域と接する第1導電型のボディ拡張領域と、
前記第1面に位置し、かつ前記第1面よりも前記第2面の近くに位置する底面を有する素子分離絶縁膜と、
前記第1面に配置され、かつ前記ボディ拡張領域とpn接合を構成する第2導電型のソース領域と、
前記ソース領域との間で前記素子分離絶縁膜を挟むように前記第1面に配置された第2導電型のドレイン領域とを備え、
前記ボディ拡張領域の前記ドレイン領域側の端部において、前記第2面の最も近くに位置する前記ボディ拡張領域の第1部分は、前記第1面に位置する前記ボディ拡張領域の第2部分よりも前記ドレイン領域の近くに位置し、かつ前記素子分離絶縁膜の前記底面よりも前記第2面の近くに位置している、半導体装置。 - 前記ボディ拡張領域は、
前記ソース領域とpn接合を構成するボディ領域と、
前記ボディ領域から前記ドレイン領域側に突き出し、かつ前記ドリフト領域の前記第2面側の部分に接する拡張領域とを含む、請求項1に記載の半導体装置。 - 前記拡張領域は、前記ボディ領域から前記素子分離絶縁膜の前記第2面側まで延在している、請求項2に記載の半導体装置。
- 前記ソース領域と前記ドレイン領域とに挟まれる前記半導体基板の領域上に配置されたゲート電極をさらに備え、
前記拡張領域の前記ドレイン領域側の第1端部は、前記ゲート電極における前記ドレイン領域側の第2端部よりも前記ソース領域の近くに位置している、請求項3に記載の半導体装置。 - 前記拡張領域は、前記ドレイン領域から前記ソース領域に向かって延びる複数の拡張延在部を有し、
前記複数の拡張延在部の各々は、平面視において前記ドレイン領域から前記ソース領域に向かう方向に交差する方向に沿って互いに分離して並んでいる、請求項2に記載の半導体装置。 - 前記分離領域は、
前記埋込領域とpn接合を構成するエピタキシャル領域と、
前記エピタキシャル領域よりも高い第2導電型の不純物濃度を有し、かつ前記埋込領域と前記ボディ拡張領域との間に配置された高濃度領域とを含む、請求項1に記載の半導体装置。 - 前記高濃度領域は、前記ボディ拡張領域の前記第2面側に配置されている、請求項6に記載の半導体装置。
- 前記高濃度領域は、平面視において前記ドレイン領域から前記ソース領域に向かう方向に交差する方向に沿って前記ドレイン領域よりも長く延在している、請求項6に記載の半導体装置。
- 前記高濃度領域は、前記ドレイン領域から前記ソース領域に向かって延びる複数の高濃度延在部を有し、
前記複数の高濃度延在部の各々は、平面視において前記ドレイン領域から前記ソース領域に向かう方向に交差する方向に沿って互いに分離して並んでいる、請求項6に記載の半導体装置。 - 絶縁ゲート型電界効果トランジスタを有する半導体装置の製造方法であって、
互いに対向する第1面および第2面を有し、かつ前記絶縁ゲート型電界効果トランジスタの形成領域内にフローティング電位を有する第1導電型の埋込領域を有する半導体基板を準備する工程と、
前記埋込領域の前記第1面側に第2導電型の分離領域を形成する工程と、
前記分離領域の前記第1面側に第2導電型のドリフト領域を形成する工程と、
前記分離領域の前記第1面側に、前記分離領域によって前記埋込領域と分離され、かつ前記ドリフト領域と接するように第1導電型のボディ拡張領域を形成する工程と、
前記第1面に位置し、かつ前記第1面よりも前記第2面の近くに位置する底面を有する素子分離絶縁膜を形成する工程と、
前記第1面に、前記ボディ拡張領域とpn接合を構成する第2導電型のソース領域と、前記ソース領域との間で前記素子分離絶縁膜を挟む第2導電型のドレイン領域とを形成する工程とを備え、
前記ボディ拡張領域の前記ドレイン領域側の端部において、前記第2面の最も近くに位置する前記ボディ拡張領域の第1部分は、前記第1面に位置する前記ボディ拡張領域の第2部分よりも前記ドレイン領域の近くに位置し、かつ前記素子分離絶縁膜の前記底面よりも前記第2面の近くに位置するように前記ボディ拡張領域が形成される、半導体装置の製造方法。
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