JP2020107686A - 基板処理装置および基板処理方法 - Google Patents
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Abstract
Description
実施形態に係る基板処理装置1について図1〜図4を参照し説明する。図1は、実施形態に係る基板処理装置1の概略構成を示す平面図である。図2は、実施形態に係る基板処理装置1の一部の概略構成を示す左側方図(その1)である。図3は、実施形態に係る基板処理装置1の一部の概略構成を示す左側方図(その2)である。図4は、図1のIV-IV断面におけるブロック図である。
次に、実施形態に係る基板処理について図5、および図6A〜図6Lを参照し説明する。図5は、実施形態に係る基板処理を示すフローチャートである。図6A〜図6Lは、実施形態に係る基板処理装置1における基板Sの搬送経路を示す図(その1〜その12)である。なお、図6A〜図6Lは、説明のため、第1処理ライン3と第3処理ライン5とを並べて記載している。
基板処理装置1は、基板Sに前処理を行う第1処理ライン3と、第1処理ライン3に対して並列に配置され、前処理が行われた基板Sにフォトレジスト液を塗布する第2処理ライン4とを備える。また、基板処理装置1は、第2処理ライン4の上方に配置され、フォトレジスト液が塗布された基板Sを搬送する搬送ライン8と、第1処理ライン3の下方に配置され、基板Sに現像処理を行う第3処理ライン5とを備える。また、基板処理装置1は、第1処理ライン3と第2処理ライン4との間に設けられ、第1処理ライン3から第2処理ライン4に基板Sを搬送する第1搬送部11を備える。また、基板処理装置1は、第1搬送部11に対して直列に配置され、フォトレジスト液が塗布された基板Sを搬送ライン8に搬送する第2搬送部12を備える。また、基板処理装置1は、第1搬送部11に対して直列に配置され、搬送ライン8から周辺露光装置62を介して第3処理ライン5に基板Sを搬送する第3搬送部10Bを備える。また、基板処理装置1は、第1搬送部11に対して直列に配置され、第3処理ライン5から現像処理が行われた基板Sを搬送する第4搬送部13を備える。
次に、本実施形態の変形例について説明する。
3 第1処理ライン(前処理ライン)
4 第2処理ライン(塗布ライン)
5 第3処理ライン(現像処理ライン)
6 減圧乾燥ユニット(載置部)
7 第1熱処理ユニット(載置部、熱処理部)
8 搬送ライン
9 第2熱処理ユニット
10B 第3搬送部
11 第1搬送部
12 第2搬送部
13 第4搬送部
27 フォトレジスト塗布ユニット
30 第1加熱ユニット(加熱部)
31 第2冷却ユニット(冷却部)
50 第2加熱ユニット(現像加熱部)
51 第3冷却ユニット
60 露光システム
61 露光装置
62 周辺露光装置(外部装置)
63 タイトラー
Claims (6)
- 基板に前処理を行う前処理ラインと、
前記前処理ラインに対して並列に配置され、前記前処理が行われた前記基板に処理液を塗布する塗布ラインと、
前記塗布ラインの上方、または下方に配置され、前記処理液が塗布された前記基板を搬送する搬送ラインと、
前記前処理ラインの上方、または下方に配置され、前記基板に現像処理を行う現像処理ラインと、
前記前処理ラインと前記塗布ラインとの間に設けられ、前記前処理ラインから前記塗布ラインに前記基板を搬送する第1搬送部と、
前記第1搬送部に対して直列に配置され、前記処理液が塗布された前記基板を前記搬送ラインに搬送する第2搬送部と、
前記第1搬送部に対して直列に配置され、前記搬送ラインから外部装置を介して前記現像処理ラインに前記基板を搬送する第3搬送部と、
前記第1搬送部に対して直列に配置され、前記現像処理ラインから前記現像処理が行われた前記基板を搬送する第4搬送部と
を備える基板処理装置。 - 前記第1搬送部と前記第2搬送部との間に設けられ、前記処理液が塗布された前記基板に減圧乾燥処理を行う減圧乾燥部と、
前記搬送ラインの上方、または下方に配置され、前記減圧乾燥処理が行われた前記基板を加熱する加熱部と
を備え、
前記第1搬送部は、
前記処理液が塗布された前記基板を前記塗布ラインから前記減圧乾燥部に搬送し、
前記第2搬送部は、
前記減圧乾燥処理が行われた前記基板を前記減圧乾燥部から前記加熱部に搬送する
請求項1に記載の基板処理装置。 - 前記減圧乾燥部の上方、または下方に配置され、前記加熱部によって加熱された前記基板を冷却する冷却部
を備え、
前記第2搬送部は、
前記加熱部から前記冷却部に前記基板を搬送し、かつ前記冷却部によって冷却された前記基板を前記冷却部から前記搬送ラインに搬送する
請求項2に記載の基板処理装置。 - 前記搬送ラインには、前記基板に管理用コードを書き込むタイトラーが設けられる
請求項1〜3のいずれか一つに記載の基板処理装置。 - 前記第1搬送部に対して直列に配置され、前記現像処理が行われた前記基板を加熱する現像加熱部
を備え、
前記第4搬送部は、
前記現像処理ラインから前記現像加熱部に前記基板を搬送する
請求項1〜4のいずれか一つに記載の基板処理装置。 - 前処理ラインによって前処理が行われた基板を、前記前処理ラインに対して並列に配置され、前記基板に処理液を塗布する塗布ラインに搬送する第1搬送工程と、
前記処理液が塗布された前記基板を、前記塗布ラインの上方、または下方に配置された搬送ラインに搬送する第2搬送工程と、
前記処理液が塗布された前記基板を、前記搬送ラインによって搬送する第3搬送工程と、
前記処理液が塗布された前記基板を、前記前処理ラインの上方、または下方に配置され、現像処理を行う現像処理ラインに外部装置を介して搬送する第4搬送工程と、
前記現像処理が行われた前記基板を、前記現像処理ラインから搬送する第5搬送工程と
を有し、
前記第1搬送工程では、前記前処理ラインと前記塗布ラインとの間に設けられた第1搬送部によって前記基板が前記塗布ラインに搬送され、
前記第2搬送工程では、前記第1搬送部に対して直列に配置された第2搬送部によって前記基板が前記搬送ラインに搬送され、
前記第4搬送工程では、前記第1搬送部に対して直列に配置された第3搬送部によって前記基板が前記外部装置を介して前記現像処理ラインに搬送され、
前記第5搬送工程では、前記第1搬送部に対して直列に配置された第4搬送部によって前記基板が前記現像処理ラインから搬送される
基板処理方法。
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TW108145475A TW202036767A (zh) | 2018-12-27 | 2019-12-12 | 基板處理裝置及基板處理方法 |
CN201911300744.4A CN111383975A (zh) | 2018-12-27 | 2019-12-17 | 基片处理装置和基片处理方法 |
KR1020190170813A KR20200081257A (ko) | 2018-12-27 | 2019-12-19 | 기판 처리 장치 및 기판 처리 방법 |
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KR20230124472A (ko) | 2022-02-18 | 2023-08-25 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
CN116705678A (zh) * | 2022-03-03 | 2023-09-05 | 株式会社斯库林集团 | 基板处理装置以及基板处理方法 |
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JP2002252156A (ja) * | 2001-02-22 | 2002-09-06 | Tokyo Electron Ltd | 処理装置 |
JP2005142372A (ja) * | 2003-11-06 | 2005-06-02 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
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JPH11251399A (ja) * | 1998-02-27 | 1999-09-17 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
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US7403260B2 (en) * | 2005-03-11 | 2008-07-22 | Tokyo Electron Limited | Coating and developing system |
JP3966884B2 (ja) * | 2005-06-17 | 2007-08-29 | 美岳 伊藤 | 基板処理装置及び基板処理方法並びに基板の製造方法 |
JP4745040B2 (ja) * | 2005-12-05 | 2011-08-10 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理装置 |
JP4531690B2 (ja) * | 2005-12-08 | 2010-08-25 | 東京エレクトロン株式会社 | 加熱処理装置 |
JP2010093125A (ja) * | 2008-10-09 | 2010-04-22 | Toray Eng Co Ltd | 基板処理システムおよび基板処理方法 |
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- 2019-12-17 CN CN201911300744.4A patent/CN111383975A/zh active Pending
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002252156A (ja) * | 2001-02-22 | 2002-09-06 | Tokyo Electron Ltd | 処理装置 |
JP2005142372A (ja) * | 2003-11-06 | 2005-06-02 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
Cited By (3)
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KR20230124472A (ko) | 2022-02-18 | 2023-08-25 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
CN116705678A (zh) * | 2022-03-03 | 2023-09-05 | 株式会社斯库林集团 | 基板处理装置以及基板处理方法 |
CN116705678B (zh) * | 2022-03-03 | 2024-01-30 | 株式会社斯库林集团 | 基板处理装置以及基板处理方法 |
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CN111383975A (zh) | 2020-07-07 |
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