JP2020095232A - 表示装置およびその製造方法 - Google Patents
表示装置およびその製造方法 Download PDFInfo
- Publication number
- JP2020095232A JP2020095232A JP2019057632A JP2019057632A JP2020095232A JP 2020095232 A JP2020095232 A JP 2020095232A JP 2019057632 A JP2019057632 A JP 2019057632A JP 2019057632 A JP2019057632 A JP 2019057632A JP 2020095232 A JP2020095232 A JP 2020095232A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- region
- conductive film
- anisotropic conductive
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 13
- 229920001197 polyacetylene Polymers 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 10
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 9
- -1 polyphenylene vinylene Polymers 0.000 claims description 8
- 239000011856 silicon-based particle Substances 0.000 claims description 5
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 4
- 229920000553 poly(phenylenevinylene) Polymers 0.000 claims description 4
- 229920000128 polypyrrole Polymers 0.000 claims description 4
- 229920000123 polythiophene Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000010408 film Substances 0.000 description 89
- 239000000758 substrate Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000470 constituent Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0269—Non-uniform distribution or concentration of particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Electroluminescent Light Sources (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
は下に位置することであり、必ずしも重力と反対の方向に向かって“上に”位置することを意味するのではない。
100:表示パネル
110:基板
120:薄膜トランジスターの表示板
200:可撓性印刷回路基板
300:印刷回路基板
400:駆動集積回路
510:第1異方性導電膜
520:第2異方性導電膜
511:伝導領域
512:絶縁領域
PE:パッド
PE1a:第1パッド
PE1b:第2パッド
PE2a:第3パッド
PE2b:第4パッド
Claims (10)
- 表示パネルと、
前記表示パネルに電気的に連結された可撓性印刷回路基板と、
前記表示パネルの一端に位置する第1パッドと、
前記可撓性印刷回路基板の一端に位置し、前記第1パッドと重畳する第2パッドと、
前記第1パッドと前記第2パッドの間に位置する第1異方性導電膜とを含み、
前記第1異方性導電膜は導電性高分子を含み、
前記第1異方性導電膜は第1伝導領域と第1絶縁領域とを含む、表示装置。 - 前記第1伝導領域は、前記第1パッドと前記第2パッドが重畳する領域に位置し、
前記第1絶縁領域は、前記第1伝導領域を囲む領域に位置し、
前記導電性高分子は、ポリアセチレン(Polyacetylene)、ポリピロール(Polypyrrole)、ポリチオフェン(Polythiophene)、ポリフェニレンビニレン(Polyphenylene vinylene)、ポリフェニレン(polyphenylene)のうち少なくともいずれか一つを含む、請求項1に記載の表示装置。 - 前記第1伝導領域は、トランスポリアセチレン(trans−Polyacetylene)を含み、
前記第1絶縁領域は、シスポリアセチレン(cis−Polyacetylene)を含む、請求項1又は2に記載の表示装置。 - 前記第1パッドのピッチ(pitch)は27μm以下である、請求項1乃至3のいずれか一項に記載の表示装置。
- 印刷回路基板、
前記可撓性印刷回路基板の他端に位置する第3パッド、
前記印刷回路基板に位置する第4パッド、および
前記第3パッドと前記第4パッドの間に位置する第2異方性導電膜をさらに含み、
前記第2異方性導電膜は導電性高分子を含み、
前記第2異方性導電膜は第2伝導領域と第2絶縁領域とを含み、
前記第2伝導領域は、前記第3パッドと前記第4パッドが重畳する領域に位置する、請求項1乃至4のいずれか一項に記載の表示装置。 - 前記可撓性印刷回路基板はデータ駆動集積回路を含み、
前記データ駆動集積回路は、前記第2パッド、第1異方性導電膜および第1パッドを通して信号を前記表示パネルに伝達する、請求項1乃至5のいずれか一項に記載の表示装置。 - 表示パネルと、
前記表示パネルに電気的に連結された可撓性印刷回路基板と、
前記表示パネルの一端に位置する第1パッドと、
前記可撓性印刷回路基板の一端に位置し、前記第1パッドと重畳する第2パッドと、
前記第1パッドと前記第2パッドの間に位置する第1異方性導電膜とを含み、
前記第1異方性導電膜は第1伝導領域と第1絶縁領域とを含み、
前記第1伝導領域は多結晶シリコンを含み、
前記第1絶縁領域は非晶質シリコンを含む、表示装置。 - 前記第1伝導領域は、前記第1パッドと前記第2パッドが重畳する領域に位置し、
前記第1絶縁領域は、前記第1伝導領域を囲む領域に位置し、
前記第1異方性導電膜は、熱硬化性樹脂または光硬化性樹脂をさらに含む、請求項7に記載の表示装置。 - 印刷回路基板、
前記可撓性印刷回路基板の他端に位置する第3パッド、
前記印刷回路基板に位置する第4パッド、および
前記第3パッドと前記第4パッドの間に位置する第2異方性導電膜をさらに含み、
前記第2異方性導電膜は、第2伝導領域と第2絶縁領域とを含み、
前記第2伝導領域は多結晶シリコン粒子を含み、
前記第2絶縁領域は非晶質シリコンを含む、請求項7又は8に記載の表示装置。 - 表示パネルと可撓性印刷回路基板を準備する段階と、
前記表示パネルまたは前記可撓性印刷回路基板に異方性導電膜を取り付ける段階と、
前記異方性導電膜の上にマスクを準備する段階と、
前記異方性導電膜にレーザを照射する段階と、を含み、
前記マスクは、前記表示パネルのパッドに対応する領域に開口部を含み、
前記異方性導電膜にレーザを照射する段階は、前記マスクの前記開口部を通して前記異方性導電膜における前記表示パネルのパッドと重畳する領域に、レーザを照射して行われる、表示装置の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0160209 | 2018-12-12 | ||
KR1020180160209A KR102629350B1 (ko) | 2018-12-12 | 2018-12-12 | 표시 장치 및 그 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020095232A true JP2020095232A (ja) | 2020-06-18 |
JP7290440B2 JP7290440B2 (ja) | 2023-06-13 |
Family
ID=71071236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019057632A Active JP7290440B2 (ja) | 2018-12-12 | 2019-03-26 | 表示装置およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11114774B2 (ja) |
JP (1) | JP7290440B2 (ja) |
KR (1) | KR102629350B1 (ja) |
CN (1) | CN111308812A (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63183482A (ja) * | 1987-01-27 | 1988-07-28 | 三菱電機株式会社 | 回路基板およびその修復方法 |
JPH0352244A (ja) * | 1989-07-20 | 1991-03-06 | Fujitsu Ltd | 半導体チップの実装構造 |
JPH0773740A (ja) * | 1993-06-29 | 1995-03-17 | Asahi Chem Ind Co Ltd | 異方導電接続用組成物 |
JPH07192790A (ja) * | 1993-12-27 | 1995-07-28 | Showa Denko Kk | 異方導電性接続材料 |
JPH10502677A (ja) * | 1994-06-29 | 1998-03-10 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 異方性導電性の接着剤及び異方性導電性の接着剤の製造方法 |
JP2006049514A (ja) * | 2004-08-03 | 2006-02-16 | Sharp Corp | 入力用配線フィルムおよびこれを備えた表示装置 |
US20160100481A1 (en) * | 2014-10-01 | 2016-04-07 | Samsung Electro-Mechanics Co., Ltd. | Anisotropic conductive film, method of manufacturing the same, and printed circuit board using the same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6055525A (ja) * | 1983-09-05 | 1985-03-30 | Mitsubishi Electric Corp | 光メモリ材料 |
US5592365A (en) * | 1993-12-21 | 1997-01-07 | Sharp Kabushiki Kaisha | Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch |
KR100671312B1 (ko) | 1999-08-25 | 2007-01-19 | 히다치 가세고교 가부시끼가이샤 | 배선단자 접속용 필름 |
TW555790B (en) * | 2000-12-26 | 2003-10-01 | Matsushita Electric Ind Co Ltd | Conductive organic thin film, process for producing the same, and organic photoelectronic device, electric wire, and electrode aech employing the same |
KR100418031B1 (ko) | 2001-05-11 | 2004-02-14 | 엘지전자 주식회사 | 표시장치 |
KR101011923B1 (ko) * | 2003-03-31 | 2011-02-01 | 스미토모덴키고교가부시키가이샤 | 이방성 도전막 및 그 제조방법 |
KR100867587B1 (ko) | 2007-04-30 | 2008-11-10 | 전선우 | 레이저를 이용한 이방전도성필름의 본딩 제어 장치 |
JP5690833B2 (ja) | 2010-09-30 | 2015-03-25 | リンテック株式会社 | 電子デバイス及び電子デバイスの製造方法 |
TWI462244B (zh) * | 2011-10-17 | 2014-11-21 | Ind Tech Res Inst | 異方向性導電膜片及其製作方法 |
KR20140110553A (ko) * | 2013-03-08 | 2014-09-17 | 삼성디스플레이 주식회사 | 이방성 도전 필름, 표시 장치, 및 표시 장치의 제조 방법 |
KR101748033B1 (ko) | 2014-09-05 | 2017-06-15 | 주식회사 엘지화학 | 전도성 적층체, 이를 포함하는 전극 및 전자소자 |
KR102355256B1 (ko) * | 2015-01-22 | 2022-01-25 | 삼성디스플레이 주식회사 | 표시 장치 |
KR101753845B1 (ko) | 2015-03-06 | 2017-07-04 | 고려대학교 산학협력단 | 전도성 고분자 복합재료의 제조방법 및 이에 따라 제조된 전도성 고분자 복합재료 |
KR20170130003A (ko) * | 2016-05-17 | 2017-11-28 | 삼성디스플레이 주식회사 | 이방성 도전 필름을 포함하는 표시 장치 및 이방성 도전 필름의 제조 방법 |
KR20180018972A (ko) * | 2016-08-12 | 2018-02-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
JP6956475B2 (ja) * | 2016-09-28 | 2021-11-02 | エルジー ディスプレイ カンパニー リミテッド | 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム |
-
2018
- 2018-12-12 KR KR1020180160209A patent/KR102629350B1/ko active IP Right Grant
-
2019
- 2019-03-26 JP JP2019057632A patent/JP7290440B2/ja active Active
- 2019-11-20 US US16/689,240 patent/US11114774B2/en active Active
- 2019-12-11 CN CN201911264583.8A patent/CN111308812A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63183482A (ja) * | 1987-01-27 | 1988-07-28 | 三菱電機株式会社 | 回路基板およびその修復方法 |
JPH0352244A (ja) * | 1989-07-20 | 1991-03-06 | Fujitsu Ltd | 半導体チップの実装構造 |
JPH0773740A (ja) * | 1993-06-29 | 1995-03-17 | Asahi Chem Ind Co Ltd | 異方導電接続用組成物 |
JPH07192790A (ja) * | 1993-12-27 | 1995-07-28 | Showa Denko Kk | 異方導電性接続材料 |
JPH10502677A (ja) * | 1994-06-29 | 1998-03-10 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 異方性導電性の接着剤及び異方性導電性の接着剤の製造方法 |
JP2006049514A (ja) * | 2004-08-03 | 2006-02-16 | Sharp Corp | 入力用配線フィルムおよびこれを備えた表示装置 |
US20160100481A1 (en) * | 2014-10-01 | 2016-04-07 | Samsung Electro-Mechanics Co., Ltd. | Anisotropic conductive film, method of manufacturing the same, and printed circuit board using the same |
Also Published As
Publication number | Publication date |
---|---|
CN111308812A (zh) | 2020-06-19 |
US11114774B2 (en) | 2021-09-07 |
JP7290440B2 (ja) | 2023-06-13 |
KR20200072637A (ko) | 2020-06-23 |
KR102629350B1 (ko) | 2024-01-25 |
US20200194906A1 (en) | 2020-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3503182B1 (en) | Electronic device and manufacturing method thereof | |
CN105301851B (zh) | 阵列基底和使用该阵列基底安装集成电路的方法 | |
US9349683B2 (en) | Chip-on-film package having bending part | |
US9281346B1 (en) | Display device | |
KR20180070774A (ko) | 기판, 전자 장치 및 이를 구비하는 표시 장치 | |
US20070222777A1 (en) | Electrooptic device, wiring board, method for manufacturing electrooptic device, and electronic device | |
TWI748166B (zh) | 電子裝置及其製造方法 | |
JP2006060211A (ja) | テープ配線基板、そのテープ配線基板を含む半導体チップパッケージ及びその半導体チップパッケージを含む液晶表示装置 | |
JP2006267605A (ja) | 表示装置 | |
US20210265546A1 (en) | Electronic device and manufacturing method thereof | |
TWI467522B (zh) | 積體顯示模組 | |
KR20000062451A (ko) | 영상 장치 및 그 제조 방법 | |
US11793040B2 (en) | Display device | |
JP2017072811A (ja) | 表示装置 | |
JP2004037859A (ja) | 表示装置 | |
KR20090029084A (ko) | 이방성 전도 필름 및 그를 포함하는 표시 장치 | |
JP2020095232A (ja) | 表示装置およびその製造方法 | |
JP2005268282A (ja) | 半導体チップの実装体及びこれを用いた表示装置 | |
US11189207B2 (en) | Chip-on-film and display including the same | |
JP2006210809A (ja) | 配線基板および実装構造体、電気光学装置および電子機器 | |
US20140284562A1 (en) | Organic light emitting diode display | |
US11296177B2 (en) | Display device with curable pattern between lead wirings and method of fabricating the same | |
KR100920354B1 (ko) | 박막 트랜지스터 표시판 | |
JP2019008106A (ja) | アレイ基板およびアレイ基板を備える表示パネル | |
JP4484750B2 (ja) | 配線基板およびそれを備えた電子回路素子ならびに表示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220221 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20221221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230110 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230320 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230509 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230601 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7290440 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |