JP2020043315A - 平坦化装置、平坦化方法及び物品の製造方法 - Google Patents
平坦化装置、平坦化方法及び物品の製造方法 Download PDFInfo
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
Description
次に、前述の平坦化装置又は平坦化方法を利用した物品(半導体IC素子、液晶表示素子、カラーフィルタ、MEMS等)の製造方法を説明する。当該製造方法は、前述の平坦化装置を使用して、基板(ウェハ、ガラス基板等)に配置された組成物と型を接触させて平坦化させ、組成物を硬化させて組成物と型を離す工程とを含む。そして、平坦化された組成物を有する基板に対して、リソグラフィ装置を用いてパターンを形成するなどの処理を行う工程と、処理された基板を他の周知の加工工程で処理することにより、物品が製造される。他の周知の工程には、エッチング、レジスト剥離、ダイシング、ボンディング、パッケージング等が含まれる。本製造方法によれば、従来よりも高品位の物品を製造することができる。
Claims (14)
- 型の平面部を用いて基板上の所定領域内の組成物を平坦化する平坦化装置であって、
前記型を保持する型保持部と、
該型保持部に保持され、凸形状に変形した前記型の平面部の形状を計測する計測部と、
該計測部の計測結果に基づいて、前記型の平面部が前記基板上の所定領域と接触するように、前記型の平面部と前記基板との位置合わせを行う制御部と、を備えることを特徴とする平坦化装置。 - 前記計測部は、前記型保持部に保持された前記型の前記基板側の表面までの距離を計測することを特徴とする請求項1に記載の平坦化装置。
- 前記計測部は、前記型保持部に保持された前記型の前記基板側の表面までの距離を前記型の面に沿った方向に複数個所計測することを特徴とする請求項2に記載の平坦化装置。
- 前記計測部は、前記型保持部に保持された前記型の前記基板側の表面に対向する位置に配置されていることを特徴とする請求項2または3に記載の平坦化装置。
- 前記計測部は、前記基板を保持する基板保持部に設けられていることを特徴とする請求項1乃至4のいずれか1項に記載の平坦化装置。
- 前記計測部は、前記型保持部に保持された前記型の側面に対向する位置に配置されていることを特徴とする請求項1に記載の平坦化装置。
- 前記計測部は、前記型保持部に保持された前記型の前記基板側の表面までの距離を前記基板の面に垂直な方向に沿って複数個所計測することを特徴とする請求項6に記載の平坦化装置。
- 前記型保持部に保持された前記型を前記基板に対して凸形状となるように前記型を変形させる変形部を備えることを特徴とする請求項1乃至7のいずれか1項に記載の平坦化装置。
- 前記変形部が前記型を凸形状に変形させた状態で、前記計測部は前記型の前記基板側の表面までの距離を計測し、前記制御部は、前記型の前記基板側の表面と前記基板までの距離が最も短くなる前記型の位置を計測することを特徴とする請求項8に記載の平坦化装置。
- 前記制御部は、前記基板に沿った方向に対して、前記型の前記基板側の表面と前記基板までの距離が最も短い位置と、前記基板上の組成物を平坦化する領域の中心とを、位置合わせすることを特徴とする請求項9に記載の平坦化装置。
- 前記基板上の組成物を平坦化させる際に、前記型を前記基板に対して凸形状に変形させた状態で前記基板上の組成物に接触させることを特徴とする請求項1乃至10のいずれか1項に記載の平坦化装置。
- 前記基板の全面に前記組成物を供給し、前記組成物を平坦化させることを特徴とする請求項1乃至11のいずれか1項に記載の平坦化装置。
- 型の平面部を用いて基板上の所定領域内の組成物を平坦化する平坦化方法であって、
型保持部に保持され、凸形状に変形した前記型の平面部の形状を計測する計測工程と、
前記計測工程における計測結果に基づいて、前記型の平面部が前記基板上の所定領域と接触するように、前記型の平面部と前記基板との位置合わせを行う位置合わせ工程と、
前記基板上の所定領域内の組成物と前記型とを接触させる接触工程と、を有することを特徴とする平坦化方法。 - 請求項13に記載の平坦化方法を用いて前記基板上の組成物を平坦化する工程と、
平坦化された組成物を有する基板を処理する工程と、を有し、処理された基板から物品を製造することを特徴とする物品の製造方法。
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JP2018171936A JP7150535B2 (ja) | 2018-09-13 | 2018-09-13 | 平坦化装置、平坦化方法及び物品の製造方法 |
KR1020190107886A KR102571412B1 (ko) | 2018-09-13 | 2019-09-02 | 평탄화 장치, 평탄화 방법 및 물품 제조 방법 |
US16/561,838 US11163231B2 (en) | 2018-09-13 | 2019-09-05 | Planarization apparatus, planarization method, and article manufacturing method |
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