JP2019530986A5 - - Google Patents
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- Publication number
- JP2019530986A5 JP2019530986A5 JP2019520056A JP2019520056A JP2019530986A5 JP 2019530986 A5 JP2019530986 A5 JP 2019530986A5 JP 2019520056 A JP2019520056 A JP 2019520056A JP 2019520056 A JP2019520056 A JP 2019520056A JP 2019530986 A5 JP2019530986 A5 JP 2019530986A5
- Authority
- JP
- Japan
- Prior art keywords
- less
- conductive
- coating layer
- copper surface
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052802 copper Inorganic materials 0.000 claims 22
- 239000010949 copper Substances 0.000 claims 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 20
- 238000000034 method Methods 0.000 claims 16
- 239000011247 coating layer Substances 0.000 claims 14
- 239000010410 layer Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims 4
- 239000011261 inert gas Substances 0.000 claims 4
- 150000002894 organic compounds Chemical class 0.000 claims 4
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims 2
- 239000001569 carbon dioxide Substances 0.000 claims 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 229910001882 dioxygen Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 230000003647 oxidation Effects 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 claims 2
- 238000006722 reduction reaction Methods 0.000 claims 2
- UGJPMSBRYUISGR-UHFFFAOYSA-N 1H-pyrrole silane Chemical compound [SiH4].N1C=CC=C1 UGJPMSBRYUISGR-UHFFFAOYSA-N 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 229910052786 argon Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16193971.5 | 2016-10-14 | ||
| EP16193971.5A EP3310137B1 (en) | 2016-10-14 | 2016-10-14 | Method for manufacturing a printed circuit board |
| PCT/EP2017/076003 WO2018069421A1 (en) | 2016-10-14 | 2017-10-12 | Method for manufacturing a printed circuit board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019530986A JP2019530986A (ja) | 2019-10-24 |
| JP2019530986A5 true JP2019530986A5 (enExample) | 2020-11-19 |
| JP7213801B2 JP7213801B2 (ja) | 2023-01-27 |
Family
ID=57136780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019520056A Active JP7213801B2 (ja) | 2016-10-14 | 2017-10-12 | プリント回路基板を製造するための方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10477700B2 (enExample) |
| EP (1) | EP3310137B1 (enExample) |
| JP (1) | JP7213801B2 (enExample) |
| KR (1) | KR102413015B1 (enExample) |
| CN (1) | CN109845415B (enExample) |
| TW (1) | TWI669041B (enExample) |
| WO (1) | WO2018069421A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11991835B2 (en) * | 2019-03-01 | 2024-05-21 | Atotech Deutschland Gmbh | Method for increasing adhesion strength between a metal and an organic material |
| CN110856348A (zh) * | 2019-10-09 | 2020-02-28 | 广东利尔化学有限公司 | 一种用于pcb除胶后处理中和还原剂 |
| CN110798980A (zh) * | 2019-10-12 | 2020-02-14 | 西安金百泽电路科技有限公司 | 一种改善渗油及油墨入孔的方法 |
| JP7474095B2 (ja) * | 2020-03-31 | 2024-04-24 | リンテック株式会社 | 接着シート、及び接着シートの使用方法 |
| JP2021194831A (ja) * | 2020-06-12 | 2021-12-27 | Ckd株式会社 | スクリーンマスク検査方法及びスクリーンマスク検査装置 |
| US11388822B2 (en) | 2020-08-28 | 2022-07-12 | Applied Materials, Inc. | Methods for improved polymer-copper adhesion |
| CN112577982A (zh) * | 2020-12-09 | 2021-03-30 | 广州添利电子科技有限公司 | 一种pcb表面处理金属薄层质量分析方法 |
| TW202307270A (zh) | 2021-06-09 | 2023-02-16 | 德商德國艾托特克有限兩合公司 | 銅層與有機層之複合物及其製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4316087A1 (de) | 1993-05-13 | 1994-11-17 | Morton Int Inc | Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten |
| JP4219641B2 (ja) | 2002-08-26 | 2009-02-04 | 新日鐵化学株式会社 | アルカリ現像型感光性樹脂組成物 |
| WO2005101929A1 (en) * | 2004-04-19 | 2005-10-27 | Youngeun Electronics Co., Ltd | Printed circuit board including track gap-filled resin and fabricating method thereof |
| EP2065927B1 (en) * | 2007-11-27 | 2013-10-02 | Imec | Integration and manufacturing method of Cu germanide and Cu silicide as Cu capping layer |
| JPWO2009125845A1 (ja) * | 2008-04-10 | 2011-08-04 | ソニーケミカル＆インフォメーションデバイス株式会社 | フレキシブル配線板の製造方法 |
| WO2012005722A1 (en) | 2010-07-06 | 2012-01-12 | Zettacore, Inc. | Methods of treating metal surfaces and devices formed thereby |
| JP2010166099A (ja) | 2010-04-30 | 2010-07-29 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
| JP6030401B2 (ja) * | 2012-10-12 | 2016-11-24 | 三井金属鉱業株式会社 | 表面処理銅箔の製造方法 |
| EP2754732B1 (en) * | 2013-01-15 | 2015-03-11 | ATOTECH Deutschland GmbH | Aqueous composition for etching of copper and copper alloys |
| KR101422262B1 (ko) * | 2013-02-08 | 2014-07-24 | 와이엠티 주식회사 | 동박층이 형성된 기판과 인쇄회로기판의 제조방법 및 이에 의하여 제조된 인쇄회로기판 |
| CN104255086B (zh) * | 2013-02-28 | 2018-09-18 | 东海神栄电子工业株式会社 | 基板的制造方法、基板以及掩蔽膜 |
| US9637271B2 (en) | 2013-03-15 | 2017-05-02 | Owens-Brockway Glass Container Inc. | Container with a medal |
| CN103260361B (zh) * | 2013-05-14 | 2016-07-06 | 金悦通电子（翁源）有限公司 | 一种hdi外层线路负片加工方法 |
| CN104735899B (zh) * | 2013-12-19 | 2017-08-22 | 鹏鼎控股(深圳)股份有限公司 | 可挠式电路板及其制作方法 |
-
2016
- 2016-10-14 EP EP16193971.5A patent/EP3310137B1/en not_active Not-in-force
-
2017
- 2017-10-12 KR KR1020197012922A patent/KR102413015B1/ko active Active
- 2017-10-12 JP JP2019520056A patent/JP7213801B2/ja active Active
- 2017-10-12 CN CN201780062323.5A patent/CN109845415B/zh not_active Expired - Fee Related
- 2017-10-12 US US16/340,697 patent/US10477700B2/en active Active
- 2017-10-12 WO PCT/EP2017/076003 patent/WO2018069421A1/en not_active Ceased
- 2017-10-13 TW TW106135163A patent/TWI669041B/zh active
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