JP2019517738A - スーパージャンクション構造のパワートランジスタ及びその製造方法 - Google Patents
スーパージャンクション構造のパワートランジスタ及びその製造方法 Download PDFInfo
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- 238000003860 storage Methods 0.000 claims description 3
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- 239000000463 material Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
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- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 150000004767 nitrides Chemical class 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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Abstract
Description
前記第1基板エピタキシャル層の上に第2基板エピタキシャル層を形成させることと、
前記第2基板エピタキシャル層の上にハードマスク層を形成させ、前記ハードマスク層をエッチングしてハードマスク層の開口を形成させることと、
前記第2基板エピタキシャル層に複数の第1トレンチを形成させるように、前記第2基板エピタキシャル層をエッチングすることと、
前記第1トレンチの内面にゲート酸化層を形成させることと、
前記第1トレンチの対向する側壁にゲートを形成させることと、
露出したゲート酸化層をエッチングし、前記第2基板エピタキシャル層をエッチングして第2トレンチを形成させることと、
前記第2トレンチの内面および前記ゲートの対向する表面を覆うようにフィールド酸化層を形成させ、前記フィールド酸化層で囲まれた収容空間内にスプリットゲートを形成させることと、
前記第2基板エピタキシャル層にボディ領域を形成させ、前記ボディ領域にソース領域を形成させることと、
前記第1基板エピタキシャル層の底部にドレイン領域を形成させることと、
を含むスーパージャンクション構造のパワートランジスタの製造方法。
Claims (13)
- 第1ドーピングタイプの第1基板エピタキシャル層と、前記第1基板エピタキシャル層の上に設けられる第1ドーピングタイプの第2基板エピタキシャル層とを備え、前記第1基板エピタキシャル層に第1ドーピングタイプのドレイン領域及び複数の第2ドーピングタイプの柱状エピタキシャルドーピング領域が形成され、前記第2基板エピタキシャル層に複数のトレンチが設けられ、前記トレンチに複合ゲート構造が形成され、隣接する前記トレンチの間の第2基板エピタキシャル層に第2ドーピングタイプのボディ領域が設けられ、前記ボディ領域に第1ドーピングタイプのソース領域が設けられる、スーパージャンクション構造のパワートランジスタ。
- 前記第2基板エピタキシャル層における複合ゲート構造の数は、前記第1基板エピタキシャル層の柱状エピタキシャルドーピング領域の数よりも多い、請求項1に記載のスーパージャンクション構造のパワートランジスタ。
- 前記複合ゲート構造は、前記柱状エピタキシャルドーピング領域の上、及び前記隣接する柱状エピタキシャルドーピング領域の間の第1基板エピタキシャル層の上に順に設けられる、請求項2に記載のスーパージャンクション構造のパワートランジスタ。
- 前記第2基板エピタキシャル層のドーピング濃度は、前記第1基板エピタキシャル層のドーピング濃度よりも大きい、請求項1に記載のスーパージャンクション構造のパワートランジスタ。
- 前記トレンチは、同じ方向の第1トレンチと、開口が前記第1トレンチの底部に位置する第2トレンチとを含み、前記複合ゲート構造がゲート、ゲート酸化層、スプリットゲート及びフィールド酸化層を含み、前記ゲート酸化層が前記第1トレンチの内面に設けられ、前記ゲートが前記第1トレンチの対向する側壁に設けられて前記ゲート酸化層を覆い、前記フィールド酸化層が前記ゲートの対向する表面及び前記第2トレンチの内面に設けられ、前記スプリットゲートが前記フィールド酸化層で囲まれた収容空間内に設けられる、請求項1に記載のスーパージャンクション構造のパワートランジスタ。
- 前記第1トレンチの幅は前記第2トレンチの幅よりも大きい、請求項5に記載のスーパージャンクション構造のパワートランジスタ。
- 前記スプリットゲートは導電層を介して前記ソース領域に接続される、請求項5に記載のスーパージャンクション構造のパワートランジスタ。
- 前記第1ドーピングタイプはP型ドーピングであり、前記第2ドーピングタイプはN型ドーピングである、請求項1に記載のスーパージャンクション構造のパワートランジスタ。
- 前記第1ドーピングタイプはN型ドーピングであり、前記第2ドーピングタイプはP型ドーピングである、請求項1に記載のスーパージャンクション構造のパワートランジスタ。
- 第1基板エピタキシャル層に複数の柱状エピタキシャルドーピング領域を形成させることと、
前記第1基板エピタキシャル層の上に第2基板エピタキシャル層を形成させることと、
前記第2基板エピタキシャル層の上にハードマスク層を形成させ、前記ハードマスク層をエッチングしてハードマスク層の開口を形成させることと、
前記第2基板エピタキシャル層に複数の第1トレンチを形成させるように前記第2基板エピタキシャル層をエッチングすることと、
前記第1トレンチの内面にゲート酸化層を形成させることと、
前記第1トレンチの対向する側壁にゲートを形成させることと、
露出したゲート酸化層をエッチングし、前記第2基板エピタキシャル層をエッチングして第2トレンチを形成させることと、
前記第2トレンチの内面と前記ゲートの対向する表面を覆ってフィールド酸化層を形成させ、前記フィールド酸化層で囲まれた収容空間内にスプリットゲートを形成させることと、
前記第2基板エピタキシャル層にボディ領域を形成させ、前記ボディ領域にソース領域を形成させることと、
前記第1基板エピタキシャル層の底部にドレイン領域を形成させることと、
を含む、スーパージャンクション構造のパワートランジスタの製造方法。 - 前記第1トレンチを形成させる際に、形成される第1トレンチの幅が前記ハードマスク層の開口の幅よりも大きくなるように、横方向のエッチングを増加させる、請求項10に記載の方法。
- 前記第2基板エピタキシャル層の第1トレンチの数は、前記第1基板エピタキシャル層の柱状エピタキシャルドーピング領域の数よりも多い、請求項10に記載の方法。
- 前記第2基板エピタキシャル層と前記第1基板エピタキシャル層は、ドーピングタイプが同じであり、且つ、前記第2基板エピタキシャル層のドーピング濃度は、前記第1基板エピタキシャル層のドーピング濃度よりも大きい、請求項10に記載の方法。
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