JP2019505750A - 基板の熱処理のためのシステムおよび方法 - Google Patents
基板の熱処理のためのシステムおよび方法 Download PDFInfo
- Publication number
- JP2019505750A JP2019505750A JP2018524783A JP2018524783A JP2019505750A JP 2019505750 A JP2019505750 A JP 2019505750A JP 2018524783 A JP2018524783 A JP 2018524783A JP 2018524783 A JP2018524783 A JP 2018524783A JP 2019505750 A JP2019505750 A JP 2019505750A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- drying
- various embodiments
- module
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1291—Process of deposition of the inorganic material by heating of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Solid Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562255928P | 2015-11-16 | 2015-11-16 | |
| US62/255,928 | 2015-11-16 | ||
| PCT/US2016/061932 WO2017087337A1 (en) | 2015-11-16 | 2016-11-14 | Systems and methods for thermal processing of a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019505750A true JP2019505750A (ja) | 2019-02-28 |
| JP2019505750A5 JP2019505750A5 (enExample) | 2019-11-21 |
Family
ID=58691397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018524783A Pending JP2019505750A (ja) | 2015-11-16 | 2016-11-14 | 基板の熱処理のためのシステムおよび方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10115900B2 (enExample) |
| EP (1) | EP3377234A4 (enExample) |
| JP (1) | JP2019505750A (enExample) |
| KR (1) | KR20180082498A (enExample) |
| CN (1) | CN108348954A (enExample) |
| TW (1) | TW201724614A (enExample) |
| WO (1) | WO2017087337A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021532541A (ja) * | 2018-07-23 | 2021-11-25 | カティーバ, インコーポレイテッド | パターン形成された有機発光ダイオードの配合物を乾燥させるシステムおよび方法 |
| JP2022020214A (ja) * | 2020-07-20 | 2022-02-01 | 株式会社Joled | 自発光型表示パネル、及び自発光型表示パネルの製造方法 |
| JP2022078586A (ja) * | 2020-11-13 | 2022-05-25 | 株式会社Screenホールディングス | 減圧乾燥装置 |
| WO2025197342A1 (ja) * | 2024-03-19 | 2025-09-25 | キヤノン株式会社 | 基板処理装置、基板処理方法及び物品の製造方法 |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
| US10468279B2 (en) | 2013-12-26 | 2019-11-05 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
| WO2015112454A1 (en) | 2014-01-21 | 2015-07-30 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
| WO2015168036A1 (en) | 2014-04-30 | 2015-11-05 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
| US10648075B2 (en) * | 2015-03-23 | 2020-05-12 | Goodrich Corporation | Systems and methods for chemical vapor infiltration and densification of porous substrates |
| US10615378B2 (en) * | 2016-09-30 | 2020-04-07 | Tokyo Electron Limited | Reduced-pressure drying apparatus |
| JP6920131B2 (ja) * | 2017-08-10 | 2021-08-18 | 東京エレクトロン株式会社 | 減圧乾燥装置 |
| CN108296067A (zh) * | 2017-09-11 | 2018-07-20 | 郑州大学 | 一种大直径化工管道表面喷漆装置 |
| JP7177619B2 (ja) * | 2018-08-01 | 2022-11-24 | 株式会社Screenホールディングス | 熱処理装置 |
| CN111086330B (zh) * | 2018-10-23 | 2021-08-31 | 广东聚华印刷显示技术有限公司 | 干燥装置及干燥工艺 |
| TWI812812B (zh) * | 2018-12-20 | 2023-08-21 | 美商凱特伊夫公司 | 使用具有溫度控制的基材支撐件之噴墨式印刷機以及將材料沉積在基材上的方法 |
| CN111384310A (zh) * | 2018-12-29 | 2020-07-07 | 广东聚华印刷显示技术有限公司 | 有机薄膜的成膜方法及其应用 |
| CN111483235A (zh) * | 2019-06-21 | 2020-08-04 | 广东聚华印刷显示技术有限公司 | 发光器件的喷墨印刷方法和喷墨印刷装置 |
| CN110350110A (zh) * | 2019-06-24 | 2019-10-18 | 深圳市华星光电技术有限公司 | 干燥装置及干燥方法 |
| CN112848701A (zh) * | 2021-01-07 | 2021-05-28 | 深圳市华星光电半导体显示技术有限公司 | 真空干燥装置 |
| CN115371368A (zh) * | 2021-08-26 | 2022-11-22 | 广东聚华印刷显示技术有限公司 | 烘烤设备以及烘烤方法 |
| TW202411079A (zh) * | 2022-09-02 | 2024-03-16 | 美商凱特伊夫公司 | 多區段邊緣校正 |
| JP7595051B2 (ja) * | 2022-10-13 | 2024-12-05 | 株式会社Screenホールディングス | 減圧乾燥装置および減圧乾燥方法 |
| JP7689148B2 (ja) * | 2023-01-25 | 2025-06-05 | 株式会社Screenホールディングス | 減圧乾燥装置および減圧乾燥方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH08124818A (ja) * | 1994-10-26 | 1996-05-17 | Tokyo Electron Ltd | 熱処理装置 |
| JP2001244241A (ja) * | 2000-02-28 | 2001-09-07 | Semiconductor Leading Edge Technologies Inc | レジスト灰化装置およびウエハー昇温方法 |
| JP2012209559A (ja) * | 2009-12-18 | 2012-10-25 | Jet Co Ltd | 基板処理装置 |
Family Cites Families (32)
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| JPS6144034A (ja) | 1984-08-07 | 1986-03-03 | Omron Tateisi Electronics Co | 車両のスイツチ制御装置 |
| KR100244041B1 (ko) | 1995-08-05 | 2000-02-01 | 엔도 마코토 | 기판처리장치 |
| US6228171B1 (en) | 1999-01-29 | 2001-05-08 | Tokyo Electron Ltd. | Heat processing apparatus |
| TW504941B (en) | 1999-07-23 | 2002-10-01 | Semiconductor Energy Lab | Method of fabricating an EL display device, and apparatus for forming a thin film |
| JP2001326162A (ja) | 2000-05-17 | 2001-11-22 | Canon Inc | 半導体製造装置および半導体デバイス製造方法 |
| JP2003007800A (ja) | 2001-06-21 | 2003-01-10 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| JP2007175703A (ja) * | 2001-09-27 | 2007-07-12 | Fujifilm Corp | 塗布膜の乾燥方法及び装置 |
| JP4066661B2 (ja) | 2002-01-23 | 2008-03-26 | セイコーエプソン株式会社 | 有機el装置の製造装置および液滴吐出装置 |
| JP3979113B2 (ja) | 2002-02-12 | 2007-09-19 | セイコーエプソン株式会社 | チャンバ装置の大気置換方法、チャンバ装置、これを備えた電気光学装置および有機el装置 |
| JP4354675B2 (ja) | 2002-06-04 | 2009-10-28 | ローツェ株式会社 | 薄板状電子部品クリーン移載装置および薄板状電子製品製造システム |
| JP3690380B2 (ja) * | 2002-08-02 | 2005-08-31 | セイコーエプソン株式会社 | 材料の配置方法、電子装置の製造方法、電気光学装置の製造方法 |
| KR101035850B1 (ko) | 2003-11-17 | 2011-05-19 | 삼성전자주식회사 | 박막 형성용 프린팅 설비 |
| TWI225008B (en) | 2003-12-31 | 2004-12-11 | Ritdisplay Corp | Ink-jet printing apparatus |
| JP2006085933A (ja) | 2004-09-14 | 2006-03-30 | Toshiba Matsushita Display Technology Co Ltd | 表示装置の製造方法及び製造装置 |
| JP4726123B2 (ja) | 2005-09-27 | 2011-07-20 | 大日本スクリーン製造株式会社 | 塗布システム |
| WO2008069259A1 (en) * | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device |
| US20090295857A1 (en) | 2008-05-28 | 2009-12-03 | Toshiba Tec Kabushiki Kaisha | Ink jet printing apparatus |
| EP2406813A4 (en) * | 2009-03-09 | 2012-07-25 | Du Pont | METHOD FOR FORMING AN ELECTROACTIVE LAYER |
| JP2011065967A (ja) | 2009-09-18 | 2011-03-31 | Toppan Printing Co Ltd | 有機el用加熱乾燥装置 |
| WO2011062043A1 (en) | 2009-11-20 | 2011-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5577685B2 (ja) | 2009-12-15 | 2014-08-27 | 三菱化学株式会社 | 有機電界発光素子の製造方法、有機電界発光素子、有機el表示装置及び有機el照明 |
| JP5423706B2 (ja) | 2010-03-15 | 2014-02-19 | 三菱化学株式会社 | 有機電界発光素子の製造方法、有機電界発光素子、有機el照明、及び有機el表示装置 |
| JP5624047B2 (ja) * | 2010-06-30 | 2014-11-12 | パナソニック株式会社 | 有機el表示パネルとその製造方法 |
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| JP2013249999A (ja) * | 2012-05-31 | 2013-12-12 | Konica Minolta Inc | 塗布膜の乾燥装置及び乾燥方法 |
| JP6181358B2 (ja) * | 2012-07-25 | 2017-08-16 | 東京エレクトロン株式会社 | ベーク処理システム及び有機el素子の有機機能膜の積層体の製造方法 |
| JP6328434B2 (ja) | 2013-03-14 | 2018-05-23 | 東京エレクトロン株式会社 | 乾燥装置及び乾燥処理方法 |
| JP5880485B2 (ja) * | 2013-05-13 | 2016-03-09 | 住友金属鉱山株式会社 | 成膜装置およびこれを用いた金属化樹脂フィルムの製造方法 |
| US10468279B2 (en) | 2013-12-26 | 2019-11-05 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
-
2016
- 2016-11-14 EP EP16866924.0A patent/EP3377234A4/en not_active Withdrawn
- 2016-11-14 CN CN201680066956.9A patent/CN108348954A/zh active Pending
- 2016-11-14 JP JP2018524783A patent/JP2019505750A/ja active Pending
- 2016-11-14 KR KR1020187015930A patent/KR20180082498A/ko not_active Withdrawn
- 2016-11-14 WO PCT/US2016/061932 patent/WO2017087337A1/en not_active Ceased
- 2016-11-14 US US15/351,424 patent/US10115900B2/en active Active
- 2016-11-16 TW TW105137435A patent/TW201724614A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08124818A (ja) * | 1994-10-26 | 1996-05-17 | Tokyo Electron Ltd | 熱処理装置 |
| JP2001244241A (ja) * | 2000-02-28 | 2001-09-07 | Semiconductor Leading Edge Technologies Inc | レジスト灰化装置およびウエハー昇温方法 |
| JP2012209559A (ja) * | 2009-12-18 | 2012-10-25 | Jet Co Ltd | 基板処理装置 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021532541A (ja) * | 2018-07-23 | 2021-11-25 | カティーバ, インコーポレイテッド | パターン形成された有機発光ダイオードの配合物を乾燥させるシステムおよび方法 |
| JP7422414B2 (ja) | 2018-07-23 | 2024-01-26 | カティーバ, インコーポレイテッド | パターン形成された有機発光ダイオードの配合物を乾燥させるシステムおよび方法 |
| JP2022020214A (ja) * | 2020-07-20 | 2022-02-01 | 株式会社Joled | 自発光型表示パネル、及び自発光型表示パネルの製造方法 |
| JP7518685B2 (ja) | 2020-07-20 | 2024-07-18 | JDI Design and Development 合同会社 | 自発光型表示パネル、及び自発光型表示パネルの製造方法 |
| JP2022078586A (ja) * | 2020-11-13 | 2022-05-25 | 株式会社Screenホールディングス | 減圧乾燥装置 |
| JP7520696B2 (ja) | 2020-11-13 | 2024-07-23 | 株式会社Screenホールディングス | 減圧乾燥装置 |
| WO2025197342A1 (ja) * | 2024-03-19 | 2025-09-25 | キヤノン株式会社 | 基板処理装置、基板処理方法及び物品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3377234A1 (en) | 2018-09-26 |
| US20170141310A1 (en) | 2017-05-18 |
| TW201724614A (zh) | 2017-07-01 |
| KR20180082498A (ko) | 2018-07-18 |
| CN108348954A (zh) | 2018-07-31 |
| US10115900B2 (en) | 2018-10-30 |
| EP3377234A4 (en) | 2019-08-07 |
| WO2017087337A1 (en) | 2017-05-26 |
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