TW201724614A - 熱加工基板的系統及方法 - Google Patents
熱加工基板的系統及方法 Download PDFInfo
- Publication number
- TW201724614A TW201724614A TW105137435A TW105137435A TW201724614A TW 201724614 A TW201724614 A TW 201724614A TW 105137435 A TW105137435 A TW 105137435A TW 105137435 A TW105137435 A TW 105137435A TW 201724614 A TW201724614 A TW 201724614A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- drying
- various embodiments
- module
- temperature
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 387
- 238000000034 method Methods 0.000 title claims abstract description 168
- 238000012545 processing Methods 0.000 title claims description 17
- 238000001035 drying Methods 0.000 claims abstract description 329
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims description 67
- 238000010438 heat treatment Methods 0.000 claims description 50
- 238000009833 condensation Methods 0.000 claims description 31
- 230000005494 condensation Effects 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 7
- 238000009472 formulation Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 138
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000011165 process development Methods 0.000 abstract description 17
- 239000007789 gas Substances 0.000 description 216
- 239000002904 solvent Substances 0.000 description 85
- 239000000976 ink Substances 0.000 description 44
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 30
- 238000001704 evaporation Methods 0.000 description 25
- 238000000576 coating method Methods 0.000 description 24
- 230000008020 evaporation Effects 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 22
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 20
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 20
- 239000001301 oxygen Substances 0.000 description 20
- 229910052760 oxygen Inorganic materials 0.000 description 20
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 19
- 238000004891 communication Methods 0.000 description 19
- 238000000746 purification Methods 0.000 description 16
- 238000001816 cooling Methods 0.000 description 15
- 229910052757 nitrogen Inorganic materials 0.000 description 15
- 238000005086 pumping Methods 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000001914 filtration Methods 0.000 description 12
- 229910052786 argon Inorganic materials 0.000 description 10
- 238000009835 boiling Methods 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 230000007717 exclusion Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000012530 fluid Substances 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- -1 moisture Chemical compound 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000007639 printing Methods 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 239000012159 carrier gas Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000006132 parent glass Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 241001080798 Polygala tenuifolia Species 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000004941 influx Effects 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000010017 yuan zhi Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1291—Process of deposition of the inorganic material by heating of the substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Solid Materials (AREA)
- Electroluminescent Light Sources (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562255928P | 2015-11-16 | 2015-11-16 | |
| PCT/US2016/061932 WO2017087337A1 (en) | 2015-11-16 | 2016-11-14 | Systems and methods for thermal processing of a substrate |
| US15/351,424 US10115900B2 (en) | 2015-11-16 | 2016-11-14 | Systems and methods for thermal processing of a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201724614A true TW201724614A (zh) | 2017-07-01 |
Family
ID=58691397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105137435A TW201724614A (zh) | 2015-11-16 | 2016-11-16 | 熱加工基板的系統及方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10115900B2 (enExample) |
| EP (1) | EP3377234A4 (enExample) |
| JP (1) | JP2019505750A (enExample) |
| KR (1) | KR20180082498A (enExample) |
| CN (1) | CN108348954A (enExample) |
| TW (1) | TW201724614A (enExample) |
| WO (1) | WO2017087337A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI713118B (zh) * | 2018-08-01 | 2020-12-11 | 日商斯庫林集團股份有限公司 | 熱處理裝置 |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
| US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
| US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
| US12064979B2 (en) | 2008-06-13 | 2024-08-20 | Kateeva, Inc. | Low-particle gas enclosure systems and methods |
| US10468279B2 (en) | 2013-12-26 | 2019-11-05 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
| WO2015112454A1 (en) | 2014-01-21 | 2015-07-30 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
| WO2015168036A1 (en) | 2014-04-30 | 2015-11-05 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
| US10648075B2 (en) * | 2015-03-23 | 2020-05-12 | Goodrich Corporation | Systems and methods for chemical vapor infiltration and densification of porous substrates |
| US10615378B2 (en) * | 2016-09-30 | 2020-04-07 | Tokyo Electron Limited | Reduced-pressure drying apparatus |
| JP6920131B2 (ja) * | 2017-08-10 | 2021-08-18 | 東京エレクトロン株式会社 | 減圧乾燥装置 |
| CN108296067A (zh) * | 2017-09-11 | 2018-07-20 | 郑州大学 | 一种大直径化工管道表面喷漆装置 |
| KR20210033989A (ko) * | 2018-07-23 | 2021-03-29 | 카티바, 인크. | 패턴화된 oled 제형을 건조하기 위한 시스템 및 방법 |
| CN111086330B (zh) * | 2018-10-23 | 2021-08-31 | 广东聚华印刷显示技术有限公司 | 干燥装置及干燥工艺 |
| TWI812812B (zh) * | 2018-12-20 | 2023-08-21 | 美商凱特伊夫公司 | 使用具有溫度控制的基材支撐件之噴墨式印刷機以及將材料沉積在基材上的方法 |
| CN111384310A (zh) * | 2018-12-29 | 2020-07-07 | 广东聚华印刷显示技术有限公司 | 有机薄膜的成膜方法及其应用 |
| CN111483235A (zh) * | 2019-06-21 | 2020-08-04 | 广东聚华印刷显示技术有限公司 | 发光器件的喷墨印刷方法和喷墨印刷装置 |
| CN110350110A (zh) * | 2019-06-24 | 2019-10-18 | 深圳市华星光电技术有限公司 | 干燥装置及干燥方法 |
| JP7518685B2 (ja) * | 2020-07-20 | 2024-07-18 | ＪＤＩ Ｄｅｓｉｇｎ ａｎｄ Ｄｅｖｅｌｏｐｍｅｎｔ 合同会社 | 自発光型表示パネル、及び自発光型表示パネルの製造方法 |
| JP7520696B2 (ja) * | 2020-11-13 | 2024-07-23 | 株式会社Ｓｃｒｅｅｎホールディングス | 減圧乾燥装置 |
| CN112848701A (zh) * | 2021-01-07 | 2021-05-28 | 深圳市华星光电半导体显示技术有限公司 | 真空干燥装置 |
| CN115371368A (zh) * | 2021-08-26 | 2022-11-22 | 广东聚华印刷显示技术有限公司 | 烘烤设备以及烘烤方法 |
| TW202411079A (zh) * | 2022-09-02 | 2024-03-16 | 美商凱特伊夫公司 | 多區段邊緣校正 |
| JP7595051B2 (ja) * | 2022-10-13 | 2024-12-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 減圧乾燥装置および減圧乾燥方法 |
| JP7689148B2 (ja) * | 2023-01-25 | 2025-06-05 | 株式会社Ｓｃｒｅｅｎホールディングス | 減圧乾燥装置および減圧乾燥方法 |
| JP2025144135A (ja) * | 2024-03-19 | 2025-10-02 | キヤノン株式会社 | 基板処理装置、基板処理方法及び物品の製造方法 |
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| JPS6144034A (ja) | 1984-08-07 | 1986-03-03 | Omron Tateisi Electronics Co | 車両のスイツチ制御装置 |
| JP3052116B2 (ja) * | 1994-10-26 | 2000-06-12 | 東京エレクトロン株式会社 | 熱処理装置 |
| KR100244041B1 (ko) | 1995-08-05 | 2000-02-01 | 엔도 마코토 | 기판처리장치 |
| US6228171B1 (en) | 1999-01-29 | 2001-05-08 | Tokyo Electron Ltd. | Heat processing apparatus |
| TW504941B (en) | 1999-07-23 | 2002-10-01 | Semiconductor Energy Lab | Method of fabricating an EL display device, and apparatus for forming a thin film |
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| JP2003007800A (ja) | 2001-06-21 | 2003-01-10 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| JP2007175703A (ja) * | 2001-09-27 | 2007-07-12 | Fujifilm Corp | 塗布膜の乾燥方法及び装置 |
| JP4066661B2 (ja) | 2002-01-23 | 2008-03-26 | セイコーエプソン株式会社 | 有機ｅｌ装置の製造装置および液滴吐出装置 |
| JP3979113B2 (ja) | 2002-02-12 | 2007-09-19 | セイコーエプソン株式会社 | チャンバ装置の大気置換方法、チャンバ装置、これを備えた電気光学装置および有機ｅｌ装置 |
| JP4354675B2 (ja) | 2002-06-04 | 2009-10-28 | ローツェ株式会社 | 薄板状電子部品クリーン移載装置および薄板状電子製品製造システム |
| JP3690380B2 (ja) * | 2002-08-02 | 2005-08-31 | セイコーエプソン株式会社 | 材料の配置方法、電子装置の製造方法、電気光学装置の製造方法 |
| KR101035850B1 (ko) | 2003-11-17 | 2011-05-19 | 삼성전자주식회사 | 박막 형성용 프린팅 설비 |
| TWI225008B (en) | 2003-12-31 | 2004-12-11 | Ritdisplay Corp | Ink-jet printing apparatus |
| JP2006085933A (ja) | 2004-09-14 | 2006-03-30 | Toshiba Matsushita Display Technology Co Ltd | 表示装置の製造方法及び製造装置 |
| JP4726123B2 (ja) | 2005-09-27 | 2011-07-20 | 大日本スクリーン製造株式会社 | 塗布システム |
| WO2008069259A1 (en) * | 2006-12-05 | 2008-06-12 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device |
| US20090295857A1 (en) | 2008-05-28 | 2009-12-03 | Toshiba Tec Kabushiki Kaisha | Ink jet printing apparatus |
| EP2406813A4 (en) * | 2009-03-09 | 2012-07-25 | Du Pont | METHOD FOR FORMING AN ELECTROACTIVE LAYER |
| JP2011065967A (ja) | 2009-09-18 | 2011-03-31 | Toppan Printing Co Ltd | 有機ｅｌ用加熱乾燥装置 |
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| JP5577685B2 (ja) | 2009-12-15 | 2014-08-27 | 三菱化学株式会社 | 有機電界発光素子の製造方法、有機電界発光素子、有機ｅｌ表示装置及び有機ｅｌ照明 |
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| JP5423706B2 (ja) | 2010-03-15 | 2014-02-19 | 三菱化学株式会社 | 有機電界発光素子の製造方法、有機電界発光素子、有機ｅｌ照明、及び有機ｅｌ表示装置 |
| JP5624047B2 (ja) * | 2010-06-30 | 2014-11-12 | パナソニック株式会社 | 有機ｅｌ表示パネルとその製造方法 |
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| JP2013249999A (ja) * | 2012-05-31 | 2013-12-12 | Konica Minolta Inc | 塗布膜の乾燥装置及び乾燥方法 |
| JP6181358B2 (ja) * | 2012-07-25 | 2017-08-16 | 東京エレクトロン株式会社 | ベーク処理システム及び有機ｅｌ素子の有機機能膜の積層体の製造方法 |
| JP6328434B2 (ja) | 2013-03-14 | 2018-05-23 | 東京エレクトロン株式会社 | 乾燥装置及び乾燥処理方法 |
| JP5880485B2 (ja) * | 2013-05-13 | 2016-03-09 | 住友金属鉱山株式会社 | 成膜装置およびこれを用いた金属化樹脂フィルムの製造方法 |
| US10468279B2 (en) | 2013-12-26 | 2019-11-05 | Kateeva, Inc. | Apparatus and techniques for thermal treatment of electronic devices |
-
2016
- 2016-11-14 EP EP16866924.0A patent/EP3377234A4/en not_active Withdrawn
- 2016-11-14 CN CN201680066956.9A patent/CN108348954A/zh active Pending
- 2016-11-14 JP JP2018524783A patent/JP2019505750A/ja active Pending
- 2016-11-14 KR KR1020187015930A patent/KR20180082498A/ko not_active Withdrawn
- 2016-11-14 WO PCT/US2016/061932 patent/WO2017087337A1/en not_active Ceased
- 2016-11-14 US US15/351,424 patent/US10115900B2/en active Active
- 2016-11-16 TW TW105137435A patent/TW201724614A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI713118B (zh) * | 2018-08-01 | 2020-12-11 | 日商斯庫林集團股份有限公司 | 熱處理裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3377234A1 (en) | 2018-09-26 |
| US20170141310A1 (en) | 2017-05-18 |
| KR20180082498A (ko) | 2018-07-18 |
| JP2019505750A (ja) | 2019-02-28 |
| CN108348954A (zh) | 2018-07-31 |
| US10115900B2 (en) | 2018-10-30 |
| EP3377234A4 (en) | 2019-08-07 |
| WO2017087337A1 (en) | 2017-05-26 |
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