JP2019195049A - 基板処理システム - Google Patents
基板処理システム Download PDFInfo
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- JP2019195049A JP2019195049A JP2019048109A JP2019048109A JP2019195049A JP 2019195049 A JP2019195049 A JP 2019195049A JP 2019048109 A JP2019048109 A JP 2019048109A JP 2019048109 A JP2019048109 A JP 2019048109A JP 2019195049 A JP2019195049 A JP 2019195049A
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- 239000000758 substrate Substances 0.000 title claims abstract description 146
- 238000012545 processing Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 claims abstract description 285
- 239000000498 cooling water Substances 0.000 claims description 59
- 230000003028 elevating effect Effects 0.000 claims description 40
- 238000005086 pumping Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000007789 gas Substances 0.000 description 182
- 230000005855 radiation Effects 0.000 description 37
- 238000012423 maintenance Methods 0.000 description 13
- 230000001965 increasing effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B1/00—Shaft or like vertical or substantially vertical furnaces
- F27B1/10—Details, accessories, or equipment peculiar to furnaces of these types
- F27B1/24—Cooling arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/32779—Continuous moving of batches of workpieces
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
11:第1の軸
12:第2の軸
13:第1の軸と第2の軸との交差点
20:冷却水供給ライン
30:ガス供給ライン
31:ガスライン
31a:第1のガスライン
31b:第2のガスライン
40:メンテナンス空間
51:排気ポンピングポート
52:吸熱ポンピングポート
100:基板処理システム
110:工程チューブ
110a:第1の工程チューブ
110b:第2の工程チューブ
115:工程部又は工程領域
120:基板ボート
130:ボート昇降器
130a:第1のボート昇降器
130b:第2のボート昇降器
131:昇降軸部材
131a:ボールスクリュー
131b:ガイドレール
131c:垂直フレーム
131d:フレーム受け台
132:昇降体
132a:ベース板
132b:摺動部
133:支持プレート
140:ユーティリティモジュール
140a:第1のユーティリティモジュール
140b:第2のユーティリティモジュール
141:冷却水制御部
142:ガス制御部
143:排気ダクト収容部
144:放熱ライン収容部
150:排気ダクト
150a:第1の排気ダクト
150b:第2の排気ダクト
160:第1及び第2のヒータ部
170:急速放熱ガスライン
170a:第1の急速放熱ガスライン
170b:第2の急速放熱ガスライン
Claims (12)
- 第1の軸の方向に離間して配置され、互いに独立した工程空間を与える第1及び第2の工程チューブと、
複数枚の基板が多段に積載され、前記第1及び第2の工程チューブの工程空間にそれぞれ配設される基板ボートと、
前記第1及び第2の工程チューブにそれぞれ配設され、前記基板ボートを昇降させる第1及び第2のボート昇降器と、
を備え、
前記第1及び第2のボート昇降器のそれぞれは、前記第1及び第2の工程チューブ間の空間に配置される昇降軸部材を備える基板処理システム。 - 前記第1のボート昇降器の昇降軸部材と前記第2のボート昇降器の昇降軸部材は、互いに点対称となるように前記第1の軸の両側に配置される請求項1に記載の基板処理システム。
- 前記第1及び第2のボート昇降器のそれぞれは、
前記昇降軸部材に連結されて前記昇降軸部材に沿って昇降する昇降体と、
前記昇降体と結合され、前記基板ボートを支持する支持プレートと、
を備え、
前記昇降体は、前記支持プレートの中心から前記第1の軸の方向と交差する第2の軸の方向に外れて前記支持プレートと結合される請求項1に記載の基板処理システム。 - 前記昇降軸部材は、
スクリューシャフトとボールナットにより構成され、前記スクリューシャフトの回転を用いて前記ボールナットを移動させるボールスクリューと、
前記スクリューシャフトの両側に配置される複数のガイドレールと、
を備える請求項3に記載の基板処理システム。 - 前記昇降体は、
前記ボールナットと結合され、前記スクリューシャフトに沿って延びるベース板と、
前記ベース板に前記ボールナットの両側にそれぞれ配置されるように結合され、前記複数のガイドレールにそれぞれ連結されて滑走する複数の摺動部と、
を備える請求項4に記載の基板処理システム。 - 前記昇降軸部材は、
前記スクリューシャフトに沿って延び、前記スクリューシャフトと前記複数のガイドレールが支持される垂直フレームを更に備える請求項4に記載の基板処理システム。 - 前記第1及び第2の工程チューブに対応してそれぞれ配設され、前記第1及び第2の工程チューブのうち、対応する工程チューブの中心における前記第1の軸の垂直軸から外れて対称的に配置される第1及び第2のユーティリティモジュールを更に備える請求項1に記載の基板処理システム。
- 前記第1及び第2のユーティリティモジュールのそれぞれは、前記対応する工程チューブから遠ざかる向きに延びる請求項7に記載の基板処理システム。
- 前記第1及び第2のユーティリティモジュールのそれぞれは、
前記対応する工程チューブから延びる冷却水供給ラインと連結され、冷却水の供給を制御する冷却水制御部と、
前記対応する工程チューブから延びるガス供給ラインと連結され、工程ガスの供給を制御するガス制御部と、
を備え、
前記第1及び第2のユーティリティモジュールのそれぞれにおいては、前記冷却水制御部が前記ガス制御部よりも前記対応する工程チューブに近付いて配置される請求項7に記載の基板処理システム。 - 前記第1及び第2の工程チューブにそれぞれ配設され、端部が複数の排気ポンピングポートにそれぞれ連結される第1及び第2の排気ダクトと、
前記第1及び第2の工程チューブにそれぞれ配設されて、前記第1及び第2の工程チューブにそれぞれ熱を供給する第1及び第2のヒータ部と、
前記第1及び第2のヒータ部をそれぞれ冷却させ、端部が複数の吸熱ポンピングポートにそれぞれ連結される第1及び第2の急速放熱ガスラインと、
を更に備え、
前記第1及び第2のユーティリティモジュールのそれぞれには、前記対応する工程チューブに配設される排気ダクトの端部及び前記対応する工程チューブに熱を供給したヒータ部を冷却させる急速放熱ガスラインの端部が配置され、
前記第1及び第2のユーティリティモジュールのそれぞれにおいては、前記配置された排気ダクトの端部が前記配置された急速放熱ガスラインの端部よりも前記対応する工程チューブに近付いて配置される請求項9に記載の基板処理システム。 - 前記ガス供給ラインのそれぞれは、複数本のガスラインを備え、
前記第1の工程チューブに連結されるガス供給ラインの前記複数本のガスラインと、前記第2の工程チューブに連結されるガス供給ラインの前記複数本のガスラインは互いに対称的に配置され、
互いに対称的なガスラインには、同じガスが供給される請求項9に記載の基板処理システム。 - 前記第1及び第2の工程チューブのそれぞれは、単一のチューブ、または外部チューブと内部チューブを備える複数のチューブにより構成される請求項1に記載の基板処理システム。
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Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020180051460A KR101930456B1 (ko) | 2018-05-03 | 2018-05-03 | 기판 처리 시스템 |
KR10-2018-0051460 | 2018-05-03 |
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JP2019195049A true JP2019195049A (ja) | 2019-11-07 |
JP6811273B2 JP6811273B2 (ja) | 2021-01-13 |
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JP2019048109A Active JP6811273B2 (ja) | 2018-05-03 | 2019-03-15 | 基板処理システム |
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US (1) | US11251056B2 (ja) |
JP (1) | JP6811273B2 (ja) |
KR (1) | KR101930456B1 (ja) |
CN (1) | CN110444500B (ja) |
TW (1) | TWI686892B (ja) |
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US11251056B2 (en) | 2022-02-15 |
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JP6811273B2 (ja) | 2021-01-13 |
CN110444500A (zh) | 2019-11-12 |
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US20190341278A1 (en) | 2019-11-07 |
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