JP2019188448A - フラックス及びソルダペースト - Google Patents
フラックス及びソルダペースト Download PDFInfo
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- JP2019188448A JP2019188448A JP2018085404A JP2018085404A JP2019188448A JP 2019188448 A JP2019188448 A JP 2019188448A JP 2018085404 A JP2018085404 A JP 2018085404A JP 2018085404 A JP2018085404 A JP 2018085404A JP 2019188448 A JP2019188448 A JP 2019188448A
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- Prior art keywords
- alcohol compound
- flux
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- weight
- heating
- Prior art date
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- 230000004907 flux Effects 0.000 title claims abstract description 132
- 229910000679 solder Inorganic materials 0.000 title claims description 23
- -1 alcohol compound Chemical class 0.000 claims abstract description 159
- 238000010438 heat treatment Methods 0.000 claims abstract description 92
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 31
- 238000002844 melting Methods 0.000 claims abstract description 21
- 230000008018 melting Effects 0.000 claims abstract description 21
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 56
- 235000011187 glycerol Nutrition 0.000 claims description 28
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 26
- ZWNMRZQYWRLGMM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diol Chemical compound CC(C)(O)CCC(C)(C)O ZWNMRZQYWRLGMM-UHFFFAOYSA-N 0.000 claims description 21
- 150000001412 amines Chemical class 0.000 claims description 21
- 239000013008 thixotropic agent Substances 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 150000007524 organic acids Chemical class 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 14
- 239000004094 surface-active agent Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 5
- 150000002366 halogen compounds Chemical class 0.000 claims description 5
- 230000003078 antioxidant effect Effects 0.000 claims description 4
- 239000003086 colorant Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 42
- 238000000518 rheometry Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 37
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 11
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- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 11
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- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 10
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
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- 239000002184 metal Substances 0.000 description 7
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- 229910044991 metal oxide Inorganic materials 0.000 description 5
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- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- 239000012190 activator Substances 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 150000001408 amides Chemical class 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- 238000002411 thermogravimetry Methods 0.000 description 4
- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004359 castor oil Substances 0.000 description 3
- 235000019438 castor oil Nutrition 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 239000000539 dimer Substances 0.000 description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 3
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 150000004671 saturated fatty acids Chemical class 0.000 description 3
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 3
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 3
- MELXIJRBKWTTJH-ONEGZZNKSA-N (e)-2,3-dibromobut-2-ene-1,4-diol Chemical compound OC\C(Br)=C(/Br)CO MELXIJRBKWTTJH-ONEGZZNKSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- GLDQAMYCGOIJDV-UHFFFAOYSA-N 2,3-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1O GLDQAMYCGOIJDV-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
- XQXPVVBIMDBYFF-UHFFFAOYSA-N 4-hydroxyphenylacetic acid Chemical compound OC(=O)CC1=CC=C(O)C=C1 XQXPVVBIMDBYFF-UHFFFAOYSA-N 0.000 description 2
- QEVGZEDELICMKH-UHFFFAOYSA-N Diglycolic acid Chemical compound OC(=O)COCC(O)=O QEVGZEDELICMKH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- CBFCDTFDPHXCNY-UHFFFAOYSA-N icosane Chemical compound CCCCCCCCCCCCCCCCCCCC CBFCDTFDPHXCNY-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 150000002896 organic halogen compounds Chemical class 0.000 description 2
- AKTJDQZOTDDMKB-UHFFFAOYSA-N oxirane;2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical class C1CO1.CC(C)CC(C)(O)C#CC(C)(O)CC(C)C AKTJDQZOTDDMKB-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- 229920002647 polyamide Polymers 0.000 description 2
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- PBODPHKDNYVCEJ-UHFFFAOYSA-M 1-benzyl-3-dodecyl-2-methylimidazol-1-ium;chloride Chemical compound [Cl-].CCCCCCCCCCCCN1C=C[N+](CC=2C=CC=CC=2)=C1C PBODPHKDNYVCEJ-UHFFFAOYSA-M 0.000 description 1
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- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
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- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- OADIZUFHUPTFAG-UHFFFAOYSA-N 2-[2-(2-ethylhexoxy)ethoxy]ethanol Chemical compound CCCCC(CC)COCCOCCO OADIZUFHUPTFAG-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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Abstract
Description
本実施の形態のフラックスは、OH基を2個以上有し、融点が25℃未満の第1のアルコール化合物と、OH基を2個以上有し、融点が25℃超の第2のアルコール化合物とを含み、25℃での粘度が10Pa・s以上50Pa・s以下、100℃での粘度が0Pa・s超1Pa・s以下である。
本実施の形態のソルダペーストは、上述したフラックスと、金属粉を含む。金属粉は、Pbを含まないはんだであることが好ましく、Sn単体、または、Sn−Ag系、Sn−Cu系、Sn−Ag−Cu系、Sn−Bi系、Sn-In系等、あるいは、これらの合金にSb、Bi、In、Cu、Zn、As、Ag、Cd、Fe、Ni、Co、Au、Ge、P等を添加したはんだの粉体で構成される。
OH基を2個以上有し、融点が25℃未満の第1のアルコール化合物と、OH基を2個以上有し、融点が25℃超の第2のアルコール化合物とを含み、25℃での粘度が10Pa・s以上50Pa・s以下、100℃での粘度が0Pa・s超1Pa・s以下であり、また、熱重量測定法による測定で、10mgの当該フラックスを、N2雰囲気下で、25℃〜250℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の15%以下であるフラックス、及び、このフラックスを用いたソルダペーストでは、ロジン等、樹脂等のベース剤、チキソ剤の含有量を減らしても、または、ロジンを含まなくても、更にはロジン以外のベース剤、チキソ剤を含まなくても、常温時と、はんだ付けで想定される熱履歴の双方で、それぞれに適した所定のレオロジー特性を持たせることができる。
(1)検証方法
実施例、比較例のフラックスについて、25℃及び100℃における粘度を測定した。実施例、比較例のフラックスの25℃における粘度の測定は、マルコム社製PCU−205の粘度計を使用した。測定法は、JIS Z 3284に準拠する。実施例、比較例のフラックスの100℃における粘度測定は、レオメータ(Thermo Scientific HAAKE MARS III(登録商標))のプレート間に挟んだ後、6Hzでプレートを回転させることにより測定した。
(2−a)25℃における粘度
〇:25℃での粘度が10Pa・s以上50Pa・s以下であった。
×:25℃での粘度が10Pa・s未満または50Pa・s超であった。
(2−b)100℃における粘度
〇:100℃での粘度が0Pa・s超1Pa・s以下であった。
×:100℃での粘度が1Pa・s超であった。
(1)検証方法
TG法(熱重量測定法)による試験評価方法として、アルミパンに各実施例及び各比較例のフラックスを10mg詰めて、ULVAC社製TGD9600を用いてN2雰囲気下で25℃〜250℃まで、昇温速度10℃/minにて加熱した。加熱後の各フラックスの重量が、加熱前の5%以下、または、15%以下になったかどうかを測定した。
〇〇:重量が加熱前の5%以下になった。
○:重量が加熱前の5%超15%以下になった。
×:重量が加熱前の15%より大きかった。
〇:25℃、100℃での粘度評価が〇、かつ、残渣量評価が〇〇または〇であった。
×:25℃、100℃での粘度評価、残渣量評価の何れか、または両方が×であった。
Claims (21)
- OH基を2個以上有したアルコール化合物を含むフラックスであって、
OH基を2個以上有し、融点が25℃未満の第1のアルコール化合物と、
OH基を2個以上有し、融点が25℃超の第2のアルコール化合物とを含み、
25℃での粘度が10Pa・s以上50Pa・s以下、100℃での粘度が0Pa・s超1Pa・s以下、10mgの当該フラックスを、N2雰囲気下で、25℃〜250℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の15%以下である
ことを特徴とするフラックス。 - 10mgの当該フラックスを、N2雰囲気下で、25℃〜250℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の5%以下である
ことを特徴とする請求項1に記載のフラックス。 - 第1のアルコール化合物を55wt%以上90wt%以下、第2のアルコール化合物を5wt%以上30wt%以下で含む
ことを特徴とする請求項1または請求項2に記載のフラックス。 - 第1のアルコール化合物/第2のアルコール化合物で表される第1のアルコール化合物と第2のアルコール化合物との重量比が、1.83以上12.40以下である
ことを特徴とする請求項1〜請求項3の何れか1項に記載のフラックス。 - 第1のアルコール化合物及び第2のアルコール化合物は、OH基を2個以上6個以下で有する
ことを特徴とする請求項1〜4の何れか1項に記載のフラックス。 - 第1のアルコール化合物は、OH基を3個以上4個以下で有する
ことを特徴とする請求項5に記載のフラックス。 - 第2のアルコール化合物は、OH基を2個以上4個以下で有する
ことを特徴とする請求項5または請求項6に記載のフラックス。 - 10mgの第1のアルコール化合物を、N2雰囲気下で、25℃〜250℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の15%以下である
ことを特徴とする請求項1〜7の何れか1項に記載のフラックス。 - 10mgの第1のアルコール化合物を、N2雰囲気下で、25℃〜250℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の5%以下である
ことを特徴とする請求項1〜7の何れか1項に記載のフラックス。 - 10mgの第2のアルコール化合物を、N2雰囲気下で、25℃〜250℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の15%以下である
ことを特徴とする請求項1〜9の何れか1項に記載のフラックス。 - 10mgの第2のアルコール化合物を、N2雰囲気下で、25℃〜250℃まで昇温速度10℃/minにて加熱した後の重量が、加熱前の重量の5%以下である
ことを特徴とする請求項1〜9の何れか1項に記載のフラックス。 - 第1のアルコール化合物は、25℃での粘度が10Pa・s未満である
ことを特徴とする請求項1〜請求項11の何れか1項に記載のフラックス。 - 第1のアルコール化合物はグリセリンである
ことを特徴とする請求項1〜請求項12の何れか1項に記載のフラックス。 - 第2のアルコール化合物は、2,5−ジメチルヘキサン−2,5−ジオールである
ことを特徴とする請求項1〜請求項13の何れか1項に記載のフラックス。 - 更に、有機酸を0wt%以上10wt%以下で含む
ことを特徴とする請求項1〜請求項14の何れか1項に記載のフラックス。 - 更に、アミンを0wt%以上10wt%以下で含む
ことを特徴とする請求項1〜請求項15の何れか1項に記載のフラックス。 - 更に、溶剤を0wt%以上15wt%以下で含む
ことを特徴とする請求項1〜請求項16の何れか1項に記載のフラックス。 - 更に、チキソ剤を0wt%以上15wt%以下で含む
ことを特徴とする請求項1〜請求項17の何れか1項に記載のフラックス。 - 更に、ベース剤を0wt%以上10wt%以下で含む
ことを特徴とする請求項1〜請求項18の何れか1項に記載のフラックス。 - 更に、ハロゲン化合物、着色剤、消泡剤、酸化防止剤、界面活性剤のうち、少なくとも1種を含む
ことを特徴とする請求項1〜請求項19の何れか1項に記載のフラックス。 - 請求項1〜請求項20の何れか1項に記載のフラックスとはんだ粉末を含む
ことを特徴とするソルダペースト
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