JP2019186281A5 - - Google Patents

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Publication number
JP2019186281A5
JP2019186281A5 JP2018071779A JP2018071779A JP2019186281A5 JP 2019186281 A5 JP2019186281 A5 JP 2019186281A5 JP 2018071779 A JP2018071779 A JP 2018071779A JP 2018071779 A JP2018071779 A JP 2018071779A JP 2019186281 A5 JP2019186281 A5 JP 2019186281A5
Authority
JP
Japan
Prior art keywords
high frequency
connection portion
connection
underfill
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018071779A
Other languages
English (en)
Japanese (ja)
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JP2019186281A (ja
JP7010116B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2018071779A priority Critical patent/JP7010116B2/ja
Priority claimed from JP2018071779A external-priority patent/JP7010116B2/ja
Priority to PCT/JP2019/011947 priority patent/WO2019193986A1/ja
Publication of JP2019186281A publication Critical patent/JP2019186281A/ja
Publication of JP2019186281A5 publication Critical patent/JP2019186281A5/ja
Application granted granted Critical
Publication of JP7010116B2 publication Critical patent/JP7010116B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018071779A 2018-04-03 2018-04-03 半導体装置 Active JP7010116B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018071779A JP7010116B2 (ja) 2018-04-03 2018-04-03 半導体装置
PCT/JP2019/011947 WO2019193986A1 (ja) 2018-04-03 2019-03-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018071779A JP7010116B2 (ja) 2018-04-03 2018-04-03 半導体装置

Publications (3)

Publication Number Publication Date
JP2019186281A JP2019186281A (ja) 2019-10-24
JP2019186281A5 true JP2019186281A5 (enExample) 2020-12-24
JP7010116B2 JP7010116B2 (ja) 2022-01-26

Family

ID=68100712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018071779A Active JP7010116B2 (ja) 2018-04-03 2018-04-03 半導体装置

Country Status (2)

Country Link
JP (1) JP7010116B2 (enExample)
WO (1) WO2019193986A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7248849B1 (ja) 2022-08-03 2023-03-29 株式会社フジクラ 半導体パッケージおよび高周波モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207222B2 (ja) * 1991-08-29 2001-09-10 株式会社東芝 電子部品装置
JPH06204293A (ja) * 1992-12-28 1994-07-22 Rohm Co Ltd 半導体装置
JP2000269384A (ja) * 1999-03-12 2000-09-29 Nec Corp マイクロ波・ミリ波回路装置及びその製造方法
US7298235B2 (en) * 2004-01-13 2007-11-20 Raytheon Company Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces
JP2006344672A (ja) * 2005-06-07 2006-12-21 Fujitsu Ltd 半導体チップとそれを用いた半導体装置
JP2006287962A (ja) * 2006-05-19 2006-10-19 Mitsubishi Electric Corp 高周波送受信モジュール
JP6183811B2 (ja) * 2014-06-30 2017-08-23 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 接合構造体および無線通信装置
JP6566846B2 (ja) * 2015-11-20 2019-08-28 新日本無線株式会社 中空パッケージ及びその製造方法

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