JP2019147353A - 液体吐出ヘッド用基板の製造方法 - Google Patents
液体吐出ヘッド用基板の製造方法 Download PDFInfo
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
Description
以下に実施例1を示して、本発明の実施形態による液体吐出ヘッド用基板の製造方法について図2を参照しながら詳細を説明する。図2(a)〜(j)は、本発明の実施例1による液体吐出ヘッド用基板の電極パッド部の製造過程を示す断面図である。
以下に実施例2を示して、本発明の実施形態による液体吐出ヘッド用基板の製造方法について図3を参照しながら詳細を説明する。図3(a)〜(j)は、本発明の実施例2による液体吐出ヘッド用基板の電極パッド部の製造過程を示す断面図である。
以下に実施例3を示して、本発明の実施形態による液体吐出ヘッド用基板の製造方法について図4及び図5を参照しながら詳細を説明する。図4(a)〜(j)及び図5(k)〜(l)は、本発明の実施例3による液体吐出ヘッド用基板の電極パッド部の製造過程を示す断面図である。
実施例1の図2(a)に示す工程と同様にして、配線層011及び第二の絶縁層012が形成された積層基板を形成する。
実施例1の図2(a)に示す工程と同様にして、配線層011及び第二の絶縁層012が形成された積層基板を形成する。
002 電極パッド
003 加熱ヒータ
004 インク発泡室
005 ノズル樹脂材料
006 インク吐出口
007 インク供給口
010 第一の絶縁層
011 配線層
012 第二の絶縁層
013 バリアメタル層
014 Au層
015a レジストマスク
015b レジストマスク
015c レジストマスク
020 腐食による空隙
Claims (12)
- 半導体基板上にバリアメタル層を形成する工程と、
前記バリアメタル層上にレジストマスクを形成する工程と、
前記バリアメタル層の直下の層の上面に到達しないように、前記レジストマスクの開口部から露出する前記バリアメタル層に対してドライエッチングを行う工程と、
前記バリアメタル層の直下の層の上面に到達するように、前記ドライエッチングを行う工程の後に残る前記バリアメタル層に対してウェットエッチングを行う工程と、
前記レジストマスクを剥離する工程とを含む、半導体基板の製造方法。 - 前記ドライエッチングによる前記バリアメタル層の厚み方向のエッチング量が、前記ウェットエッチングによる前記バリアメタル層の厚み方向のエッチング量より大きい、請求項1に記載の半導体基板の製造方法。
- 前記バリアメタル層を形成する工程で形成された前記バリアメタル層の膜厚の70%以上を前記ドライエッチングでエッチングし、前記バリアメタル層を形成する工程で形成された前記バリアメタル層の膜厚の30%以下の残りの部分を前記ウェットエッチングでエッチングする、請求項1に記載の半導体基板の製造方法。
- 配線層と、前記配線層上の絶縁層と、前記配線層及び前記絶縁層上のバリアメタル層と、前記バリアメタル層を介して前記配線層と電気的に接続される、前記バリアメタル層上の電極層と、を有する液体吐出ヘッド用基板の製造方法であって、
前記配線層及び前記絶縁層上にバリアメタル層を形成する工程と、
前記バリアメタル層上にレジストマスクを形成する工程と、
前記絶縁層に到達しないように、前記レジストマスクの開口部から露出する前記バリアメタル層に対してドライエッチングを行う工程と、
前記絶縁層に到達するように、前記ドライエッチングを行う工程の後に残る前記バリアメタル層に対してウェットエッチングを行う工程と、
前記レジストマスクを剥離する工程と、
前記ウェットエッチングを行う工程の後に残る前記バリアメタル層上に前記電極層を形成する工程とを含む、液体吐出ヘッド用基板の製造方法。 - 前記ドライエッチングによる前記バリアメタル層の厚み方向のエッチング量が、前記ウェットエッチングによる前記バリアメタル層の厚み方向のエッチング量より大きい、請求項4に記載の液体吐出ヘッド用基板の製造方法。
- 前記バリアメタル層を形成する工程で形成された前記バリアメタル層の膜厚の70%以上を前記ドライエッチングでエッチングし、前記バリアメタル層を形成する工程で形成された前記バリアメタル層の膜厚の30%以下の残りの部分を前記ウェットエッチングでエッチングする、請求項4に記載の液体吐出ヘッド用基板の製造方法。
- 前記バリアメタル層の外周端部を覆うように前記電極層を形成する、請求項4から6のいずれか一項に記載の液体吐出ヘッド用基板の製造方法。
- 前記バリアメタル層の外周端部がテーパー形状に形成され、該テーパー形状の端部を覆うように前記電極層を形成する、請求項4から7のいずれか一項に記載の液体吐出ヘッド用基板の製造方法。
- 前記バリアメタル層の外周端部の前記テーパー形状のテーパー角が30°以上70°未満である、請求項8に記載の液体吐出ヘッド用基板の製造方法。
- 前記電極層が前記バリアメタル層外周の前記絶縁層の上面に接触するように前記電極層を形成する、請求項4から9のいずれか一項に記載の液体吐出ヘッド用基板の製造方法。
- 前記電極層を加工して電極パッドを形成する工程を有し、
前記電極パッドは、前記バリアメタル層の外周端部を覆い、前記バリアメタル層外周の前記絶縁層の上面に接触している、請求項10に記載の液体吐出ヘッド用基板の製造方法。 - 前記電極層がAu層である、請求項4から11のいずれか一項に記載の液体吐出ヘッド用基板の製造方法。
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