JP2019125433A - 電源装置、前照灯、及び移動体 - Google Patents
電源装置、前照灯、及び移動体 Download PDFInfo
- Publication number
- JP2019125433A JP2019125433A JP2018003466A JP2018003466A JP2019125433A JP 2019125433 A JP2019125433 A JP 2019125433A JP 2018003466 A JP2018003466 A JP 2018003466A JP 2018003466 A JP2018003466 A JP 2018003466A JP 2019125433 A JP2019125433 A JP 2019125433A
- Authority
- JP
- Japan
- Prior art keywords
- height
- substrate
- power supply
- supply device
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
- H05K5/0008—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing assembled by screws
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10174—Diode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (11)
- 入力電力を変換して出力電力を生成する電源装置であって、
基板配置面を含む第1部材と、
前記第1部材の前記基板配置面上に配置される基板と、
前記基板の厚さ方向の前記第1部材側とは反対側を被覆する第2部材と、
前記基板上に実装された複数の電子部品と、を備え、
前記複数の電子部品は、1以上の高背部品と、前記高背部品よりも高さが低い1以上の低背部品と、を含み、
前記第2部材は、基準面と、前記基準面から前記厚さ方向の前記基板側とは反対側に窪んだ1以上の凹部と、前記基準面から前記厚さ方向の前記基板側に突出する1以上の凸部と、を含み、
前記高背部品の先端部が、前記凹部の底面に熱的に接続される一方、前記低背部品の先端部が、前記凸部の先端面に熱的に接続される、電源装置。 - 前記基準面は、前記厚さ方向に略直交する平坦面である、請求項1に記載の電源装置。
- 前記第1部材の厚さが、前記第2部材の厚さよりも大きい、請求項1又は2に記載の電源装置。
- 前記複数の電子部品は、前記高背部品よりも高さが低くて前記低背部品よりも高さが高い1以上の中背部品を含み、
前記中背部品の先端部が、前記基準面に熱的に接続される、請求項1乃至3のいずれか1つに記載の電源装置。 - 前記1以上の凹部が、複数の前記高背部品に熱的に接続する大型凹部を含むことと、前記1以上の凸部が、複数の前記低背部品に熱的に接続する大型凸部を含むことのうちの少なくとも一方を満足する、請求項1乃至4のいずれか1つに記載の電源装置。
- 前記第1部材が、一体に形成された複数の放熱フィンを有する、請求項1乃至5のいずれか1つに記載の電源装置。
- 前記各放熱フィンが直線上を延在して、前記複数の放熱フィンは平行に配置され、
前記厚さ方向と、前記放熱フィンの延在方向及び前記厚さ方向の両方に直交する前記放熱フィンの並び方向を含む平面であって、前記複数の放熱フィンが略面対称となる前記平面が存在し、
前記第2部材は、板金で構成される、請求項6に記載の電源装置。 - 前記第1部材は、前記第2部材側に突出する係合突出部を有する一方、前記第2部材は、貫通孔を有し、
前記係合突出部には、前記貫通孔内に配置される孔配置部と、その孔配置部よりも先端側に位置し、前記貫通孔を通過不可能な形状を有する係合部が含まれる、請求項1乃至7のいずれか1つに記載の電源装置。 - 前記第1部材は、押出成形で形成された元材を塑性変形させることで製造される、請求項1乃至8のいずれか1つに記載の電源装置。
- 請求項1乃至9のいずれか1つに記載の電源装置と、
電力が前記電源装置から供給される光源と、
を備える、前照灯。 - 請求項10に記載の前照灯を備える、移動体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018003466A JP7016054B2 (ja) | 2018-01-12 | 2018-01-12 | 電源装置、前照灯、及び移動体 |
US16/235,224 US20190223318A1 (en) | 2018-01-12 | 2018-12-28 | Power supply device, headlight and moving body |
DE102019100166.8A DE102019100166A1 (de) | 2018-01-12 | 2019-01-07 | Stromversorgungsvorrichtung, scheinwerfer und bewegliche karosserie |
CN201910020834.1A CN110043860A (zh) | 2018-01-12 | 2019-01-09 | 电源装置、前照灯以及移动体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018003466A JP7016054B2 (ja) | 2018-01-12 | 2018-01-12 | 電源装置、前照灯、及び移動体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019125433A true JP2019125433A (ja) | 2019-07-25 |
JP7016054B2 JP7016054B2 (ja) | 2022-02-04 |
Family
ID=67213184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018003466A Active JP7016054B2 (ja) | 2018-01-12 | 2018-01-12 | 電源装置、前照灯、及び移動体 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20190223318A1 (ja) |
JP (1) | JP7016054B2 (ja) |
CN (1) | CN110043860A (ja) |
DE (1) | DE102019100166A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021040080A (ja) * | 2019-09-05 | 2021-03-11 | 三菱電機株式会社 | 基板装置、クリーナー、及び基板カバーの製造方法 |
WO2022230645A1 (ja) * | 2021-04-30 | 2022-11-03 | 株式会社小糸製作所 | 点灯制御装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7249282B2 (ja) * | 2018-07-20 | 2023-03-30 | 株式会社ワコム | 防水型電子ペン |
US11369043B2 (en) * | 2018-10-18 | 2022-06-21 | Mitsubishi Electric Corporation | Board housing case |
EP4163537A1 (de) * | 2021-10-11 | 2023-04-12 | ZKW Group GmbH | Leiterplattenanordnung für einen kraftfahrzeugscheinwerfer |
DE102021129189A1 (de) | 2021-11-10 | 2023-05-11 | HELLA GmbH & Co. KGaA | Lichtmodul, Kühlkörper für Lichtmodul und Verfahren zum Herstellen eines Kühlkörpers |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009147107A (ja) * | 2007-12-14 | 2009-07-02 | Toyota Motor Corp | 冷却フィンおよび冷却フィンの製造方法 |
JP2009218254A (ja) * | 2008-03-07 | 2009-09-24 | Panasonic Corp | 回路モジュールとその製造方法 |
JP2014099389A (ja) * | 2012-10-17 | 2014-05-29 | Panasonic Corp | 電源装置および、これを用いた車両用前照灯装置 |
JP2015060709A (ja) * | 2013-09-18 | 2015-03-30 | 株式会社デンソー | 点灯装置及び点灯装置を備えた灯具 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2612339B2 (ja) * | 1989-04-18 | 1997-05-21 | 三菱電機株式会社 | 電子機器筐体 |
EP0512186A1 (en) * | 1991-05-03 | 1992-11-11 | International Business Machines Corporation | Cooling structures and package modules for semiconductors |
US5777844A (en) * | 1996-08-30 | 1998-07-07 | General Electric Company | Electronic control with heat sink |
US6043981A (en) * | 1997-11-13 | 2000-03-28 | Chrysler Corporation | Heat sink assembly for electrical components |
JP2000124374A (ja) * | 1998-10-21 | 2000-04-28 | Furukawa Electric Co Ltd:The | 板型ヒートパイプとそれを用いた冷却構造 |
KR100395953B1 (ko) * | 2001-05-10 | 2003-08-27 | 주식회사 히타치엘지 데이터 스토리지 코리아 | 광기록 또는 재생기기의 방열장치 |
DE10137619A1 (de) * | 2001-08-01 | 2003-02-27 | Infineon Technologies Ag | Abdeckelement für Baugruppen |
DE10213648B4 (de) * | 2002-03-27 | 2011-12-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
JP2005117887A (ja) * | 2003-09-19 | 2005-04-28 | Auto Network Gijutsu Kenkyusho:Kk | 車載用回路ユニットの取付構造及び車載用回路ユニット |
JP2005129734A (ja) * | 2003-10-23 | 2005-05-19 | Sony Corp | 電子機器 |
TWI268526B (en) * | 2003-12-05 | 2006-12-11 | Au Optronics Corp | Plasma display |
US7254032B1 (en) * | 2004-03-03 | 2007-08-07 | Cisco Technology, Inc. | Techniques for providing EMI shielding within a circuit board component |
US7609523B1 (en) * | 2004-09-29 | 2009-10-27 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive and clips |
JP4408444B2 (ja) * | 2007-09-28 | 2010-02-03 | 株式会社日立製作所 | Lcモジュール構造を用いた電子制御装置 |
JP5547938B2 (ja) * | 2008-10-07 | 2014-07-16 | パナソニック株式会社 | 情報処理装置 |
JP4789997B2 (ja) * | 2008-11-20 | 2011-10-12 | 三菱電機株式会社 | 電子基板装置 |
JP5412815B2 (ja) * | 2008-12-04 | 2014-02-12 | 富士通株式会社 | 冷却ジャケット、冷却ユニット、冷却システム及び電子機器 |
DE102009054517B4 (de) * | 2009-12-10 | 2011-12-29 | Robert Bosch Gmbh | Elektronisches Steuergerät |
US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
TWM413319U (en) * | 2011-05-13 | 2011-10-01 | Askey Computer Corp | Heat-dissipating casing for communication apparatus |
CN102892277B (zh) * | 2011-07-20 | 2016-08-03 | 光宝电子(广州)有限公司 | 电路板装置及其制造方法及具有该电路板装置的电源供应器 |
JP5384580B2 (ja) * | 2011-08-05 | 2014-01-08 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP2013197405A (ja) * | 2012-03-21 | 2013-09-30 | Hitachi Automotive Systems Ltd | 電子制御装置 |
US9007773B2 (en) * | 2012-08-31 | 2015-04-14 | Flextronics Ap, Llc | Housing unit with heat sink |
JP6176931B2 (ja) | 2013-01-28 | 2017-08-09 | 株式会社小糸製作所 | 車輌用前照灯 |
JP6141064B2 (ja) * | 2013-03-21 | 2017-06-07 | 日立オートモティブシステムズ株式会社 | 回路基板と筐体の接続方法 |
KR101787921B1 (ko) * | 2013-09-05 | 2017-10-18 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 발광 장치 |
-
2018
- 2018-01-12 JP JP2018003466A patent/JP7016054B2/ja active Active
- 2018-12-28 US US16/235,224 patent/US20190223318A1/en not_active Abandoned
-
2019
- 2019-01-07 DE DE102019100166.8A patent/DE102019100166A1/de active Pending
- 2019-01-09 CN CN201910020834.1A patent/CN110043860A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009147107A (ja) * | 2007-12-14 | 2009-07-02 | Toyota Motor Corp | 冷却フィンおよび冷却フィンの製造方法 |
JP2009218254A (ja) * | 2008-03-07 | 2009-09-24 | Panasonic Corp | 回路モジュールとその製造方法 |
JP2014099389A (ja) * | 2012-10-17 | 2014-05-29 | Panasonic Corp | 電源装置および、これを用いた車両用前照灯装置 |
JP2015060709A (ja) * | 2013-09-18 | 2015-03-30 | 株式会社デンソー | 点灯装置及び点灯装置を備えた灯具 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021040080A (ja) * | 2019-09-05 | 2021-03-11 | 三菱電機株式会社 | 基板装置、クリーナー、及び基板カバーの製造方法 |
WO2022230645A1 (ja) * | 2021-04-30 | 2022-11-03 | 株式会社小糸製作所 | 点灯制御装置 |
Also Published As
Publication number | Publication date |
---|---|
CN110043860A (zh) | 2019-07-23 |
DE102019100166A1 (de) | 2019-08-08 |
JP7016054B2 (ja) | 2022-02-04 |
US20190223318A1 (en) | 2019-07-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2019125433A (ja) | 電源装置、前照灯、及び移動体 | |
US9041196B2 (en) | Semiconductor module arrangement and method for producing and operating a semiconductor module arrangement | |
JP4638923B2 (ja) | 制御装置 | |
US6999318B2 (en) | Heatsinking electronic devices | |
US20190044452A1 (en) | Power supply, lamp, movable device, and method for manufacturing power supply | |
US7321492B2 (en) | Heat sink module for an electronic device | |
TWI557857B (zh) | 功率模組之封裝結構 | |
CN109156090B (zh) | 电路结构体 | |
US20080253090A1 (en) | Ic Component Comprising a Cooling Arrangement | |
EP2706828B1 (en) | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | |
CN108293311B (zh) | 电气接线盒 | |
KR102282209B1 (ko) | 장착 조립체 및 조명 디바이스 | |
US20130170136A1 (en) | Pcb heat sink for power electronics | |
JP6934992B1 (ja) | 電力変換装置 | |
JP6999777B1 (ja) | 電力変換装置 | |
US20200404803A1 (en) | Circuit assembly and electrical junction box | |
US7385285B2 (en) | Light assembly | |
JP6452482B2 (ja) | 電子モジュール | |
JP2008227043A (ja) | 放熱基板とこれを用いた電源ユニット | |
WO2020080248A1 (ja) | 回路構造体及び電気接続箱 | |
CN112119579B (zh) | 功率转换装置 | |
KR101801195B1 (ko) | 조명모듈 제조방법 및 이에 의하여 제조되는 조명모듈 | |
CN216982372U (zh) | 动力部件的散热组件结构 | |
JP5777175B2 (ja) | 電子回路基板およびその組立方法 | |
KR101944756B1 (ko) | 전자부품 방열 기판 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200914 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210720 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210810 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211008 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20211116 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211125 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220104 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220111 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 7016054 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |