JP2019114629A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2019114629A JP2019114629A JP2017246092A JP2017246092A JP2019114629A JP 2019114629 A JP2019114629 A JP 2019114629A JP 2017246092 A JP2017246092 A JP 2017246092A JP 2017246092 A JP2017246092 A JP 2017246092A JP 2019114629 A JP2019114629 A JP 2019114629A
- Authority
- JP
- Japan
- Prior art keywords
- axis direction
- workpiece
- cassette
- cutting
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 126
- 238000004140 cleaning Methods 0.000 claims abstract description 52
- 235000012431 wafers Nutrition 0.000 description 72
- 230000032258 transport Effects 0.000 description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- 238000003384 imaging method Methods 0.000 description 16
- 238000003754 machining Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Robotics (AREA)
- Confectionery (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
4a:第一の保持手段
4b:第二の保持手段
6a:第一の加工送り手段
6b:第二の加工送り手段
28b:第二の切削ブレード
30a:第一の切削手段
30b:第二の切削手段
32a:第一の割り出し送り手段
32b:第二の割り出し送り手段
56a:第一のカセット
56b:第二のカセット
58:カセットテーブル
62:仮受けテーブル
62a:ガイドレール
64:位置づけ手段
80:第一の搬送手段
82:第二の搬送手段
84:洗浄手段
86:第三の搬送手段
88:吸引パッド(第二の搬送手段)
90:支持部(第二の搬送手段)
92:駆動部(第二の搬送手段)
94:把持部(第一の搬送手段)
96:選択部(第一の搬送手段)
98:連結部(第一の搬送手段)
132:吸引片(第三の搬送手段)
134:支持片(第三の搬送手段)
136:駆動機構(第三の搬送手段)
Claims (5)
- 板状の被加工物を切削する切削装置であって、
被加工物を保持する第一の保持手段および第二の保持手段と、
該第一の保持手段をX軸方向に加工送りする第一の加工送り手段と、
該第一の加工送り手段と隣接し該第二の保持手段をX軸方向に加工送りする第二の加工送り手段と、
該第一の保持手段に保持された被加工物を切削する第一の切削ブレードを回転可能に備えた第一の切削手段と、
該第二の保持手段に保持された被加工物を切削する第二の切削ブレードを回転可能に備えた第二の切削手段と、
該第一の切削手段をX軸方向に直交するY軸方向に割り出し送りする第一の割り出し送り手段と、
該第二の切削ブレードを該第一の切削ブレードに対峙させ該第二の切削手段をY軸方向に割り出し送りする第二の割り出し送り手段と、
該第一の保持手段に保持される被加工物を複数収容した第一のカセットと該第二の保持手段に保持される被加工物を複数収容した第二のカセットとをX軸方向に隣接して位置づけるカセットテーブルと、
該カセットテーブルをX軸方向とY軸方向とに直交するZ軸方向に昇降させる昇降手段と、
該カセットテーブルに載置された第一のカセットおよび第二のカセットに隣接して位置づけられ被加工物を仮受けする仮受けテーブルと、
第一のカセットおよび第二のカセットから被加工物を引き出し該仮受けテーブルに被加工物を搬送する第一の搬送手段と、
該仮受けテーブルに搬送された被加工物を保持し該第一の保持手段および該第二の保持手段に被加工物を搬送する第二の搬送手段と、
切削済みの被加工物を洗浄する洗浄手段と、
該第一の保持手段に保持された切削済みの被加工物および該第二の保持手段に保持された切削済みの被加工物を保持し該洗浄手段に被加工物を搬送する第三の搬送手段と、
から少なくとも構成された切削装置。 - 該仮受けテーブルは、Y軸方向に延びると共にX軸方向に開閉する一対のガイドレールで構成され、第一のカセットおよび第二のカセットに選択的に仮受けテーブルを位置づける位置づけ手段に配設され、
該第一の搬送手段が第一のカセットから被加工物を引き出す際、該仮受けテーブルは第一のカセットに位置づけられ、
該第二の搬送手段は該仮受けテーブルに搬送された被加工物を保持し該仮受けテーブルを構成する一対のガイドレールが開き該仮受けテーブルの直下に位置づけられた該第一の保持手段に被加工物を搬送する請求項1記載の切削装置。 - 該第二の搬送手段は、被加工物を吸引保持する吸引パッドと、該吸引パッドを支持する支持部と、該支持部をX軸方向、Y軸方向、Z軸方向に移動する駆動部と、を備え、
該第一の搬送手段は、被加工物を把持する把持部と、該把持部を作用位置と非作用位置とに選択的に位置づける選択部と、該選択部を該第二の搬送手段の該支持部に連結する連結部と、を備え、
該第二の搬送手段の該駆動部によってX軸方向、Y軸方向、Z軸方向に該第一の搬送手段が移動される請求項2記載の切削装置。 - 該第三の搬送手段は、被加工物を吸引保持する吸引片と、該吸引片を支持する支持片と、該支持片をY軸方向、Z軸方向に移動する駆動機構と、を備え、該第一の保持手段および該第二の保持手段に保持された切削済みの被加工物を保持し該洗浄手段に被加工物を搬送する請求項3記載の切削装置。
- 該洗浄手段で洗浄された被加工物は該第二の搬送手段によって該仮受けテーブルまで搬送され、該仮受けテーブルに搬送された被加工物は該第一の搬送手段によって所定のカセットに収容される請求項3記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017246092A JP7032122B2 (ja) | 2017-12-22 | 2017-12-22 | 切削装置 |
KR1020180153410A KR102619218B1 (ko) | 2017-12-22 | 2018-12-03 | 절삭 장치 |
CN201811540314.5A CN109994406B (zh) | 2017-12-22 | 2018-12-17 | 切削装置 |
TW107146349A TWI806946B (zh) | 2017-12-22 | 2018-12-21 | 切削裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017246092A JP7032122B2 (ja) | 2017-12-22 | 2017-12-22 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019114629A true JP2019114629A (ja) | 2019-07-11 |
JP7032122B2 JP7032122B2 (ja) | 2022-03-08 |
Family
ID=67128687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017246092A Active JP7032122B2 (ja) | 2017-12-22 | 2017-12-22 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7032122B2 (ja) |
KR (1) | KR102619218B1 (ja) |
CN (1) | CN109994406B (ja) |
TW (1) | TWI806946B (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003163181A (ja) * | 2001-11-28 | 2003-06-06 | Disco Abrasive Syst Ltd | 加工機 |
JP2006156777A (ja) * | 2004-11-30 | 2006-06-15 | Disco Abrasive Syst Ltd | 矩形基板の分割装置 |
JP2016127097A (ja) * | 2014-12-26 | 2016-07-11 | 株式会社ディスコ | 加工装置 |
JP2017103274A (ja) * | 2015-11-30 | 2017-06-08 | 株式会社ディスコ | 切削装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2688623B2 (ja) | 1992-05-11 | 1997-12-10 | 株式会社ディスコ | ダイシング装置 |
JP5236918B2 (ja) * | 2007-10-02 | 2013-07-17 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
TWI655685B (zh) * | 2015-01-28 | 2019-04-01 | 迪思科股份有限公司 | Cutting device |
JP6441737B2 (ja) * | 2015-04-28 | 2018-12-19 | 株式会社ディスコ | 切削装置 |
-
2017
- 2017-12-22 JP JP2017246092A patent/JP7032122B2/ja active Active
-
2018
- 2018-12-03 KR KR1020180153410A patent/KR102619218B1/ko active IP Right Grant
- 2018-12-17 CN CN201811540314.5A patent/CN109994406B/zh active Active
- 2018-12-21 TW TW107146349A patent/TWI806946B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003163181A (ja) * | 2001-11-28 | 2003-06-06 | Disco Abrasive Syst Ltd | 加工機 |
JP2006156777A (ja) * | 2004-11-30 | 2006-06-15 | Disco Abrasive Syst Ltd | 矩形基板の分割装置 |
JP2016127097A (ja) * | 2014-12-26 | 2016-07-11 | 株式会社ディスコ | 加工装置 |
JP2017103274A (ja) * | 2015-11-30 | 2017-06-08 | 株式会社ディスコ | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
KR102619218B1 (ko) | 2023-12-28 |
TWI806946B (zh) | 2023-07-01 |
CN109994406A (zh) | 2019-07-09 |
TW201929066A (zh) | 2019-07-16 |
KR20190076855A (ko) | 2019-07-02 |
JP7032122B2 (ja) | 2022-03-08 |
CN109994406B (zh) | 2024-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6679157B2 (ja) | 加工装置の搬送機構 | |
JP6218600B2 (ja) | 加工装置 | |
JP2002359211A (ja) | 切削機 | |
TW201703957A (zh) | 切削裝置 | |
JP5179928B2 (ja) | ウエーハの搬出方法 | |
KR200480692Y1 (ko) | 판재의 가공 장치 | |
CN107030902B (zh) | 切削装置 | |
CN111300670B (zh) | 切削装置 | |
JP6801361B2 (ja) | ワーク搬送システム及びワーク搬送方法 | |
JP5192999B2 (ja) | イオン化エア供給プログラム | |
JP2017228561A (ja) | 切削装置 | |
JP2019114629A (ja) | 切削装置 | |
JP6208587B2 (ja) | 切削装置 | |
JP2003163181A (ja) | 加工機 | |
JP4616969B2 (ja) | 切断機 | |
JP6821254B2 (ja) | 切削装置 | |
JP5643019B2 (ja) | チャックテーブル | |
JP4856593B2 (ja) | マウント装置及びマウント方法 | |
JP6120627B2 (ja) | 切削装置 | |
CN112008702B (zh) | 搬送机器人 | |
JP4731265B2 (ja) | 切削装置 | |
KR20230094146A (ko) | 웨이퍼의 가공 방법 및 웨이퍼의 가공 장치 | |
KR20230119599A (ko) | 절삭 장치 | |
JP6084115B2 (ja) | 加工装置 | |
JP2019004069A (ja) | 加工装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201015 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210903 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210914 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211014 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220201 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220224 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7032122 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |