JP2019110235A - 半導体装置及び半導体装置の製造方法 - Google Patents
半導体装置及び半導体装置の製造方法 Download PDFInfo
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Abstract
Description
図1は、本発明の実施形態に係る半導体装置1の平面図である。半導体装置1は、ゲート構造がプレーナゲート型であり、ドリフト層の構造がスーパージャンクション構造であるMOSFETを構成するものである。半導体装置1は、平面視における外形が、正方形または長方形であり、セル部2と、セル部2を囲む周辺部3とを有する。半導体装置1において、周辺部3の構造は一般的なMOSFETと同様の構造であるので、周辺部3の構造について詳細な説明は省略する。以下においては、主にセル部2の構成について説明する。また、以下の説明において、半導体装置1の主面と平行な、互いに直交する2つの方向をそれぞれX方向及びY方向とし、半導体装置1の厚さ方向をZ方向とする。
図7は、本発明の第2の実施形態に係る埋め込み部23のX−Y断面視におけるパターンを示す図である。複数の埋め込み部23の各々は、第1の実施形態と同様、Y方向を長手方向とする細長形状を有し、X方向に互いに間隙を隔てて配置されている。本実施形態において、各埋め込み部23の、長手方向(Y方向)と平行な仮想線Vを間に挟んで互いに対向する2つの外縁e1、e2は、それぞれ、ステップ状とされている。すなわち、各埋め込み部23の幅(X方向の寸法)は、埋め込み部23の長手方向(Y方向)に沿った部位に応じて異なっており、長手方向(Y方向)に沿って段階的に変化している。具体的には、各埋め込み部23は、幅Waを有する部分23a、幅Wb(>幅Wa)を有する部分23b、幅Wc(>幅Wb)を有する部分23cが、長手方向(Y方向)に連なった構成を有する。幅Waは、例えば2.7μm程度であり、幅Wbは、例えば3.0μm程度であり、幅Wcは、例えば3.3μm程度である。
図8は、本発明の第3の実施形態に係る埋め込み部23のX−Y断面視におけるパターンを示す図である。複数の埋め込み部23の各々は、第1の実施形態と同様、Y方向を長手方向とする細長形状を有し、X方向に互いに間隙を隔てて配置されている。本実施形態において、各埋め込み部23の、長手方向(Y方向)と平行な仮想線Vを間に挟んで互いに対向する2つの外縁e1、e2は、それぞれ、直線状であり且つ仮想線Vと平行である。すなわち、各埋め込み部23の幅(X方向の寸法)は、長手方向(Y方向)における各部位において同じである。一方、埋め込み部23の幅は、他の埋め込み部23との間で異なっている。すなわち、複数の埋め込み部23のうちのいずれかの埋め込み部23の幅が、複数の埋め込み部23のうちの他のいずれかの埋め込み部23の幅と異なっている。図8に示す例では、埋め込み部23Bの幅WBは、埋め込み部23AのWAよりも広く、埋め込み部23Cの幅WCは、埋め込み部23Bの幅WBよりも広く、埋め込み部23Dの幅WDは、埋め込み部23Cの幅WCよりも広くなっている。
図9は、本発明の第4の実施形態に係る埋め込み部23のX−Y断面視におけるパターンを示す図である。複数の埋め込み部23の各々は、第1の実施形態と同様、Y方向を長手方向とする細長形状を有し、X方向に互いに間隙を隔てて配置されている。本実施形態において、各埋め込み部23の、長手方向(Y方向)と平行な仮想線Vを間に挟んで互いに対向する2つの外縁e1、e2は、それぞれ、凹凸状とされている。すなわち、各埋め込み部23の幅(X方向における長さ)は、埋め込み部23の長手方向(Y方向)に沿った部位に応じて異なっている。また、各埋め込み部23は、幅が相対的に広い第1の部分23Gと、幅が相対的に狭い第2の部分23Hと、を含み、第1の部分23Gと第2の部分23Hとが長手方向(Y方向)に沿って交互に配置されている。第1の部分23Gと第2の部分23Hとの段差Sは、例えば0.2μm程度である。
図10は、本発明の第5の実施形態に係る埋め込み部23のX−Y断面視におけるパターンを示す図である。複数の埋め込み部23の各々は、第1の実施形態と同様、Y方向を長手方向とする細長形状を有し、X方向に互いに間隙を隔てて配置されている。本実施形態において、各埋め込み部23の、長手方向(Y方向)と平行な仮想線Vを間に挟んで互いに対向する2つの外縁e1、e2は、それぞれ、曲線状であり且つ凹凸状とされている。すなわち、各埋め込み部23の幅(X方向の寸法)は、埋め込み部23の長手方向(Y方向)に沿った部位に応じて異なっている。また、各埋め込み部23は、幅が相対的に広い第1の部分23Gと、幅が相対的に狭い第2の部分23Hと、を含み、第1の部分23Gと第2の部分23Hとが長手方向(Y方向)に沿って交互に配置されている。第1の部分23Gと第2の部分23Hとの段差Sは、例えば0.2μm程度である。
図11は、本発明の第6の実施形態に係る埋め込み部23のX−Y断面視におけるパターンを示す図である。複数の埋め込み部23の各々は、第1の実施形態と同様、Y方向を長手方向とする細長形状を有し、X方向に互いに間隙を隔てて配置されている。本実施形態において、各埋め込み部23の、長手方向(Y方向)と平行な仮想線Vを間に挟んで互いに対向する2つの外縁e1、e2は、それぞれ凹凸状とされている。すなわち、各埋め込み部23の幅(X方向の寸法)は、埋め込み部23の長手方向(Y方向)に沿った部位に応じて異なっている。また、各埋め込み部23は、幅が相対的に広い第1の部分23Gと、幅が相対的に狭い第2の部分23Hと、を含み、第1の部分23Gと第2の部分23Hとが長手方向(Y方向)に沿って交互に配置されている。
図12は、本発明の第7の実施形態に係る半導体装置1Aの構成を示す断面図である。図12には、セル部2のX−Z断面が示されている。半導体装置1Aは、ゲート構造がトレンチゲート構造である点が、第1の実施形態に係る半導体装置1(図2参照)と異なる。すなわち、半導体装置1Aにおいて、各ゲート電極30は、半導体基板10の表面からボディ部20を貫通してドリフト層11(N型カラム11A)にまで達している。半導体装置1Aにおいて、ドリフト層11の構造がスーパージャンクション構造である点は、第1の実施形態に係る半導体装置1と同様である。
2 セル部
10 半導体基板
11 ドリフト層
12 ドレイン層
20 ボディ部
21 ソース
23 埋め込み部
23G 第1の部分
23H 第2の部分
30 ゲート電極
40 ソース電極
41 ドレイン電極
50 トレンチ
R1 第1の領域
R2 第2の領域
Claims (15)
- 第1の導電型を有するドリフト層と、
前記ドリフト層に埋め込まれ、前記第1の導電型とは異なる第2の導電型を有し、第1の方向を長手方向とし、前記第1の方向と交差する第2の方向に沿って互いに間隙を隔てて配置された複数の埋め込み部と、を含み、
前記埋め込み部の各々の前記第2の方向における幅が、前記第1の方向に沿って連続的に変化している
半導体装置。 - 前記第1の方向及び前記第2の方向の各々と平行な断面でみたときの、前記埋め込み部の各々の、前記第1の方向と平行な仮想線を間に挟んで互いに対向する2つの外縁が、それぞれ、前記仮想線に対して傾斜している
請求項1に記載の半導体装置。 - 前記2つの外縁のうちの一方の外縁の前記仮想線に対する傾斜角が、前記2つの外縁のうちの他方の外縁の前記仮想線に対する傾斜角と異なっている
請求項2に記載の半導体装置。 - 前記複数の埋め込み部のうちのいずれかの埋め込み部における前記2つの外縁の少なくとも一方の前記仮想線に対する傾斜角が、前記複数の埋め込み部のうちの他のいずれかの埋め込み部における前記2つの外縁の各々の前記仮想線に対する傾斜角のいずれとも異なっている
請求項2または請求項3に記載の半導体装置。 - 第1の導電型を有するドリフト層と、
前記ドリフト層に埋め込まれ、前記第1の導電型とは異なる第2の導電型を有し、第1の方向を長手方向とし、前記第1の方向と交差する第2の方向に間隙を隔てて配置された複数の埋め込み部と、を含み、
前記埋め込み部の各々は、前記第2の方向における幅が互いに異なる部位を有する
半導体装置。 - 前記埋め込み部の各々は、前記第2の方向における幅が、前記第1の方向に沿って段階的に変化している
請求項5に記載の半導体装置。 - 前記埋め込み部の各々は、前記第2の方向における幅が相対的に広い第1の部分と、前記第2の方向における幅が相対的に狭い第2の部分とを含み、前記第1の部分と前記第2の部分とが前記第1の方向に沿って交互に配置されている
請求項5に記載の半導体装置。 - 前記複数の埋め込み部の各々は、前記第2の方向における幅が一定であり且つ前記第1の方向における長さが相対的に長い第1の領域と、前記第2の方向における幅が互いに異なり且つ前記第1の方向における長さが相対的に短い複数の部分が前記第1の方向に連なった第2の領域と、を含み、前記第1の領域と前記第2の領域とが前記第1の方向に沿って交互に配置されている
請求項7に記載の半導体装置。 - 前記第1の方向及び前記第2の方向の各々と平行な断面でみたときの、前記埋め込み部の各々の、前記第2の方向と直交する仮想線を間に挟んで互いに対向する2つの外縁が、それぞれ、曲線状である
請求項7に記載の半導体装置。 - 前記埋め込み部の各々は、隣接する他の埋め込み部との間で、前記第1の部分と前記第2の部分の配置が、前記第1の方向にずれている
請求項7に記載の半導体装置。 - 第1の導電型を有するドリフト層と、
前記ドリフト層に埋め込まれ、前記第1の導電型とは異なる第2の導電型を有し、第1の方向を長手方向とし、前記第1の方向と交差する第2の方向に間隙を隔てて配置された複数の埋め込み部と、を含み、
前記複数の埋め込み部の各々の前記第2の方向における幅が、前記第1の方向に沿った各部位に応じて同じであり、
前記複数の埋め込み部のうちのいずれかの埋め込み部の前記第2の方向における幅が、前記複数の埋め込み部のうちの他のいずれかの埋め込み部の前記第2の方向における幅と異なっている
半導体装置。 - 前記ドリフト層の表層部において前記複数の埋め込み部の各々に対応して設けられ、対応する埋め込み部に接続された前記第2の導電型を有する複数のボディ部と、
前記複数のボディ部の各々の表層部に設けられ、前記第1の導電型を有するソースと、
前記ドリフト層の表面の、前記複数のボディ部の互いに隣接する各2つを跨ぐ位置に設けられたゲート電極と、
前記ドリフト層の底部に接続された前記第1の導電型を有するドレイン層と、
を更に含む
請求項1から請求項11のいずれか1項に記載の半導体装置。 - 第1の導電型のドリフト層を有する半導体基板を用意する工程と、
第1の方向を長手方向とし、前記第1の方向と交差する第2の方向に沿って互いに間隙を隔てて配置された複数のトレンチを、前記ドリフト層に形成する工程と、
前記第1の導電型とは異なる第2の導電型の半導体を、前記複数のトレンチの各々に埋め込む工程と、
を含み、
前記トレンチの各々の前記第2の方向における幅が、前記第1の方向に沿って連続的に変化している
半導体装置の製造方法。 - 第1の導電型のドリフト層を有する半導体基板を用意する工程と、
第1の方向を長手方向とし、前記第1の方向と交差する第2の方向に沿って互いに間隙を隔てて配置された複数のトレンチを、前記ドリフト層に形成する工程と、
前記第1の導電型とは異なる第2の導電型の半導体を、前記複数のトレンチの各々に埋め込む工程と、
を含み、
前記トレンチの各々は、前記第2の方向における幅が互いに異なる部位を有する
半導体装置の製造方法。 - 第1の導電型のドリフト層を有する半導体基板を用意する工程と、
第1の方向を長手方向とし、前記第1の方向と交差する第2の方向に沿って互いに間隙を隔てて配置された複数のトレンチを、前記ドリフト層に形成する工程と、
前記第1の導電型とは異なる第2の導電型の半導体を、前記複数のトレンチの各々に埋め込む工程と、
を含み、
前記複数のトレンチの各々の前記第2の方向における幅が、前記第1の方向に沿った各部位に応じて同じであり、
前記複数のトレンチのうちのいずれかのトレンチの前記第2の方向における幅が、前記複数のトレンチのうちの他のいずれかのトレンチの前記第2の方向における幅と異なっている
半導体装置の製造方法。
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US11456378B2 (en) | 2022-09-27 |
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