JP2019055908A - 鉛含有量が低減された圧電セラミック材料 - Google Patents
鉛含有量が低減された圧電セラミック材料 Download PDFInfo
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- 229910010293 ceramic material Inorganic materials 0.000 title claims abstract description 28
- 239000000203 mixture Substances 0.000 claims abstract description 54
- 229910052745 lead Inorganic materials 0.000 claims abstract description 40
- 229910052758 niobium Inorganic materials 0.000 claims abstract description 40
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000005245 sintering Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 24
- 239000011734 sodium Substances 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 6
- 238000005469 granulation Methods 0.000 claims description 4
- 230000003179 granulation Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 238000010298 pulverizing process Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 238000010344 co-firing Methods 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 239000010955 niobium Substances 0.000 description 56
- 239000011133 lead Substances 0.000 description 51
- 239000011572 manganese Substances 0.000 description 27
- 238000007792 addition Methods 0.000 description 11
- 238000009413 insulation Methods 0.000 description 4
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009770 conventional sintering Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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Abstract
Description
(K1−yNay)1−x}(Nb1−z−wTazSbw)O3の主成分、およびさらなる元素として、(1)パラジウム、銀、金、ルテニウム、ロジウム、レニウム、オスミウム、イリジウムおよびプラチナ、または(2)ニッケル、鉄、マンガン、銅、亜鉛、または(3)マグネシウム、カルシウム、ストロンチウムおよびバリウムから選択される少なくとも1つの金属元素を含む無鉛圧電セラミック組成物を記載している。
(2012)2521−2527)などの代替焼結法が提案されている。これらの方法は、コスト効率の良い大量生産に適していないか、大きな焼結体積の熱慣性により工業規模で実施することができない。
(KxNayLi1−x−y)a(MnuTavSbwNb1−u−v−w)O3のニオブ酸カリウムナトリウム(PSN)系の、無鉛圧電セラミック材料であって、
式中、0<x<1y;0<y<1;0<u<0.01;0<v<0.3;0≦w<0.2、
0.95<a<1.05;x+y≦1
である無鉛圧電セラミック材料が想定される。
k重量%のPb+l重量%のNb+m重量%のAg、
式中、
0<k<0.5;0<l<1;0≦m<1である。
(KxNayLi1−x−y)a(MnuTavSbwNb1−u−v−w)O3を有し、
式中、0<x<1y;0<y<1;0<u<0.01;0<v<0.3;0≦w<0.2、および
0.95<a<1.05;x+y≦1であり、
Pb、Nb、および任意にAgを含む基本組成に加えて、さらなる成分を含み、Pb、NbおよびAgの重量分率は圧電セラミック材料の全重量に対して以下のように選択されることを特徴とする:
k重量%のPb+l重量%のNb+m重量%のAg、
式中、0<k<0.5;0<l<1;0≦m<1である。
(KxNayLi1−x−y)a(MnuTavSbwNb1−u−v−w)O3のニオブ酸カリウムナトリウム(PSN)系の圧電セラミック材料における、圧電セラミック材料の焼結間隔を増加させるためのPb、Nb、および任意にAgの混合物の使用に関し、
式中、
0<x<1y;0<y<1;0<u<0.01;0<v<0.3;0≦w<0.2、および
0.95<a<1.05;x+y≦1であり、
添加されるPb、NbおよびAgの含有量が圧電セラミック材料全体に対して重量パーセントで以下のとおりであるように、Pb、Nbおよび任意にAgの混合物の添加が行われる:
k重量%のPb+l重量%のNb+m重量%のAg、
式中、0<k<0.5:0<l<1:0≦m<1である。
(KxNayLi1−x−y)a(MnuTavSbwNb1−u−v−w)O3に関する。
実施例1〜7:微粉砕
実施例8:スプレー造粒中の添加
tanδ:≦50 10−3
S3(室温):<0.6 10−3
Emax:≧2kV/mm
組成物
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
この組成物は、焼結間隔が≦20Kの先行技術に相当する。
組成物:
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
酸化物の混合物として+0.1重量%Pb+0.09重量%Nbが添加される。本発明によるこの組成物は、焼結間隔の30Kへの広がりを示す。
組成物:
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
酸化物の混合物として+0.2重量%Pb+0.179%重量%Nbが添加される。本発明によるこの組成物は、焼結間隔の30Kへの広がりを示す。
組成物:
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
予備成形されたか焼物として+0.1重量%Pb+0.09%重量%Nbが添加される。本発明によるこの組成物は、焼結間隔の30Kへの広がりを示す。
組成物:
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
予備成形されたか焼物として+0.2重量%Pb+0.179%重量%Nbが添加される。本発明によるこの組成物は、焼結間隔の30Kへの広がりを示す。
組成物:
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
酸化物の混合物として+0.1重量%Pb+0.022%重量%Nb+0.013重量%Mnが添加される。この組成物は、焼結間隔の広がりを示さない。
組成物:
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
酸化物の混合物として+0.1重量%Pb+0.03%重量%Nb+0.009重量%Mnが添加される。本発明によるこの組成物は、焼結間隔の40Kへの広がりを示す。
組成物:
(K0.44Na0.52Li0.04)0.998(Mn0.005[Ta0.10Sb0.06Nb0.84]0.995)O3
予備成形されたか焼物として+0.1重量%Pb+0.09%重量%Nbが添加される。本発明によるこの組成物は、焼結間隔の40Kへの広がりを示す。この実施形態では、材料の処理を工業規模で連続的に行い、PbおよびNbの添加をスプレー造粒中に行った。
Claims (19)
- 基本組成
(KxNayLi1−x−y)a(MnuTavSbwNb1−u−v−w)O3のニオブ酸カリウムナトリウム(PSN)系の、鉛含有量が低減された圧電セラミック材料であって、
式中、0<x<1y;0<y<1;0<u<0.01;0<v<0.3;0≦w<0.2、および
0.95<a<1.05;x+y≦1であり、
Pb、Nb、および任意にAgの混合物の添加は、k重量%のPb+l重量%のNb+m重量%のAgに従い、
式中、
0<k<0.5;0<l<1;0≦m<1であることを特徴とする、圧電セラミック材料。 - 0.001<k≦0.2であることを特徴とする、請求項1に記載の圧電セラミック材料。
- 0<l≦0.179であることを特徴とする、請求項1または2の一項に記載の圧電セラミック材料。
- 0.001<k≦0.2および0<l≦0.179であることを特徴とする、先行する請求項の少なくとも一項に記載の圧電セラミック材料。
- 0.001<k≦0.1であることを特徴とする、先行する請求項の少なくとも一項に記載の圧電セラミック材料。
- 0.022<l≦0.09であることを特徴とする、先行する請求項の少なくとも一項に記載の圧電セラミック材料。
- 0.001<k≦0.1および0.022<l≦0.09であることを特徴とする、先行する請求項の少なくとも一項に記載の圧電セラミック材料。
- k:lの比率は1:0.9〜1:0.3の範囲にあることを特徴とする、先行する請求項の少なくとも一項に記載の圧電セラミック材料。
- k重量%のPb、l重量%のNb、およびn重量%のMnの混合物の添加を特徴とし、n:lの比率は0.05〜0.15:0.30の範囲にある、先行する請求項の少なくとも一項に記載の圧電セラミック材料。
- k:n:lの比率は1:0.09:0.30であることを特徴とする、請求項9に記載の圧電セラミック材料。
- 圧電セラミック材料は、>20Kの範囲、特に30K〜40Kの範囲に焼結間隔を有することを特徴とする、先行する請求項の少なくとも一項に記載の圧電セラミック材料。
- 先行する請求項のうちの一項に記載の鉛含有量が低減された圧電セラミック材料を製造する方法であって、・基本組成の原料混合物を製造するステップと、・基本組成のか焼物を製造するステップと、・か焼物を微粉砕するステップと、・特にスプレー造粒によって粒状物を製造する、または多層もしくは「同時焼成」プロセス用流延スラリーを製造するステップと、・標準大気中で焼結することを含む既知の様式でさらに処理するステップとを特徴とする、方法。
- 請求項1〜11のうちの一項に記載の圧電セラミック材料系の圧電セラミック多層アクチュエータ。
- 基本組成
(KxNayLi1−x−y)a(MnuTavSbwNb1−u−v−w)O3のニオブ酸カリウムナトリウム(PSN)系の圧電セラミック材料における、圧電セラミック材料の焼結間隔を増加させるためのPb、Nb、および任意にAgの混合物の使用であって、
式中、0<x<1y;0<y<1;0<u<0.01;0<v<0.3;0≦w<0.2、および
0.95<a<1.05;x+y≦1であり、
添加されるPb、NbおよびAgの含有量が圧電セラミック材料全体に対して重量パーセントで以下のとおりであるように、PbおよびNbの混合物の添加が行われる使用:
k重量%のPb+l重量%のNb+m重量%のAg、
式中、0<k<0.5:0<l<1:0≦m<1である。 - 0.001<k≦0.2および0<l≦0.179であることを特徴とする、請求項14に記載の使用。
- 0.001<k≦0.1および0.022<l≦0.09であることを特徴とする、請求項14または15に記載の使用。
- k:lの比率は1:0.9〜1:0.3の範囲にあることを特徴とする、請求項15または16に記載の使用。
- k重量%のPb、l重量%のNb、およびn重量%のMnの混合物の添加を特徴とし、n:lの比率は0.05〜0.15:0.30の範囲にある、請求項16または17に記載の使用。
- k:n:lの比率は1:0.09:0.30であることを特徴とする、請求項18に記載の使用。
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