JP2018537888A5 - - Google Patents

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Publication number
JP2018537888A5
JP2018537888A5 JP2018520170A JP2018520170A JP2018537888A5 JP 2018537888 A5 JP2018537888 A5 JP 2018537888A5 JP 2018520170 A JP2018520170 A JP 2018520170A JP 2018520170 A JP2018520170 A JP 2018520170A JP 2018537888 A5 JP2018537888 A5 JP 2018537888A5
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JP
Japan
Prior art keywords
composite structure
wave device
acoustic wave
functional layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018520170A
Other languages
English (en)
Japanese (ja)
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JP2018537888A (ja
JP6923518B2 (ja
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Publication date
Priority claimed from FR1559994A external-priority patent/FR3042647B1/fr
Application filed filed Critical
Publication of JP2018537888A publication Critical patent/JP2018537888A/ja
Publication of JP2018537888A5 publication Critical patent/JP2018537888A5/ja
Application granted granted Critical
Publication of JP6923518B2 publication Critical patent/JP6923518B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018520170A 2015-10-20 2016-10-17 複合構造 Active JP6923518B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1559994A FR3042647B1 (fr) 2015-10-20 2015-10-20 Structure composite et procede de fabrication associe
FR1559994 2015-10-20
PCT/FR2016/052675 WO2017068270A1 (fr) 2015-10-20 2016-10-17 Structure composite et procédé de fabrication associé

Publications (3)

Publication Number Publication Date
JP2018537888A JP2018537888A (ja) 2018-12-20
JP2018537888A5 true JP2018537888A5 (enExample) 2019-11-28
JP6923518B2 JP6923518B2 (ja) 2021-08-18

Family

ID=54708030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018520170A Active JP6923518B2 (ja) 2015-10-20 2016-10-17 複合構造

Country Status (8)

Country Link
US (1) US20180316329A1 (enExample)
EP (1) EP3365927B1 (enExample)
JP (1) JP6923518B2 (enExample)
KR (1) KR102671257B1 (enExample)
CN (2) CN108271425A (enExample)
FR (1) FR3042647B1 (enExample)
SG (1) SG11201803341QA (enExample)
WO (1) WO2017068270A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3068508B1 (fr) * 2017-06-30 2019-07-26 Soitec Procede de transfert d'une couche mince sur un substrat support presentant des coefficients de dilatation thermique differents
FR3076126A1 (fr) * 2017-12-26 2019-06-28 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de realisation d'un resonateur acoustique a ondes de volume a capacite parasite reduite
FR3079346B1 (fr) * 2018-03-26 2020-05-29 Soitec Procede de fabrication d'un substrat donneur pour le transfert d'une couche piezoelectrique, et procede de transfert d'une telle couche piezoelectrique
WO2020198934A1 (en) 2019-03-29 2020-10-08 Shenzhen Xpectvision Technology Co., Ltd. Semiconductor x-ray detector
US11750172B2 (en) 2019-08-21 2023-09-05 Skyworks Solutions, Inc. Multilayer piezoelectric substrate
US11722122B2 (en) 2019-11-22 2023-08-08 Skyworks Solutions, Inc. Multilayer piezoelectric substrate with high density electrode
CN111883644B (zh) * 2020-07-23 2021-04-13 中国科学院上海微系统与信息技术研究所 一种异质压电薄膜结构及其制备方法
GB2598665B (en) * 2020-09-04 2025-07-23 Skyworks Solutions Inc Multi-layer piezoelectric substrate with controllable delta temperature coefficient of frequency
EP3989299B1 (en) * 2020-10-26 2025-08-06 Université de Franche-Comté Piezoelectric device comprising flexible single crystalline piezoelectric linbo3 and/or litao3 films integrated on flexible substrate and methods for producing the same
US12483226B2 (en) 2021-12-29 2025-11-25 Skyworks Solutions, Inc. Acoustic wave device with tilted multilayer interdigital transducer electrode
US20230223910A1 (en) 2022-01-13 2023-07-13 Skyworks Solutions, Inc. Method of making acoustic wave device with vertically mass loaded multi-layer interdigital transducer electrode for transverse mode suppression
US12500572B2 (en) 2022-04-15 2025-12-16 Skyworks Solutions, Inc. Multiplexer formed on multi-layer piezoelectric substrate and temperature compensated surface acoustic wave device dies

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW219354B (en) * 1993-05-31 1994-01-21 Ind Tech Res Inst Strengthening of multi-layer ceramic/glass articles
JPH10297931A (ja) * 1997-04-24 1998-11-10 Matsushita Electric Ind Co Ltd 複合圧電基板の製造方法
TW449937B (en) * 1999-02-26 2001-08-11 Matsushita Electronics Corp Semiconductor device and the manufacturing method thereof
FR2816445B1 (fr) * 2000-11-06 2003-07-25 Commissariat Energie Atomique Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible
JP3815424B2 (ja) * 2002-11-08 2006-08-30 株式会社村田製作所 弾性境界波装置
FR2856192B1 (fr) * 2003-06-11 2005-07-29 Soitec Silicon On Insulator Procede de realisation de structure heterogene et structure obtenue par un tel procede
WO2005069486A1 (ja) * 2004-01-19 2005-07-28 Murata Manufacturing Co., Ltd. 弾性境界波装置
WO2007142112A1 (ja) * 2006-06-02 2007-12-13 Murata Manufacturing Co., Ltd. 多層セラミック基板およびその製造方法ならびに電子部品
US7608986B2 (en) * 2006-10-02 2009-10-27 Seiko Epson Corporation Quartz crystal resonator
JP4894861B2 (ja) * 2006-12-25 2012-03-14 株式会社村田製作所 弾性境界波装置
US7408286B1 (en) * 2007-01-17 2008-08-05 Rf Micro Devices, Inc. Piezoelectric substrate for a saw device
JP5104761B2 (ja) * 2007-04-09 2012-12-19 株式会社村田製作所 セラミック基板およびその製造方法
JP2009124696A (ja) * 2007-10-26 2009-06-04 Panasonic Electric Works Co Ltd 共振装置
CN101874429B (zh) * 2007-11-30 2013-04-03 株式会社村田制作所 陶瓷复合多层基板及其制造方法以及电子元器件
JP4460612B2 (ja) * 2008-02-08 2010-05-12 富士通メディアデバイス株式会社 弾性表面波デバイス及びその製造方法
CN104589738A (zh) * 2008-05-15 2015-05-06 株式会社村田制作所 多层陶瓷基板及其制造方法
FR2942911B1 (fr) * 2009-03-09 2011-05-13 Soitec Silicon On Insulator Procede de realisation d'une heterostructure avec adaptation locale de coefficient de dilatation thermique
WO2014129432A1 (ja) * 2013-02-19 2014-08-28 日本碍子株式会社 複合基板、弾性波デバイス及び弾性波デバイスの製法
JP6242597B2 (ja) * 2013-06-03 2017-12-06 太陽誘電株式会社 弾性波デバイス及びその製造方法
US9646911B2 (en) * 2014-04-10 2017-05-09 Sensor Electronic Technology, Inc. Composite substrate

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