JP2018534608A5 - - Google Patents
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- Publication number
- JP2018534608A5 JP2018534608A5 JP2018515450A JP2018515450A JP2018534608A5 JP 2018534608 A5 JP2018534608 A5 JP 2018534608A5 JP 2018515450 A JP2018515450 A JP 2018515450A JP 2018515450 A JP2018515450 A JP 2018515450A JP 2018534608 A5 JP2018534608 A5 JP 2018534608A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid medium
- aqueous liquid
- substrate
- medium
- specific wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 15
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical group [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 239000002250 absorbent Substances 0.000 claims description 6
- 230000002745 absorbent Effects 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims 8
- 230000000996 additive effect Effects 0.000 claims 8
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/863,523 | 2015-09-24 | ||
| US14/863,523 US11358172B2 (en) | 2015-09-24 | 2015-09-24 | Method for treating substrates with an aqueous liquid medium exposed to UV-radiation |
| PCT/EP2016/072325 WO2017050774A1 (en) | 2015-09-24 | 2016-09-20 | A method for treating substrates with an aqueous liquid medium exposed to uv-radiation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018534608A JP2018534608A (ja) | 2018-11-22 |
| JP2018534608A5 true JP2018534608A5 (https=) | 2019-11-28 |
| JP6738414B2 JP6738414B2 (ja) | 2020-08-12 |
Family
ID=56979563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018515450A Active JP6738414B2 (ja) | 2015-09-24 | 2016-09-20 | 紫外線に暴露された水性液体媒体で基板を処理する方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US11358172B2 (https=) |
| EP (1) | EP3353605B8 (https=) |
| JP (1) | JP6738414B2 (https=) |
| KR (1) | KR102182028B1 (https=) |
| CN (1) | CN108292100B (https=) |
| HK (1) | HK1253381A1 (https=) |
| RU (1) | RU2680113C1 (https=) |
| TW (1) | TWI713587B (https=) |
| WO (1) | WO2017050774A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10508953B2 (en) * | 2016-12-09 | 2019-12-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for processing substrate by chemical solution in semiconductor manufacturing fabrication |
| KR102374206B1 (ko) | 2017-12-05 | 2022-03-14 | 삼성전자주식회사 | 반도체 장치 제조 방법 |
| US10867815B2 (en) * | 2018-09-04 | 2020-12-15 | Tokyo Electron Limited | Photonically tuned etchant reactivity for wet etching |
| US12604771B2 (en) * | 2021-10-28 | 2026-04-14 | Adeia Semiconductor Bonding Technologies Inc. | Direct bonding methods and structures |
| KR102495224B1 (ko) * | 2021-12-20 | 2023-02-06 | 에스케이엔펄스 주식회사 | 적층체의 제조방법 및 적층체 |
| WO2024217816A1 (en) * | 2023-04-21 | 2024-10-24 | Asml Netherlands B.V. | Substrate processing |
| US20250180992A1 (en) * | 2023-11-30 | 2025-06-05 | Applied Materials, Inc. | Deposition of resist underlayer for enhancing photoresist performance |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0862610A (ja) * | 1994-08-16 | 1996-03-08 | Toshiba Corp | 液晶表示装置用レジスト剥離液 |
| JP3940742B2 (ja) * | 1996-01-12 | 2007-07-04 | 忠弘 大見 | 洗浄方法 |
| US7163588B2 (en) * | 1997-05-09 | 2007-01-16 | Semitool, Inc. | Processing a workpiece using water, a base, and ozone |
| US6869487B1 (en) | 1997-05-09 | 2005-03-22 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
| US20050229946A1 (en) * | 1998-11-12 | 2005-10-20 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating method and apparatus |
| WO2001007177A1 (en) * | 1999-07-23 | 2001-02-01 | Semitool, Inc. | Process and apparatus for treating a workpiece such as a semiconductor wafer |
| DE10130999A1 (de) * | 2000-06-29 | 2002-04-18 | D M S Co | Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben |
| JP4077241B2 (ja) * | 2002-05-14 | 2008-04-16 | 富士通株式会社 | 半導体装置の製造方法 |
| JP2004241726A (ja) * | 2003-02-07 | 2004-08-26 | Sharp Corp | レジスト処理方法およびレジスト処理装置 |
| JP3776092B2 (ja) * | 2003-03-25 | 2006-05-17 | 株式会社ルネサステクノロジ | エッチング装置、エッチング方法および半導体装置の製造方法 |
| KR20060003346A (ko) * | 2003-04-16 | 2006-01-10 | 세키스이가가쿠 고교가부시키가이샤 | 레지스트 제거 방법 및 레지스트 제거 장치 |
| TWI245163B (en) | 2003-08-29 | 2005-12-11 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US8125610B2 (en) | 2005-12-02 | 2012-02-28 | ASML Metherlands B.V. | Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus |
| JP2007273598A (ja) * | 2006-03-30 | 2007-10-18 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
| CA2783839C (en) * | 2009-06-02 | 2019-12-31 | Snapdragon Investments Limited | Fluid treatment apparatus for removal of impurities |
| US8372186B2 (en) * | 2009-08-14 | 2013-02-12 | Gregory J. Dobbyn | Ductless fume hood gas monitoring and detection system |
| DE102009058962B4 (de) * | 2009-11-03 | 2012-12-27 | Suss Microtec Photomask Equipment Gmbh & Co. Kg | Verfahren und Vorrichtung zum Behandeln von Substraten |
| JP5502450B2 (ja) * | 2009-12-21 | 2014-05-28 | 株式会社東芝 | 反射型露光用マスク、反射型露光用マスクの検査方法、及び反射型露光用マスクの洗浄方法 |
| EP2390283A1 (en) * | 2010-05-31 | 2011-11-30 | FUJIFILM Corporation | Azo pigment or tautomer thereof, process for producing same, pigment dispersion, coloring composition, inkjet recording ink, coloring composition for color filter, and color filter |
| JP5651389B2 (ja) * | 2010-06-30 | 2015-01-14 | 富士フイルム株式会社 | 顔料組成物、インクジェット記録用インク、カラーフィルター用着色組成物及びカラーフィルター |
| JP5712051B2 (ja) * | 2011-05-20 | 2015-05-07 | パナソニック株式会社 | 剥離液リサイクルシステムと運転方法および剥離液のリサイクル方法 |
| JP5887908B2 (ja) * | 2011-12-16 | 2016-03-16 | 三菱化学株式会社 | 周期表第１３族金属窒化物半導体基板の製造方法 |
| US8715890B2 (en) * | 2012-01-31 | 2014-05-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor mask blanks with a compatible stop layer |
| BR112014030589A2 (pt) * | 2012-06-08 | 2017-06-27 | Tennant Co | sistema de limpeza, e, método para limpar uma superfície |
| WO2014050891A1 (ja) * | 2012-09-28 | 2014-04-03 | 旭硝子株式会社 | Ｅｕｖリソグラフィ用反射型マスクブランクおよびその製造方法、ならびにｅｕｖリソグラフィ用反射型マスクおよびその製造方法 |
| US9206380B2 (en) * | 2013-03-14 | 2015-12-08 | Ecolab Usa Inc. | Method of generating carbonate in situ in a use solution and of buffered alkaline cleaning under an enriched CO2 atmosphere |
| US9805946B2 (en) * | 2013-08-30 | 2017-10-31 | Taiwan Semiconductor Manufacturing Company Limited | Photoresist removal |
| JP6104192B2 (ja) * | 2014-02-17 | 2017-03-29 | 三菱電機株式会社 | 半導体装置の製造方法および製造装置 |
| CN103996617A (zh) * | 2014-06-09 | 2014-08-20 | 上海华力微电子有限公司 | 离子注入工艺后的光刻胶层的去除方法 |
-
2015
- 2015-09-24 US US14/863,523 patent/US11358172B2/en active Active
-
2016
- 2016-09-20 HK HK18112678.4A patent/HK1253381A1/zh unknown
- 2016-09-20 RU RU2018113762A patent/RU2680113C1/ru active
- 2016-09-20 WO PCT/EP2016/072325 patent/WO2017050774A1/en not_active Ceased
- 2016-09-20 KR KR1020187011495A patent/KR102182028B1/ko active Active
- 2016-09-20 EP EP16769992.5A patent/EP3353605B8/en active Active
- 2016-09-20 JP JP2018515450A patent/JP6738414B2/ja active Active
- 2016-09-20 CN CN201680055824.6A patent/CN108292100B/zh active Active
- 2016-09-23 TW TW105130777A patent/TWI713587B/zh active
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