JP2018532251A5 - - Google Patents
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- JP2018532251A5 JP2018532251A5 JP2017568255A JP2017568255A JP2018532251A5 JP 2018532251 A5 JP2018532251 A5 JP 2018532251A5 JP 2017568255 A JP2017568255 A JP 2017568255A JP 2017568255 A JP2017568255 A JP 2017568255A JP 2018532251 A5 JP2018532251 A5 JP 2018532251A5
- Authority
- JP
- Japan
- Prior art keywords
- forming
- carrier
- substrate
- light
- trace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 27
- 239000000463 material Substances 0.000 claims 7
- 239000004020 conductor Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 238000000151 deposition Methods 0.000 claims 4
- 238000009713 electroplating Methods 0.000 claims 4
- 238000005245 sintering Methods 0.000 claims 4
- 238000004806 packaging method and process Methods 0.000 claims 3
- 239000004642 Polyimide Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 238000005507 spraying Methods 0.000 claims 1
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562186102P | 2015-06-29 | 2015-06-29 | |
| US62/186,102 | 2015-06-29 | ||
| US201562254574P | 2015-11-12 | 2015-11-12 | |
| US62/254,574 | 2015-11-12 | ||
| US201562256477P | 2015-11-17 | 2015-11-17 | |
| US62/256,477 | 2015-11-17 | ||
| US201662326539P | 2016-04-22 | 2016-04-22 | |
| US62/326,539 | 2016-04-22 | ||
| PCT/US2016/039860 WO2017004064A1 (en) | 2015-06-29 | 2016-06-28 | Application specific electronics packaging systems, methods and devices |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020075175A Division JP7127083B2 (ja) | 2015-06-29 | 2020-04-21 | 特定用途向け電子機器パッケージングシステム、方法及びデバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018532251A JP2018532251A (ja) | 2018-11-01 |
| JP2018532251A5 true JP2018532251A5 (https=) | 2019-10-31 |
| JP6742352B2 JP6742352B2 (ja) | 2020-08-19 |
Family
ID=57379833
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017568255A Active JP6742352B2 (ja) | 2015-06-29 | 2016-06-28 | 特定用途向け電子機器パッケージングシステム、方法及びデバイス |
| JP2020075175A Active JP7127083B2 (ja) | 2015-06-29 | 2020-04-21 | 特定用途向け電子機器パッケージングシステム、方法及びデバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020075175A Active JP7127083B2 (ja) | 2015-06-29 | 2020-04-21 | 特定用途向け電子機器パッケージングシステム、方法及びデバイス |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US10433428B2 (https=) |
| EP (1) | EP3314991A4 (https=) |
| JP (2) | JP6742352B2 (https=) |
| KR (4) | KR102439790B1 (https=) |
| CN (3) | CN106287589B (https=) |
| TW (1) | TWI656663B (https=) |
| WO (1) | WO2017004064A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102439790B1 (ko) | 2015-06-29 | 2022-09-02 | 몰렉스 엘엘씨 | 애플리케이션 특정 전자기기 패키징 시스템, 방법 및 디바이스 |
| CN114759437A (zh) | 2016-07-07 | 2022-07-15 | 莫列斯有限公司 | 微型配电盒及采用专用电子封装技术制造微型配电盒的方法 |
| KR20200030625A (ko) | 2017-08-16 | 2020-03-20 | 몰렉스 엘엘씨 | 전기 커넥터 조립체 |
| TWI730604B (zh) * | 2019-01-22 | 2021-06-11 | 美商莫仕有限公司 | 使用專用電子封裝製造工藝的智能連接器及其製造方法 |
| WO2021173408A1 (en) * | 2020-02-26 | 2021-09-02 | Ticona Llc | Electronic device |
| EP4110610A4 (en) * | 2020-02-26 | 2024-03-27 | Ticona LLC | Polymer composition for an electronic device |
| EP4110885A4 (en) * | 2020-02-26 | 2024-04-24 | Ticona LLC | ELECTRONIC DEVICE |
| WO2021173412A1 (en) | 2020-02-26 | 2021-09-02 | Ticona Llc | Circuit structure |
| US11728065B2 (en) * | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
| US11728559B2 (en) | 2021-02-18 | 2023-08-15 | Ticona Llc | Polymer composition for use in an antenna system |
| CN117981478A (zh) * | 2021-09-22 | 2024-05-03 | Ksr Ip控股有限责任公司 | 具有多层不同类型包覆材料的踏板组件 |
| CN216354438U (zh) * | 2021-10-29 | 2022-04-19 | 宁德时代新能源科技股份有限公司 | 自加热控制电路和系统 |
| EP4441848A4 (en) | 2021-12-01 | 2025-10-22 | Ticona Llc | ANTENNA MODULE |
| US20250070525A1 (en) * | 2022-03-07 | 2025-02-27 | Molex, Llc | Electrical connector for coupling conductors to an electronic component |
| US12169055B2 (en) | 2023-03-21 | 2024-12-17 | Wes Fannin | LED luminaire with improved updating and replacement characteristics |
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| US4689103A (en) * | 1985-11-18 | 1987-08-25 | E. I. Du Pont De Nemours And Company | Method of manufacturing injection molded printed circuit boards in a common planar array |
| US4954872A (en) * | 1988-04-29 | 1990-09-04 | Altair International, Inc. | Electrical contact stabilizer assembly |
| US5283717A (en) * | 1992-12-04 | 1994-02-01 | Sgs-Thomson Microelectronics, Inc. | Circuit assembly having interposer lead frame |
| JPH0818170A (ja) | 1994-06-28 | 1996-01-19 | Honda Motor Co Ltd | 配線基板 |
| DE19535777A1 (de) | 1995-09-26 | 1997-03-27 | Siemens Ag | Optoelektronisches Halbleiter-Bauelement und Verfahren zur Herstellung |
| JPH09274121A (ja) * | 1996-04-02 | 1997-10-21 | Shinko Electric Ind Co Ltd | 光用半導体装置とその製造方法 |
| DE19623826C2 (de) * | 1996-06-14 | 2000-06-15 | Siemens Ag | Verfahren zur Herstellung eines Trägerelements für Halbleiterchips |
| JP3543189B2 (ja) | 1997-12-10 | 2004-07-14 | 日本オプネクスト株式会社 | 半導体素子パッケージおよび半導体装置 |
| JPH11195851A (ja) * | 1997-12-26 | 1999-07-21 | Hitachi Cable Ltd | 成形基板 |
| JP3675364B2 (ja) * | 2001-05-30 | 2005-07-27 | ソニー株式会社 | 半導体装置用基板その製造方法および半導体装置 |
| US6664615B1 (en) * | 2001-11-20 | 2003-12-16 | National Semiconductor Corporation | Method and apparatus for lead-frame based grid array IC packaging |
| KR100623867B1 (ko) * | 2004-12-31 | 2006-09-14 | 동부일렉트로닉스 주식회사 | 반도체 회로기판의 레이아웃 방법 |
| US7256479B2 (en) * | 2005-01-13 | 2007-08-14 | Fairchild Semiconductor Corporation | Method to manufacture a universal footprint for a package with exposed chip |
| EP1897146A2 (en) * | 2005-06-27 | 2008-03-12 | Lamina Lighting, Inc. | Light emitting diode package and method for making same |
| JP4549939B2 (ja) * | 2005-06-28 | 2010-09-22 | 日東電工株式会社 | 配線回路基板保持シート |
| JP2007071980A (ja) * | 2005-09-05 | 2007-03-22 | Mitsubishi Electric Corp | 光モジュール |
| US7341365B2 (en) * | 2005-12-16 | 2008-03-11 | Ford Global Technologies, Llc | LED unit for a vehicle lamp assembly |
| US8624129B2 (en) * | 2006-01-12 | 2014-01-07 | Samsung Electronics Co., Ltd. | Method of attaching a high power surface mount transistor to a printed circuit board |
| JP2007273533A (ja) * | 2006-03-30 | 2007-10-18 | Sumitomo Heavy Ind Ltd | 導電パターンの形成方法及び形成装置 |
| US7763478B2 (en) * | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
| US7592691B2 (en) * | 2006-09-01 | 2009-09-22 | Micron Technology, Inc. | High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies |
| JP2008263118A (ja) * | 2007-04-13 | 2008-10-30 | Nec Lighting Ltd | 発光デバイス |
| KR100937136B1 (ko) * | 2007-12-24 | 2010-01-18 | (주)루미브라이트 | 복수의 패키지를 모듈화한 리드프레임을 이용한 발광다이오드 모듈 |
| US7836586B2 (en) | 2008-08-21 | 2010-11-23 | National Semiconductor Corporation | Thin foil semiconductor package |
| JP2010140820A (ja) * | 2008-12-12 | 2010-06-24 | Toshiba Corp | 灯具、配線基板及び配線基板の製造方法 |
| US8021919B2 (en) * | 2009-03-31 | 2011-09-20 | Infineon Technologies Ag | Method of manufacturing a semiconductor device |
| US7955873B2 (en) * | 2009-03-31 | 2011-06-07 | Infineon Technologies Ag | Method of fabricating a semiconductor device |
| CN102236820A (zh) * | 2010-04-27 | 2011-11-09 | 上海长丰智能卡有限公司 | 一种带负载电容的微型射频模块及其封装方法 |
| JP5502647B2 (ja) * | 2010-08-06 | 2014-05-28 | 日東電工株式会社 | 配線回路基板集合体シートおよびその製造方法 |
| US8389334B2 (en) | 2010-08-17 | 2013-03-05 | National Semiconductor Corporation | Foil-based method for packaging intergrated circuits |
| CN202012788U (zh) | 2011-04-28 | 2011-10-19 | 东莞勤上光电股份有限公司 | 一种led照明设备 |
| KR20140062506A (ko) | 2011-09-05 | 2014-05-23 | 혼다 기켄 고교 가부시키가이샤 | 하이브리드 차량의 제어 장치 및 제어 방법 |
| JP2014027265A (ja) * | 2012-06-19 | 2014-02-06 | Taiyo Holdings Co Ltd | プリント配線板の回路形成方法、熱硬化性樹脂組成物、及びプリント配線板 |
| CN103294249B (zh) * | 2012-08-17 | 2016-05-18 | 上海天马微电子有限公司 | 触摸屏的制造方法 |
| CN103426776A (zh) * | 2013-07-09 | 2013-12-04 | 上海百嘉电子有限公司 | 智能卡载带的制造方法 |
| US9829159B2 (en) | 2013-08-23 | 2017-11-28 | Molex, Llc | LED module |
| US9318411B2 (en) * | 2013-11-13 | 2016-04-19 | Brodge Semiconductor Corporation | Semiconductor package with package-on-package stacking capability and method of manufacturing the same |
| TWI517322B (zh) * | 2014-02-19 | 2016-01-11 | 鈺橋半導體股份有限公司 | 半導體元件及其製作方法 |
| US9733304B2 (en) * | 2014-09-24 | 2017-08-15 | Micron Technology, Inc. | Semiconductor device test apparatuses |
| US9252337B1 (en) * | 2014-12-22 | 2016-02-02 | Bridgelux, Inc. | Composite substrate for light emitting diodes |
| CN105789058A (zh) * | 2015-01-14 | 2016-07-20 | 钰桥半导体股份有限公司 | 中介层嵌置于加强层中的线路板及其制作方法 |
| KR102439790B1 (ko) | 2015-06-29 | 2022-09-02 | 몰렉스 엘엘씨 | 애플리케이션 특정 전자기기 패키징 시스템, 방법 및 디바이스 |
-
2016
- 2016-06-28 KR KR1020217023239A patent/KR102439790B1/ko active Active
- 2016-06-28 WO PCT/US2016/039860 patent/WO2017004064A1/en not_active Ceased
- 2016-06-28 KR KR1020207022507A patent/KR102282488B1/ko active Active
- 2016-06-28 KR KR1020227029996A patent/KR102625466B1/ko active Active
- 2016-06-28 JP JP2017568255A patent/JP6742352B2/ja active Active
- 2016-06-28 US US15/737,935 patent/US10433428B2/en active Active
- 2016-06-28 EP EP16818608.8A patent/EP3314991A4/en active Pending
- 2016-06-28 KR KR1020187002708A patent/KR102143400B1/ko active Active
- 2016-06-29 TW TW105120444A patent/TWI656663B/zh active
- 2016-06-29 CN CN201610500213.XA patent/CN106287589B/zh active Active
- 2016-06-29 CN CN202111613301.8A patent/CN114234138B/zh active Active
- 2016-06-29 CN CN201620672647.3U patent/CN205746638U/zh not_active Expired - Fee Related
-
2019
- 2019-09-24 US US16/579,890 patent/US10667407B2/en active Active
-
2020
- 2020-04-21 JP JP2020075175A patent/JP7127083B2/ja active Active
- 2020-05-22 US US16/881,017 patent/US10905014B2/en active Active
-
2021
- 2021-01-20 US US17/152,804 patent/US11503718B2/en active Active
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