JP2018533206A5 - - Google Patents

Download PDF

Info

Publication number
JP2018533206A5
JP2018533206A5 JP2018515538A JP2018515538A JP2018533206A5 JP 2018533206 A5 JP2018533206 A5 JP 2018533206A5 JP 2018515538 A JP2018515538 A JP 2018515538A JP 2018515538 A JP2018515538 A JP 2018515538A JP 2018533206 A5 JP2018533206 A5 JP 2018533206A5
Authority
JP
Japan
Prior art keywords
metal
electronic device
metal layer
input
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018515538A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018533206A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2016/055817 external-priority patent/WO2017062662A1/en
Publication of JP2018533206A publication Critical patent/JP2018533206A/ja
Publication of JP2018533206A5 publication Critical patent/JP2018533206A5/ja
Pending legal-status Critical Current

Links

JP2018515538A 2015-10-06 2016-10-06 プリント接着促進剤をその上に含む、アンテナ、1または複数の金属トレース、および/またはインダクタを有する電子デバイス、ならびにその製造方法 Pending JP2018533206A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562238045P 2015-10-06 2015-10-06
US62/238,045 2015-10-06
PCT/US2016/055817 WO2017062662A1 (en) 2015-10-06 2016-10-06 Electronic device having an antenna, metal trace (s) and/or inductor with a printed adhesion promoter thereon

Publications (2)

Publication Number Publication Date
JP2018533206A JP2018533206A (ja) 2018-11-08
JP2018533206A5 true JP2018533206A5 (https=) 2020-01-23

Family

ID=58488494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018515538A Pending JP2018533206A (ja) 2015-10-06 2016-10-06 プリント接着促進剤をその上に含む、アンテナ、1または複数の金属トレース、および/またはインダクタを有する電子デバイス、ならびにその製造方法

Country Status (5)

Country Link
US (1) US20180285706A1 (https=)
EP (1) EP3360397A4 (https=)
JP (1) JP2018533206A (https=)
CN (1) CN108432356A (https=)
WO (1) WO2017062662A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200000548A1 (en) * 2018-07-02 2020-01-02 Covidien Lp Method and apparatus related to fabricated wireless transponder devices to be used in medical procedures
KR102662861B1 (ko) * 2018-07-13 2024-05-03 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 배터리 모듈
KR102597160B1 (ko) * 2018-07-13 2023-11-02 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 배터리 모듈
US20220173066A1 (en) * 2020-12-02 2022-06-02 Flex Ltd. Flexible hybrid electronics manufacturing method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453427A (en) * 1986-09-25 1989-03-01 Toshiba Corp Bonding process
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US6710433B2 (en) * 2000-11-15 2004-03-23 Skyworks Solutions, Inc. Leadless chip carrier with embedded inductor
WO2005022443A2 (en) * 2003-08-29 2005-03-10 Mikoh Corporation A radio frequency identification tag with tamper detection capability
US7251884B2 (en) * 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces
US8330259B2 (en) * 2004-07-23 2012-12-11 Fractus, S.A. Antenna in package with reduced electromagnetic interaction with on chip elements
US9953259B2 (en) * 2004-10-08 2018-04-24 Thin Film Electronics, Asa RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same
US20100001012A1 (en) * 2006-06-08 2010-01-07 Charles Wilson Container Wrap
US9004366B2 (en) * 2007-10-10 2015-04-14 Thin Film Electronics Asa Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
CA2702324C (en) * 2007-10-10 2017-04-11 Kovio, Inc. High reliability surveillance and/or identification tag/devices and methods of making and using the same
KR101634819B1 (ko) * 2008-05-15 2016-06-29 씬 필름 일렉트로닉스 에이에스에이 멀티플 커패시터를 이용한 감시 장치
US9016585B2 (en) * 2008-11-25 2015-04-28 Thin Film Electronics Asa Printed antennas, methods of printing an antenna, and devices including the printed antenna
CN201478440U (zh) * 2009-09-09 2010-05-19 余章军 一种手机内置天线
US8912890B2 (en) * 2012-10-01 2014-12-16 Thin Film Electronics Asa Surveillance devices with multiple capacitors
US9785881B2 (en) * 2016-02-15 2017-10-10 R.R. Donnelley & Sons Company System and method for producing an electronic device

Similar Documents

Publication Publication Date Title
KR102143400B1 (ko) 애플리케이션 특정 전자기기 패키징 시스템, 방법 및 디바이스
CN102083280B (zh) 嵌入式印刷电路板、多层印刷电路板以及它们的制造方法
CN204732406U (zh) 堆叠型被动元件整合装置
CN105047359B (zh) 电子元件与电感器
JP2018533206A5 (https=)
JP6406598B2 (ja) プリント配線板及びその製造方法
TWI669040B (zh) 柔性電路板及該柔性電路板的製造方法
JP2018014381A (ja) 基板及び電子機器
JP5868274B2 (ja) 配線基板およびそれを用いた電子装置
TWI599282B (zh) 電路板及其製造方法、應用該電路板的電子裝置
CN101287331B (zh) 电路板电性连接垫的导电结构
US20170215289A1 (en) Method For Producing A Foil Arrangement And Corresponding Foil Arrangement
KR101383783B1 (ko) 인쇄전자소자 커넥터 및 그의 제조 방법
TWI451826B (zh) 多層電路板及其製作方法
US10667397B2 (en) Electronic device having a plated antenna and/or trace, and methods of making and using the same
CN104869754B (zh) 嵌有导线的软性基板及其制造方法
CN111343802B (zh) 电路板及其制作方法
US20220408565A1 (en) System, Apparatus and Method for Utilizing Surface Mount Technology on Metal Substrates
CN103458629A (zh) 多层电路板及其制作方法
CN103828493A (zh) 元器件内置基板的制造方法及使用该制造方法的元器件内置基板
WO2010136596A3 (en) Method of manufacturing an electrical circuit on a substrate
JP2016201393A (ja) プリント基板およびその製造方法
JP2005203598A (ja) 半導体装置及びその製造方法
HK1232720A1 (en) Printed wiring board and method for manufacturing same
KR20160008017A (ko) 인쇄회로기판