JP2018529802A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018529802A5 JP2018529802A5 JP2018507563A JP2018507563A JP2018529802A5 JP 2018529802 A5 JP2018529802 A5 JP 2018529802A5 JP 2018507563 A JP2018507563 A JP 2018507563A JP 2018507563 A JP2018507563 A JP 2018507563A JP 2018529802 A5 JP2018529802 A5 JP 2018529802A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- polyimide
- paste composition
- electrically conductive
- conductive metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 239000004642 Polyimide Substances 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 15
- 239000003960 organic solvent Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical group NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 8
- 229940018564 m-phenylenediamine Drugs 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 7
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 6
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- -1 4-aminophenoxyphenyl Chemical group 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- KWOIWTRRPFHBSI-UHFFFAOYSA-N 4-[2-[3-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(N)=CC=2)=CC=1C(C)(C)C1=CC=C(N)C=C1 KWOIWTRRPFHBSI-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 2
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- WCZNKVPCIFMXEQ-UHFFFAOYSA-N 2,3,5,6-tetramethylbenzene-1,4-diamine Chemical compound CC1=C(C)C(N)=C(C)C(C)=C1N WCZNKVPCIFMXEQ-UHFFFAOYSA-N 0.000 description 1
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- UVUCUHVQYAPMEU-UHFFFAOYSA-N 3-[2-(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound NC1=CC=CC(C(C=2C=C(N)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 UVUCUHVQYAPMEU-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- BEKFRNOZJSYWKZ-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1 BEKFRNOZJSYWKZ-UHFFFAOYSA-N 0.000 description 1
- IWFSADBGACLBMH-UHFFFAOYSA-N 4-[4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]phenoxy]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C(=CC(N)=CC=3)C(F)(F)F)=CC=2)C=C1 IWFSADBGACLBMH-UHFFFAOYSA-N 0.000 description 1
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- UFFSXJKVKBQEHC-UHFFFAOYSA-N heptafluorobutyric anhydride Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(=O)OC(=O)C(F)(F)C(F)(F)C(F)(F)F UFFSXJKVKBQEHC-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/824,202 | 2015-08-12 | ||
| US14/824,202 US9649730B2 (en) | 2015-08-12 | 2015-08-12 | Paste and process for forming a solderable polyimide-based polymer thick film conductor |
| PCT/US2016/045997 WO2017027456A1 (en) | 2015-08-12 | 2016-08-08 | Paste and process for forming a solderable polyimide–based polymer thick film conductor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018529802A JP2018529802A (ja) | 2018-10-11 |
| JP2018529802A5 true JP2018529802A5 (https=) | 2019-07-25 |
| JP6737874B2 JP6737874B2 (ja) | 2020-08-12 |
Family
ID=56686979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018507563A Active JP6737874B2 (ja) | 2015-08-12 | 2016-08-08 | はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのペースト及びプロセス |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9649730B2 (https=) |
| EP (1) | EP3335224B1 (https=) |
| JP (1) | JP6737874B2 (https=) |
| CN (1) | CN108140446B (https=) |
| WO (1) | WO2017027456A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170044382A1 (en) * | 2015-08-12 | 2017-02-16 | E I Du Pont De Nemours And Company | Process for forming a solderable polyimide-based polymer thick film conductor |
| CN109776826B (zh) * | 2019-01-21 | 2020-09-29 | 深圳丹邦科技股份有限公司 | 一种聚酰亚胺厚膜和量子碳基膜、及其制备方法 |
| CN121373898B (zh) * | 2025-12-23 | 2026-03-10 | 深圳市同方电子新材料有限公司 | 一种易分散锡粉及其制备方法和锡膏 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149673A (ja) * | 1983-09-30 | 1985-08-07 | エレクトロ マテリアルズ コ−ポレ−シヨン オブ アメリカ | 導電性皮膜の形成方法 |
| JPS6183250A (ja) * | 1984-09-29 | 1986-04-26 | Nitto Electric Ind Co Ltd | 電子部品用導電性ペ−スト組成物 |
| JPH0565456A (ja) * | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
| US5545429A (en) * | 1994-07-01 | 1996-08-13 | International Business Machines Corporation | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess |
| US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
| JP2003129017A (ja) * | 2001-10-25 | 2003-05-08 | Sumitomo Bakelite Co Ltd | 導電性接着フィルム及びこれを用いた半導体装置 |
| US7348373B2 (en) * | 2004-01-09 | 2008-03-25 | E.I. Du Pont De Nemours And Company | Polyimide compositions having resistance to water sorption, and methods relating thereto |
| US7169330B2 (en) | 2004-02-25 | 2007-01-30 | E. I. Du Pont De Nemours And Company | Composition of conductive paste |
| CN1835129B (zh) * | 2005-03-16 | 2010-04-28 | E.I.内穆尔杜邦公司 | 导电性浆状组合物 |
| US7745516B2 (en) | 2005-10-12 | 2010-06-29 | E. I. Du Pont De Nemours And Company | Composition of polyimide and sterically-hindered hydrophobic epoxy |
| JP2008106145A (ja) * | 2006-10-25 | 2008-05-08 | Sekisui Chem Co Ltd | 焼結性導電ペースト |
| US8270145B2 (en) | 2007-12-04 | 2012-09-18 | Cda Processing Limited Liability Company | Screen-printable encapsulants based on soluble polybenzoxazoles |
| CN102169739B (zh) * | 2011-02-25 | 2012-09-05 | 乐山新天源太阳能电力有限公司 | 太阳电池用纳米铝浆及其制备方法 |
| JP6028727B2 (ja) * | 2011-05-18 | 2016-11-16 | 戸田工業株式会社 | 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜 |
| TW201339279A (zh) * | 2011-11-24 | 2013-10-01 | Showa Denko Kk | 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物 |
| JP5321723B1 (ja) * | 2012-10-29 | 2013-10-23 | 横浜ゴム株式会社 | 導電性組成物および太陽電池セル |
| US9818718B2 (en) * | 2012-10-30 | 2017-11-14 | Kaken Tech Co., Ltd. | Conductive paste and die bonding method |
| JP5700864B2 (ja) * | 2013-05-15 | 2015-04-15 | 石原ケミカル株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
| US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
| JP2015032493A (ja) * | 2013-08-05 | 2015-02-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびそれを用いる導電膜の製造方法 |
| CN104650653B (zh) * | 2013-11-22 | 2017-09-01 | 苏州冷石纳米材料科技有限公司 | 一种纳米导电银浆及其制备方法 |
-
2015
- 2015-08-12 US US14/824,202 patent/US9649730B2/en active Active
-
2016
- 2016-08-08 EP EP16751796.0A patent/EP3335224B1/en active Active
- 2016-08-08 JP JP2018507563A patent/JP6737874B2/ja active Active
- 2016-08-08 CN CN201680058560.XA patent/CN108140446B/zh active Active
- 2016-08-08 WO PCT/US2016/045997 patent/WO2017027456A1/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021088711A (ja) | ポリイミド系ポリマー厚膜組成物 | |
| US7604754B2 (en) | Resistor compositions for electronic circuitry applications | |
| JP2005325332A (ja) | 水分収着耐性を有するポリイミド組成物およびそれに関連する方法 | |
| US20130171459A1 (en) | Polyamic acid resin solution containing interpenetrating polymer and laminate using the same | |
| JP2018529802A5 (https=) | ||
| EP3335224B1 (en) | Paste and process for forming a solderable polyimide based polymer thick film conductor | |
| CN110050036A (zh) | 组合物、粘接剂、烧结体、接合体和接合体的制造方法 | |
| US10153075B2 (en) | Polyimide-based polymer thick film resistor composition | |
| CN110050040A (zh) | 组合物、粘接剂、烧结体、接合体和接合体的制造方法 | |
| CN110050047A (zh) | 接合体的制造方法、瞬态液相烧结用组合物、烧结体和接合体 | |
| US20160183328A1 (en) | Method and devices for high temperature thick film pastes | |
| US20150228374A1 (en) | Thermally conductive electronic substrates and methods relating thereto | |
| JP2018525494A5 (https=) | ||
| EP4424749A1 (en) | Polyamic acid varnish, polyimide composition, and adhesive | |
| EP3335223B1 (en) | Photonic sintering of a polymer thick film copper conductor composition | |
| WO2020003536A1 (ja) | 液相焼結用シート、焼結体、接合体及び接合体の製造方法 | |
| JP6737872B2 (ja) | はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス | |
| US10508217B2 (en) | Polyimide-based polymer thick film resistor composition | |
| JP5654463B2 (ja) | 金属および乳酸縮合物から構成される物質および電子部品 | |
| CN108140445B (zh) | 可焊接的聚合物厚膜铜导体组合物的光子烧结 | |
| TW201829794A (zh) | 組成物、黏著劑、燒結體、接合體及接合體的製造方法 | |
| JP2009056792A (ja) | 積層板およびその製造方法 |