JP2018525494A5 - - Google Patents
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- Publication number
- JP2018525494A5 JP2018525494A5 JP2018507553A JP2018507553A JP2018525494A5 JP 2018525494 A5 JP2018525494 A5 JP 2018525494A5 JP 2018507553 A JP2018507553 A JP 2018507553A JP 2018507553 A JP2018507553 A JP 2018507553A JP 2018525494 A5 JP2018525494 A5 JP 2018525494A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- paste composition
- polyimide
- electrically conductive
- conductive metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 16
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical group NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 8
- 229940018564 m-phenylenediamine Drugs 0.000 description 8
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 6
- UTDAGHZGKXPRQI-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]sulfonylphenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(S(=O)(=O)C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 UTDAGHZGKXPRQI-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- KWOIWTRRPFHBSI-UHFFFAOYSA-N 4-[2-[3-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=CC(C(C)(C)C=2C=CC(N)=CC=2)=CC=1C(C)(C)C1=CC=C(N)C=C1 KWOIWTRRPFHBSI-UHFFFAOYSA-N 0.000 description 3
- -1 4-aminophenoxyphenyl Chemical group 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 2
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- WCZNKVPCIFMXEQ-UHFFFAOYSA-N 2,3,5,6-tetramethylbenzene-1,4-diamine Chemical compound CC1=C(C)C(N)=C(C)C(C)=C1N WCZNKVPCIFMXEQ-UHFFFAOYSA-N 0.000 description 1
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- UVUCUHVQYAPMEU-UHFFFAOYSA-N 3-[2-(3-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound NC1=CC=CC(C(C=2C=C(N)C=CC=2)(C(F)(F)F)C(F)(F)F)=C1 UVUCUHVQYAPMEU-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- BEKFRNOZJSYWKZ-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1 BEKFRNOZJSYWKZ-UHFFFAOYSA-N 0.000 description 1
- IWFSADBGACLBMH-UHFFFAOYSA-N 4-[4-[4-[4-amino-2-(trifluoromethyl)phenoxy]phenyl]phenoxy]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C(=CC(N)=CC=3)C(F)(F)F)=CC=2)C=C1 IWFSADBGACLBMH-UHFFFAOYSA-N 0.000 description 1
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- UFFSXJKVKBQEHC-UHFFFAOYSA-N heptafluorobutyric anhydride Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(=O)OC(=O)C(F)(F)C(F)(F)C(F)(F)F UFFSXJKVKBQEHC-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/824,188 US20170044382A1 (en) | 2015-08-12 | 2015-08-12 | Process for forming a solderable polyimide-based polymer thick film conductor |
| US14/824,188 | 2015-08-12 | ||
| PCT/US2016/045982 WO2017027449A1 (en) | 2015-08-12 | 2016-08-08 | Process for forming a solderable polyimide-based polymer thick film conductor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018525494A JP2018525494A (ja) | 2018-09-06 |
| JP2018525494A5 true JP2018525494A5 (https=) | 2019-07-25 |
| JP6737872B2 JP6737872B2 (ja) | 2020-08-12 |
Family
ID=56740495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018507553A Active JP6737872B2 (ja) | 2015-08-12 | 2016-08-08 | はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20170044382A1 (https=) |
| EP (1) | EP3335225A1 (https=) |
| JP (1) | JP6737872B2 (https=) |
| CN (1) | CN108140444A (https=) |
| WO (1) | WO2017027449A1 (https=) |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149673A (ja) * | 1983-09-30 | 1985-08-07 | エレクトロ マテリアルズ コ−ポレ−シヨン オブ アメリカ | 導電性皮膜の形成方法 |
| US4666547A (en) * | 1985-03-29 | 1987-05-19 | Snowden Jr Thomas M | Electrically conductive resinous bond and method of manufacture |
| WO1991014015A1 (en) * | 1990-03-05 | 1991-09-19 | Olin Corporation | Method and materials for forming multi-layer circuits by an additive process |
| JPH04317389A (ja) * | 1991-04-16 | 1992-11-09 | Nec Corp | 配線パターンの形成方法 |
| JPH0565456A (ja) * | 1991-09-09 | 1993-03-19 | Sumitomo Bakelite Co Ltd | 気密封止用樹脂ペースト |
| US6083426A (en) * | 1998-06-12 | 2000-07-04 | Matsushita Electric Industrial Co., Ltd. | Conductive paste |
| US6344157B1 (en) * | 1999-02-12 | 2002-02-05 | National Starch And Chemical Investment Holding Corporation | Conductive and resistive materials with electrical stability for use in electronics devices |
| EP1146149A4 (en) * | 1999-11-01 | 2006-08-30 | Jsr Corp | AQUEOUS DISPERSION FOR FORMING A CONDUCTIVE LAYER, CONDUCTIVE LAYER, ELECTRONIC COMPONENT, PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
| US7348373B2 (en) * | 2004-01-09 | 2008-03-25 | E.I. Du Pont De Nemours And Company | Polyimide compositions having resistance to water sorption, and methods relating thereto |
| US7169330B2 (en) * | 2004-02-25 | 2007-01-30 | E. I. Du Pont De Nemours And Company | Composition of conductive paste |
| CN1835129B (zh) * | 2005-03-16 | 2010-04-28 | E.I.内穆尔杜邦公司 | 导电性浆状组合物 |
| JP2008106145A (ja) * | 2006-10-25 | 2008-05-08 | Sekisui Chem Co Ltd | 焼結性導電ペースト |
| JP6028727B2 (ja) * | 2011-05-18 | 2016-11-16 | 戸田工業株式会社 | 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜 |
| US9818718B2 (en) * | 2012-10-30 | 2017-11-14 | Kaken Tech Co., Ltd. | Conductive paste and die bonding method |
| US8828502B2 (en) * | 2013-02-04 | 2014-09-09 | Eastman Kodak Company | Making a conductive article |
| JP5700864B2 (ja) * | 2013-05-15 | 2015-04-15 | 石原ケミカル株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
| US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
| JP2015032493A (ja) * | 2013-08-05 | 2015-02-16 | 富士フイルム株式会社 | 導電膜形成用組成物およびそれを用いる導電膜の製造方法 |
| US9649730B2 (en) * | 2015-08-12 | 2017-05-16 | E I Du Pont De Nemours And Company | Paste and process for forming a solderable polyimide-based polymer thick film conductor |
-
2015
- 2015-08-12 US US14/824,188 patent/US20170044382A1/en not_active Abandoned
-
2016
- 2016-08-08 CN CN201680057626.3A patent/CN108140444A/zh active Pending
- 2016-08-08 WO PCT/US2016/045982 patent/WO2017027449A1/en not_active Ceased
- 2016-08-08 EP EP16754059.0A patent/EP3335225A1/en not_active Withdrawn
- 2016-08-08 JP JP2018507553A patent/JP6737872B2/ja active Active
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