JP6737872B2 - はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス - Google Patents

はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス Download PDF

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Publication number
JP6737872B2
JP6737872B2 JP2018507553A JP2018507553A JP6737872B2 JP 6737872 B2 JP6737872 B2 JP 6737872B2 JP 2018507553 A JP2018507553 A JP 2018507553A JP 2018507553 A JP2018507553 A JP 2018507553A JP 6737872 B2 JP6737872 B2 JP 6737872B2
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weight
polyimide
composition
silver
bis
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Japanese (ja)
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JP2018525494A5 (https=
JP2018525494A (ja
Inventor
スー セイギ
スー セイギ
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Paints Or Removers (AREA)
JP2018507553A 2015-08-12 2016-08-08 はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス Active JP6737872B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/824,188 US20170044382A1 (en) 2015-08-12 2015-08-12 Process for forming a solderable polyimide-based polymer thick film conductor
US14/824,188 2015-08-12
PCT/US2016/045982 WO2017027449A1 (en) 2015-08-12 2016-08-08 Process for forming a solderable polyimide-based polymer thick film conductor

Publications (3)

Publication Number Publication Date
JP2018525494A JP2018525494A (ja) 2018-09-06
JP2018525494A5 JP2018525494A5 (https=) 2019-07-25
JP6737872B2 true JP6737872B2 (ja) 2020-08-12

Family

ID=56740495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018507553A Active JP6737872B2 (ja) 2015-08-12 2016-08-08 はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのプロセス

Country Status (5)

Country Link
US (1) US20170044382A1 (https=)
EP (1) EP3335225A1 (https=)
JP (1) JP6737872B2 (https=)
CN (1) CN108140444A (https=)
WO (1) WO2017027449A1 (https=)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149673A (ja) * 1983-09-30 1985-08-07 エレクトロ　マテリアルズ　コ−ポレ−シヨン　オブ　アメリカ 導電性皮膜の形成方法
US4666547A (en) * 1985-03-29 1987-05-19 Snowden Jr Thomas M Electrically conductive resinous bond and method of manufacture
WO1991014015A1 (en) * 1990-03-05 1991-09-19 Olin Corporation Method and materials for forming multi-layer circuits by an additive process
JPH04317389A (ja) * 1991-04-16 1992-11-09 Nec Corp 配線パターンの形成方法
JPH0565456A (ja) * 1991-09-09 1993-03-19 Sumitomo Bakelite Co Ltd 気密封止用樹脂ペースト
US6083426A (en) * 1998-06-12 2000-07-04 Matsushita Electric Industrial Co., Ltd. Conductive paste
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
EP1146149A4 (en) * 1999-11-01 2006-08-30 Jsr Corp AQUEOUS DISPERSION FOR FORMING A CONDUCTIVE LAYER, CONDUCTIVE LAYER, ELECTRONIC COMPONENT, PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
US7348373B2 (en) * 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
US7169330B2 (en) * 2004-02-25 2007-01-30 E. I. Du Pont De Nemours And Company Composition of conductive paste
CN1835129B (zh) * 2005-03-16 2010-04-28 E.I.内穆尔杜邦公司 导电性浆状组合物
JP2008106145A (ja) * 2006-10-25 2008-05-08 Sekisui Chem Co Ltd 焼結性導電ペースト
JP6028727B2 (ja) * 2011-05-18 2016-11-16 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
US9818718B2 (en) * 2012-10-30 2017-11-14 Kaken Tech Co., Ltd. Conductive paste and die bonding method
US8828502B2 (en) * 2013-02-04 2014-09-09 Eastman Kodak Company Making a conductive article
JP5700864B2 (ja) * 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
JP2015032493A (ja) * 2013-08-05 2015-02-16 富士フイルム株式会社 導電膜形成用組成物およびそれを用いる導電膜の製造方法
US9649730B2 (en) * 2015-08-12 2017-05-16 E I Du Pont De Nemours And Company Paste and process for forming a solderable polyimide-based polymer thick film conductor

Also Published As

Publication number Publication date
JP2018525494A (ja) 2018-09-06
CN108140444A (zh) 2018-06-08
WO2017027449A1 (en) 2017-02-16
US20170044382A1 (en) 2017-02-16
EP3335225A1 (en) 2018-06-20

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