JP6737874B2 - はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのペースト及びプロセス - Google Patents

はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのペースト及びプロセス Download PDF

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Publication number
JP6737874B2
JP6737874B2 JP2018507563A JP2018507563A JP6737874B2 JP 6737874 B2 JP6737874 B2 JP 6737874B2 JP 2018507563 A JP2018507563 A JP 2018507563A JP 2018507563 A JP2018507563 A JP 2018507563A JP 6737874 B2 JP6737874 B2 JP 6737874B2
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Japan
Prior art keywords
weight
polyimide
thick film
composition
paste composition
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JP2018507563A
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English (en)
Japanese (ja)
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JP2018529802A5 (https=
JP2018529802A (ja
Inventor
スー セイギ
スー セイギ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
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Publication of JP2018529802A publication Critical patent/JP2018529802A/ja
Publication of JP2018529802A5 publication Critical patent/JP2018529802A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2018507563A 2015-08-12 2016-08-08 はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのペースト及びプロセス Active JP6737874B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/824,202 2015-08-12
US14/824,202 US9649730B2 (en) 2015-08-12 2015-08-12 Paste and process for forming a solderable polyimide-based polymer thick film conductor
PCT/US2016/045997 WO2017027456A1 (en) 2015-08-12 2016-08-08 Paste and process for forming a solderable polyimide–based polymer thick film conductor

Publications (3)

Publication Number Publication Date
JP2018529802A JP2018529802A (ja) 2018-10-11
JP2018529802A5 JP2018529802A5 (https=) 2019-07-25
JP6737874B2 true JP6737874B2 (ja) 2020-08-12

Family

ID=56686979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018507563A Active JP6737874B2 (ja) 2015-08-12 2016-08-08 はんだ付け可能なポリイミド系ポリマー厚膜導電体を形成するためのペースト及びプロセス

Country Status (5)

Country Link
US (1) US9649730B2 (https=)
EP (1) EP3335224B1 (https=)
JP (1) JP6737874B2 (https=)
CN (1) CN108140446B (https=)
WO (1) WO2017027456A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170044382A1 (en) * 2015-08-12 2017-02-16 E I Du Pont De Nemours And Company Process for forming a solderable polyimide-based polymer thick film conductor
CN109776826B (zh) * 2019-01-21 2020-09-29 深圳丹邦科技股份有限公司 一种聚酰亚胺厚膜和量子碳基膜、及其制备方法
CN121373898B (zh) * 2025-12-23 2026-03-10 深圳市同方电子新材料有限公司 一种易分散锡粉及其制备方法和锡膏

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60149673A (ja) * 1983-09-30 1985-08-07 エレクトロ　マテリアルズ　コ−ポレ−シヨン　オブ　アメリカ 導電性皮膜の形成方法
JPS6183250A (ja) * 1984-09-29 1986-04-26 Nitto Electric Ind Co Ltd 電子部品用導電性ペ−スト組成物
JPH0565456A (ja) * 1991-09-09 1993-03-19 Sumitomo Bakelite Co Ltd 気密封止用樹脂ペースト
US5545429A (en) * 1994-07-01 1996-08-13 International Business Machines Corporation Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
US6344157B1 (en) * 1999-02-12 2002-02-05 National Starch And Chemical Investment Holding Corporation Conductive and resistive materials with electrical stability for use in electronics devices
JP2003129017A (ja) * 2001-10-25 2003-05-08 Sumitomo Bakelite Co Ltd 導電性接着フィルム及びこれを用いた半導体装置
US7348373B2 (en) * 2004-01-09 2008-03-25 E.I. Du Pont De Nemours And Company Polyimide compositions having resistance to water sorption, and methods relating thereto
US7169330B2 (en) 2004-02-25 2007-01-30 E. I. Du Pont De Nemours And Company Composition of conductive paste
CN1835129B (zh) * 2005-03-16 2010-04-28 E.I.内穆尔杜邦公司 导电性浆状组合物
US7745516B2 (en) 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy
JP2008106145A (ja) * 2006-10-25 2008-05-08 Sekisui Chem Co Ltd 焼結性導電ペースト
US8270145B2 (en) 2007-12-04 2012-09-18 Cda Processing Limited Liability Company Screen-printable encapsulants based on soluble polybenzoxazoles
CN102169739B (zh) * 2011-02-25 2012-09-05 乐山新天源太阳能电力有限公司 太阳电池用纳米铝浆及其制备方法
JP6028727B2 (ja) * 2011-05-18 2016-11-16 戸田工業株式会社 銅粉末、銅ペースト、導電性塗膜の製造方法及び導電性塗膜
TW201339279A (zh) * 2011-11-24 2013-10-01 Showa Denko Kk 導電圖型形成方法及藉由光照射或微波加熱的導電圖型形成用組成物
JP5321723B1 (ja) * 2012-10-29 2013-10-23 横浜ゴム株式会社 導電性組成物および太陽電池セル
US9818718B2 (en) * 2012-10-30 2017-11-14 Kaken Tech Co., Ltd. Conductive paste and die bonding method
JP5700864B2 (ja) * 2013-05-15 2015-04-15 石原ケミカル株式会社 銅微粒子分散液、導電膜形成方法及び回路基板
US9190188B2 (en) * 2013-06-13 2015-11-17 E I Du Pont De Nemours And Company Photonic sintering of polymer thick film copper conductor compositions
JP2015032493A (ja) * 2013-08-05 2015-02-16 富士フイルム株式会社 導電膜形成用組成物およびそれを用いる導電膜の製造方法
CN104650653B (zh) * 2013-11-22 2017-09-01 苏州冷石纳米材料科技有限公司 一种纳米导电银浆及其制备方法

Also Published As

Publication number Publication date
CN108140446A (zh) 2018-06-08
CN108140446B (zh) 2020-07-31
EP3335224B1 (en) 2019-06-12
US9649730B2 (en) 2017-05-16
EP3335224A1 (en) 2018-06-20
JP2018529802A (ja) 2018-10-11
WO2017027456A1 (en) 2017-02-16
US20170043435A1 (en) 2017-02-16

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