JP2018519669A - オプトエレクトロニクス半導体装置 - Google Patents
オプトエレクトロニクス半導体装置 Download PDFInfo
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- JP2018519669A JP2018519669A JP2017568302A JP2017568302A JP2018519669A JP 2018519669 A JP2018519669 A JP 2018519669A JP 2017568302 A JP2017568302 A JP 2017568302A JP 2017568302 A JP2017568302 A JP 2017568302A JP 2018519669 A JP2018519669 A JP 2018519669A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Description
2 半導体積層体
3 p型ドープ半導体領域
4 活性層
5 n型ドープ半導体領域
6 ミラー層
7 p型接続層
8 n型接続層
9 電気絶縁層
10 キャリア
11 第1の貫通ビア
12 第2の貫通ビア
13 p型導電領域
14 n型導電領域
15 ESD保護素子
16 放射出口面
17 第1の主面
18 第2の主面
Claims (12)
- オプトエレクトロニクス半導体装置であって、
− p型半導体領域(3)と、n型半導体領域(5)と、前記p型半導体領域(3)と前記n型半導体領域(5)との間に配置されている活性層(4)と、を有する半導体積層体(2)、を備えた半導体ボディ(1)と、
− プラスチック材料を含み、かつ第1の貫通ビア(11)および第2の貫通ビア(12)を備えている、キャリア(10)と、
− 少なくとも部分的に前記キャリア(10)と前記半導体ボディ(1)との間に配置されているp型接続層(7)およびn型接続層(8,8A)であって、前記p型接続層(7)が前記第1の貫通ビア(11)を前記p型半導体領域(3)に接続しており、かつ前記n型接続層(8,8A)が前記第2の貫通ビア(12)を前記n型半導体領域(5)に接続している、前記p型接続層(7)および前記n型接続層(8)と、
− 前記キャリア(10)と前記半導体ボディ(1)との間に配置されているESD保護素子(15)であって、前記ESD保護素子(15)が前記第1の貫通ビア(11)と前記第2の貫通ビア(12)とに導電接続されており、前記ESD保護素子(15)の導通方向が前記半導体積層体(2)の導通方向と逆並列である、前記ESD保護素子(15)と、
を備えている、オプトエレクトロニクス半導体装置。 - 前記ESD保護素子(15)が、平坦な層の形をとる、
請求項1に記載のオプトエレクトロニクス半導体装置。 - 前記ESD保護素子(15)が、ダイオード、ショットキー接触、またはバリスタの形をとる、
請求項1または請求項2のいずれか1項に記載のオプトエレクトロニクス半導体装置。 - 前記ESD保護素子(15)が、材料ZnO、Si、TiO、ITO、SnO、Ge、Se、Te、AlN、またはグラフェンのうちの少なくとも1種類を含む、
請求項1から請求項3のいずれか1項に記載のオプトエレクトロニクス半導体装置。 - 前記ESD保護素子(15)が、前記半導体ボディ(1)の側の前記キャリア(10)の境界面に配置されている、
請求項1から請求項4のいずれか1項に記載のオプトエレクトロニクス半導体装置。 - 前記ESD保護素子(15)が、前記第1の貫通ビア(11)と前記第2の貫通ビア(12)とに直接隣接している、
請求項1から請求項5のいずれか1項に記載のオプトエレクトロニクス半導体装置。 - 前記ESD保護素子(15)が、p型導電領域(13)およびn型導電領域(14)を備えたダイオードであり、前記n型導電領域(14)が前記第1の貫通ビア(11)に導電接続されており、かつ、前記p型導電領域(13)が前記第2の貫通ビア(12)に導電接続されている、
請求項1から請求項6のいずれか1項に記載のオプトエレクトロニクス半導体装置。 - 前記p型導電領域(13)および前記n型導電領域(14)が、前記第1の貫通ビア(11)と前記第2の貫通ビア(12)の間に直線状の接続部を形成している、
請求項7に記載のオプトエレクトロニクス半導体装置。 - 前記p型導電領域(13)および前記n型導電領域(14)が、それぞれ環状構造である、
請求項7に記載のオプトエレクトロニクス半導体装置。 - 前記p型導電領域(13)および前記n型導電領域(14)が、前記p型接続層(7)または前記n型接続層(8,8A)の周囲に環状に延在している、
請求項9に記載のオプトエレクトロニクス半導体装置。 - 前記キャリア(10)が、エポキシ樹脂またはシリコーンを含む、
請求項1から請求項10のいずれか1項に記載のオプトエレクトロニクス半導体装置。 - 前記n型接続層(8,8A)が、前記p型半導体領域(3)および前記活性層(4)における開口部を通じて前記n型半導体領域(5)の中に達している、
請求項1から請求項11のいずれか1項に記載のオプトエレクトロニクス半導体装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015111485.2A DE102015111485A1 (de) | 2015-07-15 | 2015-07-15 | Optoelektronisches Halbleiterbauelement |
DE102015111485.2 | 2015-07-15 | ||
PCT/EP2016/065714 WO2017009085A1 (de) | 2015-07-15 | 2016-07-04 | Optoelektronisches halbleiterbauelement |
Publications (2)
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JP2018519669A true JP2018519669A (ja) | 2018-07-19 |
JP6571805B2 JP6571805B2 (ja) | 2019-09-04 |
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JP2017568302A Active JP6571805B2 (ja) | 2015-07-15 | 2016-07-04 | オプトエレクトロニクス半導体装置 |
Country Status (5)
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US (1) | US10559556B2 (ja) |
JP (1) | JP6571805B2 (ja) |
CN (1) | CN107851644B (ja) |
DE (1) | DE102015111485A1 (ja) |
WO (1) | WO2017009085A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015115900A1 (de) * | 2015-09-21 | 2017-03-23 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
DE102017122111B4 (de) * | 2017-09-25 | 2024-03-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektronisches Bauteil |
JP2022092294A (ja) | 2020-12-10 | 2022-06-22 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光素子の支持基板 |
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2015
- 2015-07-15 DE DE102015111485.2A patent/DE102015111485A1/de active Pending
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2016
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Also Published As
Publication number | Publication date |
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US20180197843A1 (en) | 2018-07-12 |
DE102015111485A1 (de) | 2017-01-19 |
WO2017009085A1 (de) | 2017-01-19 |
US10559556B2 (en) | 2020-02-11 |
JP6571805B2 (ja) | 2019-09-04 |
CN107851644A (zh) | 2018-03-27 |
CN107851644B (zh) | 2021-02-02 |
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