JP2018519426A5 - - Google Patents
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- Publication number
- JP2018519426A5 JP2018519426A5 JP2018500317A JP2018500317A JP2018519426A5 JP 2018519426 A5 JP2018519426 A5 JP 2018519426A5 JP 2018500317 A JP2018500317 A JP 2018500317A JP 2018500317 A JP2018500317 A JP 2018500317A JP 2018519426 A5 JP2018519426 A5 JP 2018519426A5
- Authority
- JP
- Japan
- Prior art keywords
- deposition ring
- process kit
- ring
- substrate support
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 34
- 230000008021 deposition Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims 19
- 238000005477 sputtering target Methods 0.000 claims 4
- 239000000463 material Substances 0.000 description 5
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021183138A JP7289890B2 (ja) | 2015-07-03 | 2021-11-10 | 背高の堆積リングと堆積リングクランプとを有するプロセスキット |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN2029/DEL/2015 | 2015-07-03 | ||
| IN2029DE2015 | 2015-07-03 | ||
| US15/201,019 | 2016-07-01 | ||
| PCT/US2016/040847 WO2017007729A1 (en) | 2015-07-03 | 2016-07-01 | Process kit having tall deposition ring and deposition ring clamp |
| US15/201,019 US9909206B2 (en) | 2015-07-03 | 2016-07-01 | Process kit having tall deposition ring and deposition ring clamp |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021183138A Division JP7289890B2 (ja) | 2015-07-03 | 2021-11-10 | 背高の堆積リングと堆積リングクランプとを有するプロセスキット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018519426A JP2018519426A (ja) | 2018-07-19 |
| JP2018519426A5 true JP2018519426A5 (enExample) | 2019-08-08 |
| JP6976925B2 JP6976925B2 (ja) | 2021-12-08 |
Family
ID=57683629
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018500317A Active JP6976925B2 (ja) | 2015-07-03 | 2016-07-01 | 背高の堆積リングと堆積リングクランプとを有するプロセスキット |
| JP2021183138A Active JP7289890B2 (ja) | 2015-07-03 | 2021-11-10 | 背高の堆積リングと堆積リングクランプとを有するプロセスキット |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021183138A Active JP7289890B2 (ja) | 2015-07-03 | 2021-11-10 | 背高の堆積リングと堆積リングクランプとを有するプロセスキット |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9909206B2 (enExample) |
| JP (2) | JP6976925B2 (enExample) |
| KR (1) | KR102709082B1 (enExample) |
| CN (3) | CN117867462A (enExample) |
| SG (1) | SG10202108705SA (enExample) |
| TW (2) | TWI713543B (enExample) |
| WO (1) | WO2017007729A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI653885B (zh) * | 2017-03-03 | 2019-03-11 | 宏碁股份有限公司 | 影像輸出方法及影像擷取裝置 |
| JPWO2019053869A1 (ja) * | 2017-09-15 | 2020-10-01 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置、半導体装置の製造方法およびプログラム |
| US11056325B2 (en) | 2017-12-20 | 2021-07-06 | Applied Materials, Inc. | Methods and apparatus for substrate edge uniformity |
| CN110468377B (zh) * | 2018-05-11 | 2022-04-22 | 北京北方华创微电子装备有限公司 | 腔室及半导体加工设备 |
| JP7093850B2 (ja) * | 2018-12-03 | 2022-06-30 | 株式会社アルバック | 成膜装置及び成膜方法 |
| US11961723B2 (en) * | 2018-12-17 | 2024-04-16 | Applied Materials, Inc. | Process kit having tall deposition ring for PVD chamber |
| USD888903S1 (en) | 2018-12-17 | 2020-06-30 | Applied Materials, Inc. | Deposition ring for physical vapor deposition chamber |
| US11361982B2 (en) * | 2019-12-10 | 2022-06-14 | Applied Materials, Inc. | Methods and apparatus for in-situ cleaning of electrostatic chucks |
| CN111235535B (zh) * | 2020-01-22 | 2021-11-16 | 北京北方华创微电子装备有限公司 | 一种溅射反应腔室的工艺组件及其溅射反应腔室 |
| US11935728B2 (en) * | 2020-01-31 | 2024-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method of manufacturing a semiconductor device |
| US11339466B2 (en) * | 2020-03-20 | 2022-05-24 | Applied Materials, Inc. | Heated shield for physical vapor deposition chamber |
| USD934315S1 (en) | 2020-03-20 | 2021-10-26 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD941372S1 (en) | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941371S1 (en) | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| US11380575B2 (en) | 2020-07-27 | 2022-07-05 | Applied Materials, Inc. | Film thickness uniformity improvement using edge ring and bias electrode geometry |
| USD1034491S1 (en) | 2020-07-27 | 2024-07-09 | Applied Materials, Inc. | Edge ring |
| JP7223738B2 (ja) | 2020-11-12 | 2023-02-16 | 株式会社アルバック | スパッタリング装置 |
| US11670493B2 (en) * | 2020-11-13 | 2023-06-06 | Applied Materials, Inc. | Isolator ring clamp and physical vapor deposition chamber incorporating same |
| US11581167B2 (en) | 2021-06-18 | 2023-02-14 | Applied Materials, Inc. | Process kit having tall deposition ring and smaller diameter electrostatic chuck (ESC) for PVD chamber |
| US11915918B2 (en) | 2021-06-29 | 2024-02-27 | Applied Materials, Inc. | Cleaning of sin with CCP plasma or RPS clean |
| US12183559B2 (en) | 2021-10-22 | 2024-12-31 | Applied Materials, Inc. | Apparatus for temperature control in a substrate processing chamber |
| USD1059312S1 (en) * | 2022-08-04 | 2025-01-28 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
| USD1069863S1 (en) | 2022-08-04 | 2025-04-08 | Applied Materials, Inc. | Deposition ring of a process kit for semiconductor substrate processing |
| USD1064005S1 (en) | 2022-08-04 | 2025-02-25 | Applied Materials, Inc. | Grounding ring of a process kit for semiconductor substrate processing |
| US20240068086A1 (en) * | 2022-08-29 | 2024-02-29 | Applied Materials, Inc. | Physical Vapor Deposition (PVD) Chamber Titanium-Tungsten (TiW) Target For Particle Improvement |
| CN119968474A (zh) * | 2022-10-05 | 2025-05-09 | 应用材料公司 | 用于基板的掩模、基板支撑件、基板处理设备、用于在基板上进行层沉积的方法和制造一个或多个装置的方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6743340B2 (en) * | 2002-02-05 | 2004-06-01 | Applied Materials, Inc. | Sputtering of aligned magnetic materials and magnetic dipole ring used therefor |
| US7670436B2 (en) * | 2004-11-03 | 2010-03-02 | Applied Materials, Inc. | Support ring assembly |
| US9127362B2 (en) * | 2005-10-31 | 2015-09-08 | Applied Materials, Inc. | Process kit and target for substrate processing chamber |
| US7520969B2 (en) | 2006-03-07 | 2009-04-21 | Applied Materials, Inc. | Notched deposition ring |
| SG177902A1 (en) * | 2006-12-19 | 2012-02-28 | Applied Materials Inc | Non-contact process kit |
| US8221602B2 (en) * | 2006-12-19 | 2012-07-17 | Applied Materials, Inc. | Non-contact process kit |
| KR101571558B1 (ko) | 2008-04-16 | 2015-11-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 웨이퍼 프로세싱 증착 차폐 컴포넌트들 |
| US9799497B2 (en) * | 2013-08-16 | 2017-10-24 | Taiwan Semiconductor Manufacturing Company Limited | Patterned processing kits for material processing |
| US10546733B2 (en) | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
-
2016
- 2016-07-01 KR KR1020187003405A patent/KR102709082B1/ko active Active
- 2016-07-01 SG SG10202108705SA patent/SG10202108705SA/en unknown
- 2016-07-01 JP JP2018500317A patent/JP6976925B2/ja active Active
- 2016-07-01 US US15/201,019 patent/US9909206B2/en active Active
- 2016-07-01 CN CN202311689865.9A patent/CN117867462A/zh active Pending
- 2016-07-01 CN CN201811141495.4A patent/CN109321890A/zh active Pending
- 2016-07-01 WO PCT/US2016/040847 patent/WO2017007729A1/en not_active Ceased
- 2016-07-01 CN CN201680037325.4A patent/CN107787377A/zh active Pending
- 2016-07-04 TW TW105121124A patent/TWI713543B/zh active
- 2016-07-04 TW TW109140346A patent/TWI770678B/zh active
-
2021
- 2021-11-10 JP JP2021183138A patent/JP7289890B2/ja active Active
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