JP2018518368A5 - - Google Patents

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Publication number
JP2018518368A5
JP2018518368A5 JP2017557168A JP2017557168A JP2018518368A5 JP 2018518368 A5 JP2018518368 A5 JP 2018518368A5 JP 2017557168 A JP2017557168 A JP 2017557168A JP 2017557168 A JP2017557168 A JP 2017557168A JP 2018518368 A5 JP2018518368 A5 JP 2018518368A5
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JP
Japan
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weight
residual
solder alloy
solder
optionally
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JP2017557168A
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Japanese (ja)
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JP2018518368A (ja
JP6730999B2 (ja
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Priority claimed from US15/147,137 external-priority patent/US11229979B2/en
Publication of JP2018518368A publication Critical patent/JP2018518368A/ja
Publication of JP2018518368A5 publication Critical patent/JP2018518368A5/ja
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JP2017557168A 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金 Active JP6730999B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562157302P 2015-05-05 2015-05-05
US62/157,302 2015-05-05
US15/147,137 US11229979B2 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications
US15/147,137 2016-05-05
PCT/US2016/030915 WO2016179358A1 (en) 2015-05-05 2016-05-05 High reliability lead-free solder alloys for harsh environment electronics applications

Publications (3)

Publication Number Publication Date
JP2018518368A JP2018518368A (ja) 2018-07-12
JP2018518368A5 true JP2018518368A5 (OSRAM) 2019-05-30
JP6730999B2 JP6730999B2 (ja) 2020-07-29

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Family Applications (1)

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JP2017557168A Active JP6730999B2 (ja) 2015-05-05 2016-05-05 過酷な環境での電子機器用途のための高信頼性無鉛はんだ合金

Country Status (5)

Country Link
US (4) US11229979B2 (OSRAM)
JP (1) JP6730999B2 (OSRAM)
KR (2) KR102447392B1 (OSRAM)
MY (2) MY205097A (OSRAM)
WO (1) WO2016179358A1 (OSRAM)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6516013B2 (ja) 2015-09-17 2019-05-22 富士電機株式会社 半導体装置用はんだ材
PH12018500431B1 (en) 2016-03-22 2023-07-12 Tamura Seisakusho Kk Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device
US20180153951A1 (en) * 2016-12-05 2018-06-07 Mead Johnson Nutrition Company Methods for Inducing Adipocyte Browning, Improving Metabolic Flexibility, and Reducing Detrimental White Adipocyte Tissue Deposition and Dysfunction
FR3061989B1 (fr) * 2017-01-18 2020-02-14 Safran Procede de fabrication d'un module electronique de puissance par fabrication additive, substrat et module associes
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
WO2018168858A1 (ja) * 2017-03-17 2018-09-20 富士電機株式会社 はんだ材
BR112019020490B1 (pt) * 2017-03-31 2023-03-28 Senju Metal Industry Co., Ltd Liga de solda, pasta de solda e junta de solda
KR102286739B1 (ko) * 2017-08-17 2021-08-05 현대자동차 주식회사 무연 솔더 조성물
US10456872B2 (en) 2017-09-08 2019-10-29 Tamura Corporation Lead-free solder alloy, electronic circuit substrate, and electronic device
ES2921678T3 (es) * 2017-09-14 2022-08-30 Tamura Seisakusho Kk Aleación de soldadura sin plomo, sustrato de circuito electrónico y dispositivo de control electrónico
JP6998557B2 (ja) * 2017-09-29 2022-01-18 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた接合構造体
JP6349615B1 (ja) * 2017-10-03 2018-07-04 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
JP6427752B1 (ja) * 2018-03-06 2018-11-28 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
WO2020115653A1 (en) * 2018-12-06 2020-06-11 Slovenská Technická Univerzita V Bratislave Active soft solder for ultrasonic soldering at higher application temperatures
TWI725664B (zh) * 2018-12-14 2021-04-21 日商千住金屬工業股份有限公司 焊料合金、焊料膏、焊料預形體及焊料接頭
JP6731034B2 (ja) * 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
KR102187085B1 (ko) * 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
CN113474474A (zh) * 2019-02-26 2021-10-01 铟泰公司 用于恶劣使用条件的高可靠性无铅焊料合金
TWI742813B (zh) 2019-09-02 2021-10-11 美商阿爾發金屬化工公司 高溫超高可靠性合金
CN117480029A (zh) * 2021-06-11 2024-01-30 铟泰公司 混合焊料合金粉末的高可靠性无铅焊膏
JP7079889B1 (ja) 2021-11-30 2022-06-02 株式会社タムラ製作所 はんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージ
JP7133739B1 (ja) 2021-11-30 2022-09-08 株式会社タムラ製作所 接合部、電子回路基板及び半導体パッケージ
JP7421157B1 (ja) * 2022-08-12 2024-01-24 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
WO2024034689A1 (ja) 2022-08-12 2024-02-15 千住金属工業株式会社 はんだ合金、はんだペースト及びはんだ継手
JPWO2024101041A1 (OSRAM) * 2022-11-07 2024-05-16
TW202526047A (zh) 2023-12-20 2025-07-01 美商阿爾發金屬化工公司 焊料接點
JP7640921B1 (ja) * 2024-07-23 2025-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56165588A (en) 1980-05-26 1981-12-19 Aoki Metal:Kk High temperature solder for copper tube joining
JP3027441B2 (ja) 1991-07-08 2000-04-04 千住金属工業株式会社 高温はんだ
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
US6179935B1 (en) 1997-04-16 2001-01-30 Fuji Electric Co., Ltd. Solder alloys
JP3296289B2 (ja) 1997-07-16 2002-06-24 富士電機株式会社 はんだ合金
JPH11333590A (ja) 1998-03-26 1999-12-07 Topy Ind Ltd クリープ特性に優れた高強度はんだ
JPH11291083A (ja) 1998-04-14 1999-10-26 Murata Mfg Co Ltd 半田合金
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
MY116246A (en) 1999-01-28 2003-12-31 Murata Manufacturing Co Lead-free solder and soldered article
GB9903552D0 (en) 1999-02-16 1999-04-07 Multicore Solders Ltd Reflow peak temperature reduction of solder alloys
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
AU2001214037A1 (en) * 2000-11-16 2002-05-27 H-Technologies Group Incorporated Lead-free solders
DE10135104C1 (de) * 2001-07-19 2002-09-12 Sata Farbspritztechnik Farbspritzpistole
CN1242869C (zh) 2001-07-25 2006-02-22 邓和升 无铅焊料
CN1346728A (zh) 2001-09-19 2002-05-01 大连理工大学 含稀土多合金组元无铅钎料合金
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
JP2005286274A (ja) * 2004-03-31 2005-10-13 Uchihashi Estec Co Ltd はんだ付け方法
EP1880032A4 (en) * 2005-05-11 2009-03-04 American Iron & Metal Company BRUSURE COMPOSITIONS BASED ON TIN ALLOY
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
EP2047943A4 (en) * 2006-07-05 2012-12-19 Fuji Electric Co Ltd SOLDER PASTE AND METHOD FOR SOLDERING AN ELECTRONIC PART
DE102006047764A1 (de) * 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
JP4629016B2 (ja) * 2006-10-27 2011-02-09 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法並びにパワーモジュール
WO2008073090A1 (en) 2006-12-13 2008-06-19 Halliburton Enegery Servies, Inc. Lead-free solder alloy for printed circuit board assemblies for high-temperature environments
KR100797161B1 (ko) * 2007-05-25 2008-01-23 한국생산기술연구원 주석-은-구리-인듐의 4원계 무연솔더 조성물
EP2177304B1 (en) 2007-07-13 2016-10-26 Senju Metal Industry Co., Ltd Vehicle-mounted electronic circuit
KR101167549B1 (ko) 2007-07-18 2012-07-20 센주긴조쿠고교 가부시키가이샤 차재 전자 회로용 Ｉｎ 함유 무납 땜납
CN101456103A (zh) 2008-11-18 2009-06-17 高新锡业（惠州）有限公司 一种无铅软钎焊料及其制造方法
JP5553181B2 (ja) * 2010-06-01 2014-07-16 千住金属工業株式会社 無洗浄鉛フリーソルダペースト
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
KR20130014913A (ko) 2011-08-01 2013-02-12 금오공과대학교 산학협력단 5원계 저융점 무연 솔더 조성물
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
WO2014013632A1 (ja) 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP2014057974A (ja) * 2012-09-14 2014-04-03 Senju Metal Ind Co Ltd はんだ合金
JP6089564B2 (ja) * 2012-10-11 2017-03-08 株式会社富士通ゼネラル 空気調和機
JP2015077601A (ja) 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
EP3127652B1 (en) 2014-04-02 2018-10-24 Senju Metal Industry Co., Ltd Use of a solder alloy for bonding in an led module, and led module
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device

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