JP2018516755A5 - - Google Patents

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Publication number
JP2018516755A5
JP2018516755A5 JP2017549240A JP2017549240A JP2018516755A5 JP 2018516755 A5 JP2018516755 A5 JP 2018516755A5 JP 2017549240 A JP2017549240 A JP 2017549240A JP 2017549240 A JP2017549240 A JP 2017549240A JP 2018516755 A5 JP2018516755 A5 JP 2018516755A5
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JP
Japan
Prior art keywords
resin
electrical component
polymer
hot melt
weight
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Application number
JP2017549240A
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English (en)
Japanese (ja)
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JP2018516755A (ja
JP6769986B2 (ja
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Priority claimed from US14/660,203 external-priority patent/US20160276303A1/en
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Publication of JP2018516755A publication Critical patent/JP2018516755A/ja
Publication of JP2018516755A5 publication Critical patent/JP2018516755A5/ja
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Publication of JP6769986B2 publication Critical patent/JP6769986B2/ja
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JP2017549240A 2015-03-17 2016-03-16 熱可塑性ポリマーをベースとした金属導電性ホットメルトペースト Active JP6769986B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/660,203 US20160276303A1 (en) 2015-03-17 2015-03-17 Electronic component
US14/660,203 2015-03-17
PCT/US2016/022633 WO2016149361A1 (en) 2015-03-17 2016-03-16 Metallic conductive hot melt paste based on thermoplastic polymer

Publications (3)

Publication Number Publication Date
JP2018516755A JP2018516755A (ja) 2018-06-28
JP2018516755A5 true JP2018516755A5 (enExample) 2019-04-18
JP6769986B2 JP6769986B2 (ja) 2020-10-14

Family

ID=55755669

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017549240A Active JP6769986B2 (ja) 2015-03-17 2016-03-16 熱可塑性ポリマーをベースとした金属導電性ホットメルトペースト

Country Status (4)

Country Link
US (2) US20160276303A1 (enExample)
JP (1) JP6769986B2 (enExample)
CN (1) CN107533988B (enExample)
WO (1) WO2016149361A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11751369B2 (en) * 2019-10-22 2023-09-05 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly

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CN109096975A (zh) * 2018-07-12 2018-12-28 常州聚和新材料股份有限公司 一种导电性热熔胶粘合剂
US10910340B1 (en) * 2019-10-14 2021-02-02 Heraeus Deutschland GmbH & Co. KG Silver sintering preparation and the use thereof for the connecting of electronic components
WO2021084981A1 (ja) * 2019-10-29 2021-05-06 パナソニックＩｐマネジメント株式会社 ペースト組成物、誘電体組成物、キャパシタ、及び誘電体組成物を製造する方法
WO2021118289A1 (ko) 2019-12-11 2021-06-17 주식회사 엘지화학 수처리 엘리먼트용 핫멜트 접착제 조성물, 접착 필름 및 이를 포함하는 수처리 엘리먼트
CN116235262A (zh) * 2020-09-25 2023-06-06 株式会社村田制作所 片式陶瓷电子部件及其制造方法
KR102945652B1 (ko) * 2020-10-07 2026-03-30 알파 어셈블리 솔루션스 인크. 인몰드 전자(ime) 컴포넌트의 제조에 사용하기 위한 조성물

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US5062896A (en) * 1990-03-30 1991-11-05 International Business Machines Corporation Solder/polymer composite paste and method
US5354918A (en) * 1992-07-17 1994-10-11 Shin-Etsu Chemical Co., Ltd. Highly pure monoalkylphosphine
JPH08186049A (ja) 1994-12-28 1996-07-16 Du Pont Kk 多層コンデンサー用端子電極組成物
JPH09260822A (ja) * 1996-03-18 1997-10-03 Teikoku Tsushin Kogyo Co Ltd 基板への半田による電子部品接続固定構造
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
JP3911345B2 (ja) * 1998-06-18 2007-05-09 Ｔｄｋ株式会社 有機質正特性サーミスタ
US6299801B1 (en) * 1998-11-02 2001-10-09 Tdk Corporation Organic positive temperature coefficient thermistor
JP2001055517A (ja) * 1999-08-20 2001-02-27 Matsushita Electric Works Ltd 導電性樹脂組成物およびその製造方法
US6853074B2 (en) * 1999-12-27 2005-02-08 Matsushita Electric Industrial Co., Ltd. Electronic part, an electronic part mounting element and a process for manufacturing such the articles
US6814795B2 (en) * 2001-11-27 2004-11-09 Ferro Corporation Hot melt conductor paste composition
JP4389148B2 (ja) * 2002-05-17 2009-12-24 日立化成工業株式会社 導電ペースト
JP3723549B2 (ja) * 2003-01-30 2005-12-07 荒川化学工業株式会社 ハンダ付け用フラックス組成物、クリームハンダ組成物および電子部品
JP4093188B2 (ja) * 2003-05-27 2008-06-04 株式会社村田製作所 積層セラミック電子部品とその実装構造および実装方法
JP2005120301A (ja) * 2003-10-20 2005-05-12 Hitachi Chem Co Ltd 導電性塗料
CN102786908B (zh) * 2005-03-16 2013-12-18 日立化成株式会社 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
JP2007069259A (ja) * 2005-09-09 2007-03-22 Uchihashi Estec Co Ltd ヤニ入りはんだ
JP2007091959A (ja) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
FR2942673B1 (fr) * 2009-02-27 2011-04-01 Nexans Cable electrique a haute tension

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11751369B2 (en) * 2019-10-22 2023-09-05 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly

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