JP2018516755A5 - - Google Patents
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- Publication number
- JP2018516755A5 JP2018516755A5 JP2017549240A JP2017549240A JP2018516755A5 JP 2018516755 A5 JP2018516755 A5 JP 2018516755A5 JP 2017549240 A JP2017549240 A JP 2017549240A JP 2017549240 A JP2017549240 A JP 2017549240A JP 2018516755 A5 JP2018516755 A5 JP 2018516755A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- electrical component
- polymer
- hot melt
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000642 polymer Polymers 0.000 claims description 33
- 239000012943 hotmelt Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 7
- 229920006122 polyamide resin Polymers 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 229920000877 Melamine resin Polymers 0.000 claims description 4
- 239000004640 Melamine resin Substances 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- 239000012461 cellulose resin Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 4
- 229920006287 phenoxy resin Polymers 0.000 claims description 4
- 239000013034 phenoxy resin Substances 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920001225 polyester resin Polymers 0.000 claims description 4
- 239000004645 polyester resin Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000009719 polyimide resin Substances 0.000 claims description 4
- 229920005990 polystyrene resin Polymers 0.000 claims description 4
- 229920005749 polyurethane resin Polymers 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/660,203 | 2015-03-17 | ||
| US14/660,203 US20160276303A1 (en) | 2015-03-17 | 2015-03-17 | Electronic component |
| PCT/US2016/022633 WO2016149361A1 (en) | 2015-03-17 | 2016-03-16 | Metallic conductive hot melt paste based on thermoplastic polymer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018516755A JP2018516755A (ja) | 2018-06-28 |
| JP2018516755A5 true JP2018516755A5 (enExample) | 2019-04-18 |
| JP6769986B2 JP6769986B2 (ja) | 2020-10-14 |
Family
ID=55755669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017549240A Active JP6769986B2 (ja) | 2015-03-17 | 2016-03-16 | 熱可塑性ポリマーをベースとした金属導電性ホットメルトペースト |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US20160276303A1 (enExample) |
| JP (1) | JP6769986B2 (enExample) |
| CN (1) | CN107533988B (enExample) |
| WO (1) | WO2016149361A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11751369B2 (en) * | 2019-10-22 | 2023-09-05 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109096975A (zh) * | 2018-07-12 | 2018-12-28 | 常州聚和新材料股份有限公司 | 一种导电性热熔胶粘合剂 |
| US10910340B1 (en) | 2019-10-14 | 2021-02-02 | Heraeus Deutschland GmbH & Co. KG | Silver sintering preparation and the use thereof for the connecting of electronic components |
| WO2021084981A1 (ja) * | 2019-10-29 | 2021-05-06 | パナソニックＩｐマネジメント株式会社 | ペースト組成物、誘電体組成物、キャパシタ、及び誘電体組成物を製造する方法 |
| US12234392B2 (en) | 2019-12-11 | 2025-02-25 | Lg Chem, Ltd. | Hot-melt adhesive composition for water treatment element, adhesive film, and water treatment element comprising same |
| JP7494925B2 (ja) * | 2020-09-25 | 2024-06-04 | 株式会社村田製作所 | チップ型セラミック電子部品およびその製造方法 |
| TW202419581A (zh) * | 2020-10-07 | 2024-05-16 | 美商阿爾發裝配對策公司 | 製造模內電子組件之方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5062896A (en) * | 1990-03-30 | 1991-11-05 | International Business Machines Corporation | Solder/polymer composite paste and method |
| US5354918A (en) * | 1992-07-17 | 1994-10-11 | Shin-Etsu Chemical Co., Ltd. | Highly pure monoalkylphosphine |
| JPH08186049A (ja) | 1994-12-28 | 1996-07-16 | Du Pont Kk | 多層コンデンサー用端子電極組成物 |
| JPH09260822A (ja) * | 1996-03-18 | 1997-10-03 | Teikoku Tsushin Kogyo Co Ltd | 基板への半田による電子部品接続固定構造 |
| US6238599B1 (en) * | 1997-06-18 | 2001-05-29 | International Business Machines Corporation | High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications |
| JP3911345B2 (ja) * | 1998-06-18 | 2007-05-09 | Ｔｄｋ株式会社 | 有機質正特性サーミスタ |
| US6299801B1 (en) * | 1998-11-02 | 2001-10-09 | Tdk Corporation | Organic positive temperature coefficient thermistor |
| JP2001055517A (ja) * | 1999-08-20 | 2001-02-27 | Matsushita Electric Works Ltd | 導電性樹脂組成物およびその製造方法 |
| US6853074B2 (en) * | 1999-12-27 | 2005-02-08 | Matsushita Electric Industrial Co., Ltd. | Electronic part, an electronic part mounting element and a process for manufacturing such the articles |
| US6814795B2 (en) * | 2001-11-27 | 2004-11-09 | Ferro Corporation | Hot melt conductor paste composition |
| JP4389148B2 (ja) * | 2002-05-17 | 2009-12-24 | 日立化成工業株式会社 | 導電ペースト |
| JP3723549B2 (ja) * | 2003-01-30 | 2005-12-07 | 荒川化学工業株式会社 | ハンダ付け用フラックス組成物、クリームハンダ組成物および電子部品 |
| JP4093188B2 (ja) * | 2003-05-27 | 2008-06-04 | 株式会社村田製作所 | 積層セラミック電子部品とその実装構造および実装方法 |
| JP2005120301A (ja) * | 2003-10-20 | 2005-05-12 | Hitachi Chem Co Ltd | 導電性塗料 |
| CN102382613B (zh) * | 2005-03-16 | 2014-03-12 | 日立化成株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
| JP2007069259A (ja) * | 2005-09-09 | 2007-03-22 | Uchihashi Estec Co Ltd | ヤニ入りはんだ |
| JP2007091959A (ja) * | 2005-09-30 | 2007-04-12 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
| FR2942673B1 (fr) * | 2009-02-27 | 2011-04-01 | Nexans | Cable electrique a haute tension |
-
2015
- 2015-03-17 US US14/660,203 patent/US20160276303A1/en not_active Abandoned
-
2016
- 2016-03-16 JP JP2017549240A patent/JP6769986B2/ja active Active
- 2016-03-16 CN CN201680022381.0A patent/CN107533988B/zh active Active
- 2016-03-16 WO PCT/US2016/022633 patent/WO2016149361A1/en not_active Ceased
-
2017
- 2017-07-12 US US15/647,789 patent/US10186494B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11751369B2 (en) * | 2019-10-22 | 2023-09-05 | International Business Machines Corporation | Liquid metal infiltration rework of electronic assembly |
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