JP6769986B2 - 熱可塑性ポリマーをベースとした金属導電性ホットメルトペースト - Google Patents

熱可塑性ポリマーをベースとした金属導電性ホットメルトペースト Download PDF

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JP6769986B2
JP6769986B2 JP2017549240A JP2017549240A JP6769986B2 JP 6769986 B2 JP6769986 B2 JP 6769986B2 JP 2017549240 A JP2017549240 A JP 2017549240A JP 2017549240 A JP2017549240 A JP 2017549240A JP 6769986 B2 JP6769986 B2 JP 6769986B2
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hot melt
polymer
resin
parts
weight
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JP2018516755A5 (enExample
JP2018516755A (ja
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明 稲葉
明 稲葉
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/007—After-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/3223—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the layer connector connecting to a pin of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01028—Nickel [Ni]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1207—Resistor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017549240A 2015-03-17 2016-03-16 熱可塑性ポリマーをベースとした金属導電性ホットメルトペースト Active JP6769986B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/660,203 2015-03-17
US14/660,203 US20160276303A1 (en) 2015-03-17 2015-03-17 Electronic component
PCT/US2016/022633 WO2016149361A1 (en) 2015-03-17 2016-03-16 Metallic conductive hot melt paste based on thermoplastic polymer

Publications (3)

Publication Number Publication Date
JP2018516755A JP2018516755A (ja) 2018-06-28
JP2018516755A5 JP2018516755A5 (enExample) 2019-04-18
JP6769986B2 true JP6769986B2 (ja) 2020-10-14

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US (2) US20160276303A1 (enExample)
JP (1) JP6769986B2 (enExample)
CN (1) CN107533988B (enExample)
WO (1) WO2016149361A1 (enExample)

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CN109096975A (zh) * 2018-07-12 2018-12-28 常州聚和新材料股份有限公司 一种导电性热熔胶粘合剂
US10910340B1 (en) 2019-10-14 2021-02-02 Heraeus Deutschland GmbH & Co. KG Silver sintering preparation and the use thereof for the connecting of electronic components
US11310950B2 (en) 2019-10-22 2022-04-19 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
WO2021084981A1 (ja) * 2019-10-29 2021-05-06 パナソニックＩｐマネジメント株式会社 ペースト組成物、誘電体組成物、キャパシタ、及び誘電体組成物を製造する方法
US12234392B2 (en) 2019-12-11 2025-02-25 Lg Chem, Ltd. Hot-melt adhesive composition for water treatment element, adhesive film, and water treatment element comprising same
JP7494925B2 (ja) * 2020-09-25 2024-06-04 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
TW202419581A (zh) * 2020-10-07 2024-05-16 美商阿爾發裝配對策公司 製造模內電子組件之方法

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US5062896A (en) * 1990-03-30 1991-11-05 International Business Machines Corporation Solder/polymer composite paste and method
US5354918A (en) * 1992-07-17 1994-10-11 Shin-Etsu Chemical Co., Ltd. Highly pure monoalkylphosphine
JPH08186049A (ja) 1994-12-28 1996-07-16 Du Pont Kk 多層コンデンサー用端子電極組成物
JPH09260822A (ja) * 1996-03-18 1997-10-03 Teikoku Tsushin Kogyo Co Ltd 基板への半田による電子部品接続固定構造
US6238599B1 (en) * 1997-06-18 2001-05-29 International Business Machines Corporation High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
JP3911345B2 (ja) * 1998-06-18 2007-05-09 Ｔｄｋ株式会社 有機質正特性サーミスタ
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JP2001055517A (ja) * 1999-08-20 2001-02-27 Matsushita Electric Works Ltd 導電性樹脂組成物およびその製造方法
US6853074B2 (en) * 1999-12-27 2005-02-08 Matsushita Electric Industrial Co., Ltd. Electronic part, an electronic part mounting element and a process for manufacturing such the articles
US6814795B2 (en) * 2001-11-27 2004-11-09 Ferro Corporation Hot melt conductor paste composition
JP4389148B2 (ja) * 2002-05-17 2009-12-24 日立化成工業株式会社 導電ペースト
JP3723549B2 (ja) * 2003-01-30 2005-12-07 荒川化学工業株式会社 ハンダ付け用フラックス組成物、クリームハンダ組成物および電子部品
JP4093188B2 (ja) * 2003-05-27 2008-06-04 株式会社村田製作所 積層セラミック電子部品とその実装構造および実装方法
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Publication number Publication date
CN107533988B (zh) 2021-08-03
JP2018516755A (ja) 2018-06-28
US20160276303A1 (en) 2016-09-22
CN107533988A (zh) 2018-01-02
US10186494B2 (en) 2019-01-22
US20170309591A1 (en) 2017-10-26
WO2016149361A1 (en) 2016-09-22

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