JP6959706B2 - 電気部品 - Google Patents
電気部品 Download PDFInfo
- Publication number
- JP6959706B2 JP6959706B2 JP2017001109A JP2017001109A JP6959706B2 JP 6959706 B2 JP6959706 B2 JP 6959706B2 JP 2017001109 A JP2017001109 A JP 2017001109A JP 2017001109 A JP2017001109 A JP 2017001109A JP 6959706 B2 JP6959706 B2 JP 6959706B2
- Authority
- JP
- Japan
- Prior art keywords
- wax
- hot melt
- electrical component
- resin
- melt polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000001993 wax Substances 0.000 claims description 93
- 229920000642 polymer Polymers 0.000 claims description 81
- 239000012943 hotmelt Substances 0.000 claims description 55
- 239000000843 powder Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 22
- -1 Polyethylene Polymers 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 16
- 229910052718 tin Inorganic materials 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 9
- 239000000194 fatty acid Substances 0.000 claims description 9
- 229930195729 fatty acid Natural products 0.000 claims description 9
- 235000019271 petrolatum Nutrition 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 239000004743 Polypropylene Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229920001155 polypropylene Polymers 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical group CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 6
- 150000004665 fatty acids Chemical class 0.000 claims description 6
- 239000000155 melt Substances 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000001856 Ethyl cellulose Substances 0.000 claims description 5
- 239000004698 Polyethylene Substances 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 5
- 239000004359 castor oil Substances 0.000 claims description 5
- 235000019438 castor oil Nutrition 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229920001249 ethyl cellulose Polymers 0.000 claims description 5
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 5
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 5
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000012184 mineral wax Substances 0.000 claims description 4
- 239000012170 montan wax Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000012178 vegetable wax Substances 0.000 claims description 4
- 241000283153 Cetacea Species 0.000 claims description 3
- 239000004166 Lanolin Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000012164 animal wax Substances 0.000 claims description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 3
- 239000004204 candelilla wax Substances 0.000 claims description 3
- 235000013868 candelilla wax Nutrition 0.000 claims description 3
- 229940073532 candelilla wax Drugs 0.000 claims description 3
- 239000004203 carnauba wax Substances 0.000 claims description 3
- 235000013869 carnauba wax Nutrition 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- IUJAMGNYPWYUPM-UHFFFAOYSA-N hentriacontane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC IUJAMGNYPWYUPM-UHFFFAOYSA-N 0.000 claims description 3
- 229940119170 jojoba wax Drugs 0.000 claims description 3
- 235000019388 lanolin Nutrition 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000012169 petroleum derived wax Substances 0.000 claims description 3
- 235000019381 petroleum wax Nutrition 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 239000013034 phenoxy resin Substances 0.000 claims description 3
- 229920006287 phenoxy resin Polymers 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 239000004170 rice bran wax Substances 0.000 claims description 3
- 235000019384 rice bran wax Nutrition 0.000 claims description 3
- 239000012180 soy wax Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- DSEKYWAQQVUQTP-XEWMWGOFSA-N (2r,4r,4as,6as,6as,6br,8ar,12ar,14as,14bs)-2-hydroxy-4,4a,6a,6b,8a,11,11,14a-octamethyl-2,4,5,6,6a,7,8,9,10,12,12a,13,14,14b-tetradecahydro-1h-picen-3-one Chemical compound C([C@H]1[C@]2(C)CC[C@@]34C)C(C)(C)CC[C@]1(C)CC[C@]2(C)[C@H]4CC[C@@]1(C)[C@H]3C[C@@H](O)C(=O)[C@@H]1C DSEKYWAQQVUQTP-XEWMWGOFSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 239000004640 Melamine resin Substances 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 claims description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 239000012186 ozocerite Substances 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920005990 polystyrene resin Polymers 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000003431 cross linking reagent Substances 0.000 claims 2
- 229920005749 polyurethane resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 33
- 239000000758 substrate Substances 0.000 description 17
- 239000011135 tin Substances 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 11
- 239000002245 particle Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 239000004200 microcrystalline wax Substances 0.000 description 4
- 235000019808 microcrystalline wax Nutrition 0.000 description 4
- 229940114937 microcrystalline wax Drugs 0.000 description 4
- 235000019809 paraffin wax Nutrition 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003981 vehicle Substances 0.000 description 3
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 2
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- IJMMLESAAHRIPW-UHFFFAOYSA-N acetic acid;1-phenoxypropan-2-ol Chemical compound CC(O)=O.CC(O)COC1=CC=CC=C1 IJMMLESAAHRIPW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical group CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012187 peat wax Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000012176 shellac wax Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000012181 tallow tree wax Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/282—Zn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
- B23K35/286—Al as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
- B23K35/404—Coated rods; Coated electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/248—Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Conductive Materials (AREA)
- Lubricants (AREA)
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
キャパシタとしての電気部品100が図1に示される。実施形態においてキャパシタ100が本体101と、本体の両面上の端子電極104と、端子電極上のホットメルトポリマー層105とを含む。端子電極104は、回路などの外部導電要素と電気的におよび物理的に接合される電極として定義される。実施形態においてキャパシタの本体101は、絶縁セラミック層102と内部電極103とを含む積層体である。
実施形態において金属粉末が銀、銅、金、パラジウム、白金、ロジウム、ニッケル、アルミニウム、ガリウム、インジウム、スズ、亜鉛、ビスマスおよびそれらの混合物からなる群から選択され得る。別の実施形態において金属粉末が銀、ニッケル、スズ、亜鉛、ビスマスおよびそれらの混合物からなる群から選択され得る。別の実施形態において金属粉末が銀であり得る。
ホットメルトポリマー層がポリマーを含む。金属粉末がポリマー中に分散する。ポリマーは、ホットメルトポリマーペーストにおいて使用される有機溶媒中に25℃で可溶性である。
ワックスは、20℃で展性があり30〜300℃で液体になる或る種の脂質である。ワックスの融点は別の実施形態において30〜300℃である。別の実施形態においてワックスが、植物ワックス、動物ワックス、ミネラルワックス、石油ワックス、合成ワックスおよびそれらの混合物からなる群から選択される。
溶媒を使用してポリマーを溶解することができる。端子電極上のホットメルトポリマーペーストを十分に乾燥させる間に溶媒が蒸発する。
界面活性剤、分散助剤、安定剤および可塑剤などの添加剤をペーストの所望の性質に基づいてポリマーペーストに添加することができる。
101 本体
102 絶縁セラミック層
103 内部電極
104 端子電極
105 ホットメルトポリマー層
201 基材
202 回路
203 はんだペースト
401 セラミック基材
402 硬化型電極
403 ホットメルトポリマーペースト
404 はんだペースト
Claims (10)
- 本体と、前記本体の少なくとも1つの面上の端子電極と、該電気部品および回路を半田付けするためのリフロー温度で溶融する、前記端子電極上のホットメルトポリマー層とを含む電気部品であって、前記ホットメルトポリマー層は、金属粉末と、ポリマーと、ワックスとを含み、前記ホットメルトポリマー層はガラスフリットを含まず、
前記ホットメルトポリマー層は架橋剤を含まず、前記金属粉末は表面被覆粉を含まないことを特徴とする電気部品。 - 前記ホットメルトポリマー層が厚さ1〜30μmであることを特徴とする請求項1に記載の電気部品。
- 前記金属粉末が、銀、銅、金、パラジウム、白金、ロジウム、ニッケル、アルミニウム、ガリウム、インジウム、スズ、亜鉛、ビスマスおよびそれらの混合物からなる群から選択されることを特徴とする請求項1に記載の電気部品。
- 前記ポリマーのガラス転移点(Tg)が−25〜180℃であることを特徴とする請求項1に記載の電気部品。
- 前記ポリマーが、エチルセルロース、ポリビニルブチラール樹脂、フェノキシ樹脂、ヒドロキシプロピルセルロース樹脂、ポリエステル樹脂、フェノール樹脂、エポキシ樹脂、アクリル樹脂、メラミン樹脂、ポリイミド樹脂、ポリアミド樹脂、ポリスチレン樹脂、ブチラール樹脂、ポリビニルアルコール、ポリウレタン樹脂、シリコーン樹脂およびそれらの混合物からなる群から選択されることを特徴とする請求項1に記載の電気部品。
- 前記ワックスが、植物ワックス、動物ワックス、ミネラルワックス、石油ワックス、合成ワックスおよびそれらの混合物からなる群から選択されることを特徴とする請求項1に記載の電気部品。
- 前記ワックスが、ベーベリワックス、カンデリラワックス、カルナバワックス、ヒマシ油、エスパルトワックス、ホホバ油ワックス、オーリクリーワックス、米ぬかワックス、ソイワックス、ナンキンハゼワックス、密蝋、羊毛蝋、セラックワックス、鯨ワックス、セレシンワックス、モンタンワックス、モンタンエステルワックス、パラフィンワックス、マイクロクリスタリンワックス、オゾセライトワックス、ピートワックス、パラフィンワックス、マイクロクリスタリンワックス、石油ゼリーワックス、フィッシャー−トロプシュワックス、ポリエチレンワックス、ポリオレフィンワックス、ポリプロピレンワックス、アミドワックス、脂肪酸ワックス、脂肪酸エステルワックスおよびそれらの混合物からなる群から選択されることを特徴とする請求項1に記載の電気部品。
- 前記金属粉末が100重量部であり、前記ポリマーが0.5〜20重量部であり、前記ワックスが0.1〜50重量部であることを特徴とする請求項1に記載の電気部品。
- レジスタ、キャパシタ、インダクタおよび半導体チップからなる群から選択されることを特徴とする請求項1に記載の電気部品。
- 本体の少なくとも1つの面上に形成される端子電極を含む電気部品の前記本体を提供する工程と、
ホットメルトポリマーペーストを前記端子電極上に適用する工程であって、前記ホットメルトポリマーペーストは、金属粉末と、ポリマーと、ワックスと、溶媒とを含み、前記ホットメルトポリマーペーストはガラスフリットを含まない、該工程と、
前記適用されたホットメルトポリマーを乾燥させ、前記電気部品および回路を半田付けするためのリフロー温度で溶融するホットメルトポリマー層を形成する工程であって、
前記ホットメルトポリマー層は架橋剤を含まず、前記金属粉末は表面被覆粉を含まない、該形成する工程と
を含むことを特徴とする電気部品を製造する方法。
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US14/992,427 | 2016-01-11 | ||
US14/992,427 US20170200556A1 (en) | 2016-01-11 | 2016-01-11 | Electric component |
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JP2017126745A JP2017126745A (ja) | 2017-07-20 |
JP6959706B2 true JP6959706B2 (ja) | 2021-11-05 |
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JP (1) | JP6959706B2 (ja) |
CN (1) | CN106960727B (ja) |
DE (1) | DE102017000139B4 (ja) |
WO (1) | WO2017123499A1 (ja) |
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JP6826542B2 (ja) * | 2016-01-12 | 2021-02-03 | 株式会社ノリタケカンパニーリミテド | 導電性組成物 |
JP6907907B2 (ja) * | 2017-11-30 | 2021-07-21 | Tdk株式会社 | セラミック電子部品 |
CN108213765A (zh) * | 2017-12-29 | 2018-06-29 | 广西汇智生产力促进中心有限公司 | 用于电子元件焊接的含铟焊料 |
TWI818325B (zh) * | 2020-10-07 | 2023-10-11 | 美商阿爾發裝配對策公司 | 用於在模內電子(ime)組件之製造中使用的組成物、製造組成物之方法及製造模內電子組件之方法 |
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US4419279A (en) * | 1980-09-15 | 1983-12-06 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
JPS6481107A (en) * | 1987-09-22 | 1989-03-27 | Alps Electric Co Ltd | Conductive paste |
US4881308A (en) * | 1988-07-01 | 1989-11-21 | Avx Corporation | Method of terminating lead filled capacitor |
JPH08186049A (ja) | 1994-12-28 | 1996-07-16 | Du Pont Kk | 多層コンデンサー用端子電極組成物 |
JPH1121477A (ja) * | 1997-06-30 | 1999-01-26 | Hitachi Chem Co Ltd | 導電性ペースト組成物及びこれを用いた電子部品 |
JP2001138091A (ja) * | 1999-11-17 | 2001-05-22 | Sanei Kagaku Kk | ソルダペースト用フラックス |
JP2003132735A (ja) * | 2001-10-29 | 2003-05-09 | Sumitomo Metal Mining Co Ltd | 厚膜導体ペースト及びそれを用いてなる電子部品 |
US6814795B2 (en) * | 2001-11-27 | 2004-11-09 | Ferro Corporation | Hot melt conductor paste composition |
JP3797990B2 (ja) | 2003-08-08 | 2006-07-19 | 株式会社東芝 | 熱硬化性フラックス及びはんだペースト |
US20050248908A1 (en) * | 2004-05-06 | 2005-11-10 | Gunther Dreezen | Termination coating |
JP4356581B2 (ja) * | 2004-10-12 | 2009-11-04 | パナソニック株式会社 | 電子部品実装方法 |
JP2006190491A (ja) * | 2004-12-28 | 2006-07-20 | Kyocera Chemical Corp | セラミック電子部品用導電性ペーストおよびセラミック電子部品 |
EP2243592B1 (en) | 2008-02-22 | 2020-04-01 | Harima Chemicals, Inc. | Solder bonding structure and solder paste |
US20100128665A1 (en) * | 2008-11-21 | 2010-05-27 | Alcatel-Lucent Usa Inc. | Method for providing signaling between a core network and a radio access network |
US20110128665A1 (en) * | 2009-11-30 | 2011-06-02 | Avx Corporation | Ceramic Capacitors for High Temperature Applications |
WO2013187183A1 (ja) * | 2012-06-15 | 2013-12-19 | 株式会社村田製作所 | 導電性ペースト、ならびに積層セラミック電子部品およびその製造方法 |
KR101412822B1 (ko) * | 2012-09-06 | 2014-06-27 | 삼성전기주식회사 | 외부전극용 전도성 페이스트, 이를 이용한 적층 세라믹 전자부품 및 이의 제조방법 |
JP2015109409A (ja) * | 2013-10-25 | 2015-06-11 | 株式会社村田製作所 | 電子部品 |
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CN106960727A (zh) | 2017-07-18 |
US20170200556A1 (en) | 2017-07-13 |
WO2017123499A1 (en) | 2017-07-20 |
JP2017126745A (ja) | 2017-07-20 |
CN106960727B (zh) | 2021-10-08 |
DE102017000139A1 (de) | 2017-07-13 |
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