JP2018509300A5 - - Google Patents
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- JP2018509300A5 JP2018509300A5 JP2017545573A JP2017545573A JP2018509300A5 JP 2018509300 A5 JP2018509300 A5 JP 2018509300A5 JP 2017545573 A JP2017545573 A JP 2017545573A JP 2017545573 A JP2017545573 A JP 2017545573A JP 2018509300 A5 JP2018509300 A5 JP 2018509300A5
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- positioning system
- workpiece
- positions
- spot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 25
- 238000000059 patterning Methods 0.000 claims 3
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562126420P | 2015-02-27 | 2015-02-27 | |
| US62/126,420 | 2015-02-27 | ||
| PCT/US2016/019752 WO2016138367A1 (en) | 2015-02-27 | 2016-02-26 | Fast beam manipulation for cross-axis micromachining |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018509300A JP2018509300A (ja) | 2018-04-05 |
| JP2018509300A5 true JP2018509300A5 (enExample) | 2019-04-04 |
| JP6785238B2 JP6785238B2 (ja) | 2020-11-18 |
Family
ID=56789631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017545573A Active JP6785238B2 (ja) | 2015-02-27 | 2016-02-26 | クロス軸微細加工のための高速ビーム操作 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10507544B2 (enExample) |
| JP (1) | JP6785238B2 (enExample) |
| KR (1) | KR102387132B1 (enExample) |
| CN (1) | CN107405724B (enExample) |
| TW (1) | TWI718127B (enExample) |
| WO (1) | WO2016138367A1 (enExample) |
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| US11478853B2 (en) | 2016-12-23 | 2022-10-25 | General Electric Company | Method for emissions plume monitoring in additive manufacturing |
| US11318535B2 (en) | 2016-12-23 | 2022-05-03 | General Electric Company | Method for process control in additive manufacturing |
| US11072025B2 (en) | 2016-12-23 | 2021-07-27 | General Electric Company | Method for avoiding plume interference in additive manufacturing |
| CN110545959B (zh) * | 2017-02-09 | 2022-07-05 | 美国合成公司 | 能量加工的聚晶金刚石复合片及相关方法 |
| GB2546437B (en) * | 2017-04-13 | 2018-03-21 | Elfab Ltd | Improvements in or for burst members |
| WO2018213294A1 (en) * | 2017-05-15 | 2018-11-22 | The Trustees Of The University Of Pennsylvania | Systems and methods for laser cleaving diamonds |
| EP4151353A1 (en) * | 2017-06-29 | 2023-03-22 | GF Machining Solutions AG | Method for defining a laser tool path |
| KR102411536B1 (ko) * | 2017-10-11 | 2022-06-22 | 삼성디스플레이 주식회사 | 증착 마스크 제조방법 및 제조장치 |
| KR20190055295A (ko) * | 2017-11-14 | 2019-05-23 | 삼성디스플레이 주식회사 | 마스크 제조 장치 및 마스크 제조 방법 |
| JP6910932B2 (ja) * | 2017-11-21 | 2021-07-28 | Dgshape株式会社 | 熱転写装置 |
| US11065707B2 (en) * | 2017-11-29 | 2021-07-20 | Lincoln Global, Inc. | Systems and methods supporting predictive and preventative maintenance |
| US20220274208A1 (en) * | 2018-08-01 | 2022-09-01 | Cohpros International Co., Ltd. | Cutting device for cutting composite material |
| TWI684842B (zh) * | 2018-10-04 | 2020-02-11 | 財團法人精密機械研究發展中心 | 可調變參數的加工機 |
| TWI816897B (zh) * | 2018-10-08 | 2023-10-01 | 美商伊雷克托科學工業股份有限公司 | 用於在基板中形成穿孔的方法 |
| EP3685954B1 (en) * | 2019-01-22 | 2024-01-24 | Synova S.A. | Method for cutting a workpiece with a complex fluid-jet-guided laser beam |
| TWI843784B (zh) * | 2019-01-31 | 2024-06-01 | 美商伊雷克托科學工業股份有限公司 | 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體 |
| US12326645B2 (en) * | 2019-02-21 | 2025-06-10 | Electro Scientific Industries, Inc. | Phased-array beam steering for materials processing |
| JP7404043B2 (ja) * | 2019-03-22 | 2023-12-25 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| US12103110B2 (en) * | 2019-03-22 | 2024-10-01 | Via Mechanics, Ltd. | Laser processing apparatus and laser processing method |
| WO2020251782A1 (en) * | 2019-06-10 | 2020-12-17 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
| DE102019116803A1 (de) * | 2019-06-21 | 2020-12-24 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks |
| CN111822886B (zh) * | 2020-06-11 | 2022-11-22 | 华东师范大学重庆研究院 | 一种微流控芯片微通道的多焦点超快激光制备装置及方法 |
| CN111650744B (zh) * | 2020-08-04 | 2020-10-30 | 成都极米科技股份有限公司 | 振镜的参数调节方法、装置、设备及可读存储介质 |
| DE102021202644A1 (de) * | 2021-03-18 | 2022-09-22 | Volkswagen Aktiengesellschaft | Verfahren zur Herstellung einer Ableiterfolie für Batterien |
| CN113579517B (zh) * | 2021-07-27 | 2023-07-14 | 江苏先河激光技术有限公司 | 一种四振镜群孔加工方法 |
| CN113721256A (zh) * | 2021-09-24 | 2021-11-30 | 探维科技(北京)有限公司 | 一种角度拼接激光雷达系统 |
| DE102021126360A1 (de) | 2021-10-12 | 2023-04-13 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren zur Bearbeitung eines Werkstücks durch Laserstrahlung in Form von Lissajous-Figuren sowie ein hierfür bestimmter Scanner und ein Spiegelelement |
| US12330239B2 (en) * | 2022-02-09 | 2025-06-17 | Ford Global Technologies, Llc | Laser notching apparatus for cutting of electrode sheets |
| CN115302101B (zh) * | 2022-08-31 | 2024-07-23 | 厦门通富微电子有限公司 | 晶圆切割方法及装置、电子设备、存储介质 |
| DE102023129209A1 (de) * | 2023-10-24 | 2025-04-24 | Scanlab Gmbh | Verfahren zur Laserbearbeitungsplanung und/oder zur Laserbearbeitung eines Objekts mit einem Laser |
| CN119457519A (zh) * | 2024-11-25 | 2025-02-18 | 浙江大学绍兴研究院 | 剥落式激光划切晶圆的承载平台及其方法 |
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| US3026158A (en) | 1959-04-20 | 1962-03-20 | Lewis G Freeman | Adjustable table |
| US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| US8217304B2 (en) * | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
| US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| JP2003136270A (ja) | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US6706998B2 (en) | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
| US6706999B1 (en) | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| JP4443208B2 (ja) | 2003-12-12 | 2010-03-31 | 日立ビアメカニクス株式会社 | スキャナ装置 |
| US7027199B2 (en) | 2004-06-07 | 2006-04-11 | Electro Scientific Industries, Inc. | AOM modulation techniques for facilitating pulse-to-pulse energy stability in laser systems |
| US7633034B2 (en) * | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
| US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
| US7259354B2 (en) | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| US8084706B2 (en) | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP2008049383A (ja) | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム照射方法及びビーム照射装置 |
| DE102007012815B4 (de) | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| US8026158B2 (en) | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8680430B2 (en) | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| TWI594828B (zh) | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| JP5446631B2 (ja) | 2009-09-10 | 2014-03-19 | アイシン精機株式会社 | レーザ加工方法及びレーザ加工装置 |
| US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
| GB201006679D0 (en) | 2010-04-21 | 2010-06-09 | Ucl Business Plc | Methods and apparatus to control acousto-optic deflectors |
| EP2599295A1 (en) | 2010-07-30 | 2013-06-05 | ByteMobile, Inc. | Systems and methods for video cache indexing |
| WO2012054927A2 (en) * | 2010-10-22 | 2012-04-26 | Electro Scientific Industries, Inc. | Laser processing systems and methods for beam dithering and skiving |
| WO2012116226A2 (en) * | 2011-02-25 | 2012-08-30 | Gsi Group Corporation | Predictive link processing |
| JP5953198B2 (ja) * | 2011-09-28 | 2016-07-20 | 株式会社リプス・ワークス | 極短パルスレーザによる多次元パターン形成装置及び形成方法 |
-
2016
- 2016-02-26 JP JP2017545573A patent/JP6785238B2/ja active Active
- 2016-02-26 KR KR1020177020889A patent/KR102387132B1/ko active Active
- 2016-02-26 TW TW105105862A patent/TWI718127B/zh active
- 2016-02-26 CN CN201680012156.9A patent/CN107405724B/zh active Active
- 2016-02-26 WO PCT/US2016/019752 patent/WO2016138367A1/en not_active Ceased
- 2016-02-26 US US15/055,037 patent/US10507544B2/en active Active
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