CN107405724B - 用于横轴微机械加工的快速射束操纵 - Google Patents

用于横轴微机械加工的快速射束操纵 Download PDF

Info

Publication number
CN107405724B
CN107405724B CN201680012156.9A CN201680012156A CN107405724B CN 107405724 B CN107405724 B CN 107405724B CN 201680012156 A CN201680012156 A CN 201680012156A CN 107405724 B CN107405724 B CN 107405724B
Authority
CN
China
Prior art keywords
aod
laser
laser beam
workpiece
trajectory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680012156.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN107405724A (zh
Inventor
张海滨
杨川
马克·艾伦·昂瑞斯
马汀·奥瑞克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Irecto Science Industry Co ltd
Original Assignee
Irecto Science Industry Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irecto Science Industry Co ltd filed Critical Irecto Science Industry Co ltd
Publication of CN107405724A publication Critical patent/CN107405724A/zh
Application granted granted Critical
Publication of CN107405724B publication Critical patent/CN107405724B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
CN201680012156.9A 2015-02-27 2016-02-26 用于横轴微机械加工的快速射束操纵 Active CN107405724B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562126420P 2015-02-27 2015-02-27
US62/126,420 2015-02-27
PCT/US2016/019752 WO2016138367A1 (en) 2015-02-27 2016-02-26 Fast beam manipulation for cross-axis micromachining

Publications (2)

Publication Number Publication Date
CN107405724A CN107405724A (zh) 2017-11-28
CN107405724B true CN107405724B (zh) 2020-05-05

Family

ID=56789631

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680012156.9A Active CN107405724B (zh) 2015-02-27 2016-02-26 用于横轴微机械加工的快速射束操纵

Country Status (6)

Country Link
US (1) US10507544B2 (enExample)
JP (1) JP6785238B2 (enExample)
KR (1) KR102387132B1 (enExample)
CN (1) CN107405724B (enExample)
TW (1) TWI718127B (enExample)
WO (1) WO2016138367A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015159390A1 (ja) * 2014-04-16 2015-10-22 三菱電機株式会社 指令値生成装置
US10239155B1 (en) * 2014-04-30 2019-03-26 The Boeing Company Multiple laser beam processing
US11361003B2 (en) * 2016-10-26 2022-06-14 salesforcecom, inc. Data clustering and visualization with determined group number
PL3523083T3 (pl) * 2016-11-18 2024-02-05 Ipg Photonics Corporation System i sposób laserowej obróbki materiałów
US11478853B2 (en) 2016-12-23 2022-10-25 General Electric Company Method for emissions plume monitoring in additive manufacturing
US11072025B2 (en) 2016-12-23 2021-07-27 General Electric Company Method for avoiding plume interference in additive manufacturing
US11318535B2 (en) 2016-12-23 2022-05-03 General Electric Company Method for process control in additive manufacturing
CN110545959B (zh) * 2017-02-09 2022-07-05 美国合成公司 能量加工的聚晶金刚石复合片及相关方法
GB2546437B (en) * 2017-04-13 2018-03-21 Elfab Ltd Improvements in or for burst members
US12145216B2 (en) * 2017-05-15 2024-11-19 The Trustees Of The University Of Pennsylvania Systems and methods for laser cleaving diamonds
EP3421168B1 (en) * 2017-06-29 2022-11-16 GF Machining Solutions AG Method for defining a sequence of relative positionings of a laser head in relation to a part ; method for machining a surface of a part by a laser using such method for defining ; corresponding computer program product and storage medium
KR102411536B1 (ko) * 2017-10-11 2022-06-22 삼성디스플레이 주식회사 증착 마스크 제조방법 및 제조장치
KR20190055295A (ko) * 2017-11-14 2019-05-23 삼성디스플레이 주식회사 마스크 제조 장치 및 마스크 제조 방법
JP6910932B2 (ja) * 2017-11-21 2021-07-28 Dgshape株式会社 熱転写装置
US11065707B2 (en) * 2017-11-29 2021-07-20 Lincoln Global, Inc. Systems and methods supporting predictive and preventative maintenance
US20220274208A1 (en) * 2018-08-01 2022-09-01 Cohpros International Co., Ltd. Cutting device for cutting composite material
TWI684842B (zh) * 2018-10-04 2020-02-11 財團法人精密機械研究發展中心 可調變參數的加工機
TWI816897B (zh) * 2018-10-08 2023-10-01 美商伊雷克托科學工業股份有限公司 用於在基板中形成穿孔的方法
EP3685954B1 (en) * 2019-01-22 2024-01-24 Synova S.A. Method for cutting a workpiece with a complex fluid-jet-guided laser beam
TWI892641B (zh) * 2019-01-31 2025-08-01 美商伊雷克托科學工業股份有限公司 光學系統
KR20210118969A (ko) * 2019-02-21 2021-10-01 일렉트로 사이언티픽 인더스트리즈, 아이엔씨 재료 가공을 위한 위상배열 빔 조향
JP7404043B2 (ja) * 2019-03-22 2023-12-25 ビアメカニクス株式会社 レーザ加工装置及びレーザ加工方法
US12103110B2 (en) * 2019-03-22 2024-10-01 Via Mechanics, Ltd. Laser processing apparatus and laser processing method
JP7543320B2 (ja) * 2019-06-10 2024-09-02 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法
DE102019116803A1 (de) * 2019-06-21 2020-12-24 Trumpf Laser- Und Systemtechnik Gmbh Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks
CN111822886B (zh) * 2020-06-11 2022-11-22 华东师范大学重庆研究院 一种微流控芯片微通道的多焦点超快激光制备装置及方法
CN111650744B (zh) * 2020-08-04 2020-10-30 成都极米科技股份有限公司 振镜的参数调节方法、装置、设备及可读存储介质
DE102021202644A1 (de) * 2021-03-18 2022-09-22 Volkswagen Aktiengesellschaft Verfahren zur Herstellung einer Ableiterfolie für Batterien
CN113579517B (zh) * 2021-07-27 2023-07-14 江苏先河激光技术有限公司 一种四振镜群孔加工方法
CN113721256A (zh) * 2021-09-24 2021-11-30 探维科技(北京)有限公司 一种角度拼接激光雷达系统
DE102021126360A1 (de) 2021-10-12 2023-04-13 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Bearbeitung eines Werkstücks durch Laserstrahlung in Form von Lissajous-Figuren sowie ein hierfür bestimmter Scanner und ein Spiegelelement
US12330239B2 (en) * 2022-02-09 2025-06-17 Ford Global Technologies, Llc Laser notching apparatus for cutting of electrode sheets
CN115302101B (zh) * 2022-08-31 2024-07-23 厦门通富微电子有限公司 晶圆切割方法及装置、电子设备、存储介质
DE102023129209A1 (de) * 2023-10-24 2025-04-24 Scanlab Gmbh Verfahren zur Laserbearbeitungsplanung und/oder zur Laserbearbeitung eines Objekts mit einem Laser
CN119457519A (zh) * 2024-11-25 2025-02-18 浙江大学绍兴研究院 剥落式激光划切晶圆的承载平台及其方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3026158A (en) 1959-04-20 1962-03-20 Lewis G Freeman Adjustable table
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5837962A (en) * 1996-07-15 1998-11-17 Overbeck; James W. Faster laser marker employing acousto-optic deflection
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
US6706998B2 (en) 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
JP4443208B2 (ja) 2003-12-12 2010-03-31 日立ビアメカニクス株式会社 スキャナ装置
US7133188B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing an upstream Bragg adjustment device
US7633034B2 (en) * 2004-06-18 2009-12-15 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7259354B2 (en) 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
US8084706B2 (en) 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP2008049383A (ja) 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd ビーム照射方法及びビーム照射装置
DE102007012815B4 (de) 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8680430B2 (en) 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
TWI523720B (zh) 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP5446631B2 (ja) * 2009-09-10 2014-03-19 アイシン精機株式会社 レーザ加工方法及びレーザ加工装置
KR20120113245A (ko) * 2009-12-30 2012-10-12 지에스아이 그룹 코포레이션 고속 빔 편향을 이용한 링크 처리
GB201006679D0 (en) 2010-04-21 2010-06-09 Ucl Business Plc Methods and apparatus to control acousto-optic deflectors
WO2012016226A1 (en) 2010-07-30 2012-02-02 Bytemobile, Inc. Systems and methods for video cache indexing
KR101908002B1 (ko) 2010-10-22 2018-12-19 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
WO2012116226A2 (en) * 2011-02-25 2012-08-30 Gsi Group Corporation Predictive link processing
JP5953198B2 (ja) * 2011-09-28 2016-07-20 株式会社リプス・ワークス 極短パルスレーザによる多次元パターン形成装置及び形成方法

Also Published As

Publication number Publication date
CN107405724A (zh) 2017-11-28
TWI718127B (zh) 2021-02-11
US20160250714A1 (en) 2016-09-01
KR20170120100A (ko) 2017-10-30
KR102387132B1 (ko) 2022-04-15
JP2018509300A (ja) 2018-04-05
TW201637764A (zh) 2016-11-01
US10507544B2 (en) 2019-12-17
JP6785238B2 (ja) 2020-11-18
WO2016138367A1 (en) 2016-09-01

Similar Documents

Publication Publication Date Title
CN107405724B (zh) 用于横轴微机械加工的快速射束操纵
JP7162094B2 (ja) ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法
US8648277B2 (en) Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
KR102772971B1 (ko) 레이저 가공 장치, 이를 작동하기 위한 방법, 및 이를 사용하여 피가공물을 가공하는 방법
CN102481664A (zh) 应用于介电质或其它材料的激光处理中的声光偏转器

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant