TWI718127B - 用於顫化雷射射束以沿著射束軌跡在工件中形成特徵的方法 - Google Patents
用於顫化雷射射束以沿著射束軌跡在工件中形成特徵的方法 Download PDFInfo
- Publication number
- TWI718127B TWI718127B TW105105862A TW105105862A TWI718127B TW I718127 B TWI718127 B TW I718127B TW 105105862 A TW105105862 A TW 105105862A TW 105105862 A TW105105862 A TW 105105862A TW I718127 B TWI718127 B TW I718127B
- Authority
- TW
- Taiwan
- Prior art keywords
- aod
- laser
- laser beam
- dithering
- trajectory
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562126420P | 2015-02-27 | 2015-02-27 | |
| US62/126,420 | 2015-02-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201637764A TW201637764A (zh) | 2016-11-01 |
| TWI718127B true TWI718127B (zh) | 2021-02-11 |
Family
ID=56789631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105105862A TWI718127B (zh) | 2015-02-27 | 2016-02-26 | 用於顫化雷射射束以沿著射束軌跡在工件中形成特徵的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10507544B2 (enExample) |
| JP (1) | JP6785238B2 (enExample) |
| KR (1) | KR102387132B1 (enExample) |
| CN (1) | CN107405724B (enExample) |
| TW (1) | TWI718127B (enExample) |
| WO (1) | WO2016138367A1 (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015159390A1 (ja) * | 2014-04-16 | 2015-10-22 | 三菱電機株式会社 | 指令値生成装置 |
| US10239155B1 (en) * | 2014-04-30 | 2019-03-26 | The Boeing Company | Multiple laser beam processing |
| US11361003B2 (en) * | 2016-10-26 | 2022-06-14 | salesforcecom, inc. | Data clustering and visualization with determined group number |
| EP3523083B1 (en) * | 2016-11-18 | 2023-08-09 | IPG Photonics Corporation | System and method for laser processing of materials. |
| US11318535B2 (en) | 2016-12-23 | 2022-05-03 | General Electric Company | Method for process control in additive manufacturing |
| US11478853B2 (en) | 2016-12-23 | 2022-10-25 | General Electric Company | Method for emissions plume monitoring in additive manufacturing |
| US11072025B2 (en) | 2016-12-23 | 2021-07-27 | General Electric Company | Method for avoiding plume interference in additive manufacturing |
| KR102437366B1 (ko) * | 2017-02-09 | 2022-08-29 | 유에스 신써틱 코포레이션 | 에너지 가공된 다결정 다이아몬드 컴팩트들 및 이에 관련된 방법 |
| GB2546437B (en) * | 2017-04-13 | 2018-03-21 | Elfab Ltd | Improvements in or for burst members |
| US12145216B2 (en) * | 2017-05-15 | 2024-11-19 | The Trustees Of The University Of Pennsylvania | Systems and methods for laser cleaving diamonds |
| EP3421168B1 (en) * | 2017-06-29 | 2022-11-16 | GF Machining Solutions AG | Method for defining a sequence of relative positionings of a laser head in relation to a part ; method for machining a surface of a part by a laser using such method for defining ; corresponding computer program product and storage medium |
| KR102411536B1 (ko) * | 2017-10-11 | 2022-06-22 | 삼성디스플레이 주식회사 | 증착 마스크 제조방법 및 제조장치 |
| KR20190055295A (ko) * | 2017-11-14 | 2019-05-23 | 삼성디스플레이 주식회사 | 마스크 제조 장치 및 마스크 제조 방법 |
| JP6910932B2 (ja) * | 2017-11-21 | 2021-07-28 | Dgshape株式会社 | 熱転写装置 |
| US11065707B2 (en) * | 2017-11-29 | 2021-07-20 | Lincoln Global, Inc. | Systems and methods supporting predictive and preventative maintenance |
| US20220274208A1 (en) * | 2018-08-01 | 2022-09-01 | Cohpros International Co., Ltd. | Cutting device for cutting composite material |
| TWI684842B (zh) * | 2018-10-04 | 2020-02-11 | 財團法人精密機械研究發展中心 | 可調變參數的加工機 |
| TWI816897B (zh) * | 2018-10-08 | 2023-10-01 | 美商伊雷克托科學工業股份有限公司 | 用於在基板中形成穿孔的方法 |
| EP3685954B1 (en) * | 2019-01-22 | 2024-01-24 | Synova S.A. | Method for cutting a workpiece with a complex fluid-jet-guided laser beam |
| TWI843784B (zh) * | 2019-01-31 | 2024-06-01 | 美商伊雷克托科學工業股份有限公司 | 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體 |
| CN118610876A (zh) * | 2019-02-21 | 2024-09-06 | 伊雷克托科学工业股份有限公司 | 用于材料处理的相位阵列射束操纵 |
| US12103110B2 (en) | 2019-03-22 | 2024-10-01 | Via Mechanics, Ltd. | Laser processing apparatus and laser processing method |
| JP7404043B2 (ja) * | 2019-03-22 | 2023-12-25 | ビアメカニクス株式会社 | レーザ加工装置及びレーザ加工方法 |
| EP3938138B1 (en) * | 2019-06-10 | 2025-11-12 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
| DE102019116803A1 (de) * | 2019-06-21 | 2020-12-24 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren und Vorrichtung zur Bearbeitung eines Werkstücks |
| CN111822886B (zh) * | 2020-06-11 | 2022-11-22 | 华东师范大学重庆研究院 | 一种微流控芯片微通道的多焦点超快激光制备装置及方法 |
| CN111650744B (zh) * | 2020-08-04 | 2020-10-30 | 成都极米科技股份有限公司 | 振镜的参数调节方法、装置、设备及可读存储介质 |
| DE102021202644A1 (de) * | 2021-03-18 | 2022-09-22 | Volkswagen Aktiengesellschaft | Verfahren zur Herstellung einer Ableiterfolie für Batterien |
| CN113579517B (zh) * | 2021-07-27 | 2023-07-14 | 江苏先河激光技术有限公司 | 一种四振镜群孔加工方法 |
| CN113721256A (zh) * | 2021-09-24 | 2021-11-30 | 探维科技(北京)有限公司 | 一种角度拼接激光雷达系统 |
| DE102021126360A1 (de) | 2021-10-12 | 2023-04-13 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren zur Bearbeitung eines Werkstücks durch Laserstrahlung in Form von Lissajous-Figuren sowie ein hierfür bestimmter Scanner und ein Spiegelelement |
| US12330239B2 (en) * | 2022-02-09 | 2025-06-17 | Ford Global Technologies, Llc | Laser notching apparatus for cutting of electrode sheets |
| CN115302101B (zh) * | 2022-08-31 | 2024-07-23 | 厦门通富微电子有限公司 | 晶圆切割方法及装置、电子设备、存储介质 |
| DE102023129209A1 (de) * | 2023-10-24 | 2025-04-24 | Scanlab Gmbh | Verfahren zur Laserbearbeitungsplanung und/oder zur Laserbearbeitung eines Objekts mit einem Laser |
| CN119457519A (zh) * | 2024-11-25 | 2025-02-18 | 浙江大学绍兴研究院 | 剥落式激光划切晶圆的承载平台及其方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003136270A (ja) * | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
| JP2013082006A (ja) * | 2011-09-28 | 2013-05-09 | Lps Works Co Ltd | 極短パルスレーザによる多次元パターン形成装置及び形成方法 |
| JP2014500147A (ja) * | 2010-10-22 | 2014-01-09 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3026158A (en) | 1959-04-20 | 1962-03-20 | Lewis G Freeman | Adjustable table |
| US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US5837962A (en) * | 1996-07-15 | 1998-11-17 | Overbeck; James W. | Faster laser marker employing acousto-optic deflection |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| US8217304B2 (en) * | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
| US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| US6706998B2 (en) | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
| US6706999B1 (en) | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| JP4443208B2 (ja) | 2003-12-12 | 2010-03-31 | 日立ビアメカニクス株式会社 | スキャナ装置 |
| US7133182B2 (en) | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems |
| US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
| US7633034B2 (en) * | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
| US7259354B2 (en) | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| US8084706B2 (en) | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP2008049383A (ja) | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム照射方法及びビーム照射装置 |
| DE102007012815B4 (de) | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| US8026158B2 (en) | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8680430B2 (en) | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| TWI523720B (zh) | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| JP5446631B2 (ja) * | 2009-09-10 | 2014-03-19 | アイシン精機株式会社 | レーザ加工方法及びレーザ加工装置 |
| GB201006679D0 (en) | 2010-04-21 | 2010-06-09 | Ucl Business Plc | Methods and apparatus to control acousto-optic deflectors |
| WO2012016226A1 (en) | 2010-07-30 | 2012-02-02 | Bytemobile, Inc. | Systems and methods for video cache indexing |
| WO2012116226A2 (en) * | 2011-02-25 | 2012-08-30 | Gsi Group Corporation | Predictive link processing |
-
2016
- 2016-02-26 JP JP2017545573A patent/JP6785238B2/ja active Active
- 2016-02-26 CN CN201680012156.9A patent/CN107405724B/zh active Active
- 2016-02-26 US US15/055,037 patent/US10507544B2/en active Active
- 2016-02-26 TW TW105105862A patent/TWI718127B/zh active
- 2016-02-26 WO PCT/US2016/019752 patent/WO2016138367A1/en not_active Ceased
- 2016-02-26 KR KR1020177020889A patent/KR102387132B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003136270A (ja) * | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
| JP2014500147A (ja) * | 2010-10-22 | 2014-01-09 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法 |
| JP2013082006A (ja) * | 2011-09-28 | 2013-05-09 | Lps Works Co Ltd | 極短パルスレーザによる多次元パターン形成装置及び形成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107405724A (zh) | 2017-11-28 |
| CN107405724B (zh) | 2020-05-05 |
| US20160250714A1 (en) | 2016-09-01 |
| US10507544B2 (en) | 2019-12-17 |
| KR102387132B1 (ko) | 2022-04-15 |
| WO2016138367A1 (en) | 2016-09-01 |
| KR20170120100A (ko) | 2017-10-30 |
| JP2018509300A (ja) | 2018-04-05 |
| JP6785238B2 (ja) | 2020-11-18 |
| TW201637764A (zh) | 2016-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI718127B (zh) | 用於顫化雷射射束以沿著射束軌跡在工件中形成特徵的方法 | |
| JP7162094B2 (ja) | ビームディザリング及びスカイビングのためのレーザ加工システム並びに方法 | |
| US8648277B2 (en) | Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies | |
| JP2022536649A (ja) | レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法 | |
| US9931713B2 (en) | Laser systems and methods for AOD rout processing |