JP2016517352A5 - - Google Patents

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Publication number
JP2016517352A5
JP2016517352A5 JP2016502438A JP2016502438A JP2016517352A5 JP 2016517352 A5 JP2016517352 A5 JP 2016517352A5 JP 2016502438 A JP2016502438 A JP 2016502438A JP 2016502438 A JP2016502438 A JP 2016502438A JP 2016517352 A5 JP2016517352 A5 JP 2016517352A5
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JP
Japan
Prior art keywords
speed
target position
laser
beam axis
workpiece
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JP2016502438A
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English (en)
Japanese (ja)
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JP6636417B2 (ja
JP2016517352A (ja
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Priority claimed from PCT/US2014/027439 external-priority patent/WO2014152526A1/en
Publication of JP2016517352A publication Critical patent/JP2016517352A/ja
Publication of JP2016517352A5 publication Critical patent/JP2016517352A5/ja
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JP2016502438A 2013-03-15 2014-03-14 Ａｏｄ移動減少用ａｏｄツール整定のためのレーザシステム及び方法 Active JP6636417B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361791656P 2013-03-15 2013-03-15
US201361791160P 2013-03-15 2013-03-15
US61/791,160 2013-03-15
US61/791,656 2013-03-15
PCT/US2014/027439 WO2014152526A1 (en) 2013-03-15 2014-03-14 Laser systems and methods for aod tool settling for aod travel reduction

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019195232A Division JP2020037135A (ja) 2013-03-15 2019-10-28 Ａｏｄ移動減少用ａｏｄツール整定のためのレーザシステム及び方法

Publications (3)

Publication Number Publication Date
JP2016517352A JP2016517352A (ja) 2016-06-16
JP2016517352A5 true JP2016517352A5 (enExample) 2017-04-20
JP6636417B2 JP6636417B2 (ja) 2020-01-29

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ID=51522887

Family Applications (2)

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JP2016502438A Active JP6636417B2 (ja) 2013-03-15 2014-03-14 Ａｏｄ移動減少用ａｏｄツール整定のためのレーザシステム及び方法
JP2019195232A Pending JP2020037135A (ja) 2013-03-15 2019-10-28 Ａｏｄ移動減少用ａｏｄツール整定のためのレーザシステム及び方法

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JP2019195232A Pending JP2020037135A (ja) 2013-03-15 2019-10-28 Ａｏｄ移動減少用ａｏｄツール整定のためのレーザシステム及び方法

Country Status (6)

Country Link
US (1) US9724782B2 (enExample)
JP (2) JP6636417B2 (enExample)
KR (1) KR102245812B1 (enExample)
CN (2) CN105121088B (enExample)
TW (1) TWI637803B (enExample)
WO (1) WO2014152526A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10613513B2 (en) * 2013-02-11 2020-04-07 The Aerospace Corporation Systems and methods for modifying material substrates
US10838406B2 (en) 2013-02-11 2020-11-17 The Aerospace Corporation Systems and methods for the patterning of material substrates
KR102309213B1 (ko) * 2015-03-06 2021-10-05 인텔 코포레이션 레이저 빔 조향용 음향 광학 편향기 및 거울
US9981357B2 (en) * 2015-06-22 2018-05-29 Electro Scientific Industries, Inc. Systems and methods for enabling automated motion control of a tool in a multi-axis machine tool
CN116213918A (zh) 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
EP3774166A4 (en) 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
JP6684872B2 (ja) * 2018-08-17 2020-04-22 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
US11090765B2 (en) * 2018-09-25 2021-08-17 Saudi Arabian Oil Company Laser tool for removing scaling
KR102864252B1 (ko) * 2020-03-04 2025-09-26 삼성디스플레이 주식회사 전자 장치 제조 방법
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
JP3768730B2 (ja) * 1999-06-14 2006-04-19 松下電器産業株式会社 レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
CN101172319A (zh) * 2001-02-16 2008-05-07 电子科学工业公司 用于存储器连接处理的飞击射束路径误差校正
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
US6706999B1 (en) * 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
DE10317363B3 (de) * 2003-04-15 2004-08-26 Siemens Ag Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat
US6947454B2 (en) 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
JP4443208B2 (ja) 2003-12-12 2010-03-31 日立ビアメカニクス株式会社 スキャナ装置
US7133182B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
US20060114948A1 (en) * 2004-11-29 2006-06-01 Lo Ho W Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
US7638731B2 (en) * 2005-10-18 2009-12-29 Electro Scientific Industries, Inc. Real time target topography tracking during laser processing
US8084706B2 (en) 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP2008049383A (ja) 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd ビーム照射方法及びビーム照射装置
DE102007012815B4 (de) 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
TWI523720B (zh) * 2009-05-28 2016-03-01 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
GB201006679D0 (en) 2010-04-21 2010-06-09 Ucl Business Plc Methods and apparatus to control acousto-optic deflectors
CN103338891B (zh) 2010-10-22 2016-03-02 伊雷克托科学工业股份有限公司 用于光束抖动和刮削的镭射加工系统和方法

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