JP2016516585A5 - - Google Patents
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- Publication number
- JP2016516585A5 JP2016516585A5 JP2016503316A JP2016503316A JP2016516585A5 JP 2016516585 A5 JP2016516585 A5 JP 2016516585A5 JP 2016503316 A JP2016503316 A JP 2016503316A JP 2016503316 A JP2016503316 A JP 2016503316A JP 2016516585 A5 JP2016516585 A5 JP 2016516585A5
- Authority
- JP
- Japan
- Prior art keywords
- laser
- pulse
- workpiece
- positioner
- sorting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361800903P | 2013-03-15 | 2013-03-15 | |
| US61/800,903 | 2013-03-15 | ||
| PCT/US2014/030043 WO2014145305A1 (en) | 2013-03-15 | 2014-03-15 | Laser emission-based control of beam positioner |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016516585A JP2016516585A (ja) | 2016-06-09 |
| JP2016516585A5 true JP2016516585A5 (enExample) | 2017-04-06 |
| JP6516722B2 JP6516722B2 (ja) | 2019-05-22 |
Family
ID=51537945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016503316A Expired - Fee Related JP6516722B2 (ja) | 2013-03-15 | 2014-03-15 | ビームポジショナのレーザ出射に基づく制御 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9527159B2 (enExample) |
| JP (1) | JP6516722B2 (enExample) |
| KR (1) | KR102166134B1 (enExample) |
| CN (1) | CN105102174B (enExample) |
| TW (1) | TWI583477B (enExample) |
| WO (1) | WO2014145305A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5338890B2 (ja) * | 2011-12-15 | 2013-11-13 | Ｊｆｅスチール株式会社 | レーザ溶接の溶接位置検出装置および溶接位置検出方法 |
| EP2961012A1 (en) * | 2014-06-26 | 2015-12-30 | Light Speed Marker, S.L. | Laser system for modifying objects |
| WO2017034807A1 (en) | 2015-08-26 | 2017-03-02 | Electro Scientific Industries, Inc. | Laser scan sequencing and direction with respect to gas flow |
| KR102781391B1 (ko) | 2015-09-09 | 2025-03-17 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들 |
| US11260472B2 (en) | 2016-12-30 | 2022-03-01 | Electro Scientific Industries, Inc. | Method and system for extending optics lifetime in laser processing apparatus |
| US20180207748A1 (en) * | 2017-01-23 | 2018-07-26 | Lumentum Operations Llc | Machining processes using a random trigger feature for an ultrashort pulse laser |
| DE102018205270A1 (de) * | 2018-04-09 | 2019-10-10 | Scanlab Gmbh | Laserstrahlpositioniersystem, Laserbearbeitungsvorrichtung und Steuerungsverfahren |
| CN112074370B (zh) | 2018-06-05 | 2023-03-14 | 伊雷克托科学工业股份有限公司 | 激光加工设备、其操作方法以及使用其加工工件的方法 |
| TWI892641B (zh) | 2019-01-31 | 2025-08-01 | 美商伊雷克托科學工業股份有限公司 | 光學系統 |
| US20220168847A1 (en) | 2019-06-10 | 2022-06-02 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
| CN112570881A (zh) * | 2020-11-27 | 2021-03-30 | 沧州领创激光科技有限公司 | 一种用于激光切割机的视觉寻边与定位方法 |
| EP4046741B1 (fr) | 2021-02-23 | 2023-11-01 | DM Surfaces SA | Procede d'usinage laser d'un composant horloger |
| US11683090B1 (en) | 2022-01-18 | 2023-06-20 | T-Mobile Usa, Inc. | Laser-based enhancement of signal propagation path for mobile communications |
| CN117782773B (zh) * | 2024-02-26 | 2024-05-31 | 中国地质大学（武汉） | 多脉冲飞秒激光剥蚀固体样品的进样器和剥蚀方法 |
| CN119426811A (zh) * | 2024-11-04 | 2025-02-14 | 深圳市熹扬科技有限公司 | 激光雕刻机及对焦高度检测方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6172325B1 (en) | 1999-02-10 | 2001-01-09 | Electro Scientific Industries, Inc. | Laser processing power output stabilization apparatus and method employing processing position feedback |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| TW504425B (en) * | 2000-03-30 | 2002-10-01 | Electro Scient Ind Inc | Laser system and method for single pass micromachining of multilayer workpieces |
| CA2438566A1 (en) | 2001-02-16 | 2002-08-29 | Electro Scientific Industries, Inc. | On-the-fly beam path error correction for memory link processing |
| US8497450B2 (en) * | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
| US7245412B2 (en) | 2001-02-16 | 2007-07-17 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
| JP4643889B2 (ja) | 2001-03-22 | 2011-03-02 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザ加工システム及び方法 |
| US6706998B2 (en) * | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
| JP2004042103A (ja) * | 2002-07-12 | 2004-02-12 | Sumitomo Heavy Ind Ltd | レーザ加工装置のトリガコントローラ |
| US20040017431A1 (en) * | 2002-07-23 | 2004-01-29 | Yosuke Mizuyama | Laser processing method and laser processing apparatus using ultra-short pulse laser |
| US7616669B2 (en) | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
| US6947454B2 (en) | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
| DE112004001527T5 (de) * | 2003-08-19 | 2006-07-06 | Electro Scientific Industries, Inc., Portland | Verfahren und Lasersysteme zur Verbindungsbearbeitung unter Verwendung von Laserimpulsen mit speziell zugeschnittenen Leistungsprofilen |
| US7521651B2 (en) | 2003-09-12 | 2009-04-21 | Orbotech Ltd | Multiple beam micro-machining system and method |
| JP4791457B2 (ja) * | 2004-06-07 | 2011-10-12 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザシステム性能を改善するためのａｏｍ変調技術 |
| US7133182B2 (en) * | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems |
| US7605343B2 (en) | 2006-05-24 | 2009-10-20 | Electro Scientific Industries, Inc. | Micromachining with short-pulsed, solid-state UV laser |
| US8084706B2 (en) | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP4612733B2 (ja) * | 2008-12-24 | 2011-01-12 | 東芝機械株式会社 | パルスレーザ加工装置 |
| TWI594828B (zh) | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| JP4873578B2 (ja) * | 2009-09-07 | 2012-02-08 | 住友重機械工業株式会社 | レーザ加工装置及び加工条件の決定方法 |
| US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
-
2014
- 2014-03-15 JP JP2016503316A patent/JP6516722B2/ja not_active Expired - Fee Related
- 2014-03-15 CN CN201480015616.4A patent/CN105102174B/zh not_active Expired - Fee Related
- 2014-03-15 WO PCT/US2014/030043 patent/WO2014145305A1/en not_active Ceased
- 2014-03-15 KR KR1020157023854A patent/KR102166134B1/ko active Active
- 2014-03-15 US US14/214,787 patent/US9527159B2/en active Active
- 2014-03-17 TW TW103110047A patent/TWI583477B/zh not_active IP Right Cessation
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