JP2016516585A5 - - Google Patents

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Publication number
JP2016516585A5
JP2016516585A5 JP2016503316A JP2016503316A JP2016516585A5 JP 2016516585 A5 JP2016516585 A5 JP 2016516585A5 JP 2016503316 A JP2016503316 A JP 2016503316A JP 2016503316 A JP2016503316 A JP 2016503316A JP 2016516585 A5 JP2016516585 A5 JP 2016516585A5
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JP
Japan
Prior art keywords
laser
pulse
workpiece
positioner
sorting device
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JP2016503316A
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English (en)
Japanese (ja)
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JP2016516585A (ja
JP6516722B2 (ja
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Priority claimed from PCT/US2014/030043 external-priority patent/WO2014145305A1/en
Publication of JP2016516585A publication Critical patent/JP2016516585A/ja
Publication of JP2016516585A5 publication Critical patent/JP2016516585A5/ja
Application granted granted Critical
Publication of JP6516722B2 publication Critical patent/JP6516722B2/ja
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JP2016503316A 2013-03-15 2014-03-15 ビームポジショナのレーザ出射に基づく制御 Active JP6516722B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361800903P 2013-03-15 2013-03-15
US61/800,903 2013-03-15
PCT/US2014/030043 WO2014145305A1 (en) 2013-03-15 2014-03-15 Laser emission-based control of beam positioner

Publications (3)

Publication Number Publication Date
JP2016516585A JP2016516585A (ja) 2016-06-09
JP2016516585A5 true JP2016516585A5 (enExample) 2017-04-06
JP6516722B2 JP6516722B2 (ja) 2019-05-22

Family

ID=51537945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016503316A Active JP6516722B2 (ja) 2013-03-15 2014-03-15 ビームポジショナのレーザ出射に基づく制御

Country Status (6)

Country Link
US (1) US9527159B2 (enExample)
JP (1) JP6516722B2 (enExample)
KR (1) KR102166134B1 (enExample)
CN (1) CN105102174B (enExample)
TW (1) TWI583477B (enExample)
WO (1) WO2014145305A1 (enExample)

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JP5338890B2 (ja) * 2011-12-15 2013-11-13 Ｊｆｅスチール株式会社 レーザ溶接の溶接位置検出装置および溶接位置検出方法
EP2961012A1 (en) * 2014-06-26 2015-12-30 Light Speed Marker, S.L. Laser system for modifying objects
KR102698971B1 (ko) 2015-08-26 2024-08-27 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 기체 흐름에 대한 레이저 스캔 시퀀싱 및 방향
CN116213918A (zh) 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
US20180207748A1 (en) * 2017-01-23 2018-07-26 Lumentum Operations Llc Machining processes using a random trigger feature for an ultrashort pulse laser
DE102018205270A1 (de) * 2018-04-09 2019-10-10 Scanlab Gmbh Laserstrahlpositioniersystem, Laserbearbeitungsvorrichtung und Steuerungsverfahren
EP3774166A4 (en) 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
CN112570881A (zh) * 2020-11-27 2021-03-30 沧州领创激光科技有限公司 一种用于激光切割机的视觉寻边与定位方法
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger
US11683090B1 (en) 2022-01-18 2023-06-20 T-Mobile Usa, Inc. Laser-based enhancement of signal propagation path for mobile communications
CN117782773B (zh) * 2024-02-26 2024-05-31 中国地质大学（武汉） 多脉冲飞秒激光剥蚀固体样品的进样器和剥蚀方法
CN119426811A (zh) * 2024-11-04 2025-02-14 深圳市熹扬科技有限公司 激光雕刻机及对焦高度检测方法

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TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
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CN101172319A (zh) 2001-02-16 2008-05-07 电子科学工业公司 用于存储器连接处理的飞击射束路径误差校正
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