CN105102174B - 基于激光放射所控制的射束定位器 - Google Patents

基于激光放射所控制的射束定位器 Download PDF

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Publication number
CN105102174B
CN105102174B CN201480015616.4A CN201480015616A CN105102174B CN 105102174 B CN105102174 B CN 105102174B CN 201480015616 A CN201480015616 A CN 201480015616A CN 105102174 B CN105102174 B CN 105102174B
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China
Prior art keywords
laser
workpiece
pulse
laser pulse
operable
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CN201480015616.4A
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English (en)
Chinese (zh)
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CN105102174A (zh
Inventor
乔瑟夫·法兰克尔
包伯·伯轩尼
道格·吉柏森
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Irecto Science Industry Co ltd
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Irecto Science Industry Co ltd
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Publication of CN105102174A publication Critical patent/CN105102174A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN201480015616.4A 2013-03-15 2014-03-15 基于激光放射所控制的射束定位器 Active CN105102174B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361800903P 2013-03-15 2013-03-15
US61/800,903 2013-03-15
PCT/US2014/030043 WO2014145305A1 (en) 2013-03-15 2014-03-15 Laser emission-based control of beam positioner

Publications (2)

Publication Number Publication Date
CN105102174A CN105102174A (zh) 2015-11-25
CN105102174B true CN105102174B (zh) 2017-05-31

Family

ID=51537945

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480015616.4A Active CN105102174B (zh) 2013-03-15 2014-03-15 基于激光放射所控制的射束定位器

Country Status (6)

Country Link
US (1) US9527159B2 (enExample)
JP (1) JP6516722B2 (enExample)
KR (1) KR102166134B1 (enExample)
CN (1) CN105102174B (enExample)
TW (1) TWI583477B (enExample)
WO (1) WO2014145305A1 (enExample)

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EP2961012A1 (en) * 2014-06-26 2015-12-30 Light Speed Marker, S.L. Laser system for modifying objects
KR102698971B1 (ko) 2015-08-26 2024-08-27 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 기체 흐름에 대한 레이저 스캔 시퀀싱 및 방향
CN116213918A (zh) 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
KR102401037B1 (ko) 2016-12-30 2022-05-24 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템
US20180207748A1 (en) * 2017-01-23 2018-07-26 Lumentum Operations Llc Machining processes using a random trigger feature for an ultrashort pulse laser
DE102018205270A1 (de) * 2018-04-09 2019-10-10 Scanlab Gmbh Laserstrahlpositioniersystem, Laserbearbeitungsvorrichtung und Steuerungsverfahren
EP3774166A4 (en) 2018-06-05 2022-01-19 Electro Scientific Industries, Inc. LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME
CN112570881A (zh) * 2020-11-27 2021-03-30 沧州领创激光科技有限公司 一种用于激光切割机的视觉寻边与定位方法
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger
US11683090B1 (en) 2022-01-18 2023-06-20 T-Mobile Usa, Inc. Laser-based enhancement of signal propagation path for mobile communications
CN117782773B (zh) * 2024-02-26 2024-05-31 中国地质大学（武汉） 多脉冲飞秒激光剥蚀固体样品的进样器和剥蚀方法
CN119426811A (zh) * 2024-11-04 2025-02-14 深圳市熹扬科技有限公司 激光雕刻机及对焦高度检测方法

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CN1644297A (zh) * 2003-09-12 2005-07-27 奥博泰克有限公司 多米束显微机械加工系统及方法
US20050270629A1 (en) * 2004-06-07 2005-12-08 Jay Johnson AOM modulation techniques employing transducers to modulate different axes
US20080093349A1 (en) * 2001-02-16 2008-04-24 Electro Scientific Industries, Inc. On-the-fly laser beam path dithering for enhancing throughput
CN101172319A (zh) * 2001-02-16 2008-05-07 电子科学工业公司 用于存储器连接处理的飞击射束路径误差校正

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KR101290665B1 (ko) * 2004-06-07 2013-07-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 시스템 성능 향상을 위한 ａｏｍ 변조 기술
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US20080093349A1 (en) * 2001-02-16 2008-04-24 Electro Scientific Industries, Inc. On-the-fly laser beam path dithering for enhancing throughput
CN101172319A (zh) * 2001-02-16 2008-05-07 电子科学工业公司 用于存储器连接处理的飞击射束路径误差校正
CN1561277A (zh) * 2001-03-22 2005-01-05 埃克赛尔技术有限公司 激光加工系统和方法
CN1644297A (zh) * 2003-09-12 2005-07-27 奥博泰克有限公司 多米束显微机械加工系统及方法
US20050270629A1 (en) * 2004-06-07 2005-12-08 Jay Johnson AOM modulation techniques employing transducers to modulate different axes

Also Published As

Publication number Publication date
US20140312013A1 (en) 2014-10-23
JP2016516585A (ja) 2016-06-09
TWI583477B (zh) 2017-05-21
WO2014145305A1 (en) 2014-09-18
JP6516722B2 (ja) 2019-05-22
KR102166134B1 (ko) 2020-10-16
US9527159B2 (en) 2016-12-27
TW201446374A (zh) 2014-12-16
CN105102174A (zh) 2015-11-25
KR20150132127A (ko) 2015-11-25

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