TWI583477B - 使用基於雷射放射所控制的射束定位器的雷射機械加工系統及方法 - Google Patents
使用基於雷射放射所控制的射束定位器的雷射機械加工系統及方法 Download PDFInfo
- Publication number
- TWI583477B TWI583477B TW103110047A TW103110047A TWI583477B TW I583477 B TWI583477 B TW I583477B TW 103110047 A TW103110047 A TW 103110047A TW 103110047 A TW103110047 A TW 103110047A TW I583477 B TWI583477 B TW I583477B
- Authority
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- Taiwan
- Prior art keywords
- laser
- pulse
- workpiece
- operable
- beam axis
- Prior art date
Links
- 238000003754 machining Methods 0.000 title claims description 33
- 238000000034 method Methods 0.000 title claims description 28
- 238000005520 cutting process Methods 0.000 claims description 64
- 238000012545 processing Methods 0.000 claims description 50
- 230000003287 optical effect Effects 0.000 claims description 35
- 230000001902 propagating effect Effects 0.000 claims description 15
- 230000008859 change Effects 0.000 claims description 11
- 238000005286 illumination Methods 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims 3
- 238000004891 communication Methods 0.000 claims 1
- 230000001186 cumulative effect Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 238000003698 laser cutting Methods 0.000 description 4
- 238000013139 quantization Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 238000005459 micromachining Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361800903P | 2013-03-15 | 2013-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201446374A TW201446374A (zh) | 2014-12-16 |
| TWI583477B true TWI583477B (zh) | 2017-05-21 |
Family
ID=51537945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103110047A TWI583477B (zh) | 2013-03-15 | 2014-03-17 | 使用基於雷射放射所控制的射束定位器的雷射機械加工系統及方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9527159B2 (enExample) |
| JP (1) | JP6516722B2 (enExample) |
| KR (1) | KR102166134B1 (enExample) |
| CN (1) | CN105102174B (enExample) |
| TW (1) | TWI583477B (enExample) |
| WO (1) | WO2014145305A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5338890B2 (ja) * | 2011-12-15 | 2013-11-13 | Ｊｆｅスチール株式会社 | レーザ溶接の溶接位置検出装置および溶接位置検出方法 |
| EP2961012A1 (en) * | 2014-06-26 | 2015-12-30 | Light Speed Marker, S.L. | Laser system for modifying objects |
| KR102698971B1 (ko) | 2015-08-26 | 2024-08-27 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 기체 흐름에 대한 레이저 스캔 시퀀싱 및 방향 |
| CN116213918A (zh) | 2015-09-09 | 2023-06-06 | 伊雷克托科学工业股份有限公司 | 镭射处理设备、镭射处理工件的方法及相关配置 |
| KR102401037B1 (ko) | 2016-12-30 | 2022-05-24 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 레이저 가공 장치에서 광학계의 수명을 연장하는 방법 및 시스템 |
| US20180207748A1 (en) * | 2017-01-23 | 2018-07-26 | Lumentum Operations Llc | Machining processes using a random trigger feature for an ultrashort pulse laser |
| DE102018205270A1 (de) * | 2018-04-09 | 2019-10-10 | Scanlab Gmbh | Laserstrahlpositioniersystem, Laserbearbeitungsvorrichtung und Steuerungsverfahren |
| EP3774166A4 (en) | 2018-06-05 | 2022-01-19 | Electro Scientific Industries, Inc. | LASER PROCESSING DEVICE, METHOD OF OPERATION THEREOF AND METHOD OF PROCESSING WORKPIECES USING SAME |
| CN112570881A (zh) * | 2020-11-27 | 2021-03-30 | 沧州领创激光科技有限公司 | 一种用于激光切割机的视觉寻边与定位方法 |
| EP4046741B1 (fr) | 2021-02-23 | 2023-11-01 | DM Surfaces SA | Procede d'usinage laser d'un composant horloger |
| US11683090B1 (en) | 2022-01-18 | 2023-06-20 | T-Mobile Usa, Inc. | Laser-based enhancement of signal propagation path for mobile communications |
| CN117782773B (zh) * | 2024-02-26 | 2024-05-31 | 中国地质大学（武汉） | 多脉冲飞秒激光剥蚀固体样品的进样器和剥蚀方法 |
| CN119426811A (zh) * | 2024-11-04 | 2025-02-14 | 深圳市熹扬科技有限公司 | 激光雕刻机及对焦高度检测方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030132208A1 (en) * | 2002-01-11 | 2003-07-17 | Cutler Donald R. | Simulated laser spot enlargement |
| US20050279808A1 (en) * | 2004-06-07 | 2005-12-22 | Jay Johnson | AOM modulation techniques employing plurality of tilt-angled transducers to improve laser system performance |
| TW200804023A (en) * | 2006-05-24 | 2008-01-16 | Electro Scient Ind Inc | Micromachining with short-pulsed, solid-state UV laser |
| TW201111082A (en) * | 2009-05-28 | 2011-04-01 | Electro Scient Ind Inc | Acousto-optic deflector applications in laser processing of dielectric or other materials |
| US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
| US20120083049A1 (en) * | 2006-07-20 | 2012-04-05 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6172325B1 (en) | 1999-02-10 | 2001-01-09 | Electro Scientific Industries, Inc. | Laser processing power output stabilization apparatus and method employing processing position feedback |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| WO2001074529A2 (en) * | 2000-03-30 | 2001-10-11 | Electro Scientific Industries, Inc. | Laser system and method for single pass micromachining of multilayer workpieces |
| US8497450B2 (en) * | 2001-02-16 | 2013-07-30 | Electro Scientific Industries, Inc. | On-the fly laser beam path dithering for enhancing throughput |
| CN101172319A (zh) | 2001-02-16 | 2008-05-07 | 电子科学工业公司 | 用于存储器连接处理的飞击射束路径误差校正 |
| US7245412B2 (en) | 2001-02-16 | 2007-07-17 | Electro Scientific Industries, Inc. | On-the-fly laser beam path error correction for specimen target location processing |
| KR100894088B1 (ko) | 2001-03-22 | 2009-04-20 | 엑스에스아이엘 테크놀러지 리미티드 | 레이저 기계 가공 시스템 및 방법 |
| JP2004042103A (ja) * | 2002-07-12 | 2004-02-12 | Sumitomo Heavy Ind Ltd | レーザ加工装置のトリガコントローラ |
| US20040017431A1 (en) * | 2002-07-23 | 2004-01-29 | Yosuke Mizuyama | Laser processing method and laser processing apparatus using ultra-short pulse laser |
| US6947454B2 (en) | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
| US7616669B2 (en) | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
| CN100593292C (zh) * | 2003-08-19 | 2010-03-03 | 电子科学工业公司 | 产生定制的激光脉冲组 |
| US7521651B2 (en) * | 2003-09-12 | 2009-04-21 | Orbotech Ltd | Multiple beam micro-machining system and method |
| KR101290665B1 (ko) * | 2004-06-07 | 2013-07-30 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 레이저 시스템 성능 향상을 위한 ａｏｍ 변조 기술 |
| JP4612733B2 (ja) * | 2008-12-24 | 2011-01-12 | 東芝機械株式会社 | パルスレーザ加工装置 |
| JP4873578B2 (ja) * | 2009-09-07 | 2012-02-08 | 住友重機械工業株式会社 | レーザ加工装置及び加工条件の決定方法 |
-
2014
- 2014-03-15 KR KR1020157023854A patent/KR102166134B1/ko active Active
- 2014-03-15 WO PCT/US2014/030043 patent/WO2014145305A1/en not_active Ceased
- 2014-03-15 US US14/214,787 patent/US9527159B2/en active Active
- 2014-03-15 CN CN201480015616.4A patent/CN105102174B/zh active Active
- 2014-03-15 JP JP2016503316A patent/JP6516722B2/ja active Active
- 2014-03-17 TW TW103110047A patent/TWI583477B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030132208A1 (en) * | 2002-01-11 | 2003-07-17 | Cutler Donald R. | Simulated laser spot enlargement |
| US20050279808A1 (en) * | 2004-06-07 | 2005-12-22 | Jay Johnson | AOM modulation techniques employing plurality of tilt-angled transducers to improve laser system performance |
| TW200804023A (en) * | 2006-05-24 | 2008-01-16 | Electro Scient Ind Inc | Micromachining with short-pulsed, solid-state UV laser |
| US20120083049A1 (en) * | 2006-07-20 | 2012-04-05 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| TW201111082A (en) * | 2009-05-28 | 2011-04-01 | Electro Scient Ind Inc | Acousto-optic deflector applications in laser processing of dielectric or other materials |
| US20110210105A1 (en) * | 2009-12-30 | 2011-09-01 | Gsi Group Corporation | Link processing with high speed beam deflection |
Also Published As
| Publication number | Publication date |
|---|---|
| US20140312013A1 (en) | 2014-10-23 |
| CN105102174B (zh) | 2017-05-31 |
| JP2016516585A (ja) | 2016-06-09 |
| WO2014145305A1 (en) | 2014-09-18 |
| JP6516722B2 (ja) | 2019-05-22 |
| KR102166134B1 (ko) | 2020-10-16 |
| US9527159B2 (en) | 2016-12-27 |
| TW201446374A (zh) | 2014-12-16 |
| CN105102174A (zh) | 2015-11-25 |
| KR20150132127A (ko) | 2015-11-25 |
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