JP4695363B2 - 単一ヘッド式レーザによる高スループットレーザショックピーニング - Google Patents
単一ヘッド式レーザによる高スループットレーザショックピーニング Download PDFInfo
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- JP4695363B2 JP4695363B2 JP2004240491A JP2004240491A JP4695363B2 JP 4695363 B2 JP4695363 B2 JP 4695363B2 JP 2004240491 A JP2004240491 A JP 2004240491A JP 2004240491 A JP2004240491 A JP 2004240491A JP 4695363 B2 JP4695363 B2 JP 4695363B2
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- Prior art keywords
- laser
- laser beam
- shock peening
- energy
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000035939 shock Effects 0.000 title claims description 53
- 230000003287 optical effect Effects 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000003213 activating effect Effects 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005553 drilling Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000001052 transient effect Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
- C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/001—Turbines
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Lasers (AREA)
Description
8 ガスタービンエンジンブレード
10 レーザショックピーニング装置
21 流水カーテン
24 コントローラ
31 レーザユニット
33 自励レーザ発振器
34 一次レーザビーム
36 単一のレージングロッド
35 光学系
42 レーザショックピーニング標的区域
43 光伝送回路
57 アブレーティブ皮膜
64 電気光学スイッチ
66 主ビーム通路
70 フラッシュランプ
72 電源
88 ダンプ
89 ダンプ通路
103 遅延発生器
104 光ダイオード
Claims (9)
- 単一のレージングロッド(36)のみを備えたパルス自励発振器(33)を含む、主ビーム通路(66)に沿って一次レーザビーム(34)を発生するレーザユニット(31)と、
前記自励発振器(33)の外部で前記一次レーザビーム(34)の主ビーム通路(66)に沿って作動可能に配置されて、該自励発振器(33)からの初期緩速立上り時間の一次レーザビーム(34)を遮断しかつ該主ビーム通路(66)からエネルギーを廃棄する電気光学スイッチ(64)と、
前記一次レーザビーム(34)から、少なくとも1つのレーザショックピーニング標的区域(42)のピーニング表面に集束する少なくとも1つの固定レーザビーム(2)を形成しかつ前記1つの固定レーザビーム(2)を前記少なくとも1つのレーザショックピーニング標的区域(42)に向けて配向するための少なくとも1つの光伝送回路(43)と、
を含むレーザショックピーニング装置(10)。
- 前記電気光学スイッチ(64)がポッケルスセルである、請求項1記載の装置。
- 前記電気光学スイッチ(64)からダンプ(88)に至りかつそれに沿って前記主ビーム通路(66)からエネルギーを廃棄するダンプ通路(89)をさらに含む、請求項1又は2記載の装置。
- 前記電気光学スイッチ(64)を起動させるために該電気光学スイッチ(64)に制御可能に結合された遅延発生器(103)をさらに含む、請求項3記載の装置。
- 前記レージングロッド(36)を作動させるために作動可能に配置された少なくとも1つ又は一対のフラッシュランプ(70)と、
前記フラッシュランプ(70)に駆動可能に接続された電源(72)と、
をさらに含み、
前記電源が、前記フラッシュランプ(70)を約10ヘルツ又はそれ以上の周波数で給電するように設定されている、
請求項1記載の装置。 - 前記電源(72)、フラッシュランプ(70)及びレージングロッド(36)が、1ジュール以上のエネルギー、約数百マイクロ秒の立上り時間及び約200〜300マイクロ秒から1ミリ秒までの範囲のパルス持続時間を有するレーザ出力パルス(74)を、該レージングロッド(36)から発射するように設定され、
前記電気光学スイッチがポッケルスセル(64)であり、前記ポッケルスセルが、前記一次レーザビーム(34)のエネルギーパルスを尖鋭化して該一次レーザビームが少なくとも1ジュールのエネルギーを有するようになるように設定されている、
請求項5記載の装置。 - 前記ポッケルスセル(64)を起動させるために該ポッケルスセル(64)に制御可能に結合された遅延発生器(103)をさらに含む、請求項3又は請求項6記載の装置。
- 前記レーザ発振器(33)からの初期レーザ出力パルスを測定するために前記レーザユニット(31)内に作動可能に配置されかつ前記遅延発生器(103)を起動させて前記ポッケルスセル(64)を切り替えるために該遅延発生器(103)に作動可能に結合された高速光ダイオード(104)をさらに含む、請求項7記載の装置。
- 前記レーザショックピーニング区域に向けて配向された流体ノズルをさらに含む、請求項1又は請求項8記載の装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/646,302 | 2003-08-22 | ||
US10/646,302 US6900409B2 (en) | 2003-08-22 | 2003-08-22 | Single head laser high throughput laser shock peening |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005066697A JP2005066697A (ja) | 2005-03-17 |
JP4695363B2 true JP4695363B2 (ja) | 2011-06-08 |
Family
ID=33098446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004240491A Expired - Fee Related JP4695363B2 (ja) | 2003-08-22 | 2004-08-20 | 単一ヘッド式レーザによる高スループットレーザショックピーニング |
Country Status (5)
Country | Link |
---|---|
US (1) | US6900409B2 (ja) |
JP (1) | JP4695363B2 (ja) |
CN (1) | CN100584966C (ja) |
DE (1) | DE102004040388A1 (ja) |
GB (1) | GB2405116B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9409254B2 (en) * | 2005-09-30 | 2016-08-09 | Lawrence Livermore National Security, Llc | Ablation layers to prevent pitting in laser peening |
US7906746B2 (en) * | 2005-11-30 | 2011-03-15 | General Electric Company | Laser shock peening system with time-of-flight monitoring |
US7897895B2 (en) * | 2006-05-01 | 2011-03-01 | General Electric Company | System and method for controlling the power level of a laser apparatus in a laser shock peening process |
CN104923606B (zh) * | 2015-04-23 | 2017-03-01 | 上海交通大学 | 一种用于大型工件激光喷丸成形的光路装置及方法 |
WO2018054569A1 (en) * | 2016-09-23 | 2018-03-29 | Tata Steel Nederland Technology B.V. | Method and arrangement for the liquid-assisted laser texturing of moving steel strip |
Citations (4)
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JP2000246468A (ja) * | 1999-02-16 | 2000-09-12 | General Electric Co <Ge> | レーザ衝撃ピーニング方法 |
JP2002219591A (ja) * | 2001-01-22 | 2002-08-06 | Toshiba Corp | レーザ光照射装置 |
JP2003201149A (ja) * | 2001-05-30 | 2003-07-15 | Central Glass Co Ltd | ガラスの着色方法 |
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DE69020581D1 (de) * | 1990-01-11 | 1995-08-03 | Battelle Memorial Institute | Verbesserung von materialeigenschaften. |
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2003
- 2003-08-22 US US10/646,302 patent/US6900409B2/en not_active Expired - Fee Related
-
2004
- 2004-08-19 DE DE102004040388A patent/DE102004040388A1/de not_active Ceased
- 2004-08-19 GB GB0418548A patent/GB2405116B/en not_active Expired - Fee Related
- 2004-08-20 JP JP2004240491A patent/JP4695363B2/ja not_active Expired - Fee Related
- 2004-08-23 CN CN200410057697A patent/CN100584966C/zh not_active Expired - Fee Related
Patent Citations (4)
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JPH11254156A (ja) * | 1997-12-18 | 1999-09-21 | General Electric Co <Ge> | 低エネルギ・レーザを用いるレーザ衝撃ピーニング方法 |
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JP2003201149A (ja) * | 2001-05-30 | 2003-07-15 | Central Glass Co Ltd | ガラスの着色方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2005066697A (ja) | 2005-03-17 |
US6900409B2 (en) | 2005-05-31 |
CN100584966C (zh) | 2010-01-27 |
CN1598006A (zh) | 2005-03-23 |
GB2405116B (en) | 2006-04-19 |
GB2405116A (en) | 2005-02-23 |
US20050040149A1 (en) | 2005-02-24 |
GB0418548D0 (en) | 2004-09-22 |
DE102004040388A1 (de) | 2005-03-17 |
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LAPS | Cancellation because of no payment of annual fees |