KR102245812B1 - Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법 - Google Patents
Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법 Download PDFInfo
- Publication number
- KR102245812B1 KR102245812B1 KR1020157022813A KR20157022813A KR102245812B1 KR 102245812 B1 KR102245812 B1 KR 102245812B1 KR 1020157022813 A KR1020157022813 A KR 1020157022813A KR 20157022813 A KR20157022813 A KR 20157022813A KR 102245812 B1 KR102245812 B1 KR 102245812B1
- Authority
- KR
- South Korea
- Prior art keywords
- speed
- positioning system
- workpiece
- laser
- aod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/386—Removing material by boring or cutting by boring of blind holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361791656P | 2013-03-15 | 2013-03-15 | |
| US201361791160P | 2013-03-15 | 2013-03-15 | |
| US61/791,160 | 2013-03-15 | ||
| US61/791,656 | 2013-03-15 | ||
| PCT/US2014/027439 WO2014152526A1 (en) | 2013-03-15 | 2014-03-14 | Laser systems and methods for aod tool settling for aod travel reduction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150130278A KR20150130278A (ko) | 2015-11-23 |
| KR102245812B1 true KR102245812B1 (ko) | 2021-04-30 |
Family
ID=51522887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157022813A Active KR102245812B1 (ko) | 2013-03-15 | 2014-03-14 | Aod 이동 저감을 위한 aod 툴 정착을 위한 레이저 시스템 및 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9724782B2 (enExample) |
| JP (2) | JP6636417B2 (enExample) |
| KR (1) | KR102245812B1 (enExample) |
| CN (2) | CN107150168B (enExample) |
| TW (1) | TWI637803B (enExample) |
| WO (1) | WO2014152526A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10838406B2 (en) | 2013-02-11 | 2020-11-17 | The Aerospace Corporation | Systems and methods for the patterning of material substrates |
| US10613513B2 (en) * | 2013-02-11 | 2020-04-07 | The Aerospace Corporation | Systems and methods for modifying material substrates |
| KR102309213B1 (ko) * | 2015-03-06 | 2021-10-05 | 인텔 코포레이션 | 레이저 빔 조향용 음향 광학 편향기 및 거울 |
| SG10201804397UA (en) * | 2015-06-22 | 2018-06-28 | Electro Scientific Industries Inc | Multi-axis machine tool and methods of controlling the same |
| US11077526B2 (en) * | 2015-09-09 | 2021-08-03 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of laser-processing workpieces and related arrangements |
| JP7146770B2 (ja) | 2016-12-30 | 2022-10-04 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | レーザ加工装置における光学部品の寿命を延ばすための方法及びシステム |
| CN116275467A (zh) | 2018-06-05 | 2023-06-23 | 伊雷克托科学工业股份有限公司 | 激光加工设备、其操作方法以及使用其加工工件的方法 |
| JP6684872B2 (ja) * | 2018-08-17 | 2020-04-22 | 株式会社アマダホールディングス | レーザ加工機及びレーザ加工方法 |
| US11090765B2 (en) * | 2018-09-25 | 2021-08-17 | Saudi Arabian Oil Company | Laser tool for removing scaling |
| KR102864252B1 (ko) * | 2020-03-04 | 2025-09-26 | 삼성디스플레이 주식회사 | 전자 장치 제조 방법 |
| EP4046741B1 (fr) | 2021-02-23 | 2023-11-01 | DM Surfaces SA | Procede d'usinage laser d'un composant horloger |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000351087A (ja) * | 1999-06-14 | 2000-12-19 | Matsushita Electric Ind Co Ltd | レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| JP4397163B2 (ja) * | 2001-02-16 | 2010-01-13 | エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド | メモリリンク処理用の走査ビーム経路の誤差の補正 |
| US6816294B2 (en) * | 2001-02-16 | 2004-11-09 | Electro Scientific Industries, Inc. | On-the-fly beam path error correction for memory link processing |
| JP2003136270A (ja) | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US6706999B1 (en) * | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| DE10317363B3 (de) * | 2003-04-15 | 2004-08-26 | Siemens Ag | Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat |
| US6947454B2 (en) | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
| JP4443208B2 (ja) | 2003-12-12 | 2010-03-31 | 日立ビアメカニクス株式会社 | スキャナ装置 |
| US7133188B2 (en) | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing an upstream Bragg adjustment device |
| US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| US20060114948A1 (en) * | 2004-11-29 | 2006-06-01 | Lo Ho W | Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| US7638731B2 (en) | 2005-10-18 | 2009-12-29 | Electro Scientific Industries, Inc. | Real time target topography tracking during laser processing |
| US8084706B2 (en) | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP2008049383A (ja) | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム照射方法及びビーム照射装置 |
| DE102007012815B4 (de) | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| US8026158B2 (en) * | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8680430B2 (en) * | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| TWI523720B (zh) * | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| GB201006679D0 (en) | 2010-04-21 | 2010-06-09 | Ucl Business Plc | Methods and apparatus to control acousto-optic deflectors |
| KR101908002B1 (ko) * | 2010-10-22 | 2018-12-19 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
-
2014
- 2014-03-14 JP JP2016502438A patent/JP6636417B2/ja active Active
- 2014-03-14 TW TW103109582A patent/TWI637803B/zh active
- 2014-03-14 WO PCT/US2014/027439 patent/WO2014152526A1/en not_active Ceased
- 2014-03-14 CN CN201710092567.XA patent/CN107150168B/zh active Active
- 2014-03-14 US US14/211,162 patent/US9724782B2/en active Active
- 2014-03-14 KR KR1020157022813A patent/KR102245812B1/ko active Active
- 2014-03-14 CN CN201480014010.9A patent/CN105121088B/zh active Active
-
2019
- 2019-10-28 JP JP2019195232A patent/JP2020037135A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000351087A (ja) * | 1999-06-14 | 2000-12-19 | Matsushita Electric Ind Co Ltd | レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150130278A (ko) | 2015-11-23 |
| JP2016517352A (ja) | 2016-06-16 |
| WO2014152526A1 (en) | 2014-09-25 |
| TW201446372A (zh) | 2014-12-16 |
| US20140263223A1 (en) | 2014-09-18 |
| CN105121088A (zh) | 2015-12-02 |
| TWI637803B (zh) | 2018-10-11 |
| CN105121088B (zh) | 2017-03-08 |
| JP2020037135A (ja) | 2020-03-12 |
| JP6636417B2 (ja) | 2020-01-29 |
| US9724782B2 (en) | 2017-08-08 |
| CN107150168A (zh) | 2017-09-12 |
| CN107150168B (zh) | 2019-06-21 |
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Legal Events
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| PA0105 | International application |
Patent event date: 20150821 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| AMND | Amendment | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20190314 Comment text: Request for Examination of Application |
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Comment text: Notification of reason for refusal Patent event date: 20200727 Patent event code: PE09021S01D |
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Patent event date: 20210119 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20200727 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
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Patent event code: PX09011S01I Patent event date: 20210119 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20200925 Comment text: Amendment to Specification, etc. Patent event code: PX09012R01I Patent event date: 20190314 Comment text: Amendment to Specification, etc. |
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| PX0701 | Decision of registration after re-examination |
Patent event date: 20210316 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20210219 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20210119 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20200925 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20190314 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
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Comment text: Registration of Establishment Patent event date: 20210422 Patent event code: PR07011E01D |
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