CN107150168B - 激光处理设备和经由激光工具操作而处理工件的方法 - Google Patents

激光处理设备和经由激光工具操作而处理工件的方法 Download PDF

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Publication number
CN107150168B
CN107150168B CN201710092567.XA CN201710092567A CN107150168B CN 107150168 B CN107150168 B CN 107150168B CN 201710092567 A CN201710092567 A CN 201710092567A CN 107150168 B CN107150168 B CN 107150168B
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China
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workpiece
beam axis
laser
speed
axis
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CN201710092567.XA
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English (en)
Chinese (zh)
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CN107150168A (zh
Inventor
马克·A·昂瑞斯
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Electro Scientific Industries Inc
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Electro Scientific Industries Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/388—Trepanning, i.e. boring by moving the beam spot about an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
CN201710092567.XA 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法 Active CN107150168B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361791656P 2013-03-15 2013-03-15
US201361791160P 2013-03-15 2013-03-15
US61/791,160 2013-03-15
US61/791,656 2013-03-15
CN201480014010.9A CN105121088B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201480014010.9A Division CN105121088B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法

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Publication Number Publication Date
CN107150168A CN107150168A (zh) 2017-09-12
CN107150168B true CN107150168B (zh) 2019-06-21

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CN201480014010.9A Active CN105121088B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法
CN201710092567.XA Active CN107150168B (zh) 2013-03-15 2014-03-14 激光处理设备和经由激光工具操作而处理工件的方法

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Country Status (6)

Country Link
US (1) US9724782B2 (enExample)
JP (2) JP6636417B2 (enExample)
KR (1) KR102245812B1 (enExample)
CN (2) CN105121088B (enExample)
TW (1) TWI637803B (enExample)
WO (1) WO2014152526A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10613513B2 (en) * 2013-02-11 2020-04-07 The Aerospace Corporation Systems and methods for modifying material substrates
US10838406B2 (en) 2013-02-11 2020-11-17 The Aerospace Corporation Systems and methods for the patterning of material substrates
KR102309213B1 (ko) * 2015-03-06 2021-10-05 인텔 코포레이션 레이저 빔 조향용 음향 광학 편향기 및 거울
JP6847865B2 (ja) * 2015-06-22 2021-03-24 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 多軸工作機械及びこれを制御する方法
KR20250037607A (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
CN114654082A (zh) 2016-12-30 2022-06-24 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
KR102655354B1 (ko) * 2018-06-05 2024-04-08 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
JP6684872B2 (ja) * 2018-08-17 2020-04-22 株式会社アマダホールディングス レーザ加工機及びレーザ加工方法
US11090765B2 (en) * 2018-09-25 2021-08-17 Saudi Arabian Oil Company Laser tool for removing scaling
KR102864252B1 (ko) * 2020-03-04 2025-09-26 삼성디스플레이 주식회사 전자 장치 제조 방법
EP4046741B1 (fr) 2021-02-23 2023-11-01 DM Surfaces SA Procede d'usinage laser d'un composant horloger

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101035645A (zh) * 2004-08-04 2007-09-12 电子科学工业公司 通过以圆形和螺旋形轨迹精确移动定时激光脉冲来加工孔的方法
CN101099226A (zh) * 2004-11-29 2008-01-02 电子科学工业公司 使用多激光束的高效微机械加工设备和方法
CN101172319A (zh) * 2001-02-16 2008-05-07 电子科学工业公司 用于存储器连接处理的飞击射束路径误差校正
CN101291770A (zh) * 2005-10-18 2008-10-22 伊雷克托科学工业股份有限公司 于激光处理期间的即时的靶材表面轮廓追踪
CN102481664A (zh) * 2009-05-28 2012-05-30 伊雷克托科学工业股份有限公司 应用于介电质或其它材料的激光处理中的声光偏转器

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
JP3768730B2 (ja) * 1999-06-14 2006-04-19 松下電器産業株式会社 レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
US6816294B2 (en) 2001-02-16 2004-11-09 Electro Scientific Industries, Inc. On-the-fly beam path error correction for memory link processing
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
DE10317363B3 (de) * 2003-04-15 2004-08-26 Siemens Ag Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat
US6947454B2 (en) 2003-06-30 2005-09-20 Electro Scientific Industries, Inc. Laser pulse picking employing controlled AOM loading
JP4443208B2 (ja) 2003-12-12 2010-03-31 日立ビアメカニクス株式会社 スキャナ装置
US7133182B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems
US7923306B2 (en) 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
US8084706B2 (en) 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP2008049383A (ja) 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd ビーム照射方法及びビーム照射装置
DE102007012815B4 (de) 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US8026158B2 (en) * 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
GB201006679D0 (en) 2010-04-21 2010-06-09 Ucl Business Plc Methods and apparatus to control acousto-optic deflectors
KR102143502B1 (ko) * 2010-10-22 2020-08-13 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101172319A (zh) * 2001-02-16 2008-05-07 电子科学工业公司 用于存储器连接处理的飞击射束路径误差校正
CN101035645A (zh) * 2004-08-04 2007-09-12 电子科学工业公司 通过以圆形和螺旋形轨迹精确移动定时激光脉冲来加工孔的方法
CN101099226A (zh) * 2004-11-29 2008-01-02 电子科学工业公司 使用多激光束的高效微机械加工设备和方法
CN101291770A (zh) * 2005-10-18 2008-10-22 伊雷克托科学工业股份有限公司 于激光处理期间的即时的靶材表面轮廓追踪
CN102481664A (zh) * 2009-05-28 2012-05-30 伊雷克托科学工业股份有限公司 应用于介电质或其它材料的激光处理中的声光偏转器

Also Published As

Publication number Publication date
TWI637803B (zh) 2018-10-11
JP2020037135A (ja) 2020-03-12
JP6636417B2 (ja) 2020-01-29
TW201446372A (zh) 2014-12-16
US9724782B2 (en) 2017-08-08
CN107150168A (zh) 2017-09-12
CN105121088B (zh) 2017-03-08
KR20150130278A (ko) 2015-11-23
WO2014152526A1 (en) 2014-09-25
US20140263223A1 (en) 2014-09-18
CN105121088A (zh) 2015-12-02
KR102245812B1 (ko) 2021-04-30
JP2016517352A (ja) 2016-06-16

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