TW201236790A - Laser processing device and laser processing method - Google Patents

Abstract

The topic of the present invention is to provide a laser processing device and method to process a workpiece at high speed. The laser processing device comprises: a laser source to emit the laser beam; an optic distribution system capable of distributing the laser beam emitted from the laser source toward at least a first direction and a second direction; and a first deflector to deflect the laser beams distributed by the optic distribution system toward the first and the second directions and emit the deflected laser beams. The first deflector comprises a first deflection device which is disposed on the optical path of the laser beam distributed toward the first direction in the optic distribution system, capable of deflecting and emitting the laser beam; a second deflection device which is disposed on the optical path of the laser beam distributed toward the second direction in the optic distribution system, capable of deflecting and emitting the laser beam; and third deflection devices which are disposed on the optical paths of the laser beam passing through the first deflection device and the laser beam passing through the second deflection device, capable of deflecting and emitting the incident laser beam.

Description

201236790 VI. Description of the Invention: [Technical Field] The present invention relates to a laser processing apparatus and a laser processing method for irradiating a processing object with a laser beam for processing. [Prior Art] Fig. 18 (A) to (D) show a schematic view of a conventional laser processing apparatus. Refer to Figure 18 (A). The pulsed laser beam 2 〇 is emitted from the laser source 1 . The pulsed laser beam 20 passes through the light-transmissive region of the mask 并 and is shaped into a cross-sectional shape, which is reflected by the mirror 12 and incident on the galvanometer scanner 14. The current detecting scanner 14 is configured by including two pan mirrors (current mirrors 14a and 14b) for changing the traveling direction of the incident pulsed laser beam 20 into a two-dimensional direction. The pulsed laser beam 20, which is changed in the forward direction by the current detecting scanner 14, is condensed by the f0 lens 17 and irradiated to the workpiece 30. The workpiece 30 is, for example, a printed circuit board in which a copper layer, a resin layer, and a copper layer are laminated in this order. The copper layer and the resin layer are pierced through the irradiation position by irradiating the pulsed laser beam 20 to the copper layer of the printed substrate. The control unit 18 controls the operation of the current detecting scanner 14 and the emission of the pulsed laser beam 20 from the laser light source 10. When the operation of the current detecting scanner 14 (the direction of the current mirrors 14a, 14b changes), the positioning of the irradiation position (processed position) of the pulsed laser beam 20 on the workpiece 30 is terminated, and the current is detected. The scanner 14 transmits to the control device 18 a stationary stationary signal informing the current mirrors 14a, 14b. After receiving the stationary signal, the laser oscillation command (trigger signal) is sent to the Ray-5-201236790 light source 1 控制 by the control device 18, thereby emitting the pulsed laser beam 20, and the pulsed laser beam is incident on the processed position to be positioned. The beam 20 is processed to the workpiece 30. The laser processing apparatus shown in Fig. 18 (Β) is provided with an imaging lens 16 on the optical path of the pulsed laser beam 20 between the two current mirrors 14a and 14b, as shown in Fig. 18(A). The laser processing equipment is different. In the laser processing apparatus shown in Fig. 18(A), since the current mirror 14a deflects the beam, the size of the current mirror 14b becomes large. In the laser processing apparatus shown in Fig. 18 (B) in which the imaging lens 16 is disposed between the current mirrors 14a and 14b, the sizes of the two mirrors 14a and 14b can be made equal. Since the inertia can be reduced, the operation of the current detecting scanner and the speed of processing can be realized. The laser processing apparatus shown in Fig. 18(C) is provided with a binary bifurcation and emission of the incident pulsed laser beam 20 on the optical path of the pulsed laser beam 20 passing through the light-transmitting region of the mask 11. The fork optical element 13 is different from the laser processing apparatus of Fig. 18(A). The bifurcated optical element 13 is, for example, a diffractive optical element (DOE) or a holographic optical element (HOE). The pulsed laser beam 20 is incident on the bifurcated optical element 13 and bifurcated into pulsed laser beams 20a, 20b. The two beams 20a, 20b are incident on the workpiece 30 via the current mirrors 14a, 14b, and f0, while performing double-hole processing (for example, refer to Patent Documents 1 and 2). The laser processing apparatus shown in Fig. 18(D) has a current detecting scanner 15 including two current mirrors 15a and 15b, which is different from the laser processing apparatus of Fig. 18(C). . Bifurcated by the bifurcated optical element 13

The pulsed laser beam 20a of one of S-6-201236790 is deflected by the current mirrors 15a, 15b, and is further deflected by the current mirrors 14a, 14b, and concentrated by the f0 lens 17 to be incident on the workpiece 30. The other pulsed laser beam 20b bifurcated by the bifurcated optical element 13 is deflected by the current mirrors 14a, 14b, and then incident on the workpiece 30 via the ίθ lens 17 (for example, refer to Patent Document 3). In the laser processing apparatus shown in Figs. 18(C) and (D), the pulsed laser beam 20 is bifurcated by the bifurcated optical element 13 so that the branched pulsed laser beam 20a, The peak power of 20b becomes half the power of the pulsed laser beam 20. Therefore, a state in which the laser light source 10 of the pulsed laser beam 20 having a large peak power is required to be emitted or a processable material is limited is generated. For example, the laser processing apparatus described in the patent document 3 is dedicated to the resin processing. (Prior Art Document) (Patent Document) Patent Document 1: JP-A-2007-268600 Patent Document 2: Japanese Patent No. 42 1 8209 Patent Document 3 The present invention aims to provide a laser processing apparatus and a laser processing method capable of high-speed machining. (Means for Solving the Problem) 201236790 According to one aspect of the present invention, there is provided a laser processing apparatus comprising: a laser light source that emits a laser beam; and a distribution optical system capable of at least a first direction and a laser beam emitted from the laser light source in a second direction; and a first deflector that is capable of deflecting a laser beam that is distributed in the first direction and the second direction in the distribution optical system and emits the laser beam, wherein The first deflector includes: a first deflecting element disposed on an optical path of the laser beam distributed to the first direction in the distributing optical system, and capable of deflecting the laser beam and emitting the second deflecting element; a deflection element disposed on an optical path of the laser beam distributed to the second direction in the distribution optical system and capable of deflecting the laser beam to be emitted; and a third deflection element disposed via the third deflection element The laser beam of the first deflection element and the laser beam passing through the second deflection element can deflect the incident laser beam and emit the laser beam. According to another aspect of the present invention, a laser processing method is provided, which is performed by a laser processing apparatus having: a laser light source that emits a laser beam; and a distribution optical system a laser beam emitted from the laser light source at least in a first direction and a second direction; and a first deflector that is deflectable in the first optical direction and the second direction in the distribution optical system The first deflector includes: a first deflecting element disposed on an optical path of the laser beam distributed to the first direction in the distributing optical system and capable of deflecting the thunder a second deflection element that is disposed on an optical path of the laser beam that is distributed in the second direction in the distribution optical system and that can deflect the laser beam and emit the beam; and a third offset

-8-201236790 A rotating element is disposed on an optical path of a laser beam passing through the first deflecting element and a laser beam passing through the second deflecting element, and is capable of deflecting an incident laser beam and emitting the same In a state where the first and third deflecting elements are stationary and the second deflecting element changes the deflecting direction, the laser beam is emitted from the laser light source, and the lightning is distributed to the first direction in the distributing optical system. Beam. Moreover, according to another aspect of the present invention, a laser processing method is provided, which is performed by a laser processing apparatus having a laser light source that emits a laser beam and a distribution optical system. The laser beam emitted from the laser light source can be distributed to at least the first direction and the second direction; and the first deflector can be deflected in the first optical direction and the second direction in the distribution optical system The first deflector includes a first deflection element that is disposed on an optical path of the laser beam that is distributed in the first direction in the distribution optical system and that is deflectable The laser beam is emitted; the second deflection element is disposed on an optical path of the laser beam distributed to the second direction in the distribution optical system, and is capable of deflecting the laser beam and emitting the beam; and a deflection element disposed on an optical path of the laser beam passing through the first deflection element and the laser beam passing through the second deflection element, and capable of deflecting the incident laser beam and emitting the beam It is, in a state where the first deflecting element 1 ~ 3 stationary, the laser light emitted from the laser beam, to the first direction and the second direction and the distribution in the laser beam-splitting optical system. Further, according to another aspect of the present invention, there is provided a laser processing method-9 - 201236790 'This method is carried out using a laser processing apparatus having a laser light source that emits a laser beam; and a light distribution system The first laser beam can be distributed from the first to fourth directions, and the first deflector can deflect the laser beam distributed in the first direction and the second direction of the distributed light to form a deflector. The laser beam that is distributed in the direction of the distribution optical system 3 and the fourth direction can be deflected and emitted, and the first deflector includes a first deflection element that is disposed in the first optical direction in the optical system. The beam is deflected and emitted by the beam; the second deflection element is disposed on the path of the distribution optical system in the second direction and is capable of deflecting the laser beam to be emitted; and the third partial system is disposed on The second deflector is included in the optical path of the laser beam of the first deflection element and the laser beam of the second deflection element, and is deflected and included: the fourth deflection element is placed in the distribution optical system The optical beam that is divided into the third direction can be deflected and emitted; and the fifth is disposed on the optical path of the first laser beam in the distribution optical system, and the laser can be deflected a beam-emitting deflection element that is disposed on an optical path passing through the fourth deflection element and the laser beam passing through the fifth deflection element, and is incident on the laser beam, and is characterized in that it is emitted from the laser beam At the time of beaming, the laser processing and loading system on the optical path of the laser beam that is not distributed by the distribution optical system in the first to sixth deflection elements is changed, and the laser system that emits the laser beam is emitted in the middle; and the middle direction In the above, the optical rotating element disposed on the beam splitting path and disposed on the laser beam is distributed in the direction of the laser beam deflecting element by the first laser beam. And the laser beam of the sixth piece and capable of deflecting the light source to be emitted in at least one deflection direction of the deflection element - 10 201236790. And, according to another aspect of the present invention, a laser processing method is provided, which is performed by a laser processing apparatus having: a laser light source that emits a laser beam; a distribution optical system, The laser beam emitted from the laser light source can be distributed in the first to fourth directions, and the first deflector can deflect the thunder that is distributed in the first direction and the second direction in the distribution optical system. And a second deflector that deflects and emits a laser beam that is distributed in the third direction and the fourth direction in the distribution optical system, wherein the first deflector includes: a deflection element disposed on an optical path of the laser beam distributed to the first direction in the distribution optical system, and capable of deflecting the laser beam to be emitted; the second deflection element being disposed in the foregoing Distributing the laser beam on the optical path of the laser beam allocated to the second direction in the optical system and deflecting the laser beam; and the third deflection element is disposed through the first deflection element The laser beam is deflected by the laser beam passing through the laser beam passing through the second deflection element, and the incident beam is deflected. The second deflector includes a fourth deflection element disposed in the distribution optical system. The optical path of the laser beam allocated to the third direction in the middle direction and capable of deflecting the laser beam and emitted; and the fifth deflection element disposed in the laser beam allocated to the fourth direction in the distribution optical system The beam path "and can deflect the laser beam to be emitted; and the sixth deflection element" is disposed on the optical path of the laser beam passing through the fourth deflection element and the laser beam passing through the fifth deflection element And deflecting the incident laser beam and emitting 'characterized by emitting the laser beam from the laser light source in a state where the first to sixth deflection elements 5 -11 - 201236790 are stationary, and distributing The laser beam is distributed to the first to fourth directions in the optical system. (Effect of the Invention) According to the present invention, it is possible to provide a laser processing apparatus and a laser processing method which can perform high speed machining. [Embodiment] Fig. 1 is a view showing a laser processing apparatus according to a first embodiment. For example, a laser source 40 comprising a C02 laser oscillator receives a trigger pulse (trigger signal) from the device 60 to emit a pulsed laser 80. The pulsed laser beam 80 is shaped into a cross-sectional shape by passing through a light-transmitting region having a light-transmitting region and a light-shielding region mask 41, and is incident on an acousto-optic deflector (AOD) 42. The AOD 42 is an optical deflector utilizing an acousto-optic effect, and is capable of receiving a control signal transmitted from the control device 60 to change the direction of the incident pulsed laser beam 80 and to emit it. The exit side (deflection angle) of the pulsed laser beam emitted by the AOD 42 can be varied by the frequency of the control signal applied to the AOD 42. The control device 60 applies a control signal having a different frequency to the AOD 42, and selectively emits a pulse laser 80° along the mutually different optical paths A and B, and a pulsed laser beam 80a distributed to the optical path A having a relatively small deflection angle to the current. Mirror 43 a. The pulsed laser beam 80b assigned to the optical path B having a relatively large deflection angle is incident on the current mirror 43b. The pulsed laser beams 80a, 80b are separately described as being controlled by the beam, and the beam is redirected into the punching -12-201236790. The upper layer is reversed. The upper layer is determined to be able to be moved by the current mirrors 43a, 43b. And incident on the current mirror 44. The current mirror 44 shoots the pulsed laser beams 80a, 80b and enters the workpiece 30 on the holding stage 70 via the f0 lens 45. The f0 lens 45 condenses the pulsed laser beam 80a 80b and images the beam cross section (the shape of the light region) at the position of the mask 41 on the workpiece 30. The stage 70 is a stage for movably holding the workpiece 30, for example, a stage. The workpiece 30 is a printed circuit board having, for example, a layer formed of copper in this order, a resin layer formed of an epoxy resin containing glass cloth, and a laminated structure in which an upper layer is formed of copper. The pulsed laser beams 80a, 80b are incident on the workpiece 30 from the surface of the layer (copper layer) to form a through hole penetrating the upper layer and the resin and reaching the lower layer (copper layer). The irradiation of the pulsed laser beams 80a, 80b is performed, for example, by a periodic method. The through holes are formed by causing the 3 to 5 pulsed laser beams 80a, 80b to be incident on the plurality of processed positions drawn on the workpiece 30, respectively. The sizes of the holes forming the processed position are, for example, equal. The current mirrors 43a, 43b, and 44 are emitted by the pulsed laser beams 80a, 80b which can change the direction in which the pan mirror deflects the incident surface. The control unit 60 is capable of controlling the emission direction of the pulsed laser beams 80a, 80b (the incident position on the workpiece 30) by changing the direction of the reflection faces of the current mirrors 43a, 43b, 44. The incident position of the pulsed laser beams 80a, 80b on the member 30 in the X-axis direction is caused by the change in the direction of the reflection surface of the current mirrors 43a, 43b. Moreover, by the change of the direction of the reflecting surface of the current mirror 44, the incident position of the pulsed laser beam 8 0 a, 8 Ob in the Y-axis direction of the member 30 can be shifted from 13 to 201236790 by the current mirrors 43a, 43b. When the change in the direction of the reflecting surface ends the positioning in the X-axis direction of the incident position (processed position) of the pulsed laser beams 80a and 80b on the workpiece 30, the current mirror 43a is sent from the current mirrors 43a and 43b to the control device 60 to notify the current mirror 43a. , the stationary still signal of 43b. When the position of the incident position of the pulsed laser beams 80a and 80b on the workpiece 30 is stopped in the Y-axis direction by the change in the direction of the reflecting surface of the current mirror 44, the current is transmitted from the current mirror 44 to the control device 60. The stationary stationary signal of mirror 44. After the positioning of the incident position of the pulsed laser beam is completed, the control device 60 transmits a laser oscillation command (trigger signal) to the laser light source 40, thereby emitting the pulsed laser beam 80 and injecting the pulsed laser beam into the processed position. The processing of the workpiece 30 is performed. If the processing of the range (processable range) of the irradiatable pulsed laser beams 80a, 80b is completed by changing the direction of the reflection surface of the current mirrors 43a, 43b, 44, the unprocessed area of the workpiece 30 is carried by the stage 70. Move to the machinable range of the current mirrors 43a, 43b, 44. The workpiece 30 is controlled by the control device 60 based on the movement of the stage 70. Further, the processable range is, for example, a square area of 50 mm on one side. The laser processing apparatus according to the first embodiment is characterized in that it has a current mirror 43a, 43b for respectively deflecting the incident pulsed laser beam and a current mirror 44 for further deflecting the laser beam 80 deflected by the current mirrors 43a, 43b. These three current mirrors constitute a galvanometer scanner. Fig. 2 is a timing chart showing a laser processing method based on the first embodiment. The laser processing method based on the first embodiment is carried out using the laser processing apparatus according to the first embodiment -14-201236790 and based on the control based on the control unit 60. The horizontal axis of the timing chart represents time. The vertical axis of the "laser beam 80" segment indicates the state in which the laser beam 80 is emitted and not emitted. In the figure, the laser pulses of the pulsed laser beam 80 emitted from the laser light source 40 are expressed as laser pulses L1 to L9 in the order of emission. The vertical axes of the "current mirror 43a", "current mirror 43b", and "current mirror 44" segments indicate the state of movement and rest of the respective current mirrors 43a, 43b, 44. The vertical axis of the "AOD42" segment indicates the frequency of the control signal applied to the AOD42. The laser beam 80 incident on the AOD 42 to which the control signal having a relatively low frequency is applied advances on the optical path A, and the laser beam 80 incident on the AOD 42 to which the relatively high frequency control signal is applied is on the optical path B. go ahead. The laser pulse L1 is emitted after the current mirror 44 is stationary and the current mirror 43a is stationary. If the position of the incident position of the (stationary) laser pulse L1 is ended in the Y-axis direction, the current mirror 44 transmits a current still signal to the control unit 60. Similarly, if the position of the incident position of the laser pulse L1 is ended in the X-axis direction, the current mirror 43a transmits a current still signal to the control device 60. The control device 60 receives the current still signal indicating that the positioning of the incident position of the laser pulse L1 is completed in both the X-axis direction and the Y-axis direction, and then transmits the trigger signal to the laser light source 40. The laser source 40 receives the trigger signal and emits a laser pulse L1. The control device 60 transmits a trigger signal '0 to the laser light source 40 and applies a relatively low frequency control signal to the AOD 42' to cause the laser pulse L1 to be incident on the current mirrors 43a, 44 as the transmission source of the current still signal. Control. The laser pulse L1 is deflected by the AOD 42 and proceeds on the optical path A and is incident on the processed position of the workpiece 30 via the current mirrors 43a, 44, f0 lens 45 -15 - 201236790. During this period, the current mirror 43b is moved (change in the direction of the reflecting surface). After the ejection of the laser pulse L1 is completed, the control device 60 transmits a control signal for positioning the current mirrors 43a, 44, respectively, so that the laser pulse is incident on the processed position where the subsequent processing is performed. The current mirrors 43a, 44 receive the control signals from the control unit 60 and begin to move. The control unit 60 cancels the control signal applied to the AOD 42 but cancels it before or after the end of the output of the laser pulse L1. In Fig. 2, it is indicated that the completion of the release of all the laser pulses is completed. In addition, the control signal is applied to the AOD 42 before or after the laser pulse L1 is started to be emitted, but in the figure, it is indicated as being applied simultaneously with the start of all the laser pulses. The laser pulse L2 is emitted after the current mirror 44 is stationary and the current mirror 43b is stationary. The current mirror 44 transmits a current still signal indicating the position of the incident position of the end of the laser pulse L2 in the Y-axis direction to the control device 60. The current mirror 43b transmits a current still signal indicating the position of the incident position of the end of the laser pulse L2 in the X-axis direction to the control device 60. The control device 60 receives the current still signal and transmits a trigger signal to the laser light source 40, emits the laser pulse L2 from the laser light source 40, and applies a relatively high frequency control signal to the AOD 42 to cause the laser pulse L2 to be incident on the current. Control of mirror 43b '44. The laser pulse L2 is deflected by the AOD 42 and advanced on the optical path B and incident on the processed position of the workpiece 30 via the current mirrors 43b, 44 and f0 lens 45. During this time, the current mirror 43a continues to move. After the ejection of the laser pulse L2 is completed, the control device 60 sends a control signal for positioning the current to the current-16-201236790 mirrors 4 3 b, 4 4 so that the laser pulse is incident on the processed position 'current of the subsequent processing. The mirrors 43b, 44 receive control signals from the control device 60 and begin to move. Similarly to the laser pulse L1, the laser pulses L3 and L4 are emitted after the current mirrors 44 and 43a are stationary, and are incident on a predetermined processed position via the current mirrors 43a and 44, respectively. Thus, the processing of the two processed positions is continuously performed by the laser pulse passing through the current mirror 43a. During this time, the current mirror 4 3 b continues to move. Further, after the laser pulses L3 and L4 are emitted, the current mirrors 43a and 44 are moved. The current mirror 43b is stationary and sends a stationary signal to the control unit 60. Further, the movement of the current mirror 44 is completed, and the stationary signal is sent to the control device 60. Control device 60 receives the stationary signal of the slowest current mirror 44 and emits a laser pulse L5. The laser pulse L5 is distributed to the optical path B by the AOD 42 to which the relatively high frequency control signal is applied, and is incident on the processed position of the workpiece 30 via the current mirrors 43b, 44. After the end of the ejection of the laser pulse L5, the current mirrors 43b, 44 start to move. During this time, the current mirror 43a continues to move. The laser pulse L6 is emitted in accordance with the trigger signal of the control device 60 that has received the stationary signal of the current mirrors 44, 43a, and is incident on the processed position via the current mirrors 43a, 44. After the end of the ejection of the laser pulse L6, the current mirrors 43a, 44 start to move. During the processing based on the laser pulse L6, the current mirror 43b continues to move. Upon completion of the positioning based on the current mirrors 4 3 b, 4 4 , the control unit 60 receives a stationary signal from both of the current mirrors 43b, 44. However, even in the case of the positioning of the incident position of the laser-17-201236790 pulse, the time to complete the positioning (the time when the slowest current mirror receives the stationary signal) may be the moment from the front of the laser pulse. The time of the shortest period of time during which the pulse can be emitted (oscillated). At this time, after the time period of the shortest period of time by the control means 60, that is, for example, the pulsed laser beam 80 is emitted in the shortest period (the upper limit of the laser oscillation frequency of the laser 40). At the time when the control device 60 receives the stationary from both of the current mirrors 43b and 44, the shortest cycle time does not elapse from the time when the laser pulse L6 is emitted. Therefore, the laser pulse L7 is emitted after the time when the laser beam L6 is emitted, the time of the shortest period of the laser beam 80 can be emitted. After the laser pulse L7 is emitted, the current mirrors 43b, 44 start to move. During the processing based on the laser pulse L7, the current mirror 43a continues to move. The laser pulse L8 is emitted after the control device 60 doubles the stationary signal from the current mirrors 44, 43a. After the end of the ejection of the laser pulse L8, the flow mirror 43a starts moving. Current mirror 44 remains stationary. This is based on the Y coordinate of the processed position of the next laser pulse L9 being equal to the Y coordinate of the processed position of the base pulse L8. During the processing based on the pulse L 8 , the current mirror 43 b continues to move. The laser pulse L9 is emitted after the current mirror 43b is stationary, and the processed current mirrors 43b, 44 are incident on the workpiece 30. In the present example, from the time when the laser pulse L 8 is emitted to the end of the lightning strike L9 The current mirror 44 is in a stationary state, but the X coordinate based on the processed position of the laser L9 and the laser beam based on the laser beam L8 are added at the end of the passing signal source. Because the Rayleigh shot from the static position pulse pulse station

When the X coordinates of S -18- 201236790 are equal, for example, control for not moving the current mirror 43a is performed. Thus, when the X coordinate or the Y coordinate based on the processed position of the next laser pulse is equal, control for not moving either of the current mirrors 43a, 43b, and 44 or not moving the current mirrors 43a, 43b can be performed. The laser processing method according to the first embodiment temporally distributes each laser pulse of the pulsed laser beam 80 emitted from the laser light source 40 to the current mirrors 4 3 a, 4 3 b by AOD 42 per pulse. Either side. The laser pulse is emitted in a state in which one of the current mirrors 43a and 43b and the current mirror 44 are stationary, and is irradiated to the workpiece 30 via a stationary current mirror. While the pulsed laser beam 80 is emitted while the two current mirrors 43 a and 43 b are stationary while one of the mirrors is stationary, the other mirror is moved by the incident position of the laser pulse for positioning. It is possible to increase the laser irradiation frequency with respect to the workpiece 30. According to the laser processing method of the first embodiment, the pulse energy of each laser pulse irradiated to the workpiece 30 can be maintained at the same level as the pulse energy and the peak power of the pulsed laser beam 80 emitted from the laser light source 40. And the state of the peak power, speed up the processing. Fig. 3 is a timing chart showing a laser processing method based on the second embodiment. The laser processing method based on the second embodiment is based on the laser processing apparatus according to the first embodiment, and is implemented based on the control of the control unit 60. The horizontal axis of the timing chart and the vertical axis of each segment are equal to the horizontal and vertical axes of the timing chart shown in Fig. 2. In the figure, the laser pulses of the pulsed laser beam 80 emitted from the laser light source 40 are shown as laser pulses L1 to L7 in the order of emission. In the laser processing method according to the second embodiment, the laser pulses L1 to L7a which are advanced on the optical path a -19-201236790 are generated by time division from the respective laser pulses L1 to L7 by the AOD 42 and advance on the optical path B. Laser pulses Lib~L7b. The pulse widths of the laser pulse Lla and the laser pulse Lib are, for example, equal. The pulse widths of the laser pulses L2a to L7a and the laser pulses L2b to L7b are also the same. The laser pulse L1 is emitted after the current mirrors 44, 43a are stationary and the current mirror 43b is stopped. When the positions of the incident positions of the laser pulses L 1 a, L 1 b are respectively terminated in the X-axis direction, the current mirrors 43a, 43b transmit a current still signal to the control device 60. When the positioning of the incident positions of the laser pulses L1a and Lib is completed in the Y-axis direction, the current mirror 44 transmits a current still signal to the control device 60. Control device 60 transmits a trigger signal to laser source 40 after receiving current stationary signals from current mirrors 43a, 43b, 44. The laser light source 40 emits a laser pulse L1. The control device 60 transmits a trigger signal to the laser light source 40, and sequentially applies a control signal having a relatively low frequency and a relatively high frequency control signal to the A OD 42 in sequence. The time at which the relatively low frequency control signal is applied is equal to the time at which the control signal is applied at a relatively high frequency. The application of the relatively high frequency control signal is released, for example, at the same time as the exit of the laser pulse L1. Further, in the figure, a control signal having a relatively low frequency is applied while starting to emit all of the laser pulses L1 to L7, and a control signal having a relatively high frequency is released at the same time as the end of the emission, but the start of the application of the control signal is performed. And the cancellation does not necessarily coincide with the start of the emission and the end of the emission of the laser pulses L 1 to L7. From the laser pulse L1 incident to AOD42-20-201236790 during the application of a relatively low frequency control signal, the laser pulse L1a advancing on the optical path A is generated by time division. Further, from the laser pulse L1 incident on the AOD 42 during the application of the relatively high frequency control signal, the laser pulse Lib advancing on the optical path B is generated by time division. The laser pulse Lla is incident on the processed position of the workpiece 30 via the current mirror 43a, the current mirror 44, and the f0 lens 45. The laser pulse Lib is incident on the processed position of the workpiece 30 via the current mirror 43b, the current mirror 44, and the fe lens 45. The Y coordinate of the processed position of the incident laser pulse L 1 a is equal to the Y coordinate of the processed position of the incident laser pulse Lib. The control means 60 ends the application of the control signal having a relatively low frequency, and transmits a control signal for positioning the current mirror 43a to inject the next laser pulse L2a to the predetermined processed position. The current mirror 43a receives the control signal from the control unit 60, and starts moving before ending the injection of the laser pulse L1b to the processed position (before the assignment to the optical path B is completed). Further, the control device 60 ends the application of the control signal having a relatively high frequency (ending the exiting laser pulse L1), and transmits a control signal for positioning the current mirrors 43b, 44 so as to be incident on the next processed position, respectively. Laser pulses L2b, L2a and L2b. The current mirrors 43b, 44 receive control signals from the control device 60 and begin to move. The laser pulse L2 is emitted after the current mirrors 43b, 44 are stationary and the current mirror 43a is stopped. A current still signal is transmitted from each of the current mirrors 43a, 43b, 44 to the control device 60, and the control device 60 receives the stationary signal of the static mirror 49a which is the slowest, and transmits a trigger signal to the laser light source 40. The laser source 40 emits a laser pulse L2. -21 - 201236790 The control device 60 transmits a trigger signal to the laser light source 40, and continuously applies a control signal having a relatively low frequency α and a relatively high frequency control signal to the AOD 42 in sequence. The laser pulse L2a generated along the optical path 雷 from the laser pulse L2 incident to the AOD 42 during the application of the relatively low frequency control signal is incident on the processed position of the workpiece 30 via the current mirrors 43a, 44 and the f0 lens 45. Further, the laser pulse L2b generated by the laser pulse B which is incident on the optical path B during the application of the relatively high frequency control signal is incident on the processed position of the workpiece 30 via the current mirrors 43b, 44 and the f0 lens 45. . The Y coordinates of the processed positions of the incident two laser pulses L2a, L2b are equal. The control device 60 ends the application of the control signal having a relatively low frequency, and transmits a control signal for positioning the current mirror 43a to inject the next laser pulse L3a to the predetermined processed position to receive the current of the control signal. The mirror 43a starts moving before ending the incident laser pulse L2b. Further, the control device 60 ends the application of the control signal having a relatively high frequency, and transmits a control signal for positioning the current mirrors 43b, 44 to respectively inject the next laser pulses L3b, L3a and the predetermined processed positions. L3b, the current mirrors 43b, 44 receiving the control signal start to move. The laser pulse L3 is emitted after the current mirrors 43a, 43b are stationary and the current mirror 44 is stationary. A current stationary signal is transmitted from each of the current mirrors 43a, 43b, 44 to the control device 6A, and the control device 60 receives the stationary signal of the slowest current mirror 44 and transmits a trigger signal to the laser source 40, the laser-22-201236790 The light source 40 emits the laser pulse L3 in accordance with the trigger signal. The control device 60 transmits a trigger signal to the laser light source 40, and the AOD 42 sequentially applies a control signal having a relatively low frequency of the port and a control signal having a higher frequency. From the laser pulse A generated during the application of the relatively low frequency control signal, the laser pulse L3 is generated along the optical path A. The flow mirrors 43a, 44 and the f0 lens 45 are incident on the workpiece 30, from the applied frequency. The laser pulse L3b generated by the laser pulse L3 incident on the relatively high control signal during the period of the control signal is incident on the workpiece 30 by the flow mirrors 43b, 44 and the f0 lens 45. . The Y of the processed position of the two laser pulses L3a, L3b is incident. The control device 60 ends the application of the control signal having a relatively low frequency and transmits a control signal for positioning the current mirror 43a to be incident on the next laser pulse L4a at a predetermined processed position, and receives the current mirror 43a of the number. Before the end of the incident laser pulse L3b is started, the control device 60 ends the control of applying the relatively high frequency and sends a control signal for the current mirrors 43b, 44 to be positioned to respectively inject the next laser pulse to the predetermined processed position. L4a and L4b, the current mirrors 43b, 44 receiving the control signal are turned on and the laser pulse L4 is emitted after the current mirror 44' 43b is stationary and the current is stopped. Control device 60 receives the stationary signal of the slowest current and transmits a trigger signal to laser source 40. And the rate relative to the AOD42 via the electrical position AOD42 via the electrical position coordinate phase number, and moved to the pre-control letter. Signal, number, L4b, initial movement 43a mirror 43 a -23- 201236790 The control device 60 sends a trigger signal to the laser light source 40, and sequentially applies a relatively low frequency control signal to the A OD42, and the frequency is relatively high. The control signal cuts the laser pulse L4a from the laser pulse L4 to the optical path A, and cuts out the laser pulse L4b toward the optical path B. The laser pulses L4a, L4b are incident on the processed position of the Y coordinate of the workpiece 30. The current mirrors 43a, 43b, 44 are moved at a predetermined timing by the control of the control device 60 to be incident on a predetermined processed position. A laser pulse L5 a, L5b ο sends a stationary signal from the completed current mirrors 43b, 43a, 44 to the control device 60, but the time at which the incident position of the next laser pulse L5 a, L5b is completed is from the exit. When the timing of the preceding laser pulse L4 does not pass the time of the shortest period of time during which the laser pulse can be emitted, the control device 60 emits the laser pulse L5 after the elapse of the shortest period of time, and successively applies the frequency to the AOD42. The control signal having a relatively low control signal and a relatively high frequency cuts out the laser pulse L5a from the laser pulse L5 to the optical path A, and cuts out the laser pulse L5b toward the optical path B. The laser pulses L5a, L5b are incident on the workpiece at the same position as the Y coordinate of the workpiece 30. The current mirrors 43a, 43b, 44 are moved at a predetermined timing by the control of the control means 60 to inject the next laser pulses L6a, L6b to the predetermined processed position. The laser pulse L6 is emitted after the current mirrors 43b, 44 are stationary and the current mirror 43a is stopped. Control device 60 receives the stationary signal of the slowest current mirror 43a and transmits a trigger signal to the laser source 40. The control device 60 sends a trigger signal to the laser light source 40, and sequentially applies a relatively low-frequency control signal and a relatively high-frequency control signal to the -24 - 201236790 AOD42, and cuts out the laser pulse A from the laser pulse A. The laser pulse L6a cuts out the laser pulse L6b toward the optical path B. The laser pulses L6a, L6b are incident on the workpiece to be processed at the Y coordinate of the workpiece 30. The current mirror 4 3 a ends the application of a relatively low frequency control signal and opens, and the current mirror 43b ends the application of a relatively high frequency control signal and starts moving. The current mirror 44 also maintains a static state after the incident laser pulse L6b. This is because the Y coordinates based on the added position of the next laser pulses L7a, L7b are equal to the coordinates of the processed position Y based on the laser pulses L6a, L6b. The laser pulse L7 is emitted after the current mirrors 43a, 43b are at rest. The laser pulse L7a cut out from the optical path A by the AOD 42 is incident on the processed position on the workpiece 30 via the stationary current mirrors 43a, 44. The laser pulse L7b cut out by the path B is incident on the workpiece at the workpiece 30 via the current mirror 43b in the stationary state. In the present example, the current mirror 44 is in a state of being stopped from the time when the laser pulse L6 is emitted until the end of the laser beam L7, but the X coordinate based on the processed position of the laser pulse L7a and the laser pulse L6a are added. When the X coordinates of the position are equal, the control for not moving the current mirror 43a is performed, and when the X coordinate of the processed position based on the laser pulse L7b is equal to the X coordinate of the processed position of the base laser pulse L6b, Control of moving the flow mirror 43b. Thus, when the X coordinate or the Y coordinate based on the processing position of the next laser pulse is equal, it is possible to prevent any of the currents 43a, 43b, 44 from being shifted or not to bother the start of the current mirror 43a, 43b. The 44-pulse work of the light is controlled by the mirror -25-201236790. According to the laser processing method of the second embodiment, the laser pulses of the pulsed laser beam 80 emitted from the laser light source 40 are time-distributed in two directions (the optical path A and the optical path B) which are different from each other. According to the laser processing method of the second embodiment, it is possible to inject 2 lightning into the machinable range of a square region having a side of 50 mm with a time difference applied to the AOD 42 only when the control signal having a relatively low frequency is applied. The pulse is shot, so the processing speed can be increased. However, in the laser processing method according to the first embodiment, for example, the laser beam is emitted in a state where one of the current mirrors 43a and 43b and the current mirror 44 are stationary, but in the second embodiment, three current mirrors are used. Since the laser pulses are emitted in a state where all of 43a, 43b, and 44 are stationary, there is a possibility that the processing speed becomes slower than that of the first embodiment. Fig. 4 is a timing chart showing a laser processing method based on the third embodiment. The laser processing method according to the third embodiment is implemented by using the laser processing apparatus according to the first embodiment and based on the control of the manufacturing apparatus 60. The horizontal axis of the timing chart and the vertical axis of each segment are equal to the horizontal and vertical axes in the timing chart shown in Fig. 3. In the laser processing method according to the second embodiment, a control signal having a relatively low frequency and a relatively high frequency control signal are sequentially applied to the AOD 42, and laser pulses L1 L L7a and Ray are used from all the laser pulses L1 to L7. The sequence of the shot pulses L1 b to L7b cuts out the laser pulses to the optical paths A and B. In the laser processing method according to the third embodiment, the current mirrors 43a, 43b which are incident on the laser beam at the processed position at a relatively large distance between the current and the next processed position are first cut. Control of the laser pulse. -26- 201236790 The laser pulse L 1 is emitted after the current mirrors 4 4, 4 3 a are stationary and the current mirror 4 3 b is stationary. When the positions of the incident positions of the laser pulses L 1 a, L 1 b are respectively terminated in the X-axis direction, the current mirrors 4 3 a, 4 3 b send a current still signal to the control device 60. When the position of the incident positions of the laser pulses L 1 a and L 1 b is completed in the Y-axis direction, the current mirror 4 4 sends a current still signal to the control unit 60. After receiving the current stationary signal from the current mirrors 4 3 a, 4 3 b, and 4 4, the control device 60 transmits a trigger signal to the laser light source 40. The laser light source 40 emits a laser pulse L1. The control device 60 determines the distance between the processed position of the incident laser pulse LI a and the processed position of the next incident laser pulse L2a and the processed position of the incident laser pulse L 1 b and the next incident. The distance between the processed positions of the laser pulses L2b is such that the laser pulses of the current processed position at which the laser pulses LI a and Lib are incident to a distance from the next processed position are incident first. To the workpiece 3 0. In the laser processing of the timing chart shown in Fig. 4, the distance between the processed position of the incident laser pulse L 1 a and the processed position of the incident laser pulse L2a is larger than the incident laser pulse L 1 b is processed. The distance between the position and the processed position of the incident laser pulse L2b. Therefore, the control device 60 transmits a trigger signal to the laser light source 40, and continuously applies the AOD 42 by applying a control signal having a relatively low frequency first and then applying a control signal having a relatively high frequency. The laser pulse L 1 incident on the AOD 42 during the application of the relatively low frequency control signal is time-divided to generate a laser pulse L 1 a that advances on the optical path A. Further, the laser pulse L1 which is incident on the AOD 42 during the application of the relatively high frequency control signal is time-divided to generate the forward laser pulse L 1 b on the optical path B. The laser pulse L 1 a is incident on the processed position of the workpiece 30 via the current mirror 43 3 a, the current mirror 44 and the f0 lens 45. Further, the laser pulse Lib is incident on the processed position of the workpiece 30 via the current mirror 43b, the current mirror 44, and the f0 lens 45. The Y coordinate of the processed laser pulse L1 a is equal to the γ coordinate of the processed position of the incident laser pulse Lib. The control means 60 ends the application of the control signal having a relatively low frequency, and transmits a control signal for positioning the current mirror 43a to inject the next laser pulse L2a to the predetermined processed position. The current mirror 43a receives control from the control unit 60. The signal is started to move before the incident laser pulse L 1 b is finished. Further, the control device 60 ends the application of the control signal having a relatively high frequency, and transmits a control signal for positioning the current mirrors 43b, 44 so as to respectively inject the next laser pulse L2b, L2a to the predetermined processed position. And L2b » current mirrors 43b, 44 receive control signals from control device 60 and begin to move. The laser pulse L2 is emitted after the current mirrors 43b, 44 are stationary and the current mirror 43a is stopped. A current stationary signal is transmitted from each of the current mirrors 43a, 43b, 44 to the control device 60, and the control device 60 receives the stationary signal of the static mirror 49a which is the slowest, and transmits a trigger signal to the laser light source 40 to emit the laser pulse L2. The distance between the processed position of the incident laser pulse L2b and the processed position of the incident laser pulse L3b is greater than the processed position of the incident laser pulse L 2 a and the processed position of the incident laser pulse L 3 a distance. Therefore, the control device 60 transmits a trigger signal to the laser light source 40, and the AOD 42 is continuously applied in such a manner that the control signal having a relatively high frequency is applied first and then the control signal having a lower frequency is applied. The laser pulses L2b generated by the laser pulse B which are incident on the optical path B during the application of the relatively high frequency control signal are incident on the workpiece 30 by the flow mirrors 43b, 44 and the f0 lens 45. Further, the laser pulse generated by the laser pulse A divided by the laser pulse A of the laser pulse A2 of the AOD 42 during the application of the relatively low frequency control signal is incident on the workpiece 30 through the current mirrors 43a, 44 and the ίθ lens 45. The coordinates of the processed bits of the incident two laser pulses L2b, L2a are equal. The control device 60 ends the application of a control signal having a relatively high frequency and transmits a control signal for positioning the current mirror 43b to be incident on the next laser pulse L3b at a predetermined processed position, and the current mirror 43b receiving the number ends. The incident laser pulse L2a is started before, and the control device 60 ends the control of applying the relatively low frequency and sends a control signal for the current mirrors 43a, 44 to be positioned to respectively inject the next laser to the predetermined processed position. The pulses L3a and L3b, the current mirrors 43a, 44 receiving the control signal, and the laser pulse L3 are emitted after the current mirrors 43a, 43b are stationary and the current is stopped. From each of the current mirrors 43a, 43b, 44 to the control | send current stationary signal, the control device 60 receives the stationary signal of the slowest 44 and transmits a trigger signal to the laser source 40 and the rate of incidence relative to the AOD 42 is incident to the rush through the electrical position. The Y number of L2 a is added and moves to the pre-control letter. Signal, number, to L3a, start to move; 44 static to set 60 current mirror, laser -29 - 201236790 Light source 40 emits laser pulse L3 according to the trigger signal. The control device 60 transmits a trigger signal to the laser light source 40, and the AOD 42 sequentially applies a control signal having a relatively low frequency of the port and a control signal having a higher frequency. This is because the distance between the position of the incident laser pulse L3a and the processed position of the incident laser pulse L4a is the distance between the processed position of the laser pulse L3b and the position of the incident laser pulse L4b. From the laser pulse A generated during the application of the relatively low frequency control signal, the laser pulse L3 is generated along the optical path A. The flow mirrors 43a, 44 and the f0 lens 45 are incident on the workpiece 30, from the applied frequency. The laser pulse L3b generated by the laser pulse L3 incident on the relatively high control signal during the period of the control signal is incident on the workpiece 30 by the flow mirrors 43b, 44 and the f0 lens 45. The Y of the processed position of the two laser pulses L 3 a, L 3 b is incident. The control device 60 ends the application of the control signal having a relatively low frequency and transmits a control signal for positioning the current mirror 43a to be incident on the next laser pulse L4a at the predetermined processed position, and the current mirror 43a receiving the number ends. The incident laser pulse L3b is started before, and the control device 60 ends the control of applying the relatively high frequency and sends a control signal for the current mirrors 43b, 44 to be positioned to respectively inject the next laser pulse L4a to the predetermined processed position. And L4b, the current mirrors 43b, 44 receiving the control signal are turned on and the pair ratio is processed to be larger than the added AOD42 via the electrician position AOD42 via the electrician position coordinate phase number, and then moved to the pre-control letter. Signal, No., L4b, start movement 201236790 The laser pulse L4 is emitted after the current mirrors 44, 43b are stationary and the current mirror 43a is stopped. Control device 60 receives the stationary signal of the slowest current mirror 43a and transmits a trigger signal to laser source 40. The control device 60 sends a trigger signal to the laser light source 40, and continuously applies a relatively low control signal to the AOD 42 and a relatively high frequency control signal, and sequentially cuts the laser pulse from the laser pulse L4 to the optical path A. L4a, the laser pulse L4b is cut out to the optical path B. This is because the distance between the processed position of the incident laser pulse L4a and the processed position of the incident laser pulse L5a is larger than the processed position of the incident laser pulse L4b and the processed position of the incident laser pulse L5b. the distance. The laser pulses L4a, L4b are incident on the workpiece at the same position as the Y coordinate of the workpiece 30. The current mirrors 43a, 43b, 44 start to move at a predetermined timing by the control of the control means 60 to inject the next laser pulses L5a, L5b + 〇 from the completed processed current mirrors 43b, 43a, 44 to the predetermined processed position. The stationary signal is transmitted to the control device 60, but the time at which the incident position of the next laser pulse L5a, L5b is completed is the shortest period of time from which the laser pulse L4 is emitted before the laser pulse L4 is emitted. At the time of time, the control device 60 emits the laser pulse L5 after the elapse of the shortest period of time, and continuously applies a relatively low frequency control signal, a relatively high frequency control signal to the AOD 42, and sequentially from the laser pulse L5. The laser pulse L5a is cut out from the optical path A, and the laser pulse L5b is cut out toward the optical path B. This is because the distance between the processed position of the incident laser pulse L5a and the processed position of the incident laser pulse L6a is greater than the -31 - 201236790 processing position of the incident laser pulse L5b and the incident laser pulse L5b. The distance between the machining positions. The laser pulses L5a, L5b are incident on the workpiece at the same position as the Y coordinate of the workpiece 30. The current mirrors 43a, 43b, 44 are moved at a predetermined timing by the control of the control means 60 to inject the next laser pulses L6a, L6b to the predetermined processed position. The laser pulse L6 is emitted after the current mirrors 43b, 44 are stationary and the current mirror 43a is stopped. Control device 60 receives the stationary signal of the slowest current mirror 43a and transmits a trigger signal to the laser source 40. The control device 60 sends a trigger signal to the laser light source 40, and continuously applies a relatively high control signal to the AOD 42 and a relatively low frequency control signal, and sequentially from the laser pulse L. 6 Cut out the laser pulse L6b toward the optical path, and cut out the laser pulse L6a toward the optical path. This is because the distance between the processed position of the incident laser pulse L6b and the processed position of the incident laser pulse L7b is larger than the processed position of the incident laser pulse L6a and the processed position of the incident laser pulse L7a. distance. The laser pulses L6b, L6a are incident on the workpiece position at which the Y coordinate of the workpiece 30 is equal. The current mirror 43b ends the application of a relatively high frequency control signal and starts to move. The current mirror 43a ends the application of a relatively low frequency control signal and starts moving. . The current mirror 44 also maintains a stationary state after the incident laser pulse L6a. At this time, the Y coordinates based on the processed positions of the laser pulses L7a and L7b are equal to the Y coordinates of the processed positions based on the laser pulses L6a and L6b. The laser pulse L7 is emitted after the current mirrors 43a, 43b are at rest. Since the distance between the processed position of the incident laser pulse L7b and the processed position of the incident laser pulse L8b of -32 - 201236790 is larger than the processed position of the incident laser pulse L7a and the processed position of the incident laser pulse L8a Therefore, the AOD42 sequentially applies a relatively high control signal and a relatively low frequency control signal. The laser pulse L7b cut out to the optical path B enters the processed position on the workpiece 30 via the current mirrors 43b, 44 in the stationary state. The laser pulse L7a cut out to the optical path A is incident on the processed position on the workpiece 30 via the current mirrors 43a, 44 in the stationary state. According to the laser processing method of the third embodiment, first, the laser pulse of the current machining position that is incident to the next machining position is incident on the workpiece 30, and is first moved. The movement of the current mirror having a long time (positioning time) enables processing at a higher speed than in the second embodiment. Further, for example, the distance between the processed positions of the laser pulses LIa, L2a incident through the current mirror 43a is equal to the distance between the processed positions of the laser pulses L1b, L2b incident through the current mirror 43b, and When the movement times of the current mirrors 43a and 43b are equal to each other, either one of the laser pulses L1a and L1b may be incident on the workpiece 30 first. Fig. 5 is a view showing a laser processing apparatus based on the second embodiment. The laser processing apparatus according to the second embodiment does not have the AOD 42 that selectively distributes the pulsed laser beam 80 to the optical path A or the optical path B, but has a bifurcated (energy splitting) laser pulse and simultaneously approaches the optical path A and the optical path. The polarization beam splitter 46 assigned by B is different from the laser processing apparatus according to the first embodiment. The polarizing beam splitter 46 transmits a portion of the beam 80 of the pulse Ray-33-201236790 emitted from the laser source 40, for example, half and advances it along the optical path A, reflecting the remaining portion and causing it to follow the optical path B. . The pulsed laser beams 80a' 80b advancing on the optical paths A, B are respectively reflected by the folding mirrors 47a, 47b fixedly arranged as needed and incident on the current mirrors 43a, 43b, and the current mirrors 43a, 43b and the current mirror 44 are directed to the X-axis. The direction and the Y-axis direction (two-dimensional direction) change the emission direction, and are collected by the ίθ lens 45, and then incident on the processed position of the workpiece 30. The pulse energy and the peak power of the pulsed laser beams 80a, 80b incident on the workpiece 30 are, for example, half of that of the laser processing apparatus according to the first embodiment. Fig. 6 is a timing chart showing a laser processing method based on the fourth embodiment. The laser processing method based on the fourth embodiment is carried out by using the laser processing apparatus according to the second embodiment and based on the control of the control unit 60. The horizontal axis of the timing chart and the vertical axis of each segment are equal to the horizontal axis and the vertical axis corresponding to the timing chart shown in Fig. 2. In the figure, the respective laser pulses of the pulsed laser beam 80 emitted from the laser light source 40 are expressed as laser pulses L1 to L7 in the order of emission. Further, the laser pulses after the laser beams L1 to L7 are branched by the polarization beam splitter 46 to the optical paths A and B (energy division) are shown as laser pulses L1a to L7a and Lib to L7b, respectively. The laser pulse L1 is emitted after the current mirrors 44, 43a are stationary and the current mirror 43b is stopped. When the positions of the incident positions of the laser pulses L 1 a, L 1 b are respectively terminated in the X-axis direction, the current mirrors 43a, 43b transmit a current still signal to the control device 60. When the positioning of the incident positions of the laser pulses L 1 a and L 1 b is completed in the Y-axis direction, the current mirror 44 transmits a current still signal to the control device 60. The control device 60 receives the current still signal from the current mirrors 43a, 43b, 44 s -34 - 201236790 (while receiving the stationary signal from the slowest current mirror 4 3 b), and sends a trigger signal to the laser source 40, The laser light source 40 emits a laser pulse L 1 in accordance with the trigger signal. The laser pulse L! is divided by the polarization beam splitter 46 into a laser pulse Lla that advances on the optical path A and a laser pulse Lib that advances on the optical path B. The laser pulses L1a, Lib pass through the current mirrors 43a, 43b, respectively. The current mirror 44 is simultaneously incident on the processed position where the Y coordinate of the workpiece 30 is equal. After the end of the ejection of the laser pulse L1, the control unit 60 transmits control signals for positioning the current mirrors 43a, 43b, 44, respectively, to inject the laser pulses to the next processed position. The current mirrors 43a' 43b, 44 receive control signals from the control device 60 and begin to move. The laser pulse L2 is emitted after the current mirrors 43b, 44 are stationary and the current mirror 43a is stopped. The laser pulse L2 is divided into laser pulses L2a, L2b advancing on the optical paths A, B by the polarization beam splitter 46, and each of the laser pulses L2a, L2b is simultaneously incident on the workpiece 3 via the current mirrors 43a, 43b and the current mirror 44. The Y coordinate of 0 is equal to the processed position. After the exit of the laser pulse L2, the control device 60 sends a control signal for the new positioning to the current mirrors 4 3 a, 4 3 b, and 4 4 to inject the laser pulse to the next processed position. 43 a, 43b, 44 receive the control signal from the control device 60 and start moving. The laser pulse L3 is emitted after the current mirrors 43a, 43b are stationary and the current mirror 44 is stopped. The laser pulses L3 are distributed by the polarization beam splitters 46 to the optical paths A, B. The laser pulses L3a, L3b are simultaneously incident on the Y coordinate of the workpiece 30 via the current mirrors 43a, 43b and the current mirror 44, respectively. -35- 201236790 Location. After the end of the ejection of the laser pulse L3, the control device 60 transmits a control signal for causing a new positioning to the current mirrors 43a, 43b, 44, respectively, to inject a laser pulse to the next processed position, the current mirrors 43a, 43b, 44 A control signal from the control device 60 is received and movement begins. The laser pulse L4 is emitted in accordance with a trigger signal from the control device 60 that receives the stationary signals of the current mirrors 44, 43b, 43a, and is divided into laser pulses L4a, L4b by the polarization beam splitter 46. The laser pulses L4a, L4b are simultaneously incident to the processed position of the workpiece 30 equal to the Y coordinate via the current mirrors 43a, 43b and the current mirror 44, respectively. After the ejection of the laser pulse L4 is finished, the current mirrors 43a, 43b, 44 start to move. The positioning means control unit 60 based on the incident position of the laser pulses of the current mirrors 43a, 43b, 44 is completed to receive the stationary signals from the current mirrors 43a, 43b, 44. However, the time at which the positioning of the current mirrors 4 3 a, 4 3 b, 44 is completed is the time from the time when the laser pulse L4 is emitted, and the time period of the shortest period of time during which the laser pulse can be emitted is not passed. Therefore, the laser pulse L5 It is emitted after the elapse of the shortest period of time. The laser pulse L5 is divided into laser pulses L5a, L5b by the polarization beam splitter 46, and the laser pulses L5a, L5b are simultaneously incident on the Y of the workpiece 30 via the current mirrors 4 3 a, 4 3 b and the current mirror 4 4, respectively. The coordinates are equal to the processed position. After the end of the ejection of the laser pulse L5, the current mirrors 43a, 43b, 44 start to move. The laser pulse L6 is emitted after the control device 60 receives the still signal from the current mirrors 43b, 44, 43a, and the laser pulse L6a, L6b divided by the polarized beam splitter 46 via the current mirror 43a, 201236790 43b, respectively. And the current mirror 44 is simultaneously incident on the workpiece where the Y coordinate of the workpiece 30 is equal. After the ejection of the laser pulse L6 is completed, the current mirrors 43a, 43b are activated. Current mirror 44 remains stationary. This is because the Y coordinate based on the processed position of the next shot pulses L7a, L7b is equal to the Y coordinate based on the processed position of the lasers L6a, L6b. The laser pulse L7 is emitted by the polarization beam splitter 46 after the current mirrors 43a, 43b are stationary. The laser pulses L7a, L7b divided by the flow mirrors 43a, 43b and the current mirror 44 are simultaneously incident on the Y of the workpiece 30. Processing position. After the end of the ejection of the laser pulse L7, the electric power 43a, 43b, 44 starts to move. .  In the present example, the current mirror 44 is in a state of being stopped from the time when the laser pulse L6 is emitted until the end of the lightning strike L7, but the X coordinate based on the processed position of the laser beam L7a and the position X based on the laser pulse L6a. When the coordinates are equal, the control of not moving the current mirror 43a is performed, and when the X coordinate of the processed position based on the laser pulse L7b is equal to the X coordinate of the processed position of the laser pulse L6b, the movement of the non-flowing mirror 43b is performed. control. Thus, when the X coordinate or the Y coordinate based on the processing position of the next laser pulse is equal, it is possible to perform control such that none of the electric powers 43a, 43b, 44 or the double motion of the current mirrors 4 3 a, 4 3 b is not performed. . According to the laser processing method of the fourth embodiment, it is possible to simultaneously inject two pulses into the processable range of a square region having an edge of 50 mm, so that the processing speed can be increased. However, when a lightning pulse is added based on the first real motion, it is processed by a pulse lens of the electric coordinate lens. In the laser processing method of shifting the mirror of the electric current to a laser, as in a laser application example, 37-201236790, for example, a laser pulse is emitted in a state in which one of the current mirrors 43a and 43b is stationary with the current mirror 44, but based on In the laser processing method of the fourth embodiment, since the laser pulses are emitted in a state where all of the three current mirrors 43a, 43b, and 44 are stationary, the processing speed may become slower than that of the first embodiment. Fig. 7 is a view showing a laser processing apparatus based on the third embodiment. Simultaneous processing of two workpieces 31, 32 is performed by the laser processing apparatus according to the third embodiment. The workpieces 31, 32 are, for example, the same printed substrate as the workpiece 30. The distribution optical system 48 is an AOD, a polarization beam splitter or the like which can selectively or simultaneously distribute the incident laser beam 80 to optical systems of two optical paths A and B which are different from each other. By distributing the optical system 48. The pulsed laser beam 80a assigned to the optical path A is incident on the processed position of the workpiece 31 via the current mirrors 43a, 44 and the f0 lens 45, and the workpiece 31 is bored. The pulsed laser beam 8〇b distributed to the optical path B by the distribution optical system 48 is incident on the processed position of the workpiece 32 via the current mirrors 43b and 44 and the fe lens 45, and the drilling of the workpiece 32 is performed. The machining mode (hole mode) of the workpieces 3 1 and 3 2 may be equal or different. The laser processing apparatus according to the third embodiment can perform high-speed drilling processing on two workpieces 3 1 and 3 2 by, for example, the laser processing methods according to the first to fourth embodiments. Fig. 8 is a view showing a laser processing apparatus based on the fourth embodiment. The laser processing apparatuses according to the first to third embodiments are 1 f0 and 2-axis laser processing apparatuses including three current mirrors 43a, 43b, and 44 and an f0 lens 45 and processed by two machining axes. The laser processing apparatus according to the fourth embodiment is a 2 f0, 4-axis laser processing apparatus having two sets of 2 - 38 - 201236790 shaft processing sections including three current mirrors and a fe lens, according to the control device 60. The pulsed laser beam 80 from which the trigger signal is emitted from the laser light source 40 is shaped into a cross-sectional shape by passing through the light-transmitting region of the mask 41, and is incident on the AOD 42. The control device 60 can apply the control signals of the four frequencies α to 6 which are different from each other to the AOD 42 to sequentially distribute the pulsed laser beam 80 to the optical paths Α to D from the side where the deflection angle is small. In the figure, the laser beams advanced on the optical paths A to D are shown as pulsed laser beams 81a, 81b, 82a, and 82b, respectively. In addition, from the side with the smaller frequency, it is α, 泠, 7, and 5. After the pulsed laser beams 81a, 81b, 82a, 82b are incident on the current mirrors 51a, 51b, 54a, 54b and deflected, respectively, the pulsed laser beams 81a, 81b are incident on the carrier by the current mirror 52 and the f0 lens 53. The workpiece 33 of the stage 71, the pulsed laser beams 82a and 82b are incident on the workpiece 34 held by the stage 72 via the current mirror 55 and the ίθ lens 56. The stages 71, 72 are, for example, a load stage. The workpieces 33, 34 are, for example, the same printed substrate as the workpiece 30. The current mirrors 51a and 54a, the current mirrors 51b and 54b, the current mirrors 52 and 55, and the f 0 lenses 53 and 56 are respectively connected to the current mirror 43 a of the first to third embodiments, the current mirror 4 3 b, and the current mirror 44. The f 0 lens 45 corresponds to and has the same function. By the incident pulsed laser beams 81a, 81b, 82a, and 82b, holes having shapes corresponding to the shape of the light-transmitting region of the mask 41 are formed on the workpieces 33, 34. Fig. 9 is a view showing the timing of the laser processing method based on the fifth embodiment - 39 - 201236790. The laser processing method based on the fifth embodiment is carried out using the laser processing apparatus according to the fourth embodiment and based on the control of the control unit 60. The horizontal axis of the timing chart and the vertical axis of each segment are equal to the horizontal and vertical axes of the timing chart shown in Fig. 2. In the figure, the laser pulses of the pulsed laser beam 80 emitted from the laser light source 40 are expressed as laser pulses L1 to L8 in the order of emission. In the laser processing method according to the fifth embodiment, the laser beam which is advanced on any two optical paths of the optical paths A to D is generated by time division from the respective laser pulses Ln (n = 1 to 8) by the AOD 42. A part of the laser pulse Ln cut out to the optical paths A, B, and C' D is denoted as Lna, Lnb, Lnc, and Lnd, respectively. Pulses of 2 laser pulses cut out from each laser pulse Ln.  The widths are equal to each other, for example. In the fifth embodiment, as an example, two laser pulses are generated by time division from each of the laser pulses Ln, and one of them is incident on the processable range via the f0 lens 53, and the other is incident on the via lens 56. Processing range. Further, when one of the two is assigned to the optical path A (current mirror 51a), the other is assigned to the optical path C (current mirror 54a), and when one of them is assigned to the optical path B (current mirror 5 1 b ), the other is assigned to Optical path D (current mirror 54b). The laser pulse L 1 is emitted after the current mirrors 5 5, 5 2, 5 1 a are stationary and the current mirror 5 4 a is at rest. If the positions of the incident positions of the laser pulses L 1 a, L 1 c are respectively terminated in the X-axis direction, the current mirrors 5 1 a, 54a transmit a current still signal to the control device 60. If the laser pulses LI a, LI are respectively ended When the incident position of c is positioned along the Y-axis direction, the current mirrors 5, 5 5 send a current still signal to the control unit -40 - 201236790. Control device 60 receives the current still signal from the slowest stationary current mirror 54a and transmits a trigger signal to laser source 40. The laser light source 40 emits a laser pulse L1. The control device 60 transmits a trigger signal to the laser light source 40, and continuously applies a control signal for the port frequency α and a control signal for the frequency to the AOD 42 in sequence. The application of the control signal of the frequency r is released, for example, at the same time as the end of the ejection of the laser pulse L1. In addition, in the figure, a control signal having a relatively low frequency is applied while starting to emit all of the laser pulses L1 to L8, and the control signal having a relatively high frequency is released while the emission is ended. However, the start and release of the control signal application are performed. It is not always necessary to coincide with the start of emission and the end of emission of the laser pulses L1 to L8. The laser pulse L1 incident on the AOD 42 during the control signal of the application frequency α is time-divided to generate a laser pulse L1 a which advances on the optical path. Further, the laser pulse u incident on the AOD 42 during the control signal applied with the frequency τ is time-divided to generate the laser pulse L 1 c advancing on the optical path C. The laser pulse L 1 a is incident on the processed position of the workpiece 33 via the current mirror 5 1 a, the current mirror 5 2 and the ίθ lens 53. Further, the laser pulse Lie is incident on the processed position of the workpiece 34 via the current mirror 54a, the current mirror 55, and the lens 56. The control device 60 ends the control signal for applying the frequency α, and transmits a control signal for positioning the current mirrors 51a, 52. The current mirrors 5 1 a , 52 receive control signals from the control unit 60 and begin to move before the incident laser pulses L1 c are finished. Further, the control device 60 ends the control signal for applying the frequency T of -41 - 201236790, and transmits a control signal for positioning the current mirrors 54a, 55. The current mirrors 54a, 55 receive control signals from the control unit 60 and begin to move. The current mirrors 51b and 54b that are not incident on the laser pulses L1a and Lie generated from the laser pulse L1 move while irradiating the workpieces 33 and 34 with the laser pulses L1a and L1c. The laser pulse L2 is emitted after the current mirrors 5 5, 5 1 b, 5 2 are stationary and the current mirror 54b is at rest. A current stationary signal is transmitted from each of the current mirrors 55, 51b, 52, 54b to the control device 60, and the control device 60 receives the stationary signal of the stationary still current mirror 54b and transmits a trigger signal to the laser source 40. The laser light source 40 emits a laser pulse L2. The control device 60 transmits a trigger signal to the laser light source 40, and sequentially applies a control signal of [] frequency 、 and a control signal of frequency 5 to the AOD 42 in sequence. The laser pulse L2b generated by the laser beam B divided into the laser beam B during the control signal applied with the frequency yS is incident on the workpiece 33 at the processed position via the current mirrors 5 1b, 52 and the f0 lens 53. Further, the laser pulse L2d generated by dividing the laser pulse D2 incident on the optical path D during the application of the control signal of the frequency 5 is incident on the processed position of the workpiece 34 via the current mirrors 54b, 55 and the f0 lens 56. The control device 60 ends the control signal for applying the frequency ,, and transmits a control signal for positioning the current mirrors 5 1 b, 5 2 , and the current mirrors 5 lb, 52 receiving the control signals start before the incident laser pulse L2d is finished. mobile. Further, the control device 60 ends the control signal for applying the frequency (5, and transmits a control signal for positioning the current mirrors 54b, 55 to be positioned,

S -42- 201236790 The current mirrors 54b, 55 that receive the control signal start to move. The current mirrors 5 la and 54a that are not incident on the laser pulses L2b and L2d generated from the lightning pulse L2 illuminate the workpieces 3 3 and 34 with the laser pulses L2b and L2 (i period of movement). The laser pulse L3 is in the current mirror 51a. 54a, 55 are stationary and the current mirror is emitted after being stopped. A current stationary signal is sent from each of the current mirrors 51a, 54a, 55, 52 to the control device 60, and the control device 60 receives the stationary signal of the stationary slowest current mirror 52 and is directed to the laser. The light source 40 transmits a trigger signal, and the laser light source 40 emits the laser pulse L3 according to the trigger signal. The control device 60 transmits a trigger signal to the laser light source 40, and the AOD 42 sequentially applies a control signal of the frequency [α] and the control of the frequency r. The laser pulse L3 that is incident on the AOD 42 during the application of the control signal of the frequency α is incident on the workpiece 3 3 via the currents 5 1 a, 5 2 and the f 0 lens 53. The processing position is such that the laser pulse L3, which is incident on the optical path C during the application of the control signal of the frequency 7, is incident on the processed position of the workpiece 34 via the current mirror 54a and the f0 lens 56. 0 end application frequency The control signal of the rate α, and the convection mirrors 5 1 a, 5 2 send control signals for positioning, and the current mirrors 5 1 a, 5 2 receiving the control signals are moved before ending the incident laser pulse L 3 c . Then, the control device 60 ends the control signal for applying the frequency r and transmits a control signal for positioning the current mirrors 54a and 55, and the current mirrors 54a and 55 that receive the control signal start to move. The non-incident is generated from the lightning pulse L3. The current mirrors 51b, 54b of the laser pulses L3a, L3c are incident on the No. 52 system, and the laser beam is irradiated to the workpiece 3 3, 3 4 at the time of -43-201236790. During the period of L3 c. The laser pulse L 4 is emitted after the current mirrors 5 2, 5 1 b, 5 5 are stationary and the current mirror 54 b is stationary. The control device 60 receives the stationary signal of the static mirror 24 4b which is the slowest, And a trigger signal is sent to the laser light source 40. The control device 60 transmits a trigger signal to the laser light source 40, and sequentially applies a control signal of frequency 々 and a control signal of frequency 5 to the AOD 42 in sequence, and cuts out from the laser pulse L4 to the optical path B. Laser pulse L4b, light D cuts out the laser pulse L4d. The current mirrors 51b, 52, 54b, 55 start moving at a predetermined timing by the control of the control device 60. The current mirror 51a of the laser pulses L4b, L4d generated from the laser pulse L4 is not incident. 54a moves while irradiating the laser beams L4b and L4d to the workpieces 33 and 34. The stationary signals are transmitted from the current mirrors 5 1 a, 5 4 a, 5 2, 5 5 that have completed positioning to the control device 60, but are completed. The timing at which the incident position of the next laser pulse L5 a, L5 c is positioned is the time from the time when the laser pulse L4 before the exit is emitted does not pass the minimum period of time during which the laser pulse can be emitted, and therefore, the control device 60 After the elapse of the shortest period of time, the laser pulse L5 is emitted, and the control signal of the frequency α and the control signal of the frequency r are successively applied to the AOD 42 in sequence, and the laser pulse L5a is cut out from the laser pulse L5 to the optical path C to the optical path C. The laser pulse L5c is cut out. The current mirrors 51a, 52, 54a, 55 start to move at a predetermined timing by the control of the control unit 60. The current mirrors 51b and 54b that are not incident on the laser pulses L5a and L5c generated from the laser pulse L5 move while irradiating the workpieces 33 and 34 with the laser pulses L5a and L5c. The laser pulse L6 is emitted after the current mirrors 51b, 52, 55 are stationary and the current mirror sy - 44 - 201236790 5 4b is stationary. Control device 60 receives the stationary signal of the slowest stationary current 54b and transmits a trigger signal to laser source 40. The control device 60 transmits a trigger signal to the laser light source 40, and the AOD 42 sequentially applies a control signal of the frequency of the port/3 and a control number of the frequency 5, and cuts the laser pulse L6b from the laser pulse L6 to the optical path B to the light D. The laser pulse L6d is cut out. The laser pulses L6b, L6d are incident on the processed positions of the members 3 3, 34, respectively. The current mirror 5 1 b ends the application frequency; the control signal of 8 starts to move but the current mirror 52 remains stationary after the incident laser pulse L6b because the processing range is based on the f0 lens 53 assigned from the next laser pulse L7. The Y coordinate of the processed position of the laser pulse L7a is equal to the Y coordinate of the processed position of the base laser pulse L6b. The current mirror 54b 5 5 ends the application of the frequency (5 control signal and starts moving. The current mirrors 51a, 54a of the laser pulses L6b, L6d which are not incident from the lightning pulse L6 illuminate the workpieces 33, 34 with the laser pulses L6b, L6d The laser pulse L7 is emitted after the current mirrors 54a, 55, 51a are stationary. The laser pulse L7a cut out to the optical path A by the AOD 42 is incident on the workpiece 33 via the static current mirrors 51a, 52. The laser pulse L7c cut out by the optical path C is incident on the processed position on the member 34 via the current mirrors 54a, 55. The current mirrors 51a, 52, 54a, 55 are moved at a predetermined timing by the control of the manufacturing device 60. The current mirrors 51b and 54b that are not incident on the laser pulses L7a and L7c generated from the lightning pulse L7 move while the laser beams L7a and L7c are irradiated to the workpieces 33 and 34. The laser pulses L8 are stationary at the current mirrors 52, 55, 54a. The current mirror 5 mirror is emitted to the signal worker, and is emitted after the stationary control is shot at 1 a -45-201236790. After being distributed by the AOD42 to the optical paths A and C, the current is incident through the current mirrors 5 1 a and 54a respectively. To the predetermined processed position. In this period The current mirrors 5 1 b, 5 4b continue to move. The processing is continuously performed by the laser pulses of the current mirrors 5 1 a, 5 4a. In the laser processing method according to the fifth embodiment, when the laser pulse is emitted At least one of the current mirrors 51a, 51b, 54a, 54b on the optical paths A to D that are not distributed by the AOD 42 to the laser pulse is moved for positioning. For example, a laser pulse from the incident to the AOD 42 When two laser pulses generated by time division are distributed to the optical path A and the optical path C for processing, at least one of the current mirrors 5 1 b and 5 4b is moved to perform positioning of the subsequent laser pulse, from the incident to the incident. When one of the laser pulses of the AOD 42 is divided into two laser pulses generated by time division and distributed in the optical path B and the optical path D, at least one of the current mirrors 51a and 54a is moved to perform positioning of the subsequent laser pulse. Further, in the laser processing method according to the fifth embodiment, the peak power of each of the laser pulses irradiated to the workpieces 3 3 and 34 and the pulsed laser beam 8 emitted from the laser light source 40 are as follows. The peak power of 0 is equal. In the laser processing method according to the fifth embodiment, a control signal having a relatively low frequency and a relatively high frequency control signal are sequentially applied to the AOD 42. However, as in the laser processing method according to the third embodiment, the first direction may be The laser beam is cut out at the current machining position where the distance between the machining position and the next machining position is relatively large. In the laser machining method according to the fifth embodiment, the time is divided by time. The laser pulses L 1 to L8 are assigned to both the processable range of the f0 lens 53 and the machinable range of the S / -46 - 201236790 fe lens 56, but may also be the following laser processing method, that is, the laser is not divided by time. The shot pulses L 1 to L8 are selectively divided into one of the operable range of the fe lens 53 and one of the operable ranges of the f0 lens 56, that is, one of the optical paths A to D. At this time, when the laser beam is fired, the three current mirrors on the mirror side of the f0 that are not distributed by the AOD 42 and the light path of the unassigned laser pulse even though they are on the side of the fe At least one of the current mirrors 5 1 a, 5 1 b 5 4a, 5 4b moves for positioning. With the laser addition method (variation based on the laser processing method of the fifth embodiment), the pulse energy and the peak power of each laser pulse can be made with the pulsed laser beam 8 from the laser light source 40. The pulse energy and the peak power are equal to work. Fig. 10 is a view showing a sequence of a laser processing method based on the sixth embodiment. The laser processing method based on the sixth embodiment is carried out using a laser processing apparatus based on the fourth embodiment and based on the control of the control unit 60. The horizontal axis of the timing chart and the vertical axis of each segment are the same as the horizontal axis and the vertical axis of the time chart shown in Fig. 2. In the laser processing method according to the fifth embodiment, two laser pulses are generated by time division from each of the laser veins Ln, and one of them is incident on the processable range of the ίθ lens 53 and the other is incident on the f0. Through the processing range of 5.6, in the laser processing method according to the sixth embodiment, the two laser pulses generated by time division from each laser pulse Ln are selectively selected for each laser pulse Ln. The incident lens is incident on the processable range via f0 through 5 3, and the lens is provided by any of the workable ranges of the fe lens 56 to be applied to the lens by the mirror method -47-201236790. The laser pulse L 1 is emitted after the current mirrors 5 2, 5 1 a are stationary and the current mirror 5 1 b is stopped. When the positions of the incident positions of the laser pulses L 1 a, L 1 b are respectively terminated in the X-axis direction, the current mirrors 5 1 a, 5 1 b send a current still signal to the control device 60. When the position of the incident position of the laser pulses L 1 a, L 1 b is completed in the Y-axis direction, the current mirror 52 transmits a current still signal to the control device 60. The control device 60 receives the current still signal from the slowest current mirror 5 1 b and sends a trigger signal to the laser source 40. The laser light source 40 emits a laser pulse L1. The control device 60 transmits a trigger signal to the laser light source 40, and sequentially applies a control signal of the frequency α and a control signal of the frequency /3 to the AOD 42 in sequence. The application of the control signal of the frequency /3 is released, for example, at the same time as the end of the ejection of the laser pulse L1. The laser pulse L1 incident on the AOD 42 during the control signal applied with the frequency α is time-divided to generate a laser pulse L1a advancing on the optical path. Further, the laser pulse L1 incident on the AOD 42 during the application of the frequency control signal is time-divided to generate the laser pulse L 1 b advancing on the optical path B. The laser pulse L 1 a passes through the current mirror 5 1 a, the current mirror 5 2 and the fe lens 53 , and the laser pulse Lib is processed into the workpiece 33 via the current mirror 51 b , the current mirror 52 and the fe lens 53 respectively. position. The Y coordinates of the processed positions at which the two laser pulses L1a and Lib are incident are equal to each other. The control device 60 ends the control signal for applying the frequency α, and transmits a control signal for positioning the current mirror 51a. The current mirror 5 1 a receives -48- 201236790 a control signal from the control device 60 that begins to move before ending the incident laser pulse Lib. Further, the control device 60 ends the control signal to which the frequency /3 is applied, and transmits a control signal for positioning the current mirrors 5 1 b, 5 2 . Current mirrors 5 1 b, 52 receive control signals from control unit 60 and begin to move. The current mirrors 54a, 54b, 55 that are not incident on the laser pulses LIa and Lib generated from the laser pulse L1 move while irradiating the workpiece 33 with the laser pulses L1a, Lib. The laser pulse L2 is emitted after the current mirrors 55, 54a are stationary and the current mirror 54b is stopped. A current still signal is sent from each of the current mirrors 55, 54a, 54b to the control unit 60, and the control unit 60 receives the stationary signal of the slowest current mirror 54b and transmits a trigger signal to the laser source 40. The laser source 40 emits a laser pulse L2. The control device 60 transmits a trigger signal to the laser light source 40, and continuously applies a control signal for the port frequency r to the AOD 42 in sequence, and controls the frequency 5 for sulfur. The laser pulse L2 c generated by the laser pulse C2 incident on the optical path C during the application of the control signal of the frequency 7* is passed through the current mirrors 54a, 55 and the fe lens 56, and is controlled from the applied frequency "5". The laser pulse L2d generated by the laser pulse D2 incident on the optical path D during the signal period is incident on the processed position of the workpiece 34 via the current mirrors 54b and 55 and the f0 lens 56, respectively. The Y coordinates of the processed positions of the incident two laser pulses L2c, L2d are equal to each other. The control device 60 ends the control signal for applying the frequency r, and transmits a control signal for positioning the current mirror 54a, and the current mirror 54a receiving the control signal -49-201236790 starts moving before ending the incident laser pulse L2d. Further, the control device 60 ends the control signal for applying the frequency 5, and transmits a control signal for positioning the current mirrors 54b, 55, and the current mirror 54b' 55 receiving the control is started to move. The current mirrors 51a, 51b, 52 that are not incident on the laser pulses L2c, L2d generated from the laser pulse L2 move while irradiating the workpiece 34 with the laser pulses L2c, L2d. The laser pulse L 3 is emitted after the current mirrors 5 1 a, 5 1 b are stationary and the current mirror 52 is stationary. A current stationary signal is transmitted from each of the current mirrors 5 1 a, 5 1 b, and 5 2 to the control device 60, and the control device 60 receives the stationary signal of the slowest current mirror 52 and transmits a trigger signal to the laser light source 40. The laser light source 40 emits the laser pulse L3 in accordance with the trigger signal. The control device 60 transmits a trigger signal to the laser light source 40, and sequentially applies a control signal for the port frequency α and a frequency cold control signal to the AOD 42 in sequence. From the laser pulse L3 incident on the AOD 42 during the application of the control signal of the frequency α, the laser pulse L3 a generated along the optical path is divided by the current mirrors 5 1 a, 5 2 and the f0 lens 5 3 , and from the applied frequency 々 During the control signal, the laser pulse L3 incident on the AOD 42 is divided along the optical path B, and the laser pulse L3b is incident on the processed position of the workpiece 33 via the current mirrors 5 1 b, 5 2 and the f0 lens 53 respectively. The control device 60 ends the control signal for applying the frequency α, and transmits a control signal for positioning the current mirror 51a, and the current mirror 51a receiving the control signal starts moving before ending the incident laser pulse L3b. Further, the control device 60 ends the control signal for applying the frequency A, and transmits a control signal for positioning the electric-50-201236790 flow mirrors 5 1 b, 52, and the current mirrors 5 1 b, 52 receiving the control signal start to move. . The current mirrors 54a, 54b, 55 that are not incident on the laser pulses L3a, L3b generated from the laser pulse L3 move while irradiating the workpiece 33 with the laser pulses L3a, L3b. The laser pulse L4 is emitted after the current mirrors 55, 54a are stationary and the current mirror 54b is stopped. Control device 60 receives the stationary signal of the slowest current mirror 54b and transmits a trigger signal to laser source 40. The control device 60 transmits a trigger signal to the laser light source 40, and sequentially applies a control signal of frequency 7 and a control signal of frequency <5 to the AOD 42 in sequence, and cuts out the laser pulse L4c from the laser pulse L4 to the optical path C to the optical path D. The laser pulse L4 d is cut out. The current mirrors 5 4a, 5 4b, 5 5 start to move at a predetermined timing by the control of the control device 60. The current mirrors 51a, 51b, 52 that are not incident on the laser pulses L4c, L4d generated from the laser pulse L4 move while irradiating the workpiece 34 with the laser pulses L4c, L4d. The stationary signal is sent from the current mirrors 5 1 b, 5 2, 5 1 a that have completed positioning to the control device 60. However, since the position of the incident position of the next laser pulse L5a, L5b is completed, the lightning is emitted from the front. The timing at which the pulse L4 is emitted does not pass the time at which the shortest period of the laser pulse can be emitted. Therefore, the control device 60 emits the laser pulse L 5 after the elapse of the shortest period of time, and the pair Α Ο D 4 2 The control signal of the frequency α and the control signal of the frequency /3 are successively applied in sequence, the laser pulse L 5 a is cut out from the laser pulse L 5 to the optical path, and the laser pulse L 5 b is cut out to the optical path B. The current mirrors 5 1 a , 51b start to move at a predetermined timing by the control of the control unit 60, but the current mirror 52 maintains a stationary state of -51 - 201236790 even after the incident laser pulse L5b. This is because the Y coordinate of the workpiece to be processed when the laser beam L7b is incident on the current mirrors 5 1 a and 5 1 b is equal to the Y coordinate of the workpiece to be processed based on L5a and L5b. The current mirror 54a of the laser pulses L5a, L5b generated without the incident pulse L5 moves the laser pulse L6 while the current mirrors 55, 54a are stationary and currents during the irradiation of the laser pulses L5a, L5b to the workpiece 33; . Control device 60 receives the stationary signal that is the slowest static and transmits a trigger signal to laser source 40. The control device 60 transmits a trigger signal AOD42 to the laser light source 40, and sequentially applies a control signal of the frequency 、 frequency, frequency No. 5, and cuts the laser pulse L6c D from the laser pulse L6 to the optical path C to cut out the laser pulse L6d. The laser pulses L6c, L6d are the processed positions of the pieces 34, respectively. The current mirrors 54a, 54b, 55 start to shift the laser pulses 'L6c, L6d generated from the laser pulse L6 at a predetermined timing, and the laser pulse L7 during the irradiation of the laser pulses L6c, L6d to the workpiece 34 at the predetermined time. After the current mirror 5 1 b is stationary and the current mirror 5 1 is emitted. The laser pulse name cut out by the AOD 42 to the optical path A is from the static current mirrors 5 1 a, 52, and the optical path B pulse L7b is incident on the Y coordinate of the work via the current mirrors 5 1 b and 52 respectively. The position to be processed. The current mirrors 5 1 a, 5 1 b, and the control of the control device 60 start moving at a predetermined timing. The current mirrors 55 of the laser pulses L7a, L7b generated by the unshot pulse L7 are irradiated to the workpiece 33 during the irradiation of the laser pulses L7a, L7b: the pulse L7a, the laser pulse from the laser pulse _ 54b, 55 the mirror 54b static flow The mirror 54b and the pair of control signals are incident on the optical path to the working motion. The inflow mirror 5 1 a 1 moves. a stationary K L 7 a is removed from the lightning rods 54a, 54b by incidence. -52- 201236790 The laser pulse L8 is emitted after the current mirrors 52, 51b are stationary and the current mirror 51a is stationary, and is distributed to the predetermined path via the current mirrors 5 1 a, 5 1 b after being distributed to the optical paths A and B by the AOD 42 The device being processed. During this period, the current mirrors 5 4 a, 5 4 b continue to move. In the example shown in the figure, the current mirror 55 is stationary in the middle of the ejection of the laser pulse L8. The laser pulses L7, L8 are transmitted together to the processable range of the fe lens 53, and the processing of the processed device within the processable range of the ίθ lens 53 is continuously performed. For example, when the laser pulse L7 is emitted, at least one of the current mirrors 54a, 54b, 55 is moved, that is, when at least one of them is also moved when the laser pulse L8 is emitted, the laser pulses L7, L8 continue to be transmitted to the fe lens. The processable range of 53. In the laser processing method according to the sixth embodiment, at least one of the three current mirrors on the fe lens side where the laser pulse is not distributed by the AOD 42 is moved when the laser pulse is emitted. Therefore, the processing speed can be accelerated. Further, in the laser processing method according to the sixth embodiment, it is also possible to first cut out the laser toward the current processed position at a relatively large distance between the current processed position and the next processed position. pulse. The figure is a schematic view showing a laser processing apparatus based on the fifth embodiment. A laser processing apparatus according to a fifth embodiment includes a polarization beam splitter that splits (energy splits) a pulsed laser beam and is simultaneously distributed to two optical paths, and a pulse laser that is respectively disposed and distributed by the polarization beam splitter 2 AODs on the beam's light path. The two AODs can selectively distribute the incident pulsed laser beams to each of the two optical paths for each laser pulse or distribute them to each other with a small time difference. The polarizing beam splitting-53-201236790 and two A O D are included to form a distribution optical system capable of distributing pulsed laser beams in four directions. The pulsed laser beam 80 emitted from the laser light source 40 is incident on the polarization beam splitter 46 through the light transmitting region of the mask 41. The polarized beam splitter 46 reflects a portion of the pulsed laser beam 80 emerging from the laser source 40, for example, half and advances it along the optical path A, transmitting the remaining portion and advancing along the optical path B. The pulsed laser beams 80A, 80B advancing on the optical paths A, B are incident on the AODs 42a, 42b, respectively. The AOD 42a is capable of distributing the pulsed laser beam 80A to the optical path Aa and the optical path Ab. When assigned to the optical path Aa, a relatively low frequency control signal is applied to the AOD 42a, and when assigned to the optical path Ab, a relatively high frequency control signal is applied. A 〇 D 42b can distribute the pulsed laser beam 80B to the optical path Ba and the optical path Bb. When assigned to the optical path Ba, a relatively low frequency control signal is applied to the AOD 42b, and when assigned to the optical path Bb, a relatively high frequency control signal is applied. The pulsed laser beams advanced on the optical paths Aa, Ab, Ba, Bb are labeled as pulsed laser beams 80Aa, 80Ab, 80Ba, 80Bb, respectively. The pulsed laser beam 80Aa distributed to the optical path Aa by the AOD 42a is deflected by the current mirror 51a and the current mirror 52, and is collected by the f0 lens 53 to be incident on the workpiece 33 held by the stage 71. Similarly, the pulsed laser beam 8 OAb distributed to the optical path Ab by the AOD 42a is incident on the processed position of the workpiece 33 via the current mirrors 5 1b, 52, f0 lens 53. The pulsed laser beam 80Ba distributed to the optical path Ba by the AOD 42b is deflected by the current mirror 54a and the current mirror 55, and is condensed by the f0 lens 56 to be incident thereon.

St -54- 201236790 is held at the processed position of the workpiece 34 of the stage 72. Similarly, the pulsed laser beam 80Bb distributed to the optical path Bb by the AOD 42b is incident on the processed position of the workpiece 34 via the current mirrors 5 4b, 55 and the f0 lens 56. Fig. 12 is a timing chart showing a laser processing method based on the seventh embodiment. The laser processing method based on the seventh embodiment is carried out by using the laser processing apparatus according to the fifth embodiment and based on the control of the control unit 60. The horizontal axis of the timing chart and the vertical axis of each segment are the same as the horizontal axis in the timing chart shown in Fig. 2 and the vertical axis of each segment. In the figure, the respective laser pulses of the pulsed laser beam 80 emitted from the laser light source 40 are shown as laser pulses L1 to L8 in the order of emission. In the laser processing method according to the seventh embodiment, any of the optical paths Aa, Ab, Ba, Bb is generated from the respective laser pulses Ln (n = 1 to 8) by the polarization beam splitters 46 and AOD 42a' 42b. A laser pulse that advances on two light paths. A part of the laser pulse Ln advancing along the optical paths Aa, Ab, Ba, Bb is denoted as LnAa, LnAb, LnBa, LnBb, respectively. In the fifth embodiment, energy such as each laser pulse Ln is divided into two laser pulses, one of which is incident on the processable range via the f0 lens 53 and the other is incident on the machineable via the f0 lens 56. range. Further, when one of them is assigned to the optical path Aa (current mirror 5 1 a ), the other is assigned to the optical path Ba (current mirror 54 a ), and when one of them is assigned to the optical path Ab (current mirror 5 1 b ), the other is Assigned to the optical path Bb (current mirror 54b). The laser pulse L 1 is emitted after the current mirrors 5 5, 5 2, 5 4 a are stationary and the current mirror 5 1 a is at rest. Control device 60 receives the stationary signal of the slowest current mirror 5 1 a -55 - 201236790 and transmits a trigger signal to laser source 40. The laser source 40 receives the trigger signal and emits a laser pulse L1. Control device 60 sends a trigger signal to laser source 40 and applies a relatively low frequency control signal to AOD 42a, 42b. The laser pulses split by the polarized beam splitter 46 along the optical paths A and B and equally incident on the AODs 42a and 42b are distributed to the optical paths Aa and Ba, respectively. The laser pulse LI Aa is incident on the processed position of the workpiece 33 via the current mirrors 51a, 52, and the ίθ lens 53. The laser pulse LIBa is incident on the processed position of the workpiece 34 via the current mirrors 54a, 55 and the f0 lens 56. During the ejection of the laser pulse L1, the current mirrors 51b, 54b which are not incident on the laser pulses L1Aa, LIBa are moved. • The laser pulse L1 is emitted, and the control device 60 releases the control signal for the Α Ο D 4 2 a, 4 2 b, and sends the current mirrors 5 1 a, 5 2, 54 a, 55 to control the positioning. signal. The current mirrors 51a, 52, 54a, 55 receive control signals from the control device 60 and begin to move. The laser pulse L2 is emitted after the current mirrors 5 2, 5 5, 5 1 b are stationary and the current mirror 54 4 is at rest. The control unit 60 receives the still signal of the slowest stationary current mirror 54b, and transmits a trigger signal to the laser light source 40, and applies a relatively high frequency control signal to the AODs 42a and 42b. The laser pulses split by the polarization beam splitter 46 along the optical paths A and B and equally incident on the AODs 42a and 42b are distributed to the optical paths Ab and Bb, respectively. The laser pulse L2Ab is incident on the processed position of the workpiece 3 3 via the current mirrors 5 1 b, 5 2, f0 lens 53. The laser pulse L2Bb is incident on the processed position of the workpiece 34 via the current mirrors 54b, 55 and the f0 lens 56. During the ejection of the laser pulse L2, the current mirrors 51a, 54a of the non-incident laser pulses L2Ab, L2Bb are moved 201236790 pairs, 5 2 〇 52 phases are entered in pairs 5 2 phases are entered in pairs, and the laser pulses are emitted. At L2, the control device 60 cancels the AOD 42a and 42b urging port control signals, and transmits a control signal for positioning the current mirrors 5 lb, 52 5 4b, and 5 5 . The current mirrors 5 1 b, 54, 54 and 55 receive the control signal from the control unit 60 and start moving. The laser pulse L3 is emitted after the current mirrors 5 1 a, 54a, 55 are stationary, similarly to the laser pulse L 1 . A lower frequency control signal is applied to AOD 42a, 42b. The laser pulses divided by the energy of the optical path A, B or the like by the polarization beam splitter 46 are respectively distributed to the optical paths Aa and Ba, and are incident on the processed positions of the workpieces 33 and 34, respectively. Between the shot laser pulses L3, the current mirrors 5 1 b, 5 4b which are not incident on the laser pulses L3 Aa, L3 B a are moved. When the laser pulse L3 is emitted, the control device 60 releases the AOD 42a ' 42b application control signal, and the current mirrors 5 1 a ' 5 2 54a, 55 start moving. The laser pulse L4 is emitted after the current mirrors 5 1 b, 54b, 55 are stationary, in the same manner as the laser pulse L2. A higher frequency control signal is applied to AOD 42a, 42b. The laser pulses split by the polarization beam splitter 46 along the optical paths A, B and the like are respectively distributed to the optical paths Ab, Bb, and are incident on the processed positions of the workpieces 3 3, 34, respectively. Between the shot laser pulses L4, the current mirrors 51a, 54a of the non-incident laser pulses L4Ab, L4Bb move. When the laser pulse L4 is emitted, the control device 60 releases the AOD 42a and 42b urging port control signals, and the current mirrors 51b, 52 - 57 - 201236790 5 4b, 55 start moving. The positioning of the incident positions of the laser pulses L5A a , L5Ba based on the current mirrors 51a, 52, 54a, 55 is completed, and the control device 60 receives the stationary signals from the respective current mirrors 51a, 52, 54a, 55. However, the timing at which the positioning is completed is the time from the time when the front laser pulse L4 is emitted without the elapse of the shortest period of time during which the laser pulse can be emitted. Therefore, the control means 60 emits the laser pulse L5 after the elapse of the shortest period of time, and applies a relatively low frequency control signal to the AODs 42a, 42b. The laser pulses L5Aa, L5Ba are incident on the processed positions of the workpieces 3 3, 34, respectively. During the ejection of the laser pulse L5, the current mirrors 51b and 54b, which are not incident on the laser pulses L5Aa, L5Ba, move. After the end of the ejection of the laser pulse L5, the current mirrors 5 1 a , 5 2, 5 4 a, 5 5 start to move. The laser pulse L 6 is emitted after the current mirrors 5 2, 5 5, 5 1 b are stationary and the current mirror 54 4 is at rest. The laser pulse L6 is emitted, and a relatively high frequency control signal is applied to the AODs 42a and 42b. The laser pulses split by the equalizing energy along the optical paths A and B by the polarization beam splitter 46 are respectively distributed to the optical paths Ab and Bb, and are incident on the processed positions of the workpieces 3 3 and 34, respectively. During the emission of the laser pulse L6, the current mirrors 51a, 54a which are not incident on the laser pulses L6Ab, L6Bb are moved. The laser pulse L6 is emitted, and the control device 60 releases the control signal to the AODs 42a and 42b. Then, the current mirrors 5 1 b and 5 4b are moved. However, the current mirrors 52, 55 are maintained in a stationary state. This is because the Y coordinates based on the processed position of the next laser pulse L7Aa, L7Ba are respectively based on the processed positions based on the laser pulses L6Ab, L6Bb.

S -58- 201236790 The gamma coordinates are equal. The laser pulse L7 is emitted while the current mirror 54a is stationary and after the current mirror. The injection is performed and the lower control signals are applied to the AODs 42a, 42b. The laser pulses divided by the energy of the polarized beam splitter 46 along the light and the like are respectively distributed to the optical path Aa, and the laser pulse L7Aa advanced on Aa is processed into the workpiece 33 through the electric 52 and the fe lens 53 in the stationary state. The laser pulse L7Ba advancing in position is incident on the processed position of the workpiece 34 via the current in the stationary state and the f0 lens 56. During the pulse L7, the laser pulses L7 Aa, L7Ba, and 5 4b are not incident. When the laser pulse L7 is emitted, the control means AOD 42a, 42b apply a control signal, and the current mirrors 54a, 55 start moving. The laser pulse L8 is emitted at the current mirrors 51a, 52, 54a, 55. The relatively low frequency applied to the AODs 42a and 42b is distributed by the polarization beam splitters 46 along the optical paths A and B, respectively, to the optical paths Aa and Ba, and respectively incident on the workpiece processing position. During the ejection of the laser pulse L8, the current mirrors 51b and 54b which have not entered L8Aa and L8Ba are moved. Thus, for example, when at least one of the currents ί is moved when the laser pulse L 7 is emitted, that is, when at least one of the pulses L8 is also moved, the divided laser pulses L7, L8 are incident through the current mirrors 51a, 54a. The applied frequency paths A and B to the stationary surfaces 33, 34 of the workpieces 33, 34 are Ba. In the optical path flow mirror 5 1 a, . The optical path Ba mirrors 54a, 55 are controlled by the laser current mirror 5 1 b 60 after the pair 51a, 52 is deactivated. The laser pulse of the cut laser pulse .33 '34 is 5 lb, 54b. The laser pulse L8 is emitted at the position where the laser beam is shot at -59-201236790, and the control device 60 releases the AOD42a, 42b. A control signal is applied and, in addition, the current mirrors 5 1 a, 5 2, 5 4 a, 5 5 are moved. In the laser processing method according to the seventh embodiment, when the laser pulse is emitted, at least one of the current mirrors 51a, 51b, 54a' 54b on the optical path not distributed by the AOD 42a, 42b is subjected to movement. The positioning of the incident position of the subsequent laser pulse is performed. Therefore, the processing speed can be increased. In the laser processing method according to the seventh embodiment, a part of the energy of the pulsed laser beam 80 is distributed to the optical path A, and the remaining portion is distributed to the optical path B, and the laser pulses are respectively made in the optical paths A and B. Selectively proceed to one of the two optical paths. For example, the laser processing methods according to the second and third embodiments of the timing chart are shown in FIGS. 3 and 4, respectively. In the optical path A' B, respectively, one laser pulse can be divided into time segments. The laser pulses that are advanced on the two optical paths are processed in four axes with a small time difference. At this time, after the six current mirrors 51a, 51b, 52, 54a, 54b, 55 are stationary for positioning, the pulsed laser beam 80 is emitted from the laser light source 40. Fig. 13 is a schematic view showing a laser processing apparatus based on the sixth embodiment. In the laser processing apparatus according to the fifth embodiment, the AODs 42a and 42b are disposed on the optical path of the pulsed laser beam distributed by the polarization beam splitter 46. However, in the laser processing apparatus according to the sixth embodiment, in the laser processing apparatus, The polarization beam splitters 46a, 46b are disposed on the optical path of the pulsed laser beam distributed by D42. The AOD 42 and the polarization beam splitters 46a and 46b are included to constitute a distribution optical system capable of distributing pulsed laser beams in four directions of -60 to 201236790. The pulsed laser beam 80 emitted from the laser light source 40 is incident on the AOD 42 through the light transmitting region. The AOD 42 is capable of selectively distributing the pulse ray to the optical path A and the optical path B. When assigned to optical path A, a control signal is applied to AOD42. When assigned to the optical path B, a control signal is applied. The pulsed laser beam 80a assigned to the optical path A is divided into two laser pulses by the polarized light 46a, for example, by equal energy, and is split by the current mirrors 5 1 a, 5 1 b, respectively, and incident through the current mirror 5 2 53 to Similarly, the processed position of the workpiece 33 held by the stage 71 is similar. The pulsed laser beam 80b distributed to the optical path B is divided into two laser pulses by the equalizer 46b, for example, by the current mirror 54a. 54b is deflected, and is incident on the workpiece 34 held by the stage 72 via the current 彳 lens 56. The laser processing method according to the sixth embodiment can be used. The laser processing method (the laser processing method based on the eighth embodiment) If the AOD 42 distributes the laser pulses to the optical paths A and B in each of the pulses, and during the processing of the two added holes of the workpiece 3 (when the laser pulse is emitted), the current mirror is moved, 5 At least one of 5 is irradiated to the laser position of the workpiece 34, and at the time of the laser processing period of the two processed positions of the workpiece 34, the current mirrors 5la, 51b, 52 are moved! The positioning of the laser pulses that are illuminated to the workpiece 33 is performed. When the f beam 80 of 模4 1 is selected, the laser pulse of the AOD42 beam splitter and the ίθ lens are not set. The light beam splitting division i 55 ' ίθ processing position is implemented as follows), that is, the selection of the 54a, 54b pulse of the work position is one (the output g is one less -61 - 201236790 and 'for example, as in the third figure, FIG. 4 shows a laser processing method based on the second and third embodiments of the timing chart, and the laser beam along the two optical paths a and B can be generated by AOD42 from one laser pulse in time, with a small The time difference is subjected to 4-axis machining. At this time, after the six current mirrors 51a, 51b, 52, 54a, 54b, and 55 are stationary for positioning, the pulsed laser beam 80 is emitted from the laser light source 40. Based on the sixth embodiment The laser processing device distributes the laser pulses to two optical paths for 2f0 and 4 axis processing, but it is also possible to further apply control signals of different frequencies to the A〇D42. It is possible to use different control signals of n kinds of frequencies. (η + 1 ) f Θ, 2 X ( n + 1 ) axis processing. The following describes the processable range. Refer to Figure 14 (Α)~(G) to describe the processing area of the current mirror. As shown in Figure (A), incident to, for example, an AOD or beam splitter The laser pulse of the configured distributor is selectively distributed to one of the two optical paths in accordance with the laser pulse, or is distributed to both of the optical paths with a small time difference, and is equally distributed to the two optical paths. The two optical paths are arranged in one of the two optical paths. The first deflection element that deflects the incident laser pulse, for example, the current mirrors 4 3 a, 5 1 a, and 5 4 a. The other is disposed with a second deflection element that can deflect the incident laser pulse and emit the second deflection element. The current mirrors 43 b, 5 1 b , and 5 4b are incident on the third deflection element, such as the current mirrors 44 and 52, through which the laser pulses of the first and second deflection elements are incident on the laser pulse capable of deflecting the incident laser beam. 5 5. The first to third deflection elements are included to constitute a deflector capable of deflecting the incident laser pulse, for example, a current detecting scanner. The laser beam emitted by the third deflection element is a f0 lens (concentrating lens) Concentration -62- 201236790 The position to be processed at the workpiece. By deflecting the laser pulse by the deflector, the incident position of the laser pulse is moved within the machinable range, and the workpiece is laser processed. For example, 1 and 2 The deflection element is capable of moving the incident position of the laser pulse on the workpiece in the X-axis direction, and the third deflection element is movable in the Y-axis direction. As shown in Fig. 14(B), for example, the edge X of 50 mm The square processable range in the axial direction and the Y-axis direction is divided into a processing region of the first deflecting element and a processing region of the second deflecting element. The processing region of the first deflecting element is capable of being deflected by the first deflecting element and the third deflecting element The element deflects a region where the laser beam incident on the deflector is irradiated, and the processing region of the second deflecting element is irradiated by the laser beam incident on the deflector by the second deflecting element and the third deflecting element. Area. The processing regions of the first and second deflecting elements are, for example, congruent rectangles having a length of 2 5 m in the X-axis direction and a length of 50 mm in the Y-axis direction. However, depending on the number or arrangement of the positions to be processed, the size or shape of the processing regions of the first and second deflection elements may be generally changed as shown in Figs. 4(C) to (F), for example. In the example shown in Fig. 14(C), the processing regions of the first and second deflecting elements are rectangular in which the lengths of the long sides are equal and the lengths of the short sides are different. In the example shown in Fig. 14(D), the two processing zones are congruent isosceles triangles. In the example shown in Fig. 14(E), the processing region of the first deflecting element is a right-angled isosceles triangle, and the processing region of the second deflecting element is a pentagon. In the example shown in Fig. 14(F), the processing regions of the first and second deflecting elements are congruent hexagons between the opposite sides of the square divided by a polygonal line 8-63-201236790 and As shown in Fig. (G), the processing regions of the first and second rotating elements can be formed into a congruent rectangle having a length of 50 mm in the X-axis direction and a length of 25 mm in the direction. In the first and second deflection processing regions, the length in the direction in which the first and second deflection elements are moved (the X-axis direction) is longer than the direction in the third deflection element (the Y-axis direction). Length, which speeds up processing. However, for example, in the second embodiment, the laser processing method according to the second embodiment is shown in FIG. 3, when the laser pulses of the first and second deflection elements are generated by time division from one laser pulse, and the incident is performed to γ. When the laser processing method of the coordinate position of the coordinates is used, the processing area setting shown in Fig. 14 (Fig. 15(A), (B) and Fig. 16(A), (B) shows the workpiece. A top view of the machining position and the machinable range. Referring to Figures 15(A) and (B), the workpiece is held on the table in such a manner that it can be processed in the shortest time in accordance with the position of the added king. When the processed position and the machinable range are in the relative positional relationship shown in the first (A), the workpiece is rotated relative to the galvano-scanning scanner by the 0-stage, as shown in Fig. 15(B). The processed position is configured inside.

Refer to Figure 16 (A) and (B). The order of irradiating the laser beam to the position to be processed in the processable range (each zone) (the machining sequence is set according to the moving speed of the first to third deflection elements or the position to be processed, and is optimized for the problem of traveling salespersons, etc. Therefore, the processing time is short. As an example, as shown in Fig. 16(A), the case where the incident velocity is not equal to the position of the Y2-biased Y-axis element is equal to: 〇) The example is the most orthogonal

S -64- 201236790 The machining process is set to the Y-axis direction as shown in Figure 16 (B), as shown in Figure 16 (B). The movement of the third deflection element is performed. The angle and the amount of deflection are minimized as a whole, and the laser beam is incident on the plurality of processed positions in the respective processing regions by the control device 60 in the processing order. The invention has been described in accordance with the above examples, but the invention is not limited thereto. For example, in the embodiment, the machining of the machining range is performed while the stage is stationary, and after the machining is finished, the so-called step repetition of moving the unprocessed area of the workpiece to the processable range of the current-sense scanner is performed. The processing is performed, but the movement of the stage can be synchronized with the movement of the incident position of the laser pulse based on the current detecting scanner, and the laser beam is incident on the workpiece while the stage is being moved. Further, in the embodiment, the size of the hole formed by the laser pulse irradiated through the first deflection element is equal to the size of the hole formed by the laser pulse irradiated through the second deflection element, but may be set to Different sizes or shapes. Further, as in the modification shown in Fig. 17, the two imaging lenses for imaging the images of the laser pulses in the first and second deflection elements on the third deflection element may be arranged in the first The structure on the optical path between the second deflection element and the third deflection element. It can improve the movement and processing speed of the deflector. Further, in the deflector of the embodiment, it is assumed that the laser pulse deflected by the two deflecting elements (the first and second deflecting elements) is incident on! The deflection of the -65-201236790 rotation element (third deflection element), but it is also possible to set the laser pulse deflected by three or more deflection elements to be incident on! The structure of the deflection elements. Further, it is also possible to adopt a configuration in which a laser pulse deflected by a plurality of deflection elements is incident on a plurality of deflection elements. Further, for example, the laser processing method according to the fifth to eighth embodiments or the modification of the laser processing method according to the fifth embodiment can be considered to have at least one current mirror through which the laser pulse does not pass. In addition to the examples of laser processing methods that move when a laser pulse is emitted from a laser light source, those skilled in the art will be able to make various modifications, improvements, combinations, and the like. (Industrial Applicability) In addition to being used for the drilling process by irradiating a laser beam, it can also be used for general laser processing such as scribing, patterning, annealing, and welding. It is not limited to a pulse wave, and it is also possible to use a laser light source that emits a laser beam of a continuous wave. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a laser processing apparatus according to a first embodiment. Fig. 2 is a timing chart showing a laser processing method based on the first embodiment. Fig. 3 is a view showing the timing of the laser processing method based on the second embodiment - 66 - 201236790. Fig. 4 is a timing chart showing a laser processing method based on the third embodiment. Fig. 5 is a view showing a laser processing apparatus based on the second embodiment. Fig. 6 is a timing chart showing a laser processing method based on the fourth embodiment. Fig. 7 is a view showing a laser processing apparatus based on the third embodiment. Fig. 8 is a view showing a laser processing apparatus based on the fourth embodiment. The '9th figure shows a timing chart based on the laser processing method of the fifth embodiment. Fig. 10 is a timing chart showing a laser processing method based on the sixth embodiment. Fig. 11 is a view showing a laser processing apparatus based on the fifth embodiment. Fig. 12 is a timing chart showing a laser processing method based on the seventh embodiment. Fig. 13 is a view showing a laser processing apparatus based on the sixth embodiment. Fig. 14 (A) to (G) show the processing area of the current mirror. Fig. 15 (A) and (B) are schematic plan views showing the processed position of the workpiece and the processing range of -67-201236790. Fig. 16 (A) and (B) are schematic plan views showing the workpiece to be processed and the machined range. Fig. 17 is a schematic view showing a part of a laser processing apparatus based on a modification. Fig. 18 (A) to (D) show a schematic view of a conventional laser processing apparatus. [Description of main component symbols] I 〇: laser light source II: mask 1 2 : mirror 1 3 : bifurcated optical element 1 4, 1 5 : current detecting scanner 14a, 14b, 15a, 15b: current mirror 1 6 : imaging lens 1 7 : f 0 lens 18 : control device 2 0 : laser beam 3 0 to 3 4 : workpiece 40 : laser light source 4 1 : mask 42, 42a, 42b: AOD 43a, 43b, 44 : Current mirror 201236790 4 5 : f 0 lens 46, 46a, 46b: polarized beam splitter 47a to 47f: folded mirror 48: distribution optical system 5 1 a, 5 1 b, 5 2 : current mirror 5 3 : f Θ Lens 54a, 54b, 55: current mirror 5 6 : f 0 lens 6 〇: control devices 70 to 72: stage 8 0a, 80, 80A, 80B, 80Aa, 80Ab, 80Ba, 80Bb, 80b '81a > 81b , 82a, 82b: laser beam

Claims (1)

201236790 VII. Patent application scope: 1. A laser processing device, comprising: a laser light source, which emits a laser beam; a distribution optical system capable of distributing at least the first direction and the second direction from the laser a laser beam emitted from the light source; and a first deflector capable of deflecting a laser beam distributed in the first direction and the second direction in the distribution optical system, wherein the first deflector includes: a deflection element that is disposed on an optical path of a laser beam that is distributed in the first direction in the distribution optical system, and that can deflect the laser beam and emit the laser beam; and the second deflection element is disposed in the deflection beam In the optical system of the distribution optical system, the laser beam is distributed to the second direction, and the laser beam can be deflected and emitted; and the third deflection element is disposed on the laser beam via the first deflection element And the optical path of the laser beam passing through the second deflection element, and the incident laser beam can be deflected and emitted. 2. The laser processing apparatus according to claim 1, wherein the first deflector is a current detecting scanner, and the first to third deflecting elements are current mirrors that change a direction of a reflecting surface. 3. The laser processing apparatus S-70-201236790 according to claim 1 or 2, further comprising a control device for controlling emission of a laser beam from the laser light source, the laser beam being distributed based on the foregoing The distribution of the optical system and the laser beam are based on the deflection directions of the first to third deflection elements, and the control device is from the thunder in a state where the first and third deflection elements are stationary and the second deflection element is changed in the deflection direction. The light source emits a laser beam, and the laser beam is distributed to the first direction in the distribution optical system. The laser processing apparatus according to claim 1 or 2, further comprising: a control device that controls emission of the laser beam from the laser light source, and distribution of the laser beam based on the distribution. And the laser beam is based on the deflection directions of the first to third deflection elements, and the control device emits the laser beam from the laser light source while the first to third deflection elements are stationary, and the distribution optical system The laser beam is distributed to the first direction and the second direction. The laser processing apparatus according to claim 4, wherein the control device sequentially distributes the laser beam to the first direction and the second direction in the distribution optical system, and ends the second The direction of deflection of the first deflection element is changed before the direction of the distribution of the laser beam. The laser processing apparatus according to claim 4, wherein the control device firstly arranges the first and second deflection elements to have a relatively large distance between the current and the next position to be processed. The laser processing apparatus according to claim 4, wherein the above-mentioned control device simultaneously reaches the first one as described in the fourth aspect of the invention. The direction and the aforementioned second direction are assigned to the laser beam. The laser processing apparatus according to any one of claims 1 to 3, wherein the third deflection element and the third deflection element are deflected and incident on the first a region in which the laser beam of the deflector illuminates the laser beam and the laser beam incident on the first deflector by the second deflecting element and the third deflecting element deflects the region of the laser beam The length in the direction in which the first and second deflection elements move the incident position of the laser beam is longer than the length in the direction in which the third deflection element moves the incident position of the laser beam. The laser processing apparatus according to any one of the first to eighth aspect of the present invention, wherein the control device is capable of being the smallest in the order of the amount of deflection of the entire third deflection element The first deflecting element and the third deflecting element deflect a laser beam incident on the first deflector to illuminate a region of the laser beam, and can be deflected by the second deflecting element and the third deflecting element to enter the first A laser beam of a deflector is used to illuminate a plurality of processed locations of the laser beam into the laser beam. The laser processing apparatus according to claim 1, wherein the distribution optical system of S-72-201236790 is capable of distributing the laser beam emitted from the laser light source in the third direction and the fourth direction. Further, the second deflector that can deflect the laser beam that is distributed in the third optical direction and the fourth direction in the distribution optical system, and the second deflector includes: a fourth deflection element that is configured In the optical path of the laser beam distributed to the third direction in the distribution optical system, the laser beam can be deflected and emitted; and the fifth deflection element is disposed in the distribution optical system to the first And a sixth deflection element disposed on the optical beam passing through the fourth deflection element and passing through the fifth deflection element; The laser beam is deflected by the incident laser beam and emitted. The laser processing apparatus according to claim 1, further comprising: a control device that controls emission of the laser beam from the laser light source, and distribution of the laser beam based on the distribution optical system And the laser beam is based on the yaw directions of the first to sixth deflection elements, and when the laser beam is emitted from the laser light source, the control device changes the first to sixth deflection elements not disposed by the distribution optical The system distributes at least one direction of deflection of the deflection element on the optical path of the laser beam. 1 2 . The laser processing apparatus according to claim 10, -73-201236790 further comprising a control device for controlling emission of the laser light source by the laser, the laser beam being based on the distribution optical system The laser beam is emitted from the laser light source in a state in which the first to sixth deflection elements are stationary, and the laser beam is emitted from the laser light source in the distribution light. The laser beam is distributed to the first to fourth directions. a laser processing method, which is performed by using a laser processing apparatus having: a laser light source that is a laser beam; and a distribution optical system capable of at least a first direction And a laser beam emitted from the laser light source; and a first deflection capable of deflecting a laser beam distributed in a second direction to the first direction in the distribution optical system, wherein the first beam is emitted The first deflection element is disposed on an optical path of the laser beam distributed to the first direction in the distribution optical, and is capable of being deflected and emitted; and the second deflection element is disposed In the optical system of the optical system, the laser beam is distributed in the second direction, and the laser beam is deflected to emit the third deflection element, and the laser beam is coupled to the laser beam of the first deflection element. The light beam passing through the second deflected laser beam is deflected by the incident laser beam, and is emitted from the foregoing in a state where the first and third deflecting elements are stationary and the second deflecting is changed in the deflecting direction. Laser The light source emits a laser beam in the aforementioned distribution optical system to distribute the laser beam in the foregoing second direction. 1 4 · The laser processing square beam according to claim 13 of the patent application is emitted from the sub-control system tooling. , the rotator system can be placed in the component, and can be placed in the element, the element, and the method, S-74-201236790, wherein the first deflection element and the third deflection element can be deflected and incident on the first a region in which the laser beam of the deflector illuminates the laser beam and the laser beam incident on the first deflector by the second deflecting element and the third deflecting element deflects the region of the laser beam The length in the direction in which the first and second deflection elements move the incident position of the laser beam is longer than the length in the direction in which the third deflection element moves the incident position of the laser beam. a laser processing method, which is performed by a laser processing apparatus having: a laser light source that emits a laser beam; and a distribution optical system capable of at least a first a laser beam emitted from the laser light source in a direction and a second direction; and a first deflector capable of deflecting a laser beam distributed in the first direction and the second direction in the distribution optical system to emit The first deflector includes a first deflecting element disposed on an optical path of the laser beam distributed to the first direction in the distribution optical system, and capable of deflecting the laser beam to emit: a second deflection element that is disposed on an optical path of the laser beam that is distributed in the second direction in the distribution optical system, and that can deflect the laser beam and emit the laser beam; and the third deflection element is disposed The first to third deflection elements are emitted from the laser beam passing through the first deflection element and the optical beam passing through the second deflection element, and can be deflected by the incident laser beam. The stationary state, the emitted light ray emitted from the laser beam, and the laser beam assigned to the first 1-75-201236790 the second direction and the direction in the distribution of the optical system. The laser processing method according to claim 15, wherein the distribution optical system sequentially distributes the laser beam to the first direction and the second direction, and ends the second direction. The deflection direction of the first deflection element is changed before the laser beam is dispensed. The laser processing method according to claim 15, wherein the first and second deflection elements are arranged to have a relatively large distance between the current and the next processed position. The optical path of the deflection element incident on the laser beam at the processing location distributes the laser beam. The laser processing method according to claim 15, wherein the laser beam is distributed to the first direction and the second direction at the same time. The laser processing method according to any one of the first to third aspect of the invention, wherein the deflection amount of the entire third deflection element is minimized, The first deflecting element and the third deflecting element deflect a laser beam incident on the first deflector to illuminate a region of the laser beam, and can be deflected by the second deflecting element and the third deflecting element to enter the first A laser beam of the deflector illuminates a plurality of incident laser beam incident at a plurality of processed locations within the region of the laser beam. 20. A laser processing method, which is carried out using a laser processing apparatus having: a laser source that emits a beam of -76-201236790; a distribution optical system capable of a first to fourth laser beam emitted from the laser light source; and a first deflector that is rotated in the first optical direction and the first distributed laser beam in the distribution optical system; and a second a deflector that emits a laser beam in the third optical direction and the fourth direction in the distribution optical system, wherein the first deflector includes a first member disposed in the distribution optics In the optical path of the laser beam distributed to the foregoing, the laser beam can be deflected to emit two deflection elements, which are disposed on the optical path of the laser beam distributed in the second direction of the distribution optical system. And deflecting the laser beam; and the third deflection element is disposed on the laser beam passing through the first element and the laser beam passing through the second deflection element, and is capable of deflecting the incident laser beam and emitting the beam The second partial The fourth deflection element is disposed on the optical path of the laser beam distributed in the third direction of the distribution optical system, and is capable of deflecting the beam and emitting the fifth deflection element, which is disposed in the aforementioned a laser beam that is distributed to the fourth direction in the system and that emits the laser beam; and a sixth deflection element that is disposed with the laser beam of the fourth deflection element and the fifth deflection The optical beam of the element beam is deflected by the incident laser beam, and when the laser beam is emitted from the laser light source, the sixth deflection element is not disposed and distributed by the distribution optical system. At least one direction of deflection of the deflection element on the optical path of the beam. Distributing to the direction of the deflection element 1 that can be shifted in the forward direction by the second direction; the first beam to the first beam and the deflection beam of the optical device can be biased to the laser device by the feature 1 to the first The Ray-77-201236790 2 1 . A laser processing method, which is performed by using a lightning processing device having a laser light source, a laser beam, and a distribution optical system capable of being the first a fourth laser beam emitted from the laser light source; a first deflector that is rotated in the first optical direction and in the distributed laser beam; and a second deflector In the distribution optical system, the third direction and the fourth-order laser beam are emitted in the distribution optical system. The first deflector includes a first member, and the first deflector is disposed in the distribution optical system. The optical path of the laser beam is capable of deflecting the laser beam and the deflection element is disposed on the optical path of the laser beam distributed in the second direction of the distribution optical system, and is capable of deflecting the emission; and Deflection element And being disposed in a laser beam passing through the element and a laser beam passing through the second deflection element and deflecting the incident laser beam, wherein the second deflection: the fourth deflection element is configured The light beam of the laser beam distributed in the third direction of the distribution optics can be emitted in a biased manner, and the fifth deflection element is disposed in the laser beam distributed to the fourth direction in the system. On the optical path, the laser beam is rotated to emit: and a sixth deflection element is provided with a laser beam of the fourth deflection element and an optical path passing through the fifth deflection beam, and is capable of deflecting the incident laser beam In the state in which the first to sixth deflection elements are stationary, the projection direction distribution system of the first and sixth deflection elements can be deflected in the second direction by the deflection in the first direction, and the first direction is emitted in the first direction. The first beam deflected by the laser beam includes a laser that is optically coupled to the laser and capable of being biased by the element, and is characterized in that the laser beam is emitted from the Ray S-78-201236790 light source, and in Dispensing said optical system assigns the laser beam to the first to the fourth direction. -79-