JP2012121038A - Laser beam machining device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining device and method capable of machining a workpiece at high speed by irradiating the workpiece with laser beam.SOLUTION: The laser beam machining device includes a laser beam source for emitting the laser beam, a dividing optical system capable of dividing the laser beam emitted from the laser beam source into at least the first and second directions, and a first deflector capable of deflecting and emitting the laser beam divided into the first and second directions by the dividing optical system. The first deflector includes: a first deflecting element which is disposed on a light path of the laser beam divided into the first direction in the dividing optical system and can deflect and emit the laser beam; a second deflecting element which is disposed on a light path of the laser beam divided into the second direction and can deflect and emit the laser beam; and a third deflecting element which is disposed on the light paths of the laser beam through the first deflecting element and the laser beam through the second deflecting element, and can deflect and emit the incident laser beam.

Description

  The present invention relates to a laser processing apparatus and a laser processing method for performing processing by irradiating a workpiece with a laser beam.

  18A to 18D are schematic views showing a conventional laser processing apparatus.

  Reference is made to FIG. A pulsed laser beam 20 is emitted from the laser light source 10. The pulse laser beam 20 passes through the light transmitting region of the mask 11, is shaped in cross section, is reflected by the reflecting mirror 12, and enters the galvano scanner 14. The galvano scanner 14 includes two oscillating mirrors (galvano mirrors 14a and 14b), and emits the incident pulse laser beam 20 while changing the traveling direction of the pulse laser beam 20 in a two-dimensional direction. The pulse laser beam 20 whose traveling direction has been changed by the galvano scanner 14 is condensed by the fθ lens 17 and irradiated onto the work 30. The work 30 is a printed circuit board in which, for example, a copper layer, a resin layer, and a copper layer are laminated in this order. By irradiating the copper layer of the printed circuit board with the pulse laser beam 20, a through-hole penetrating the copper layer and the resin layer at the irradiation position is formed.

  The control device 18 controls the operation of the galvano scanner 14 and the emission of the pulsed laser beam 20 from the laser light source 10. When the positioning of the irradiation position (processed position) of the pulse laser beam 20 on the workpiece 30 is completed by the operation of the galvano scanner 14 (change in the direction of the galvano mirrors 14a and 14b), the stationary state that informs the stationary state of the galvano mirrors 14a and 14b. A signal is transmitted from the galvano scanner 14 to the control device 18. After receiving the stationary signal, the control device 18 transmits a laser oscillation command (trigger signal) to the laser light source 10 so that the pulse laser beam 20 is emitted, and the pulse laser beam 20 is incident on the positioned processing position. The workpiece 30 is processed.

  The laser processing apparatus shown in FIG. 18B has the laser processing shown in FIG. 18A in that the imaging lens 16 is provided on the optical path of the pulse laser beam 20 between the two galvanometer mirrors 14a and 14b. Different from the device. In the laser processing apparatus shown in FIG. 18A, since the galvano mirror 14a deflects the beam, the size of the galvano mirror 14b increases. In the laser processing apparatus shown in FIG. 18B in which the imaging lens 16 is disposed between the galvanometer mirrors 14a and 14b, the size of both the mirrors 14a and 14b can be made equal. Since the inertia can be reduced, the operation and processing speed of the galvano scanner can be increased.

  In the laser processing apparatus shown in FIG. 18C, the two-branch optical element 13 that divides and emits the incident pulse laser beam 20 is disposed on the optical path of the pulse laser beam 20 that has passed through the light-transmitting region of the mask 11. This is different from the laser processing apparatus of FIG. The bifurcated optical element 13 is, for example, a diffractive optical element (DOE) or a holographic optical element (HOE). The pulse laser beam 20 is incident on the bifurcated optical element 13 and bifurcated into pulse laser beams 20a and 20b. Both beams 20a and 20b are incident on the workpiece 30 via the galvanometer mirrors 14a and 14b and the fθ lens 17, and two holes are processed simultaneously (for example, refer to Patent Documents 1 and 2).

  The laser processing apparatus shown in FIG. 18D is different from the laser processing apparatus shown in FIG. 18C in that it has a galvano scanner 15 configured to include two galvanometer mirrors 15a and 15b. One pulsed laser beam 20a branched by the bifurcated optical element 13 is deflected by galvanometer mirrors 15a and 15b, further deflected by galvanometer mirrors 14a and 14b, condensed by an fθ lens 17, and incident on a work 30. To do. The other pulsed laser beam 20b branched by the two-branch optical element 13 is deflected by the galvanometer mirrors 14a and 14b and then enters the work 30 via the fθ lens 17 (see, for example, Patent Document 3).

  In the laser processing apparatus shown in FIGS. 18C and 18D, since the pulse laser beam 20 is bifurcated by the bifurcated optical element 13, the peak power of the branched pulse laser beams 20a and 20b is the pulse laser beam. Half that of 20. For this reason, a laser light source 10 that emits a pulse laser beam 20 having a high peak power may be required, or a material that can be processed may be limited. For example, the laser processing apparatus described in Patent Document 3 is exclusively used for resin processing.

JP 2007-268600 A Japanese Patent No. 4218209 International Publication No. 2003/041904

  An object of the present invention is to provide a laser processing apparatus and a laser processing method capable of high-speed processing.

  According to one aspect of the present invention, a laser light source that emits a laser beam, a distribution optical system that can distribute the laser beam emitted from the laser light source into at least a first direction and a second direction, and the distribution optical system And a first deflector capable of deflecting and emitting the laser beam distributed in the first direction and the second direction, and the first deflector is the first direction by the distribution optical system. Are arranged on the optical path of the laser beam distributed to the first deflection element that can deflect and emit the laser beam, and on the optical path of the laser beam distributed in the second direction by the distributing optical system. A second deflection element that is arranged and can deflect and emit the laser beam, a laser beam that passes through the first deflection element, and a second deflection element that passes through the second deflection element. Disposed in the laser beam optical path, the laser processing apparatus and a third deflection element which can be emitted by deflecting the laser beam incident are provided.

  According to another aspect of the present invention, a laser light source that emits a laser beam, a sorting optical system that can sort the laser beam emitted from the laser light source into at least a first direction and a second direction, and the sorting optics A first deflector capable of deflecting and emitting the laser beam distributed in the first direction and the second direction in the system, and the first deflector is configured to transmit the first beam in the distribution optical system. A first deflection element arranged on the optical path of the laser beam distributed in the direction and capable of deflecting and emitting the laser beam; and on the optical path of the laser beam distributed in the second direction by the distribution optical system A second deflecting element that can deflect and emit the laser beam, a laser beam that passes through the first deflecting element, and a second deflecting element that passes through the second deflecting element. A laser processing method using a laser processing apparatus that is disposed on the optical path of the laser beam and includes a third deflecting element capable of deflecting and emitting the incident laser beam. A laser beam is emitted from the laser light source while the deflection element is stationary and the second deflection element is changing the deflection direction, and the laser beam is distributed in the first direction by the distribution optical system. A laser processing method is provided.

  According to another aspect of the present invention, a laser light source that emits a laser beam, a sorting optical system that can sort the laser beam emitted from the laser light source into at least a first direction and a second direction, A first deflector capable of deflecting and emitting the laser beam sorted in the first direction and the second direction by the sorting optical system, and the first deflector A first deflection element arranged on the optical path of the laser beam distributed in the first direction and capable of deflecting and emitting the laser beam, and a laser beam distributed in the second direction by the distribution optical system A second deflection element disposed on the optical path and capable of deflecting and emitting the laser beam; a laser beam via the first deflection element; and the second deflection element A laser processing method performed using a laser processing apparatus including a third deflection element that is disposed on an optical path of a laser beam that has passed through and that can deflect and emit an incident laser beam. A laser processing method characterized in that a laser beam is emitted from the laser light source while the three deflection elements are stationary, and the laser beam is distributed in the first direction and the second direction by the distribution optical system. Provided.

  Further, according to another aspect of the present invention, a laser light source that emits a laser beam, a distribution optical system that can distribute the laser beam emitted from the laser light source in first to fourth directions, and the distribution optical system A first deflector capable of deflecting and emitting a laser beam distributed in the first direction and the second direction, and a laser beam distributed in the third direction and the fourth direction by the distribution optical system; A first deflector disposed on an optical path of the laser beam distributed in the first direction by the distribution optical system, and the laser beam Are arranged on the optical path of the laser beam distributed in the second direction by the distribution optical system, and deflects the laser beam. A second deflecting element that can emit, a laser beam that passes through the first deflecting element, and a laser beam that passes through the second deflecting element are arranged on the optical path of the deflected laser beam to be emitted. The second deflector is disposed on the optical path of the laser beam distributed in the third direction by the distribution optical system, and deflects and emits the laser beam. A fourth deflecting element that can be arranged, a fifth deflecting element that is arranged on the optical path of the laser beam distributed in the fourth direction by the distributing optical system, can deflect and emit the laser beam, It is arranged on the optical path of the laser beam that has passed through the fourth deflecting element and the laser beam that has passed through the fifth deflecting element, and can deflect and emit the incident laser beam. A laser processing method performed using a laser processing apparatus including six deflection elements, wherein the laser beam is distributed by the distribution optical system among the first to sixth deflection elements when a laser beam is emitted from the laser light source. There is provided a laser processing method characterized in that at least one deflection direction of a deflection element not arranged in the beam optical path is changed.

  According to another aspect of the present invention, a laser light source that emits a laser beam, a distribution optical system that can distribute the laser beam emitted from the laser light source in first to fourth directions, and the distribution optical system A first deflector capable of deflecting and emitting a laser beam distributed in the first direction and the second direction, and a laser beam distributed in the third direction and the fourth direction by the distribution optical system; A first deflector disposed on an optical path of the laser beam distributed in the first direction by the distribution optical system, and the laser beam Are arranged on the optical path of the laser beam distributed in the second direction by the distribution optical system, and deflects the laser beam. A second deflecting element that can emit, a laser beam that passes through the first deflecting element, and a laser beam that passes through the second deflecting element are arranged on the optical path of the deflected laser beam to be emitted. The second deflector is disposed on the optical path of the laser beam distributed in the third direction by the distribution optical system, and deflects and emits the laser beam. A fourth deflecting element that can be arranged, a fifth deflecting element that is arranged on the optical path of the laser beam distributed in the fourth direction by the distributing optical system, can deflect and emit the laser beam, It is arranged on the optical path of the laser beam that has passed through the fourth deflecting element and the laser beam that has passed through the fifth deflecting element, and can deflect and emit the incident laser beam. A laser processing method performed using a laser processing apparatus including six deflection elements, wherein the laser beam is emitted from the laser light source while the first to sixth deflection elements are stationary, and the laser beam is A laser processing method is provided in which the sorting optical system sorts the first to fourth directions.

  According to the present invention, it is possible to provide a laser processing apparatus and a laser processing method capable of high-speed processing.

It is the schematic which shows the laser processing apparatus by a 1st Example. It is a timing chart which shows the laser processing method by a 1st Example. It is a timing chart which shows the laser processing method by the 2nd example. It is a timing chart which shows the laser processing method by the 3rd example. It is the schematic which shows the laser processing apparatus by a 2nd Example. It is a timing chart which shows the laser processing method by the 4th example. It is the schematic which shows the laser processing apparatus by a 3rd Example. It is the schematic which shows the laser processing apparatus by the 4th Example. It is a timing chart which shows the laser processing method by 5th Example. It is a timing chart which shows the laser processing method by the 6th Example. It is the schematic which shows the laser processing apparatus by the 5th Example. It is a timing chart which shows the laser processing method by a 7th Example. It is the schematic which shows the laser processing apparatus by the 6th Example. (A)-(G) is the schematic explaining the processing area of a galvanometer mirror. (A) And (B) is a schematic plan view which shows the to-be-processed position and workable range of a workpiece | work. (A) And (B) is a schematic plan view which shows the to-be-processed position and workable range of a workpiece | work. It is the schematic which shows a part of laser processing apparatus by a modification. (A)-(D) are schematic which shows the conventional laser processing apparatus.

FIG. 1 is a schematic view showing a laser processing apparatus according to the first embodiment. For example, a laser light source 40 including a CO ₂ laser oscillator receives a trigger pulse (trigger signal) from the control device 60 and emits a pulsed laser beam 80. The pulse laser beam 80 has a cross-sectional shape shaped by passing through a light-transmitting region of a mask 41 having a light-transmitting region and a light-blocking region, and is incident on an acousto-optic deflector (AOD) 42.

  The AOD 42 is an optical deflector that utilizes the acousto-optic effect, and can receive a control signal transmitted from the control device 60 and change the traveling direction of the incident pulse laser beam 80 to emit. The emission direction (deflection angle) of the pulse laser beam emitted from the AOD 42 can be changed according to the frequency of the control signal applied to the AOD 42. The control device 60 applies control signals having different frequencies to the AOD 42 and selectively emits the pulse laser beam 80 along the optical paths A and B different from each other.

  The pulsed laser beam 80a distributed to the optical path A having a relatively small deflection angle is incident on the galvanometer mirror 43a. The pulsed laser beam 80b distributed to the optical path B having a relatively large deflection angle is incident on the galvanometer mirror 43b. The pulse laser beams 80a and 80b are reflected by the galvanometer mirrors 43a and 43b, respectively, and enter the galvanometer mirror 44. The galvanometer mirror 44 reflects the pulse laser beams 80 a and 80 b and makes the laser beam incident on the work 30 held on the stage 70 via the fθ lens 45. The fθ lens 45 condenses the pulse laser beams 80 a and 80 b and forms an image of the beam cross section (the shape of the light transmitting region) at the position of the mask 41 on the work 30.

  The stage 70 is, for example, an XYθ stage that holds the workpiece 30 in a movable manner. The work 30 is a printed circuit board having a laminated structure in which, for example, a lower layer made of copper, a resin layer made of an epoxy resin containing glass cloth, and an upper layer made of copper are laminated in this order. The pulsed laser beams 80a and 80b are incident on the workpiece 30 from the surface of the upper layer (copper layer), and penetrate through the upper layer and the resin layer to form a through hole reaching the lower layer (copper layer).

  Irradiation with the pulse laser beams 80a and 80b is performed by, for example, a cycle method. A through-hole is formed by making the pulse laser beams 80a and 80b of 3 to 5 shots enter each of a plurality of processing positions defined on the workpiece 30 in a cyclic manner. The size of the hole formed at the processing position is, for example, equal.

  The galvanometer mirrors 43a, 43b, and 44 are oscillating mirrors that can change the direction of the reflecting surface, and deflect and emit the incident pulse laser beams 80a and 80b. The control device 60 can control the emission directions (incident positions on the workpiece 30) of the pulse laser beams 80a and 80b by changing the directions of the reflection surfaces of the galvanometer mirrors 43a, 43b, and 44. The incident position along the X-axis direction of the pulsed laser beams 80a and 80b on the workpiece 30 can be moved by changing the orientation of the reflecting surfaces of the galvanometer mirrors 43a and 43b. Further, the incident position along the Y-axis direction of the pulse laser beams 80a and 80b on the workpiece 30 can be moved by changing the direction of the reflecting surface of the galvanometer mirror 44.

  When the positioning of the incident positions (processed positions) of the pulse laser beams 80a and 80b on the workpiece 30 in the X-axis direction is finished due to the change in the direction of the reflecting surface of the galvanometer mirrors 43a and 43b, the galvanometer mirrors 43a and 43b are stopped. A stationary signal to notify is transmitted to the control device 60 from the galvanometer mirrors 43a and 43b. Further, when the positioning of the incident positions of the pulse laser beams 80a and 80b on the work 30 in the Y-axis direction is finished due to the change in the direction of the reflecting surface of the galvano mirror 44, a stationary signal for notifying the galvano mirror 44 is stationary. To the control device 60.

  After the positioning of the incident position of the pulse laser beam is completed, the control device 60 transmits a laser oscillation command (trigger signal) to the laser light source 40, whereby the pulse laser beam 80 is emitted, and the pulse laser beam is incident on the processing position. Then, the workpiece 30 is processed.

  By changing the direction of the reflecting surface of the galvanometer mirrors 43a, 43b, and 44, when processing in the range in which the pulse laser beams 80a and 80b can be irradiated (processable range) is completed, the stage 70 unloads the workpiece 30. The processing area is moved to a processable range of the galvanometer mirrors 43a, 43b, and 44. The movement of the workpiece 30 by the stage 70 is controlled by the control device 60. The workable range is, for example, a square region with a side of 50 mm.

  The laser processing apparatus according to the first embodiment includes three galvano mirrors 43a and 43b for deflecting an incident pulse laser beam and a galvano mirror 44 for further deflecting the laser beam 80 deflected by the galvano mirrors 43a and 43b. It is characterized in that it has a galvano scanner configured to include a galvanometer mirror.

  FIG. 2 is a timing chart showing the laser processing method according to the first embodiment. The laser processing method according to the first embodiment is performed under the control of the control device 60 using the laser processing apparatus according to the first embodiment. The horizontal axis of the timing chart represents time. The vertical axis of the stage of “Laser Beam 80” indicates whether the laser beam 80 is emitted or not emitted. In this figure, each laser pulse of the pulse laser beam 80 emitted from the laser light source 40 is expressed as laser pulses L1 to L9 in the emission order. The vertical axes of the “galvano mirror 43 a”, “galvano mirror 43 b”, and “galvano mirror 44” indicate the moving and stationary states of the galvano mirrors 43 a, 43 b, 44, respectively. The vertical axis of the “AOD42” stage indicates the frequency of the control signal applied to the AOD42. The laser beam 80 incident on the AOD 42 with the relatively low frequency control signal applied travels along the optical path A, and the laser beam 80 incident on the AOD 42 with the relatively high frequency control signal applied is Travel along optical path B.

  The laser pulse L1 is emitted after the galvano mirror 44 is stationary and the galvano mirror 43a is stationary. The galvano mirror 44 transmits a galvano stationary signal to the control device 60 when the positioning of the incident position of the laser pulse L1 along the Y-axis direction is completed (still). Similarly, the galvano mirror 43a transmits a galvano stationary signal to the control device 60 when the positioning of the incident position of the laser pulse L1 along the X-axis direction is completed. The control device 60 transmits a trigger signal to the laser light source 40 after receiving a galvano stationary signal indicating that the positioning of the incident position of the laser pulse L1 has been completed in both the X-axis direction and the Y-axis direction. In response to this, the laser light source 40 emits a laser pulse L1. The control device 60 transmits a trigger signal to the laser light source 40 and applies a control signal having a relatively low frequency to the AOD 42, and applies a laser pulse L1 to the galvano mirrors 43a and 44, which are galvano stationary signal transmission sources. Is controlled to enter. The laser pulse L1 is deflected by the AOD 42, travels along the optical path A, and enters the processing position of the workpiece 30 via the galvanometer mirrors 43a and 44 and the fθ lens 45. During this period, the galvanometer mirror 43b moves (changes in the direction of the reflecting surface).

  After the emission of the laser pulse L1, the control device 60 transmits a control signal for positioning the galvanometer mirrors 43a and 44 so that the laser pulse is incident on a processing position where subsequent processing is performed. The galvanometer mirrors 43a and 44 receive the control signal from the control device 60 and start moving. The control device 60 cancels the control signal applied to the AOD 42, but the cancellation may be performed before or after the end of the emission of the laser pulse L1. In FIG. 2, it is shown that the release is performed simultaneously with the end of the emission of all the laser pulses. The application of the control signal to the AOD 42 is not limited before and after the start of the emission of the laser pulse L1, but in this figure, it is shown that it is applied simultaneously with the start of the emission of all the laser pulses.

  The laser pulse L2 is emitted after the galvano mirror 44 is stationary and the galvano mirror 43b is stationary. The galvano mirror 44 transmits to the control device 60 a galvano stationary signal indicating the end of positioning along the Y-axis direction of the incident position of the laser pulse L2. The galvano mirror 43b transmits to the control device 60 a galvano stationary signal indicating the end of positioning along the X-axis direction of the incident position of the laser pulse L2. Upon receiving these signals, the control device 60 transmits a trigger signal to the laser light source 40, emits a laser pulse L2 from the laser light source 40, and applies a control signal having a relatively high frequency to the AOD 42 to thereby generate a galvano mirror. Control to cause the laser pulse L2 to enter 43b and 44 is performed. The laser pulse L2 is deflected by the AOD 42, travels along the optical path B, and enters the processing position of the workpiece 30 through the galvanometer mirrors 43b and 44 and the fθ lens 45. During this period, the galvano mirror 43a continues to move.

  After the end of the emission of the laser pulse L2, the control device 60 transmits a control signal for positioning the galvanometer mirrors 43b and 44 so that the laser pulse is incident on the processing position where the subsequent processing is performed, The galvanometer mirrors 43b and 44 receive the control signal from the control device 60 and start moving.

  Similarly to the laser pulse L1, the laser pulses L3 and L4 are emitted after the galvanometer mirrors 44 and 43a are stopped, and enter the predetermined processing positions via the galvanometer mirrors 43a and 44, respectively. In this way, processing of two processing positions is continuously performed by the laser pulse passing through the galvano mirror 43a. During this time, the galvanometer mirror 43b continues to move. Note that after the emission of the laser pulses L3 and L4 is completed, the galvanometer mirrors 43a and 44 move.

  The galvano mirror 43 b stops and transmits a stationary signal to the control device 60. Further, the movement of the galvanometer mirror 44 is finished, and a stationary signal is transmitted to the control device 60. The control device 60 causes the laser pulse L5 to be emitted together with the stationary signal received by the galvano mirror 44 that has been stationary the latest.

  The laser pulse L5 is distributed to the optical path B by the AOD 42 to which a control signal having a relatively high frequency is applied, and enters the processing position of the workpiece 30 via the galvanometer mirrors 43b and 44. After the emission of the laser pulse L5 is completed, the galvanometer mirrors 43b and 44 start moving. During this time, the galvanometer mirror 43a continues to move.

  The laser pulse L6 is emitted according to the trigger signal of the control device 60 that has received the stationary signals of the galvanometer mirrors 44 and 43a, and enters the processing position via the galvanometer mirrors 43a and 44. After the emission of the laser pulse L6 is completed, the galvanometer mirrors 43a and 44 start moving. During processing by the laser pulse L6, the galvano mirror 43b continues to move.

  Positioning by the galvanometer mirrors 43b and 44 is completed, and the control signal 60 receives stationary signals from both the galvanometer mirrors 43b and 44. However, even when positioning of the incident position of the laser pulse is completed, the pulse laser beam 80 is changed from when the last laser pulse is emitted when the positioning is completed (when a stationary signal is received from the latest stationary galvanometer mirror). There may be times when the time corresponding to the shortest possible emission (oscillation) time has not elapsed. In that case, the control device 60 emits the pulsed laser beam 80 after the time corresponding to the shortest period has elapsed, that is, for example, in the shortest period (the upper limit of the laser oscillation frequency of the laser light source 40).

  At the time when the control signal 60 receives stationary signals from both the galvanometer mirrors 43b and 44, the time corresponding to the shortest period has not elapsed since the emission of the laser pulse L6. For this reason, the laser pulse L7 is emitted after the elapse of a time corresponding to the shortest cycle in which the laser beam 80 can be emitted from when the laser pulse L6 is emitted. After the emission of the laser pulse L7 is completed, the galvanometer mirrors 43b and 44 start moving. While the processing by the laser pulse L7 is performed, the galvano mirror 43a continues to move.

  The laser pulse L8 is emitted after the control device 60 receives a stationary signal from both the galvanometer mirrors 44 and 43a. After the emission of the laser pulse L8 is completed, the galvano mirror 43a starts to move. The galvano mirror 44 maintains a stationary state. This is because the Y coordinate of the processing position by the next laser pulse L9 is equal to the Y coordinate of the processing position by the laser pulse L8. While processing by the laser pulse L8 is performed, the galvanometer mirror 43b continues to move.

  The laser pulse L9 is emitted after the galvano mirror 43b is stationary, and enters the processing position on the workpiece 30 via the galvano mirrors 43b and 44 in a stationary state.

  In this example, the galvanometer mirror 44 is in a stationary state from the time when the laser pulse L8 is emitted until the end of the emission of the laser pulse L9, but the X coordinate of the processing position by the laser pulse L9 is X of the processing position by the laser pulse L8. When it is equal to the coordinates, for example, control is performed not to move the galvanometer mirror 43a. As described above, when the X coordinate or the Y coordinate of the processing position by the next laser pulse is equal, control is performed so that either one of the galvanometer mirrors 43a, 43b, 44 or both the galvanometer mirrors 43a, 43b is not moved. It is possible.

  In the laser processing method according to the first embodiment, each laser pulse of the pulse laser beam 80 emitted from the laser light source 40 is temporally distributed to one of the galvano mirrors 43a and 43b by the AOD 42 for each pulse. The laser pulse is emitted in a state where one of the galvanometer mirrors 43a and 43b and the galvanometer mirror 44 is stationary, and is irradiated onto the workpiece 30 via the stationary galvanometer mirror. Using two galvanometer mirrors 43a and 43b, while one of the mirrors is stationary, while the pulse laser beam 80 is emitted, the other mirror is moved for positioning the incident position of the subsequent laser pulse. By making it, the laser irradiation frequency with respect to the workpiece | work 30 can be made high. According to the laser processing method of the first embodiment, the processing speed is maintained while maintaining the pulse energy and peak power of each laser pulse irradiated to the workpiece 30 equal to that of the pulse laser beam 80 emitted from the laser light source 40. Can be faster.

  FIG. 3 is a timing chart showing the laser processing method according to the second embodiment. The laser processing method according to the second embodiment is performed under the control of the control device 60 using the laser processing apparatus according to the first embodiment. The horizontal axis of the timing chart and the vertical axis of each stage are the same as those in the timing chart shown in FIG. In the figure, each laser pulse of the pulse laser beam 80 emitted from the laser light source 40 is expressed as laser pulses L1 to L7 in the emission order. In the laser processing method according to the second embodiment, the AOD 42 is used, and from each of the laser pulses L1 to L7, the laser pulses L1a to L7a traveling on the optical path A and the laser pulses L1b to L7b traveling on the optical path B are Generate by time division. The pulse widths of the laser pulse L1a and the laser pulse L1b are, for example, equal. The same applies to the pulse widths of the laser pulses L2a to L7a and the laser pulses L2b to L7b.

  The laser pulse L1 is emitted after the galvanometer mirrors 44 and 43a are stationary and the galvanometer mirror 43b is stationary. The galvanometer mirrors 43a and 43b transmit a galvano stationary signal to the control device 60 when positioning of the incident positions of the laser pulses L1a and L1b along the X-axis direction is completed. When the positioning of the incident positions of the laser pulses L1a and L1b along the Y-axis direction is completed, the galvanometer mirror 44 transmits a galvano stationary signal to the control device 60. The control device 60 transmits a trigger signal to the laser light source 40 after receiving the galvano stationary signal from the galvanometer mirrors 43 a, 43 b, 44. The laser light source 40 emits a laser pulse L1.

  The control device 60 continuously applies a relatively low frequency control signal and a relatively high frequency control signal to the AOD 42 in this order, along with transmission of the trigger signal to the laser light source 40. The application time of the control signal having a relatively low frequency is equal to the application time of the control signal having a relatively high frequency. The application of the control signal having a relatively high frequency is canceled simultaneously with the end of the emission of the laser pulse L1, for example.

  In this figure, a control signal having a relatively low frequency is applied simultaneously with the start of emission of all the laser pulses L1 to L7, and a control signal having a relatively high frequency is canceled simultaneously with the end of emission. As shown, the start and release of application of the control signal need not coincide with the start and end of emission of the laser pulses L1 to L7.

  From a laser pulse L1 incident on the AOD 42 during a period when a control signal having a relatively low frequency is applied, a laser pulse L1a traveling in the optical path A is temporally divided and generated. Further, a laser pulse L1b traveling in the optical path B is temporally divided and generated from the laser pulse L1 incident on the AOD 42 during a period in which a control signal having a relatively high frequency is applied. The laser pulse L1a is incident on the processing position of the workpiece 30 via the galvanometer mirror 43a, the galvanometer mirror 44, and the fθ lens 45. The laser pulse L1b is incident on the workpiece 30 through the galvanometer mirror 43b, the galvanometer mirror 44, and the fθ lens 45. The Y coordinate of the processing position where the laser pulse L1a is incident is equal to the Y coordinate of the processing position where the laser pulse L1b is incident.

  The control device 60 transmits a control signal for positioning the galvano mirror 43a so that the next laser pulse L2a is incident on a predetermined processing position when the control signal having a relatively low frequency is applied. . The galvanometer mirror 43a receives the control signal from the control device 60, and starts moving before the laser pulse L1b is incident on the processing position (before distribution to the optical path B). Further, the control device 60 ends the application of the control signal with a relatively high frequency (end of the emission of the laser pulse L1), and the next laser pulses L2b and L2a at predetermined processing positions with respect to the galvanometer mirrors 43b and 44, respectively. And the control signal which performs positioning is transmitted so that L2b may inject. The galvanometer mirrors 43b and 44 start to move in response to a control signal from the control device 60.

  The laser pulse L2 is emitted after the galvano mirrors 43b and 44 are stationary and the galvano mirror 43a is stationary. From each of the galvanometer mirrors 43a, 43b, 44, a galvano stationary signal is transmitted to the control device 60, and the control device 60 transmits a trigger signal to the laser light source 40 along with reception of the stationary signal of the galvano mirror 43a that has been stationary most slowly. The laser light source 40 emits a laser pulse L2.

  The control device 60 sequentially applies a control signal having a relatively low frequency and a control signal having a relatively high frequency to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40.

  A laser pulse L2a generated by being divided along the optical path A from a laser pulse L2 incident on the AOD 42 during a period when a control signal having a relatively low frequency is applied passes through the galvanometer mirrors 43a and 44 and the fθ lens 45. Then, the light enters the workpiece 30 at the position to be processed. Further, the laser pulse L2b generated by being divided along the optical path B from the laser pulse L2 incident on the AOD 42 during the period in which the control signal having a relatively high frequency is applied is generated by the galvanometer mirrors 43b and 44 and the fθ lens 45. And enters the processing position of the workpiece 30. The Y coordinate of the processing position where both laser pulses L2a and L2b are incident is equal.

  The control device 60 transmits a control signal for positioning the galvano mirror 43a so that the next laser pulse L3a is incident on a predetermined processing position when the application of the control signal having a relatively low frequency is completed. Upon receiving this, the galvanometer mirror 43a starts moving before the end of the incidence of the laser pulse L2b. In addition, the control device 60 causes the next laser pulses L3b, L3a, and L3b to be incident on the galvanometer mirrors 43b and 44 at predetermined processing positions when the application of the control signal having a relatively high frequency is completed. The control signal for positioning is transmitted, and the galvanometer mirrors 43b and 44 which have received the control signal start moving.

  The laser pulse L3 is emitted after the galvanometer mirrors 43a and 43b are stationary and the galvanometer mirror 44 is stationary. From each galvanometer mirror 43a, 43b, 44, a galvano stationary signal is transmitted to the control device 60. The control device 60 transmits a trigger signal to the laser light source 40 along with the stationary signal reception of the latest stationary galvanometer mirror 44, In response to this, the laser light source 40 emits a laser pulse L3.

  The control device 60 sequentially applies a control signal having a relatively low frequency and a control signal having a relatively high frequency to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40.

  A laser pulse L3a generated by being divided along the optical path A from the laser pulse L3 incident on the AOD 42 during a period when a control signal having a relatively low frequency is applied passes through the galvanometer mirrors 43a and 44 and the fθ lens 45. Then, the laser pulse L3b that is split and generated along the optical path B from the laser pulse L3 that is incident on the processing position of the workpiece 30 and is incident on the AOD 42 during a period in which the control signal having a relatively high frequency is applied is The light enters the workpiece 30 through the galvanometer mirrors 43 b and 44 and the fθ lens 45. The Y coordinate of the processing position where both laser pulses L3a and L3b are incident is equal.

  The control device 60 transmits a control signal for positioning the galvano mirror 43a so that the next laser pulse L4a is incident on a predetermined processing position when the application of the control signal having a relatively low frequency is completed. Upon receiving this, the galvanometer mirror 43a starts moving before the end of the incidence of the laser pulse L3b. Further, the control device 60 causes the next laser pulses L4b, L4a, and L4b to enter the predetermined processing positions with respect to the galvanometer mirrors 43b and 44 when the application of the control signal having a relatively high frequency is completed. The control signal for positioning is transmitted, and the galvanometer mirrors 43b and 44 which have received the control signal start moving.

  The laser pulse L4 is emitted after the galvanometer mirrors 44 and 43b are stationary and the galvanometer mirror 43a is stationary. The control device 60 transmits a trigger signal to the laser light source 40 along with the reception of the stationary signal of the galvano mirror 43a that is stationary the latest.

  The control device 60 sequentially applies a relatively low frequency control signal and a relatively high frequency control signal to the AOD 42 in order, in addition to the transmission of the trigger signal to the laser light source 40, from the laser pulse L4. A laser pulse L4a is cut out in the optical path A, and a laser pulse L4b is cut out in the optical path B. The laser pulses L4a and L4b are incident on the machining position where the Y coordinate of the workpiece 30 is equal. The galvanometer mirrors 43a, 43b, and 44 start moving at a predetermined timing so that the next laser pulses L5a and L5b are incident on a predetermined processing position under the control of the control device 60.

  A stationary signal is transmitted to the control device 60 from the galvanometer mirrors 43b, 43a, 44 that have been positioned, but the positioning of the incident positions of the next laser pulses L5a, L5b has been completed since the previous laser pulse L4 was emitted. Since the time for the shortest cycle at which the laser pulse can be emitted has not elapsed, the control device 60 emits the laser pulse L5 after the time for the shortest cycle has elapsed, and is relative to the AOD 42. A low-frequency control signal and a relatively high-frequency control signal are successively applied in sequence to cut out the laser pulse L5a in the optical path A and the laser pulse L5b in the optical path B from the laser pulse L5. The laser pulses L5a and L5b are incident on the machining position where the Y coordinate of the workpiece 30 is equal. The galvanometer mirrors 43a, 43b, and 44 start moving at a predetermined timing so that the next laser pulses L6a and L6b are incident on a predetermined processing position under the control of the control device 60.

  The laser pulse L6 is emitted after the galvanometer mirrors 43b and 44 are stationary and the galvanometer mirror 43a is stationary. The control device 60 transmits a trigger signal to the laser light source 40 along with the reception of the stationary signal of the galvano mirror 43a that is stationary the latest.

  The control device 60 continuously applies a relatively low frequency control signal and a relatively high frequency control signal to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40, from the laser pulse L 6. A laser pulse L6a is cut out in the optical path A, and a laser pulse L6b is cut out in the optical path B. The laser pulses L6a and L6b are incident on the machining position where the Y coordinate of the workpiece 30 is equal.

  The galvano mirror 43a starts moving when the application of the control signal having a relatively low frequency is completed, and the galvano mirror 43b starts moving when the application of the control signal having a relatively high frequency is completed. The galvanometer mirror 44 remains stationary after the laser pulse L6b is incident. This is because the Y coordinate of the processing position by the next laser pulses L7a and L7b is equal to the Y coordinate of the processing position by the laser pulses L6a and L6b.

  The laser pulse L7 is emitted after the galvanometer mirrors 43a and 43b are stationary. The laser pulse L7a cut out in the optical path A by the AOD 42 is incident on the processing position on the workpiece 30 via the stationary galvanometer mirrors 43a and 44. The laser pulse L7b cut out in the optical path B is incident on the processing position on the workpiece 30 via the stationary galvanometer mirrors 43b and 44.

  In this example, the galvanometer mirror 44 is in a stationary state from the time when the laser pulse L6 is emitted until the end of the emission of the laser pulse L7, but the X coordinate of the processing position by the laser pulse L7a is X of the processing position by the laser pulse L6a. When equal to the coordinates, control is performed not to move the galvanometer mirror 43a. Further, when the X coordinate of the processing position by the laser pulse L7b is equal to the X coordinate of the processing position by the laser pulse L6b, control is performed not to move the galvano mirror 43b. As described above, when the X coordinate or the Y coordinate of the processing position by the next laser pulse is equal, control is performed so that either one of the galvanometer mirrors 43a, 43b, 44 or both the galvanometer mirrors 43a, 43b is not moved. It is possible.

  In the laser processing method according to the second embodiment, each laser pulse of the pulse laser beam 80 emitted from the laser light source 40 is temporally distributed in two different directions (optical path A and optical path B). According to the laser processing method according to the second embodiment, two shots are formed in a processable range in which a side is a square region having a side of 50 mm with a time difference of a relatively low frequency control signal applied to the AOD 42. Since laser pulses can be incident, the processing speed can be increased. However, in the laser processing method according to the first embodiment, for example, the laser pulse is emitted while one of the galvano mirrors 43a and 43b and the galvano mirror 44 are stationary, but in the second embodiment, three laser pulses are emitted. Since the laser pulse is emitted while all of the galvanometer mirrors 43a, 43b, and 44 are stationary, the processing speed may be slower than in the first embodiment.

  FIG. 4 is a timing chart showing the laser processing method according to the third embodiment. The laser processing method according to the third embodiment is performed under the control of the control device 60 using the laser processing apparatus according to the first embodiment. The horizontal axis of the timing chart and the vertical axis of each stage are the same as those in the timing chart shown in FIG.

  In the laser processing method according to the second embodiment, a control signal is applied to the AOD 42 in the order of a control signal having a relatively low frequency and a control signal having a relatively high frequency, and from all the laser pulses L1 to L7, Laser pulses were cut out in the optical paths A and B in the order of the laser pulses L1a to L7a and the laser pulses L1b to L7b. In the laser processing method according to the third embodiment, the laser pulse is first cut out to the galvanometer mirrors 43a and 43b that cause the laser pulse to enter the processing position where the distance between the processing positions is relatively large between this time and the next time. Take control.

  The laser pulse L1 is emitted after the galvanometer mirrors 44 and 43a are stationary and the galvanometer mirror 43b is stationary. The galvanometer mirrors 43a and 43b transmit a galvano stationary signal to the control device 60 when positioning of the incident positions of the laser pulses L1a and L1b along the X-axis direction is completed. When the positioning of the incident positions of the laser pulses L1a and L1b along the Y-axis direction is completed, the galvanometer mirror 44 transmits a galvano stationary signal to the control device 60. The control device 60 transmits a trigger signal to the laser light source 40 after receiving the galvano stationary signal from the galvanometer mirrors 43 a, 43 b, 44. The laser light source 40 emits a laser pulse L1.

  The control device 60 determines the distance between the processing position where the current laser pulse L1a is incident and the processing position where the next laser pulse L2a is incident, and the processing position where the current laser pulse L1b is incident and the next laser pulse L2b. Of the laser pulses L1a and L1b, the laser pulse incident on the current machining position having a large distance to the next machining position is first applied to the workpiece 30 based on the distance between the machining position and the incident machining position. Make it incident.

  In the laser processing whose timing chart is shown in FIG. 4, the distance between the processing position where the laser pulse L1a is incident and the processing position where the laser pulse L2a is incident is the processing position where the laser pulse L1b is incident and the laser pulse. L2b is larger than the distance to the processing position where the light enters. For this reason, the control device 60 continuously applies a relatively low frequency control signal to the AOD 42 and a relatively high frequency control signal to the AOD 42 after transmitting the trigger signal to the laser light source 40. To do.

  From a laser pulse L1 incident on the AOD 42 during a period when a control signal having a relatively low frequency is applied, a laser pulse L1a traveling in the optical path A is temporally divided and generated. Further, a laser pulse L1b traveling in the optical path B is temporally divided and generated from the laser pulse L1 incident on the AOD 42 during a period in which a control signal having a relatively high frequency is applied. The laser pulse L1a is incident on the processing position of the workpiece 30 via the galvanometer mirror 43a, the galvanometer mirror 44, and the fθ lens 45. The laser pulse L1b is incident on the workpiece 30 through the galvano mirror 43b, the galvano mirror 44, and the fθ lens 45. The Y coordinate of the processing position where the laser pulse L1a is incident is equal to the Y coordinate of the processing position where the laser pulse L1b is incident.

  The control device 60 transmits a control signal for positioning the galvano mirror 43a so that the next laser pulse L2a is incident on a predetermined processing position when the control signal having a relatively low frequency is applied. . The galvanometer mirror 43a receives the control signal from the control device 60, and starts moving before the end of the incidence of the laser pulse L1b. Further, the control device 60 causes the next laser pulses L2b, L2a, and L2b to be incident on the galvano mirrors 43b and 44 at predetermined processing positions when the application of the control signal having a relatively high frequency ends. A control signal for positioning is transmitted. The galvanometer mirrors 43b and 44 start to move in response to a control signal from the control device 60.

  The laser pulse L2 is emitted after the galvano mirrors 43b and 44 are stationary and the galvano mirror 43a is stationary. From each galvanometer mirror 43a, 43b, 44, a galvano stationary signal is transmitted to the control device 60, and the control device 60 transmits a trigger signal to the laser light source 40 along with the stationary signal reception of the latest stationary galvanometer mirror 43a, A laser pulse L2 is emitted.

  The distance between the processing position where the laser pulse L2b is incident and the processing position where the laser pulse L3b is incident are the distance between the processing position where the laser pulse L2a is incident and the processing position where the laser pulse L3a is incident Bigger than. For this reason, the control device 60 continuously applies a relatively high frequency control signal to the AOD 42 first and a relatively low frequency control signal to the AOD 42 after transmitting the trigger signal to the laser light source 40. To do.

  The laser pulse L2b generated by being divided along the optical path B from the laser pulse L2 incident on the AOD 42 during the period when the control signal having a relatively high frequency is applied passes through the galvanometer mirrors 43b and 44 and the fθ lens 45. Then, the light enters the workpiece 30 at the position to be processed. Further, the laser pulse L2a generated by being divided along the optical path A from the laser pulse L2 incident on the AOD 42 during a period in which the control signal having a relatively low frequency is applied is generated by the galvanometer mirrors 43a and 44 and the fθ lens 45. And enters the processing position of the workpiece 30. The Y coordinate of the processing position where both laser pulses L2b and L2a are incident is the same.

  The control device 60 transmits a control signal for positioning the galvano mirror 43b so that the next laser pulse L3b is incident on a predetermined processing position when the control signal having a relatively high frequency is applied. Upon receiving this, the galvanometer mirror 43b starts moving before the end of the incidence of the laser pulse L2a. In addition, the control device 60 causes the next laser pulses L3a, L3a, and L3b to enter the predetermined processing positions with respect to the galvanometer mirrors 43a and 44 when the application of the control signal having a relatively low frequency ends. The control signal for positioning is transmitted, and the galvanometer mirrors 43a and 44 that have received the control signal start moving.

  The laser pulse L3 is emitted after the galvanometer mirrors 43a and 43b are stationary and the galvanometer mirror 44 is stationary. From each galvanometer mirror 43a, 43b, 44, a galvano stationary signal is transmitted to the control device 60. The control device 60 transmits a trigger signal to the laser light source 40 along with the stationary signal reception of the latest stationary galvanometer mirror 44, In response to this, the laser light source 40 emits a laser pulse L3.

  The control device 60 sequentially applies a control signal having a relatively low frequency and a control signal having a relatively high frequency to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40. This is because the distance between the processing position where the laser pulse L3a is incident and the processing position where the laser pulse L4a is incident are the distance between the processing position where the laser pulse L3b is incident and the processing position where the laser pulse L4b is incident. This is because it is larger than the distance between them.

  A laser pulse L3a generated by being divided along the optical path A from the laser pulse L3 incident on the AOD 42 during a period when a control signal having a relatively low frequency is applied passes through the galvanometer mirrors 43a and 44 and the fθ lens 45. Then, the laser pulse L3b that is split and generated along the optical path B from the laser pulse L3 that is incident on the processing position of the workpiece 30 and is incident on the AOD 42 during a period in which the control signal having a relatively high frequency is applied is The light enters the workpiece 30 through the galvanometer mirrors 43 b and 44 and the fθ lens 45. The Y coordinate of the processing position where both laser pulses L3a and L3b are incident is equal.

  The control device 60 transmits a control signal for positioning the galvano mirror 43a so that the next laser pulse L4a is incident on a predetermined processing position when the application of the control signal having a relatively low frequency is completed. Upon receiving this, the galvanometer mirror 43a starts moving before the end of the incidence of the laser pulse L3b. Further, the control device 60 causes the next laser pulses L4b, L4a, and L4b to enter the predetermined processing positions with respect to the galvanometer mirrors 43b and 44 when the application of the control signal having a relatively high frequency is completed. The control signal for positioning is transmitted, and the galvanometer mirrors 43b and 44 which have received the control signal start moving.

  The laser pulse L4 is emitted after the galvanometer mirrors 44 and 43b are stationary and the galvanometer mirror 43a is stationary. The control device 60 transmits a trigger signal to the laser light source 40 along with the reception of the stationary signal of the galvano mirror 43a that is stationary the latest.

  The control device 60 continuously applies a relatively low frequency control signal and a relatively high frequency control signal to the AOD 42 along with the transmission of the trigger signal to the laser light source 40, and the optical path A from the laser pulse L 4. The laser pulse L4a is cut out in this order, and the laser pulse L4b in the optical path B is cut out in this order. This is because the distance between the processing position where the laser pulse L4a is incident and the processing position where the laser pulse L5a is incident are the distance between the processing position where the laser pulse L4b is incident and the processing position where the laser pulse L5b is incident. This is because it is larger than the distance between them.

  The laser pulses L4a and L4b are incident on the machining position where the Y coordinate of the workpiece 30 is equal. The galvanometer mirrors 43a, 43b, and 44 start moving at a predetermined timing so that the next laser pulses L5a and L5b are incident on a predetermined processing position under the control of the control device 60.

  A stationary signal is transmitted to the control device 60 from the galvanometer mirrors 43b, 43a, 44 that have been positioned, but the positioning of the incident positions of the next laser pulses L5a, L5b has been completed since the previous laser pulse L4 was emitted. Since the time for the shortest cycle at which the laser pulse can be emitted has not elapsed, the control device 60 emits the laser pulse L5 after the time for the shortest cycle has elapsed, and is relative to the AOD 42. A low-frequency control signal and a relatively high-frequency control signal are continuously applied to the laser pulse L5, and the laser pulse L5a in the optical path A and the laser pulse L5b in the optical path B are cut out in this order. The distance between the processing position where the laser pulse L5a is incident and the processing position where the laser pulse L6a is incident are the distance between the processing position where the laser pulse L5b is incident and the processing position where the laser pulse L5b is incident. It is because it is larger than.

  The laser pulses L5a and L5b are incident on the machining position where the Y coordinate of the workpiece 30 is equal. The galvanometer mirrors 43a, 43b, and 44 start moving at a predetermined timing so that the next laser pulses L6a and L6b are incident on a predetermined processing position under the control of the control device 60.

  The laser pulse L6 is emitted after the galvanometer mirrors 43b and 44 are stationary and the galvanometer mirror 43a is stationary. The control device 60 transmits a trigger signal to the laser light source 40 along with the reception of the stationary signal of the galvano mirror 43a that is stationary the latest.

  The control device 60 continuously applies a relatively high frequency control signal and a relatively low frequency control signal to the AOD 42 along with the transmission of the trigger signal to the laser light source 40, and the optical path B from the laser pulse L6. The laser pulse L6b is cut out in this order, and the laser pulse L6a in the optical path A is cut out in this order. The distance between the processing position where the laser pulse L6b is incident and the processing position where the laser pulse L7b is incident are the distance between the processing position where the laser pulse L6a is incident and the processing position where the laser pulse L7a is incident. It is because it is larger than.

  The laser pulses L6b and L6a are incident on the machining position where the Y coordinate of the workpiece 30 is equal. The galvanomirror 43b starts moving when the application of the relatively high frequency control signal ends, and the galvanomirror 43a starts moving when the application of the relatively low frequency control signal ends. The galvanometer mirror 44 remains stationary after the laser pulse L6a is incident. This is because the Y coordinate of the processing position by the next laser pulses L7a and L7b is equal to the Y coordinate of the processing position by the laser pulses L6a and L6b.

  The laser pulse L7 is emitted after the galvanometer mirrors 43a and 43b are stationary. The distance between the processing position where the laser pulse L7b is incident and the processing position where the laser pulse L8b is incident are the distance between the processing position where the laser pulse L7a is incident and the processing position where the laser pulse L8a is incident. Therefore, the AOD 42 is applied in the order of a relatively high frequency control signal and a relatively low frequency control signal. The laser pulse L7b cut out in the optical path B is incident on the processing position on the workpiece 30 via the stationary galvanometer mirrors 43b and 44. The laser pulse L7a cut out in the optical path A is incident on the processing position on the workpiece 30 via the stationary galvanometer mirrors 43a and 44.

  According to the laser processing method of the third embodiment, the laser pulse incident on the current processing position having a large distance to the next processing position is first incident on the work 30 and the movement time (positioning time) is long. By moving the galvanometer mirror first, it is possible to perform processing faster than in the second embodiment.

  For example, the distance between the machining positions where the laser pulses L1a and L2a passing through the galvano mirror 43a are incident and the distance between the processing positions where the laser pulses L1b and L2b passing through the galvano mirror 43b are incident are equal. When the moving times of the mirrors 43a and 43b are equal to each other, any of the laser pulses L1a and L1b may be incident on the workpiece 30 first.

  FIG. 5 is a schematic view showing a laser processing apparatus according to the second embodiment. The laser processing apparatus according to the second embodiment does not include the AOD 42 that selectively distributes the pulse laser beam 80 to the optical path A or the optical path B, branches the laser pulse (energy division), and distributes the laser pulse to the optical path A and the optical path B at the same time. The difference from the laser processing apparatus according to the first embodiment is that a polarizing beam splitter 46 is provided.

  The polarization beam splitter 46 transmits part of the pulse laser beam 80 emitted from the laser light source 40, for example, half, and travels along the optical path A, and reflects the rest and travels along the optical path B. The pulse laser beams 80a and 80b traveling in the optical paths A and B are respectively reflected by folding mirrors 47a and 47b that are fixedly arranged as necessary, and enter the galvano mirrors 43a and 43b, and the galvano mirrors 43a and 43b and The emission direction is changed in the X-axis direction and the Y-axis direction (two-dimensional direction) by the galvanometer mirror 44, and after being condensed by the fθ lens 45, the light enters the processing position of the workpiece 30. The pulse energy and peak power of the pulsed laser beams 80a and 80b incident on the workpiece 30 are, for example, half of those in the case of the laser processing apparatus according to the first embodiment.

  FIG. 6 is a timing chart showing the laser processing method according to the fourth embodiment. The laser processing method according to the fourth embodiment is performed under the control of the control device 60 using the laser processing apparatus according to the second embodiment. The horizontal axis of the timing chart and the vertical axis of each stage are equal to those corresponding in the timing chart shown in FIG. In the drawing, each laser pulse of the pulse laser beam 80 emitted from the laser light source 40 is shown as laser pulses L1 to L7 in the emission order. Further, the laser pulses after the laser pulses L1 to L7 are branched (energy-divided) into the optical paths A and B by the polarization beam splitter 46 are represented as laser pulses L1a to L7a and L1b to L7b, respectively.

  The laser pulse L1 is emitted after the galvanometer mirrors 44 and 43a are stationary and the galvanometer mirror 43b is stationary. The galvanometer mirrors 43a and 43b transmit a galvano stationary signal to the control device 60 when positioning of the incident positions of the laser pulses L1a and L1b along the X-axis direction is completed. When the positioning of the incident positions of the laser pulses L1a and L1b along the Y-axis direction is completed, the galvanometer mirror 44 transmits a galvano stationary signal to the control device 60. The control device 60 transmits a trigger signal to the laser light source 40 after receiving the galvano stationary signal from the galvano mirrors 43a, 43b, and 44 (along with receiving the stationary signal from the latest galvano mirror 43b). In response to this, a laser pulse L1 is emitted. The laser pulse L1 is divided by the polarization beam splitter 46 into a laser pulse L1a traveling on the optical path A and a laser pulse L1b traveling on the optical path B. The laser pulses L1a and L1b are transmitted through the galvanometer mirrors 43a and 43b and the galvanometer mirror 44, respectively. Then, the workpiece 30 enters the machining position having the same Y coordinate at the same time.

  After the emission of the laser pulse L1, the control device 60 transmits a control signal for positioning the galvanometer mirrors 43a, 43b, 44 so that the laser pulse is incident on the next processing position. The galvanometer mirrors 43a, 43b, 44 receive the control signal from the control device 60 and start moving.

  The laser pulse L2 is emitted after the galvano mirrors 43b and 44 are stationary and the galvano mirror 43a is stationary. The laser pulse L2 is divided into laser pulses L2a and L2b traveling in the optical paths A and B by the polarization beam splitter 46. The laser pulses L2a and L2b pass through the galvanometer mirrors 43a and 43b and the galvanometer mirror 44, respectively. Simultaneously enter a processing position having the same Y coordinate.

  After the emission of the laser pulse L2, the control device 60 transmits a control signal that causes the galvanometer mirrors 43a, 43b, and 44 to perform new positioning so that the laser pulse is incident on the next processing position. 43a, 43b, and 44 receive the control signal from the control apparatus 60, and start a movement.

  The laser pulse L3 is emitted after the galvanometer mirrors 43a and 43b are stationary and the galvanometer mirror 44 is stationary. The laser pulses L3a and L3b obtained by dividing the laser pulse L3 into the optical paths A and B by the polarization beam splitter 46 are simultaneously passed through the galvanometer mirrors 43a and 43b and the galvanometer mirror 44 to the machining position where the Y coordinate of the workpiece 30 is equal. Incident.

  After the emission of the laser pulse L3 is completed, the control device 60 transmits a control signal for performing new positioning so that the laser pulse is incident on the galvano mirrors 43a, 43b, and 44, respectively, and the galvano mirror 43a. , 43b, 44 receive the control signal from the control device 60 and start moving.

  The laser pulse L4 is emitted according to the trigger signal of the control device 60 that has received the stationary signals of the galvanometer mirrors 44, 43b, and 43a, and is divided into laser pulses L4a and L4b by the polarization beam splitter 46. The laser pulses L4a and L4b are simultaneously incident on the workpiece 30 having the same Y coordinate through the galvanometer mirrors 43a and 43b and the galvanometer mirror 44, respectively. After the emission of the laser pulse L4 is completed, the galvanometer mirrors 43a, 43b, and 44 start moving.

  The positioning of the laser pulse incident position by the galvanometer mirrors 43a, 43b, 44 is completed, and the control signal 60 receives the stationary signal from the galvanometer mirrors 43a, 43b, 44. However, since the time when the positioning of the galvano mirrors 43a, 43b, 44 is completed is the time when the shortest period of time during which the laser pulse can be emitted has not elapsed since the emission of the laser pulse L4, the laser pulse L5 is equivalent to the shortest period. After the elapse of time elapses. The laser pulse L5 is divided into laser pulses L5a and L5b by the polarization beam splitter 46. The laser pulses L5a and L5b are processed positions having the same Y coordinate of the workpiece 30 via the galvanometer mirrors 43a and 43b and the galvanometer mirror 44, respectively. Incident simultaneously. After the emission of the laser pulse L5 is completed, the galvanometer mirrors 43a, 43b, and 44 start moving.

  The laser pulse L6 is emitted after the control device 60 receives a stationary signal from the galvanometer mirrors 43b, 44, 43a, and the laser pulses L6a, L6b obtained by dividing the laser pulse L6 by the polarization beam splitter 46 are respectively galvanometer mirror 43a, 43b and the galvanometer mirror 44 enter the workpiece 30 at the same processing position having the same Y coordinate.

  After the emission of the laser pulse L6 is completed, the galvanometer mirrors 43a and 43b start to move. The galvano mirror 44 maintains a stationary state. This is because the Y coordinate of the processing position by the next laser pulses L7a and L7b is equal to the Y coordinate of the processing position by the laser pulses L6a and L6b.

  The laser pulse L7 is emitted after the galvanometer mirrors 43a and 43b are stopped, and the laser pulses L7a and L7b separated by the polarization beam splitter 46 are transmitted through the galvanometer mirrors 43a and 43b and the galvanometer mirror 44, respectively. Simultaneously enter a processing position having the same Y coordinate. After the emission of the laser pulse L7 is finished, the galvanometer mirrors 43a, 43b, 44 start moving.

  In this example, the galvanometer mirror 44 is in a stationary state from the time when the laser pulse L6 is emitted until the end of the emission of the laser pulse L7, but the X coordinate of the processing position by the laser pulse L7a is X of the processing position by the laser pulse L6a. When equal to the coordinates, control is performed not to move the galvanometer mirror 43a. Further, when the X coordinate of the processing position by the laser pulse L7b is equal to the X coordinate of the processing position by the laser pulse L6b, control is performed not to move the galvano mirror 43b. As described above, when the X coordinate or the Y coordinate of the processing position by the next laser pulse is equal, control is performed so that either one of the galvanometer mirrors 43a, 43b, 44 or both the galvanometer mirrors 43a, 43b is not moved. It is possible.

  According to the laser processing method of the fourth embodiment, for example, two shots of laser pulses can be simultaneously incident on a workable range that is a square region having a side of 50 mm, so that the processing speed can be increased. However, in the laser processing method according to the first embodiment, for example, a laser pulse is emitted in a state where one of the galvano mirrors 43a and 43b and the galvano mirror 44 are stationary, but in the laser processing method according to the fourth embodiment, Since the three galvanometer mirrors 43a, 43b and 44 emit laser pulses in a stationary state, the processing speed may be slower than in the first embodiment.

  FIG. 7 is a schematic view showing a laser processing apparatus according to the third embodiment. Using the laser processing apparatus according to the third embodiment, two workpieces 31 and 32 are simultaneously processed. The workpieces 31 and 32 are printed circuit boards similar to the workpiece 30, for example. The distribution optical system 48 is an optical system that can selectively or simultaneously distribute the incident laser beam 80 to two different optical paths A and B, such as an AOD and a polarization beam splitter. The pulse laser beam 80a distributed to the optical path A by the distribution optical system 48 enters the processing position of the work 31 via the galvanometer mirrors 43a and 44 and the fθ lens 45, and the work 31 is punched. . The pulse laser beam 80b distributed to the optical path B by the distribution optical system 48 enters the processing position of the work 32 via the galvano mirrors 43b and 44 and the fθ lens 45, and the work 32 is punched. . The processing patterns (hole patterns) of the workpieces 31 and 32 may be equal or different. Using the laser processing apparatus according to the third embodiment, for example, the laser processing methods according to the first to fourth embodiments can be performed, and the two workpieces 31 and 32 can be drilled at high speed. .

  FIG. 8 is a schematic view showing a laser processing apparatus according to the fourth embodiment. The laser processing apparatus according to the first to third embodiments is a 1fθ, 2-axis laser processing apparatus that includes three galvanometer mirrors 43a, 43b, 44, and an fθ lens 45 and performs processing with two processing axes. there were. The laser processing apparatus according to the fourth embodiment is a 2fθ, 4-axis laser processing apparatus having two sets of two-axis processing units each including three galvanometer mirrors and an fθ lens.

  The pulsed laser beam 80 emitted from the laser light source 40 in response to the trigger signal from the control device 60 passes through the light-transmitting region of the mask 41 so that the cross-sectional shape is shaped and enters the AOD 42. The control device 60 can distribute the pulse laser beam 80 to the optical paths A to D in order from the smaller deflection angle by applying control signals having four different frequencies α to δ to the AOD 42. In this figure, the laser beams traveling along the optical paths A to D are represented as pulsed laser beams 81a, 81b, 82a, and 82b, respectively. Note that α, β, γ, and δ are in order from the lowest frequency.

  The pulse laser beams 81a, 81b, 82a, and 82b are incident on the galvanometer mirrors 51a, 51b, 54a, and 54b and deflected, and then the pulse laser beams 81a and 81b are staged via the galvanometer mirror 52 and the fθ lens 53. The pulse laser beams 82 a and 82 b are incident on the workpiece 34 held on the stage 72 via the galvanometer mirror 55 and the fθ lens 56. Stages 71 and 72 are, for example, XYθ stages. The workpieces 33 and 34 are printed boards similar to the workpiece 30, for example.

  The galvanometer mirrors 51a and 54a, the galvanometer mirrors 51b and 54b, the galvanometer mirrors 52 and 55, and the fθ lenses 53 and 56 are respectively the galvanometer mirror 43a, the galvanometer mirror 43b, the galvanometer mirror 44, and the fθ lens 45 in the first to third embodiments. And have the same function.

  When the pulsed laser beams 81a, 81b, 82a, and 82b are incident, holes having a shape corresponding to the shape of the light transmitting region of the mask 41 are formed in the workpieces 33 and 34.

  FIG. 9 is a timing chart showing the laser processing method according to the fifth embodiment. The laser processing method according to the fifth embodiment is performed under the control of the control device 60 using the laser processing apparatus according to the fourth embodiment. The horizontal axis of the timing chart and the vertical axis of each stage are the same as those in the timing chart shown in FIG. In the drawing, each laser pulse of the pulse laser beam 80 emitted from the laser light source 40 is represented as laser pulses L1 to L8 in the emission order.

  In the laser processing method according to the fifth embodiment, the AOD 42 is used, and a laser pulse that travels in any two of the optical paths A to D is temporally divided and generated from each of the laser pulses Ln (n = 1 to 8). To do. Some of the laser pulses Ln cut out in the optical paths A, B, C, and D are represented as Lna, Lnb, Lnc, and Lnd, respectively. The pulse widths of two laser pulses cut out from each laser pulse Ln are equal to each other, for example.

  In the fifth embodiment, as an example, two laser pulses are generated in time division from each laser pulse Ln, one of which can be processed via the fθ lens 53 and the other can be processed via the fθ lens 56. Incident into the range. Further, when one is distributed to the optical path A (galvanomirror 51a), the other is distributed to the optical path C (galvanomirror 54a), and when one is distributed to the optical path B (galvanomirror 51b), the other is distributed to the optical path D (galvanomirror 54b). Distribute.

  The laser pulse L1 is emitted after the galvano mirrors 55, 52, and 51a are stationary and the galvano mirror 54a is stationary. The galvanometer mirrors 51a and 54a transmit a galvano stationary signal to the control device 60 when the positioning of the incident positions of the laser pulses L1a and L1c along the X-axis direction is completed. The galvano mirrors 52 and 55 transmit a galvano stationary signal to the control device 60 when positioning of the incident positions of the laser pulses L1a and L1c along the Y-axis direction is completed. The control device 60 transmits a trigger signal to the laser light source 40 along with the reception of the galvano stationary signal from the galvano mirror 54a that is stationary the latest. The laser light source 40 emits a laser pulse L1.

  The control device 60 continuously applies the control signal of the frequency α and the control signal of the frequency γ to the AOD 42 in this order along with the transmission of the trigger signal to the laser light source 40. The application of the control signal with the frequency γ is canceled simultaneously with the end of the emission of the laser pulse L1, for example.

  In this figure, a control signal with a relatively low frequency is applied simultaneously with the start of emission of all the laser pulses L1 to L8, and a control signal with a relatively high frequency is canceled simultaneously with the end of emission. As shown, the start and release of application of the control signal need not coincide with the start and end of emission of the laser pulses L1 to L8.

  From the laser pulse L1 incident on the AOD 42 during the period when the control signal of the frequency α is applied, the laser pulse L1a traveling in the optical path A is generated in a time division manner. A laser pulse L1c traveling in the optical path C is temporally divided and generated from the laser pulse L1 incident on the AOD 42 during the period when the control signal of the frequency γ is applied. The laser pulse L1a is incident on the work position of the workpiece 33 via the galvanometer mirror 51a, the galvanometer mirror 52, and the fθ lens 53. Further, the laser pulse L1c enters the processing position of the workpiece 34 via the galvano mirror 54a, the galvano mirror 55, and the fθ lens 56.

  The control device 60 transmits a control signal for positioning to the galvanometer mirrors 51a and 52 when the application of the control signal of the frequency α is completed. The galvanometer mirrors 51a and 52 receive the control signal from the control device 60 and start moving before the end of the incidence of the laser pulse L1c. Further, the control device 60 transmits a control signal for positioning to the galvanometer mirrors 54a and 55 at the end of the application of the control signal of the frequency γ. The galvanometer mirrors 54a and 55 start to move in response to a control signal from the control device 60. The galvanometer mirrors 51b and 54b to which the laser pulses L1a and L1c generated from the laser pulse L1 do not enter move while the workpieces 33 and 34 are irradiated with the laser pulses L1a and L1c.

  The laser pulse L2 is emitted after the galvano mirrors 55, 51b, 52 are stationary and the galvano mirror 54b is stationary. From each of the galvanometer mirrors 55, 51b, 52, 54b, a galvano stationary signal is transmitted to the control device 60, and the control device 60 transmits a trigger signal to the laser light source 40 along with receiving the stationary signal of the galvano mirror 54b that has been stationary most slowly. To do. The laser light source 40 emits a laser pulse L2.

  The control device 60 sequentially applies a control signal having a frequency β and a control signal having a frequency δ to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40.

  A laser pulse L2b generated by being divided along the optical path B from the laser pulse L2 incident on the AOD 42 during the period in which the control signal of the frequency β is applied is transmitted through the galvanometer mirrors 51b and 52 and the fθ lens 53. It is incident on 33 processing positions. Further, a laser pulse L2d generated by being divided along the optical path D from the laser pulse L2 incident on the AOD 42 during the period when the control signal of the frequency δ is applied passes through the galvanometer mirrors 54b and 55 and the fθ lens 56. Then, it enters the processing position of the workpiece 34.

  The control device 60 transmits a control signal for positioning to the galvanometer mirrors 51b and 52 at the end of the application of the control signal of the frequency β, and the galvanometer mirrors 51b and 52 having received the control signal end the incidence of the laser pulse L2d. Start moving forward. The control device 60 transmits a control signal for positioning to the galvanometer mirrors 54b and 55 upon completion of the application of the control signal of the frequency δ, and the galvanometer mirrors 54b and 55 that have received the control signal start moving. . The galvanometer mirrors 51a and 54a to which the laser pulses L2b and L2d generated from the laser pulse L2 are not incident move while the workpieces 33 and 34 are irradiated with the laser pulses L2b and L2d.

  The laser pulse L3 is emitted after the galvano mirrors 51a, 54a, and 55 are stationary and the galvano mirror 52 is stationary. From each of the galvanometer mirrors 51 a, 54 a, 55, 52, a galvano stationary signal is transmitted to the control device 60, and the control device 60 transmits a trigger signal to the laser light source 40 along with receiving the stationary signal of the latest stationary galvano mirror 52. In response to this, the laser light source 40 emits a laser pulse L3.

  The control device 60 sequentially applies a control signal having a frequency α and a control signal having a frequency γ to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40.

  A laser pulse L3a generated by being divided along the optical path A from the laser pulse L3 incident on the AOD 42 during the period when the control signal of the frequency α is applied is transmitted through the galvanometer mirrors 51a and 52 and the fθ lens 53. The laser pulse L3c generated by being divided along the optical path C from the laser pulse L3 incident on the processing position 33 and applied to the AOD 42 during the period in which the control signal of the frequency γ is applied is obtained by galvanometer mirrors 54a, 55, Then, the light enters the processing position of the workpiece 34 via the fθ lens 56.

  The control device 60 transmits a control signal for positioning to the galvanometer mirrors 51a and 52 at the end of the application of the control signal of the frequency α, and the galvanometer mirrors 51a and 52 having received the control signal end the incidence of the laser pulse L3c. Start moving forward. The control device 60 transmits a control signal for positioning to the galvanometer mirrors 54a and 55 upon completion of the application of the control signal of the frequency γ, and the galvanometer mirrors 54a and 55 that have received the control signal start moving. . The galvanometer mirrors 51b and 54b to which the laser pulses L3a and L3c generated from the laser pulse L3 are not incident move while the workpieces 33 and 34 are irradiated with the laser pulses L3a and L3c.

  The laser pulse L4 is emitted after the galvano mirrors 52, 51b, and 55 are stationary and the galvano mirror 54b is stationary. The control device 60 transmits a trigger signal to the laser light source 40 at the same time as receiving the stationary signal of the galvano mirror 54b that has been stationary most recently.

  The control device 60 transmits a trigger signal to the laser light source 40 and sequentially applies a control signal having a frequency β and a control signal having a frequency δ to the AOD 42 in order, and the laser pulse L4b is transferred from the laser pulse L4 to the optical path B. The laser pulse L4d is cut out in the optical path D. The galvanometer mirrors 51b, 52, 54b, and 55 start moving at a predetermined timing under the control of the control device 60. The galvanometer mirrors 51a and 54a to which the laser pulses L4b and L4d generated from the laser pulse L4 are not incident move while the workpieces 33 and 34 are irradiated with the laser pulses L4b and L4d.

  A stationary signal is transmitted from the galvanometer mirrors 51a, 54a, 52, and 55 that have been positioned to the control device 60. When the next laser pulses L5a and L5c are positioned at the incident position, the last laser pulse L4 is emitted. Therefore, since the time for the shortest cycle in which the laser pulse can be emitted has not elapsed, the control device 60 emits the laser pulse L5 after the time for the shortest cycle has elapsed, and the AOD 42 A control signal of frequency α and a control signal of frequency γ are successively applied in order, and a laser pulse L5a is cut out from the laser pulse L5 to the optical path A and a laser pulse L5c is cut out from the optical path C. The galvanometer mirrors 51 a, 52, 54 a and 55 start moving at a predetermined timing under the control of the control device 60. The galvanometer mirrors 51b and 54b to which the laser pulses L5a and L5c generated from the laser pulse L5 are not incident move while the workpieces 33 and 34 are irradiated with the laser pulses L5a and L5c.

  The laser pulse L6 is emitted after the galvano mirrors 51b, 52, and 55 are stationary and the galvano mirror 54b is stationary. The control device 60 transmits a trigger signal to the laser light source 40 at the same time as receiving the stationary signal of the galvano mirror 54b that has been stationary most recently.

  The control device 60 transmits a trigger signal to the laser light source 40 and sequentially applies a control signal having a frequency β and a control signal having a frequency δ to the AOD 42 in order, and the laser pulse L6b is transferred from the laser pulse L6 to the optical path B. The laser pulse L6d is cut out in the optical path D. The laser pulses L6b and L6d are incident on the processing positions of the workpieces 33 and 34, respectively.

  The galvano mirror 51b starts to move with the end of the application of the control signal of the frequency β, but the galvano mirror 52 remains stationary even after the laser pulse L6b is incident. This is because the Y coordinate of the processing position by the laser pulse L7a, which is distributed from the next laser pulse L7 to the processable range of the fθ lens 53, is equal to the Y coordinate of the processing position by the laser pulse L6b. The galvanometer mirrors 54b and 55 start moving when the application of the control signal with the frequency δ ends. The galvanometer mirrors 51a and 54a to which the laser pulses L6b and L6d generated from the laser pulse L6 are not moved move while the workpieces 33 and 34 are irradiated with the laser pulses L6b and L6d.

  The laser pulse L7 is emitted after the galvanometer mirrors 54a, 55, 51a are stationary. The laser pulse L7a cut out in the optical path A by the AOD 42 enters the processing position of the workpiece 33 via the stationary galvanometer mirrors 51a and 52. The laser pulse L7c cut out in the optical path C is incident on the processing position on the workpiece 34 via the galvanometer mirrors 54a and 55. The galvanometer mirrors 51a, 52, 54a, and 55 start moving at a predetermined timing under the control of the control device 60. The galvanometer mirrors 51b and 54b to which the laser pulses L7a and L7c generated from the laser pulse L7 do not enter move while the workpieces 33 and 34 are irradiated with the laser pulses L7a and L7c.

  The laser pulse L8 is emitted after the galvanometer mirrors 52, 55, and 54a are stationary, and further after the galvanometer mirror 51a is stationary, and after being distributed to the optical paths A and C by the AOD 42, the laser pulse L8 passes through the galvanometer mirrors 51a and 54a, respectively. Incident at a predetermined processing position. During this time, the galvanometer mirrors 51b and 54b continue to move. Processing is continuously performed by a laser pulse passing through the galvanometer mirrors 51a and 54a.

  In the laser processing method according to the fifth embodiment, at least one of the galvanometer mirrors 51a, 51b, 54a, and 54b on the optical paths A to D where the laser pulse is not distributed by the AOD 42 when the laser pulse is emitted is for positioning. Move to. For example, while performing processing by allocating two laser pulses generated in a time division manner from one laser pulse incident on the AOD 42 to the optical path A and the optical path C, the galvanometer mirrors 51b and 54b are moved, During the subsequent positioning of the laser pulse and processing by dividing the two laser pulses generated by time division from one laser pulse incident on the AOD 42 into the optical path B and the optical path D, the galvanometer mirror 51a, At least one of 54a is moved to perform subsequent laser pulse positioning. For this reason, the processing speed can be increased. In the laser processing method according to the fifth embodiment, the peak power of each laser pulse applied to the workpieces 33 and 34 is equal to that of the pulse laser beam 80 emitted from the laser light source 40.

  In the laser processing method according to the fifth embodiment, the control signal is applied to the AOD 42 in the order of a control signal having a relatively low frequency and a control signal having a relatively high frequency. Like the laser processing method, the laser pulse may be cut out first toward the current processing position where the distance between the current processing position and the next processing position is relatively large.

  In the laser processing method according to the fifth embodiment, each of the laser pulses L1 to L8 is temporally divided and distributed to both the processable range of the fθ lens 53 and the processable range of the fθ lens 56. Each of the laser pulses L1 to L8 is not divided in terms of time, but selectively one of either the workable range of the fθ lens 53 and the workable range of the fθ lens 56, that is, one of the optical paths A to D. A laser processing method can also be used. In that case, three galvanometer mirrors on the fθ lens side to which the laser pulse is not distributed by the AOD 42 when the laser pulse is emitted, and a galvano mirror on the optical path to which the laser pulse is distributed but on the fθ lens side to which the laser pulse is not distributed. At least one of the mirrors 51a, 51b, 54a, 54b moves for positioning. According to this laser processing method (a modification of the laser processing method according to the fifth embodiment), the pulse energy and peak power of each laser pulse are made equal to that of the pulse laser beam 80 emitted from the laser light source 40, and Processing can be performed.

  FIG. 10 is a timing chart showing the laser processing method according to the sixth embodiment. The laser processing method according to the sixth embodiment is performed under the control of the control device 60 using the laser processing apparatus according to the fourth embodiment. The horizontal axis of the timing chart and the vertical axis of each stage are the same as those in the timing chart shown in FIG.

  In the laser processing method according to the fifth embodiment, two laser pulses are divided and generated from each laser pulse Ln in terms of time, and one is processed through the fθ lens 53 and the other is processed through the fθ lens 56. In the laser processing method according to the sixth embodiment, the two laser pulses generated by time division from each laser pulse Ln are both passed through the fθ lens 53 for each laser pulse Ln. The laser beam is selectively incident on one of the processable range to be processed and the processable range via the fθ lens 56.

  The laser pulse L1 is emitted after the galvanometer mirrors 52 and 51a are stationary and the galvanometer mirror 51b is stationary. The galvanometer mirrors 51a and 51b transmit a galvano stationary signal to the control device 60 when the positioning of the incident positions of the laser pulses L1a and L1b along the X-axis direction is completed. When the positioning of the incident positions of the laser pulses L1a and L1b along the Y-axis direction is completed, the galvanometer mirror 52 transmits a galvano stationary signal to the control device 60. The control device 60 transmits a trigger signal to the laser light source 40 together with the reception of the galvano stationary signal from the galvano mirror 51b that is stationary most recently. The laser light source 40 emits a laser pulse L1.

  The control device 60 continuously applies the control signal of the frequency α and the control signal of the frequency β to the AOD 42 in this order along with the transmission of the trigger signal to the laser light source 40. The application of the control signal with the frequency β is canceled simultaneously with the end of the emission of the laser pulse L1, for example.

  From the laser pulse L1 incident on the AOD 42 during the period when the control signal of the frequency α is applied, the laser pulse L1a traveling in the optical path A is generated in a time division manner. Further, a laser pulse L1b traveling in the optical path B is temporally divided and generated from the laser pulse L1 incident on the AOD 42 during the period when the control signal of the frequency β is applied. The laser pulse L1a passes through the galvanometer mirror 51a, the galvanometer mirror 52, and the fθ lens 53, and the laser pulse L1b passes through the galvanometer mirror 51b, the galvanometer mirror 52, and the fθ lens 53, respectively. Incident at the processing position. The Y coordinate of the processing position where both laser pulses L1a and L1b are incident is equal to each other.

  The control device 60 transmits a control signal for positioning to the galvano mirror 51a when the application of the control signal of the frequency α is completed. The galvanometer mirror 51a receives the control signal from the control device 60 and starts moving before the end of the incidence of the laser pulse L1b. Further, the control device 60 transmits a control signal for positioning to the galvanometer mirrors 51b and 52 at the end of the application of the control signal of the frequency β. The galvanometer mirrors 51b and 52 start to move in response to the control signal from the control device 60. The galvanometer mirrors 54a, 54b, 55 to which the laser pulses L1a, L1b generated from the laser pulse L1 do not enter move while the workpiece 33 is irradiated with the laser pulses L1a, L1b.

  The laser pulse L2 is emitted after the galvanometer mirrors 55 and 54a are stationary and the galvanometer mirror 54b is stationary. From each of the galvanometer mirrors 55, 54a, 54b, a galvano stationary signal is transmitted to the control device 60, and the control device 60 transmits a trigger signal to the laser light source 40 along with reception of the stationary signal of the latest stationary galvano mirror 54b. The laser light source 40 emits a laser pulse L2.

  The control device 60 sequentially applies a control signal having a frequency γ and a control signal having a frequency δ to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40.

  A laser pulse L2c generated by being divided along the optical path C from the laser pulse L2 incident on the AOD 42 during the period when the control signal of the frequency γ is applied passes through the galvanometer mirrors 54a and 55 and the fθ lens 56. Further, a laser pulse L2d generated by being divided along the optical path D from the laser pulse L2 incident on the AOD 42 during the period when the control signal of the frequency δ is applied passes through the galvanometer mirrors 54b and 55 and the fθ lens 56. Then, the light enters the work position of the workpiece 34. The Y coordinate of the processing position where both laser pulses L2c and L2d are incident is equal to each other.

  The control device 60 transmits a control signal for positioning to the galvanometer mirror 54a at the end of the application of the control signal of the frequency γ, and the galvanometer mirror 54a receiving the control signal moves before the end of the incidence of the laser pulse L2d. Start. The control device 60 transmits a control signal for positioning to the galvanometer mirrors 54b and 55 upon completion of the application of the control signal of the frequency δ, and the galvanometer mirrors 54b and 55 that have received the control signal start moving. . The galvanometer mirrors 51a, 51b, 52 on which the laser pulses L2c, L2d generated from the laser pulse L2 are not incident move while the workpiece 34 is irradiated with the laser pulses L2c, L2d.

  The laser pulse L3 is emitted after the galvanometer mirrors 51a and 51b are stationary and the galvanometer mirror 52 is stationary. From each of the galvanometer mirrors 51a, 51b, 52, a galvano stationary signal is transmitted to the control device 60. The control device 60 transmits a trigger signal to the laser light source 40 along with the stationary signal reception of the latest stationary galvano mirror 52, In response to this, the laser light source 40 emits a laser pulse L3.

  The control device 60 sequentially applies a control signal with a frequency α and a control signal with a frequency β to the AOD 42 in order, along with transmission of a trigger signal to the laser light source 40.

  A laser pulse L3a generated by being divided along the optical path A from the laser pulse L3 incident on the AOD 42 during the period when the control signal of the frequency α is applied passes through the galvanometer mirrors 51a, 52 and the fθ lens 53, Further, a laser pulse L3b generated by being divided along the optical path B from the laser pulse L3 incident on the AOD 42 during the period when the control signal of the frequency β is applied passes through the galvanometer mirrors 51b and 52 and the fθ lens 53. Then, the light enters the processing position of the workpiece 33.

  The control device 60 transmits a control signal for positioning to the galvanometer mirror 51a at the end of the application of the control signal of the frequency α, and the galvanometer mirror 51a that receives the control signal moves before the end of the incidence of the laser pulse L3b. Start. The control device 60 transmits a control signal for positioning to the galvanometer mirrors 51b and 52 when the application of the control signal of the frequency β is completed, and the galvanometer mirrors 51b and 52 that have received the control signal start moving. . The galvanometer mirrors 54a, 54b, 55 to which the laser pulses L3a, L3b generated from the laser pulse L3 are not incident move while the workpiece 33 is irradiated with the laser pulses L3a, L3b.

  The laser pulse L4 is emitted after the galvanometer mirrors 55 and 54a are stationary and the galvanometer mirror 54b is stationary. The control device 60 transmits a trigger signal to the laser light source 40 at the same time as receiving the stationary signal of the galvano mirror 54b that has been stationary most recently.

  The control device 60 sequentially applies a control signal having a frequency γ and a control signal having a frequency δ to the AOD 42 together with the transmission of a trigger signal to the laser light source 40, and the laser pulse L 4 c, from the laser pulse L 4 to the optical path C, A laser pulse L4d is cut out in the optical path D. The galvanometer mirrors 54 a, 54 b and 55 start moving at a predetermined timing under the control of the control device 60. The galvanometer mirrors 51a, 51b, 52 on which the laser pulses L4c, L4d generated from the laser pulse L4 are not incident move while the workpiece 34 is irradiated with the laser pulses L4c, L4d.

A stationary signal is transmitted to the control device 60 from the galvanometer mirrors 51b, 52, 51a that have been positioned, but when the positioning of the incident positions of the next laser pulses L5a, L5b has been completed, Since the time corresponding to the shortest cycle at which the laser pulse can be emitted has not elapsed, the control device 60 emits the laser pulse L5 after the time corresponding to the shortest cycle has elapsed, and the frequency α And the control signal of frequency β are successively applied in sequence, and the laser pulse L5a is cut out from the laser pulse L5 to the optical path A, and the laser pulse L5b is cut out from the optical path B. The galvano mirrors 51a and 51b start moving at a predetermined timing under the control of the control device 60, but the galvano mirror 52 remains stationary even after the laser pulse L5b is incident. This is because the Y coordinate of the processing position when the laser pulses L7a and L7b are subsequently incident on the galvanometer mirrors 51a and 51b to perform processing is equal to the Y coordinate of the processing position by the laser pulses L5a and L5b.
The galvanometer mirrors 54a, 54b, 55 to which the laser pulses L5a, L5b generated from the laser pulse L5 are not incident move while the workpiece 33 is irradiated with the laser pulses L5a, L5b.

  The laser pulse L6 is emitted after the galvanometer mirrors 55 and 54a are stationary and the galvanometer mirror 54b is stationary. The control device 60 transmits a trigger signal to the laser light source 40 at the same time as receiving the stationary signal of the galvano mirror 54b that has been stationary most recently.

  The control device 60 transmits a trigger signal to the laser light source 40 and sequentially applies a control signal having a frequency γ and a control signal having a frequency δ to the AOD 42 in order, so that the laser pulse L6c is transferred from the laser pulse L6 to the optical path C. The laser pulse L6d is cut out in the optical path D. The laser pulses L6c and L6d are incident on the work position of the workpiece 34, respectively.

  The galvanometer mirrors 54a, 54b, and 55 start moving at a predetermined timing. The galvanometer mirrors 51a and 51b to which the laser pulses L6c and L6d generated from the laser pulse L6 do not enter move while the workpiece 34 is irradiated with the laser pulses L6c and L6d.

  The laser pulse L7 is emitted after the galvano mirror 51b is stationary and the galvano mirror 51a is stationary. The laser pulse L7a cut out in the optical path A by the AOD 42 passes through the galvano mirrors 51a and 52 in a stationary state, and the laser pulse L7b cut out in the optical path B passes through the galvano mirrors 51b and 52, Each is incident on a work position on the workpiece 33 having the same Y coordinate. The galvanometer mirrors 51a, 51b, 52 start to move at a predetermined timing under the control of the control device 60. The galvanometer mirrors 54a, 54b, 55 to which the laser pulses L7a, L7b generated from the laser pulse L7 do not enter move while the workpiece 33 is irradiated with the laser pulses L7a, L7b.

  The laser pulse L8 is emitted after the galvanometer mirrors 52 and 51b are stationary, and further the galvanometer mirror 51a is stationary. After being distributed to the optical paths A and B by the AOD 42, the laser pulse L8 is respectively transmitted through the galvanometer mirrors 51a and 51b. Incident at the processing position. During this time, the galvanometer mirrors 54a and 54b continue to move. In the example shown in this figure, the galvanometer mirror 55 is stationary during the emission of the laser pulse L8. Both the laser pulses L7 and L8 are propagated to the workable range of the fθ lens 53, and the machining of the work position within the workable range of the fθ lens 53 is continuously performed.

  For example, when the laser pulse L7 is emitted, at least one of the galvanometer mirrors 54a, 54b, and 55 is moving, and when at least one of them is also moving when the laser pulse L8 is emitted, the laser pulses L7 and L8 are: Then, it is propagated to the workable range of the fθ lens 53.

  In the laser processing method according to the sixth embodiment, at the time of emitting a laser pulse, at least one of the three galvanometer mirrors on the fθ lens side to which the laser pulse is not distributed by the AOD 42 moves. For this reason, the processing speed can be increased. In the laser processing method according to the sixth embodiment, the laser pulse can be cut out first toward the current processing position where the distance between the current processing position and the next processing position is relatively large. Is possible.

  FIG. 11 is a schematic view showing a laser processing apparatus according to the fifth embodiment. The laser processing apparatus according to the fifth embodiment is arranged on the optical path of the pulsed laser beam split by the polarization beam splitter and the polarization beam splitter that splits the pulse laser beam (energy splitting) and splits it into two optical paths at the same time. Two AODs. Each of the two AODs can emit an incident pulsed laser beam selectively to one of the two optical paths for each laser pulse or to be distributed to both with a slight time difference. A sorting optical system that includes a polarizing beam splitter and two AODs and can divide the pulse laser beam in four directions is configured.

  The pulse laser beam 80 emitted from the laser light source 40 passes through the light transmitting region of the mask 41 and enters the polarization beam splitter 46. The polarization beam splitter 46 reflects a part, for example, half of the pulsed laser beam 80 emitted from the laser light source 40 and travels along the optical path A, and transmits the remaining part and travels along the optical path B. The pulse laser beams 80A and 80B traveling in the optical paths A and B are incident on the AODs 42a and 42b, respectively.

  The AOD 42a can distribute the pulse laser beam 80A into the optical path Aa and the optical path Ab. When distributing to the optical path Aa, a control signal having a relatively low frequency is applied to the AOD 42a, and when distributing to the optical path Ab, a control signal having a relatively high frequency is applied to the AOD 42a.

  The AOD 42b can distribute the pulse laser beam 80B to the optical path Ba and the optical path Bb. When distributing to the optical path Ba, a control signal having a relatively low frequency is applied to the AOD 42b, and when distributing to the optical path Bb, a control signal having a relatively high frequency is applied to the AOD 42b. The pulse laser beams traveling in the optical paths Aa, Ab, Ba, and Bb are denoted as pulse laser beams 80Aa, 80Ab, 80Ba, and 80Bb, respectively.

  The pulse laser beam 80Aa distributed to the optical path Aa by the AOD 42a is deflected by the galvanometer mirror 51a and the galvanometer mirror 52, collected by the fθ lens 53, and incident on the processing position of the workpiece 33 held on the stage 71. Similarly, the pulse laser beam 80Ab distributed to the optical path Ab by the AOD 42a enters the processing position of the workpiece 33 via the galvanometer mirrors 51b and 52 and the fθ lens 53.

  The pulse laser beam 80Ba distributed to the optical path Ba by the AOD 42b is deflected by the galvanometer mirror 54a and the galvanometer mirror 55, collected by the fθ lens 56, and incident on the processing position of the workpiece 34 held on the stage 72. Similarly, the pulse laser beam 80Bb distributed to the optical path Bb by the AOD 42b enters the processing position of the workpiece 34 via the galvanometer mirrors 54b and 55 and the fθ lens 56.

  FIG. 12 is a timing chart showing the laser processing method according to the seventh embodiment. The laser processing method according to the seventh embodiment is performed under the control of the control device 60 using the laser processing apparatus according to the fifth embodiment. The horizontal axis of the timing chart and the vertical axis of each stage are the same as those in the timing chart shown in FIG. In the drawing, each laser pulse of the pulse laser beam 80 emitted from the laser light source 40 is represented as laser pulses L1 to L8 in the emission order.

  In the laser processing method according to the seventh embodiment, any two of the optical paths Aa, Ab, Ba and Bb are used from each of the laser pulses Ln (n = 1 to 8) using the deflection beam splitter 46 and the AODs 42a and 42b. A laser pulse that travels through is generated. A part of the laser pulse Ln traveling along the optical paths Aa, Ab, Ba, and Bb is represented as LnAa, LnAb, LnBa, and LnBb, respectively.

  In the fifth embodiment, each laser pulse Ln is equally divided into two laser pulses, and one is incident on a workable range via the fθ lens 53 and the other is incident on a workable range via the fθ lens 56. Furthermore, when one is distributed to the optical path Aa (galvanomirror 51a), the other is distributed to the optical path Ba (galvanomirror 54a), and when one is distributed to the optical path Ab (galvanomirror 51b), the other is distributed to the optical path Bb (galvanomirror 54b). Distribute.

  The laser pulse L1 is emitted after the galvano mirrors 55, 52, and 54a are stationary and the galvano mirror 51a is stationary. The control device 60 transmits a trigger signal to the laser light source 40 along with the reception of the stationary signal of the galvano mirror 51a that is stationary the latest. In response to this, the laser light source 40 emits a laser pulse L1. The control device 60 applies a control signal having a relatively low frequency to the AODs 42 a and 42 b along with the transmission of the trigger signal to the laser light source 40. Laser pulses that are split with equal energy along the optical paths A and B by the deflecting beam splitter 46 and enter the AODs 42a and 42b are distributed to the optical paths Aa and Ba, respectively. The laser pulse L1Aa is incident on the work position of the workpiece 33 via the galvanometer mirrors 51a and 52 and the fθ lens 53. The laser pulse L1Ba is incident on the work position of the workpiece 34 via the galvanometer mirrors 54a and 55 and the fθ lens 56. During the period in which the laser pulse L1 is emitted, the galvanometer mirrors 51b and 54b to which the laser pulses L1Aa and L1Ba are not incident move.

  Upon completion of the emission of the laser pulse L1, the control device 60 cancels the application of the control signal to the AODs 42a and 42b, and further transmits a control signal for causing the galvanometer mirrors 51a, 52, 54a and 55 to perform positioning. The galvanometer mirrors 51a, 52, 54a, 55 receive the control signal from the control device 60 and start moving.

  The laser pulse L2 is emitted after the galvano mirrors 52, 55, 51b are stationary and the galvano mirror 54b is stationary. The control device 60 transmits a trigger signal to the laser light source 40 together with the reception of the stationary signal of the latest stationary galvano mirror 54b, and applies a relatively high frequency control signal to the AODs 42a and 42b. Laser pulses that are split with equal energy along the optical paths A and B by the deflecting beam splitter 46 and enter the AODs 42a and 42b are distributed to the optical paths Ab and Bb, respectively. The laser pulse L2Ab is incident on the work position of the workpiece 33 via the galvanometer mirrors 51b and 52 and the fθ lens 53. The laser pulse L2Bb enters the processing position of the workpiece 34 via the galvanometer mirrors 54b and 55 and the fθ lens 56. During the period in which the laser pulse L2 is emitted, the galvanometer mirrors 51a and 54a where the laser pulses L2Ab and L2Bb are not incident move.

  Upon completion of the emission of the laser pulse L2, the control device 60 cancels the application of the control signal to the AODs 42a and 42b, and further transmits a control signal that causes the galvanometer mirrors 51b, 52, 54b, and 55 to perform positioning. The galvanometer mirrors 51b, 52, 54b, 55 receive the control signal from the control device 60 and start moving.

  Similarly to the laser pulse L1, the laser pulse L3 is emitted after the galvanometer mirrors 51a, 52, 54a, and 55 are stationary. A relatively low frequency control signal is applied to the AODs 42a and 42b. The laser pulses that are split with equal energy along the optical paths A and B by the deflecting beam splitter 46 are distributed to the optical paths Aa and Ba, respectively, and enter the processing positions of the workpieces 33 and 34, respectively. During the period when the laser pulse L3 is emitted, the galvanometer mirrors 51b and 54b to which the laser pulses L3Aa and L3Ba are not incident move.

  At the end of the emission of the laser pulse L3, the control device 60 cancels the application of the control signal to the AODs 42a and 42b, and further causes the galvanometer mirrors 51a, 52, 54a and 55 to start moving.

  Similarly to the laser pulse L2, the laser pulse L4 is emitted after the galvanometer mirrors 51b, 52, 54b, and 55 are stationary. A relatively high frequency control signal is applied to the AODs 42a and 42b. The laser pulses that are split with equal energy along the optical paths A and B by the deflecting beam splitter 46 are distributed to the optical paths Ab and Bb, respectively, and enter the processing positions of the workpieces 33 and 34, respectively. During the period when the laser pulse L4 is emitted, the galvanometer mirrors 51a and 54a to which the laser pulses L4Ab and L4Bb are not incident move.

  At the end of the emission of the laser pulse L4, the control device 60 cancels the application of the control signal to the AODs 42a and 42b, and further causes the galvanometer mirrors 51b, 52, 54b and 55 to start moving.

  Positioning of the incident positions of the laser pulses L5Aa and L5Ba by the galvanometer mirrors 51a, 52, 54a and 55 is completed, and the control signal 60 receives a stationary signal from each galvanometer mirror 51a, 52, 54a and 55. However, when the positioning is completed, the time corresponding to the shortest cycle in which the laser pulse can be emitted has not elapsed since the previous emission of the laser pulse L4. Therefore, the control device 60 emits the laser pulse L5 after the time corresponding to the shortest period has elapsed, and applies a control signal having a relatively low frequency to the AODs 42a and 42b. Laser pulses L5Aa and L5Ba are incident on the work positions of the workpieces 33 and 34, respectively. During the period when the laser pulse L5 is emitted, the galvanometer mirrors 51b and 54b to which the laser pulses L5Aa and L5Ba are not incident move. After the emission of the laser pulse L5 is completed, the galvanometer mirrors 51a, 52, 54a, 55 start moving.

  The laser pulse L6 is emitted after the galvano mirrors 52, 55, and 51b are stationary and the galvano mirror 54b is stationary. Along with the emission of the laser pulse L6, a control signal having a relatively high frequency is applied to the AODs 42a and 42b. The laser pulses that are split with equal energy along the optical paths A and B by the deflecting beam splitter 46 are distributed to the optical paths Ab and Bb, respectively, and enter the processing positions of the workpieces 33 and 34, respectively. During the period in which the laser pulse L6 is emitted, the galvanometer mirrors 51a and 54a to which the laser pulses L6Ab and L6Bb are not incident move.

  At the end of the emission of the laser pulse L6, the control device 60 releases the application of the control signal to the AODs 42a and 42b. In addition, the galvanometer mirrors 51b and 54b are started to move. However, the galvanometer mirrors 52 and 55 are kept stationary. This is because the Y coordinate of the processing position by the next laser pulses L7Aa and L7Ba is equal to the Y coordinate of the processing position by the laser pulses L6Ab and L6Bb, respectively.

  The laser pulse L7 is emitted after the galvano mirror 54a is stationary and the galvano mirror 51a is stationary. Along with the emission, a control signal having a relatively low frequency is applied to the AODs 42a and 42b. The laser pulses that are split with equal energy along the optical paths A and B by the deflecting beam splitter 46 are distributed to the optical paths Aa and Ba, respectively. The laser pulse L7Aa traveling in the optical path Aa is incident on the work position of the workpiece 33 via the stationary galvanometer mirrors 51a and 52 and the fθ lens 53. The laser pulse L7Ba traveling in the optical path Ba is incident on the work position of the workpiece 34 via the stationary galvanometer mirrors 54a and 55 and the fθ lens 56. During the period when the laser pulse L7 is emitted, the galvanometer mirrors 51b and 54b to which the laser pulses L7Aa and L7Ba are not incident move.

  At the end of the emission of the laser pulse L7, the control device 60 cancels the application of the control signal to the AODs 42a and 42b, and further causes the galvanometer mirrors 51a, 52, 54a and 55 to start moving.

  The laser pulse L8 is emitted after the galvanometer mirrors 51a, 52, 54a, and 55 are stationary. A relatively low frequency control signal is applied to the AODs 42a and 42b. The laser pulses that are split with equal energy along the optical paths A and B by the deflecting beam splitter 46 are distributed to the optical paths Aa and Ba, respectively, and enter the processing positions of the workpieces 33 and 34, respectively. During the period in which the laser pulse L8 is emitted, the galvanometer mirrors 51b and 54b to which the laser pulses L8Aa and L8Ba are not incident are moving.

  Thus, for example, when at least one of the galvanometer mirrors 51b and 54b is moving when the laser pulse L7 is emitted, and at least one of them is also moving when the laser pulse L8 is emitted, the laser pulse L7 , L8 is continuously incident on the workpieces 33 and 34 via the galvanometer mirrors 51a and 54a.

  At the end of the emission of the laser pulse L8, the control device 60 cancels the application of the control signal to the AODs 42a and 42b, and further causes the galvanometer mirrors 51a, 52, 54a, and 55 to start moving.

  In the laser processing method according to the seventh embodiment, at the time of emitting the laser pulse, at least one of the galvanometer mirrors 51a, 51b, 54a, and 54b on the optical path where the laser pulse is not distributed by the AODs 42a and 42b moves. Subsequent positioning of the incident position of the laser pulse is performed. For this reason, the processing speed can be increased.

  In the laser processing method according to the seventh embodiment, a part of the energy of the pulse laser beam 80 is distributed to the optical path A and the remaining part is distributed to the optical path B. Further, in each of the optical paths A and B, the laser pulse is transmitted to one of the two optical paths. Selectively proceeded. For example, as in the laser processing methods according to the second and third embodiments whose timing charts are shown in FIG. 3 and FIG. 4, in each of the optical paths A and B, laser pulses traveling from one laser pulse to two optical paths are changed. It is also possible to divide and generate in time and perform 4-axis machining with a slight time difference. In this case, after all the six galvanometer mirrors 51a, 51b, 52, 54a, 54b, and 55 are stopped for positioning, the pulsed laser beam 80 is emitted from the laser light source 40.

  FIG. 13 is a schematic view showing a laser processing apparatus according to the sixth embodiment. In the laser processing apparatus according to the fifth embodiment, the AODs 42a and 42b are arranged on the optical path of the pulsed laser beam distributed by the polarization beam splitter 46. In the laser processing apparatus according to the sixth embodiment, the AOD 42 is distributed. Polarizing beam splitters 46a and 46b are arranged on the optical path of the pulse laser beam. A sorting optical system that includes the AOD 42 and the polarization beam splitters 46a and 46b and can sort the pulse laser beam in four directions is configured.

  The pulse laser beam 80 emitted from the laser light source 40 passes through the light transmitting region of the mask 41 and enters the AOD 42. The AOD 42 can selectively distribute the pulse laser beam 80 to the optical path A and the optical path B. When allocating to the optical path A, no control signal is applied to the AOD 42. When allocating to the optical path B, a control signal is applied to the AOD 42.

  The pulse laser beam 80a distributed to the optical path A is split into, for example, equal energy into two laser pulses by the polarization beam splitter 46a, and the split laser pulses are deflected by the galvanometer mirrors 51a and 51b, respectively, and the galvanometer mirror 52 and the fθ lens. Then, the light enters the processing position of the workpiece 33 held on the stage 71 via 53.

  Similarly, the pulse laser beam 80b distributed to the optical path B is divided into, for example, equal energy into two laser pulses by the polarization beam splitter 46b, and the divided laser pulses are deflected by the galvanometer mirrors 54a and 54b, respectively. Then, the light enters the processing position of the workpiece 34 held on the stage 72 via the fθ lens 56.

  Using the laser processing apparatus according to the sixth embodiment, for example, a laser pulse is selectively distributed to one of the optical paths A and B for each pulse by the AOD 42 to perform drilling at two processing positions of the workpiece 33. During the interval (when the laser pulse is emitted), at least one of the galvanometer mirrors 54a, 54b, and 55 is moved to position the laser pulse irradiated to the workpiece 34, and the two machining positions of the workpiece 34 are drilled. During machining (during laser pulse emission), a laser machining method (eighth embodiment) for positioning a laser pulse irradiated to the workpiece 33 by moving at least one of the galvanometer mirrors 51a, 51b, 52 Can be carried out.

  Further, for example, as in the laser processing methods according to the second and third embodiments, the timing charts of which are shown in FIGS. 3 and 4, the laser pulses along the two optical paths A and B from one laser pulse are timed by the AOD 42. It is also possible to divide and generate four-axis machining with a slight time difference. In this case, after all the six galvanometer mirrors 51a, 51b, 52, 54a, 54b, and 55 are stopped for positioning, the pulsed laser beam 80 is emitted from the laser light source 40.

  The laser processing apparatus according to the sixth embodiment distributes laser pulses to two optical paths to perform 2fθ and 4-axis processing, but a control signal having a different frequency may be applied to the AOD 42. Using control signals of n different frequencies from each other, machining of (n + 1) fθ and 2 × (n + 1) axes can be performed.

  Hereinafter, the processable range will be described.

  With reference to FIGS. 14A to 14G, the processing area of the galvanometer mirror will be described. As shown in FIG. 14A, for example, a laser pulse incident on a sorter including an AOD or a beam splitter is selectively transmitted to one of two optical paths for each laser pulse or with a slight time difference. Furthermore, it is simultaneously distributed to two optical paths. In one of the two optical paths, a first deflecting element that can deflect and emit an incident laser pulse, for example, a galvanometer mirror 43a, 51a, or 54a is disposed. On the other side, a second deflecting element capable of deflecting and emitting an incident laser pulse, for example, galvanometer mirrors 43b, 51b, and 54b is disposed. The laser pulse that has passed through the first and second deflecting elements is incident on a third deflecting element that can deflect and emit the incident laser pulse, for example, galvanometer mirrors 44, 52, and 55. A deflector, such as a galvano scanner, that includes the first to third deflecting elements and can deflect and emit the incident laser pulse is configured. The laser pulse emitted from the third deflecting element is condensed by an fθ lens (condensing lens) and is incident on a workpiece processing position. By deflecting the laser pulse with the deflector, the incident position of the laser pulse is moved within the processable range, and laser processing is performed on the workpiece. For example, the first and second deflecting elements can move the incident position of the laser pulse on the work along the X-axis direction, and the third deflecting element along the Y-axis direction.

  As shown in FIG. 14B, for example, a workable range in which a side of 50 mm is a square shape along the X-axis direction and the Y-axis direction is divided into a machining area of the first deflection element and a machining area of the second deflection element. Divided. The processing area of the first deflection element is an area that can be irradiated by deflecting the laser pulse incident on the deflector with the first deflection element and the third deflection element, and the processing area of the second deflection element is This is an area that can be irradiated by deflecting the laser pulse incident on the deflector with the second deflecting element and the third deflecting element. The processing areas of the first and second deflection elements are, for example, congruent rectangular shapes having a length along the X-axis direction of 25 mm and a length along the Y-axis direction of 50 mm.

  However, depending on the number and arrangement of the positions to be processed, the size and shape of the processing areas of the first and second deflection elements may be changed as shown in FIGS. 14C to 14F, for example. In the example shown in FIG. 14C, the processing areas of the first and second deflection elements are rectangular shapes having the same long side length and different short side lengths. In the example shown in FIG. 14D, both processing areas have a congruent right isosceles triangle shape. In the example shown in FIG. 14E, the processing area of the first deflection element is a right isosceles triangle, and the processing area of the second deflection element is a pentagon. In the example shown in FIG. 14 (F), the processing areas of the first and second deflection elements are congruent concave hexagonal shapes in which the sides between the squares are divided by broken lines.

  Further, as shown in FIG. 14G, the processing areas of the first and second deflection elements have a congruent rectangular shape with a length along the X-axis direction of 50 mm and a length along the Y-axis direction of 25 mm. You can also In the processing area of the first and second deflection elements, the length along the direction (X-axis direction) in which the first and second deflection elements move the incident position, and the direction in which the third deflection element moves the incident position (Y By making it longer than the length along the axial direction), the processing speed can be increased. However, for example, as in the laser processing method according to the second embodiment whose timing chart is shown in FIG. 3, a laser pulse that passes through the first and second deflection elements is temporally divided and generated from one laser pulse, and Y In the case of performing a laser processing method in which the light is incident on a processing position having the same coordinates, the processing area setting shown in FIG. 14G cannot be employed.

  FIGS. 15A and 15B and FIGS. 16A and 16B are schematic plan views showing a work position and a workable range of a workpiece.

  Reference is made to FIGS. 15A and 15B. The workpiece is held on the stage so that, for example, machining can be performed in the shortest time according to the arrangement of the machining positions. As an example, when the work position and the workable range are in the relative positional relationship shown in FIG. 15A, the work and the galvano scanner are relatively rotated and moved using the θ stage. In the embodiment shown in B), the processing position is arranged within the processing possible range.

  Reference is made to FIGS. The laser pulse irradiation sequence (processing sequence) to the processing position within the processing range (each processing area) has the shortest processing time depending on, for example, the moving speed of the first to third deflection elements and the position of the processing position. Optimize for the salesman patrol problem and so on. As an example, as shown in FIG. 16 (A), instead of reciprocating in the Y-axis direction, the entire X-axis positive direction is processed, but as shown in FIG. 16 (B), the movement distance in the Y-axis direction. The processing order is set so that the (moving angle and deflection amount of the third deflection element) is minimized as a whole, and the control device 60 causes laser pulses to be incident on a plurality of processing positions in each processing area in the processing order. Let

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto.

  For example, in the embodiment, so-called step-and-repeat machining is performed in which the machining range is machined while the stage is stationary, and the unmachined area of the workpiece is moved to the machining area of the galvano scanner. However, the movement of the stage and the movement of the incident position of the laser pulse by the galvano scanner may be synchronized so that the laser pulse is incident on the workpiece while moving the stage.

  In the embodiment, the size of the hole formed by the laser pulse irradiated via the first deflection element, and the size of the hole formed by the laser pulse irradiated via the second deflection element Are equal, but can be of different sizes and shapes.

  Further, as in the modification shown in FIG. 17, two imaging lenses for forming images of the laser pulses in the first and second deflecting elements on the third deflecting element are provided as the first and second deflecting elements and the first deflecting element. It is good also as a structure arrange | positioned on the optical path between 3 deflection | deviation elements. The operation of the deflector and the processing speed can be improved.

  In the deflector of the embodiment, the laser pulse deflected by two deflecting elements (first and second deflecting elements) is configured to enter one deflecting element (third deflecting element). The laser pulse deflected by the above deflecting elements may be configured to enter one deflecting element. Furthermore, it is also possible to adopt a configuration in which laser pulses deflected by a plurality of deflection elements are incident on the plurality of deflection elements.

  Further, for example, in the laser processing methods according to the fifth to eighth embodiments and the modification of the laser processing method according to the fifth embodiment, at least one galvanometer mirror through which no laser pulse passes is present, and at least one of them is present. Can be considered as an example of a laser processing method in which the laser beam is moved when laser pulses are emitted from the laser light source.

  It will be apparent to those skilled in the art that other various modifications, improvements, combinations, and the like are possible.

  In addition to drilling performed by irradiating with a laser beam, laser processing such as marking, patterning, annealing, welding, etc. can be generally used. Not only the pulse wave but also a laser light source that emits a continuous wave laser beam can be used.

DESCRIPTION OF SYMBOLS 10 Laser light source 11 Mask 12 Reflection mirror 13 Bifurcated optical element 14, 15 Galvano scanner 14a, 14b, 15a, 15b Galvano mirror 16 Imaging lens 17 f (theta) lens 18 Control apparatus 20 Laser beam 30-34 Work 40 Laser light source 41 Mask 42 42a, 42b AOD
43a, 43b, 44 Galvano mirror 45 fθ lenses 46, 46a, 46b Polarizing beam splitters 47a to 47f Folding mirror 48 Distributing optical systems 51a, 51b, 52 Galvano mirror 53 fθ lenses 54a, 54b, 55 Galvano mirror 56 fθ lens 60 Controller 70 to 72 Stages 80, 80A, 80B, 80Aa, 80Ab, 80Ba, 80Bb, 80a, 80b, 81a, 81b, 82a, 82b Laser beam

Claims (21)

A laser light source for emitting a laser beam;
A sorting optical system capable of sorting a laser beam emitted from the laser light source into at least a first direction and a second direction;
A first deflector capable of deflecting and emitting the laser beam distributed in the first direction and the second direction by the distribution optical system;
The first deflector is
A first deflection element disposed on an optical path of a laser beam distributed in the first direction by the distribution optical system, and capable of deflecting and emitting the laser beam;
A second deflecting element disposed on the optical path of the laser beam distributed in the second direction by the distributing optical system and capable of deflecting and emitting the laser beam;
A laser beam that has passed through the first deflection element, and a third deflection element that is disposed on the optical path of the laser beam that has passed through the second deflection element and can deflect and emit the incident laser beam. Laser processing equipment.   2. The laser processing apparatus according to claim 1, wherein the first deflector is a galvano scanner, and the first to third deflecting elements are galvano mirrors capable of changing a direction of a reflecting surface. 3. And a control device for controlling the emission of the laser beam from the laser light source, the distribution of the laser beam by the distribution optical system, and the deflection direction of the laser beam by the first to third deflection elements,
The control device emits a laser beam from the laser light source in a state where the first and third deflecting elements are stationary and the second deflecting element is changing a deflection direction, and the laser beam is distributed to the sorting optics. The laser processing apparatus according to claim 1, wherein the laser processing apparatus distributes the first direction in a system. And a control device for controlling the emission of the laser beam from the laser light source, the distribution of the laser beam by the distribution optical system, and the deflection direction of the laser beam by the first to third deflection elements,
The control device emits a laser beam from the laser light source in a state where the first to third deflection elements are stationary, and causes the laser beam to be emitted in the first direction and the second direction by the sorting optical system. The laser processing apparatus according to claim 1 or 2, wherein the laser processing apparatus is distributed.   The control device distributes the laser beam in the order of the first direction and the second direction by the distribution optical system, and changes the deflection direction of the first deflection element before the laser beam is distributed in the second direction. The laser processing apparatus according to claim 4.   The control device has an optical path in which a deflection element that makes a laser beam incident on a machining position where a distance between the machining positions is relatively large between the current and next deflection elements is arranged in the first and second deflection elements. The laser processing apparatus according to claim 4, wherein the laser beam is first distributed.   The laser processing apparatus according to claim 4, wherein the control device distributes the laser beam simultaneously in the first direction and the second direction.   An area where the laser beam can be irradiated by deflecting the laser beam incident on the first deflector by the first deflecting element and the third deflecting element, and the laser incident on the first deflector By deflecting the beam with the second deflecting element and the third deflecting element, the first and second deflecting elements move in the direction in which the incident position of the laser beam moves in an area where the laser beam can be irradiated. The laser processing apparatus according to any one of claims 1 to 3, wherein a length along the third deflection element is longer than a length along a direction in which the third deflection element moves a laser beam incident position.   The control device deflects the laser beam incident on the first deflector with the first deflecting element and the third deflecting element in an order that minimizes the deflection amount of the third deflecting element as a whole. The laser beam can be irradiated by deflecting the laser beam incident on the first deflector with the second deflecting element and the third deflecting element. The laser processing apparatus according to any one of claims 1 to 8, wherein a laser beam is incident on a plurality of processing positions in an area where the processing is possible. The distribution optical system can distribute the laser beam emitted from the laser light source in the third direction and the fourth direction,
And a second deflector capable of deflecting and emitting the laser beam distributed in the third direction and the fourth direction by the distribution optical system,
The second deflector is
A fourth deflection element arranged on the optical path of the laser beam distributed in the third direction by the distribution optical system, and capable of deflecting and emitting the laser beam;
A fifth deflection element disposed on the optical path of the laser beam distributed in the fourth direction by the distribution optical system and capable of deflecting and emitting the laser beam;
And a sixth deflection element that is disposed on the optical path of the laser beam that has passed through the fourth deflection element and the laser beam that has passed through the fifth deflection element, and can deflect and emit the incident laser beam. The laser processing apparatus according to claim 1. And a control device for controlling the emission of the laser beam from the laser light source, the distribution of the laser beam by the distribution optical system, and the deflection direction of the laser beam by the first to sixth deflection elements,
The control device sets at least one deflection direction of a deflection element that is not arranged in an optical path of the laser beam to be sorted by the sorting optical system among the first to sixth deflection elements when the laser beam is emitted from the laser light source. The laser processing apparatus according to claim 10 to be changed. And a control device for controlling the emission of the laser beam from the laser light source, the distribution of the laser beam by the distribution optical system, and the deflection direction of the laser beam by the first to sixth deflection elements,
The control device emits a laser beam from the laser light source in a state where the first to sixth deflection elements are stationary, and distributes the laser beam in the first to fourth directions by the distribution optical system. Item 11. A laser processing apparatus according to Item 10. A laser light source that emits a laser beam; a distribution optical system that can distribute the laser beam emitted from the laser light source at least in a first direction and a second direction; and A first deflector capable of deflecting and emitting a laser beam distributed in two directions, and the first deflector emits light of the laser beam distributed in the first direction by the distribution optical system. A first deflection element arranged on the path and capable of deflecting and emitting the laser beam, and arranged on the optical path of the laser beam distributed in the second direction by the distribution optical system, and deflecting the laser beam On the optical path of the second deflection element that can be emitted, the laser beam that passes through the first deflection element, and the laser beam that passes through the second deflection element It is location, a laser processing method using the laser processing device and a third deflection element which can be emitted by deflecting the laser beam incident,
In a state where the first and third deflection elements are stationary and the second deflection element is changing the deflection direction, a laser beam is emitted from the laser light source, and the laser beam is emitted by the sorting optical system. A laser processing method characterized by sorting in a direction.   An area where the laser beam can be irradiated by deflecting the laser beam incident on the first deflector by the first deflecting element and the third deflecting element, and the laser incident on the first deflector By deflecting the beam with the second deflecting element and the third deflecting element, the first and second deflecting elements move in the direction in which the incident position of the laser beam moves in an area where the laser beam can be irradiated. 14. The laser processing method according to claim 13, wherein a length along which the third deflection element moves is longer than a length along a direction in which the third deflection element moves the incident position of the laser beam. A laser light source that emits a laser beam; a distribution optical system that can distribute the laser beam emitted from the laser light source at least in a first direction and a second direction; and A first deflector capable of deflecting and emitting a laser beam distributed in two directions, and the first deflector emits light of the laser beam distributed in the first direction by the distribution optical system. A first deflection element arranged on the path and capable of deflecting and emitting the laser beam, and arranged on the optical path of the laser beam distributed in the second direction by the distribution optical system, and deflecting the laser beam On the optical path of the second deflection element that can be emitted, the laser beam that passes through the first deflection element, and the laser beam that passes through the second deflection element It is location, a laser processing method using the laser processing device and a third deflection element which can be emitted by deflecting the laser beam incident,
A laser beam is emitted from the laser light source while the first to third deflecting elements are stationary, and the laser beam is distributed in the first direction and the second direction by the distribution optical system. Laser processing method.   16. The laser beam is distributed in the order of the first direction and the second direction by the distribution optical system, and the deflection direction of the first deflection element is changed before the laser beam is distributed in the second direction. Laser processing method.   Of the first and second deflecting elements, the laser beam is first applied to the optical path in which the deflecting element that causes the laser beam to enter the processing position where the distance between the processing positions is relatively large between the current time and the next time. The laser processing method according to claim 15, which is distributed.   The laser processing method according to claim 15, wherein the laser beam is simultaneously distributed in the first direction and the second direction.   The laser beam incident on the first deflector is deflected by the first deflecting element and the third deflecting element in an order that minimizes the amount of deflection of the third deflecting element as a whole. An area that can be irradiated, and a plurality of laser beams in the area that can be irradiated by deflecting the laser beam incident on the first deflector with the second deflecting element and the third deflecting element. The laser processing method according to any one of claims 13 to 18, wherein a laser beam is incident on a position to be processed. A laser light source that emits a laser beam, a distribution optical system that can distribute the laser beam emitted from the laser light source in the first to fourth directions, and a distribution optical system that distributes the laser beam in the first direction and the second direction A first deflector capable of deflecting and emitting the emitted laser beam, and a second deflector capable of deflecting and emitting the laser beam distributed in the third direction and the fourth direction by the distribution optical system. The first deflector is disposed on the optical path of the laser beam distributed in the first direction by the distribution optical system, and can deflect and emit the laser beam. A deflection element and a second deflection element arranged on the optical path of the laser beam distributed in the second direction by the distribution optical system and capable of deflecting and emitting the laser beam And a third deflecting element that is disposed on an optical path of the laser beam that has passed through the first deflecting element and the laser beam that has passed through the second deflecting element and can deflect and emit the incident laser beam; The second deflector is disposed on the optical path of the laser beam distributed in the third direction by the distribution optical system, and can deflect and emit the laser beam; A fifth deflection element arranged on the optical path of the laser beam distributed in the fourth direction by the distribution optical system and capable of deflecting and emitting the laser beam; and a laser beam via the fourth deflection element And a sixth deflection element that is disposed on the optical path of the laser beam that has passed through the fifth deflection element and can deflect and emit the incident laser beam. A laser processing method using a
At the time of emission of a laser beam from the laser light source, at least one deflection direction of a deflection element that is not arranged in an optical path of the laser beam to be sorted by the sorting optical system among the first to sixth deflection elements is changed. A laser processing method. A laser light source that emits a laser beam, a distribution optical system that can distribute the laser beam emitted from the laser light source in the first to fourth directions, and a distribution optical system that distributes the laser beam in the first direction and the second direction A first deflector capable of deflecting and emitting the emitted laser beam, and a second deflector capable of deflecting and emitting the laser beam distributed in the third direction and the fourth direction by the distribution optical system. The first deflector is disposed on the optical path of the laser beam distributed in the first direction by the distribution optical system, and can deflect and emit the laser beam. A deflection element and a second deflection element arranged on the optical path of the laser beam distributed in the second direction by the distribution optical system and capable of deflecting and emitting the laser beam And a third deflecting element that is disposed on an optical path of the laser beam that has passed through the first deflecting element and the laser beam that has passed through the second deflecting element and can deflect and emit the incident laser beam; The second deflector is disposed on the optical path of the laser beam distributed in the third direction by the distribution optical system, and can deflect and emit the laser beam; A fifth deflection element arranged on the optical path of the laser beam distributed in the fourth direction by the distribution optical system and capable of deflecting and emitting the laser beam; and a laser beam via the fourth deflection element And a sixth deflection element that is disposed on the optical path of the laser beam that has passed through the fifth deflection element and can deflect and emit the incident laser beam. A laser processing method using a
A laser that emits a laser beam from the laser light source while the first to sixth deflection elements are stationary, and distributes the laser beam in the first to fourth directions by the distribution optical system. Processing method.

Images