JP2017148853A - Optical processing device and optical processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical processing device capable of shortening processing time.SOLUTION: An optical processing device scans processing light and processes a processing object 35. The optical processing device includes processing light generation means 42 which generates a plurality of processing lights that lights output from light sources 41A and 41B are mutually independently modulated on the basis of processing data. Accordingly, the processing portions different from each other can be simultaneously processed and processing time in the optical processing device can be shortened.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical processing apparatus and an optical processing method.

  2. Description of the Related Art Conventionally, an optical processing apparatus that processes a processing object by scanning processing light such as laser light is known.

  For example, in Patent Document 1, pulsed laser light oscillated from a laser oscillator is scanned in a one-dimensional direction by an optical scanning unit such as a polygon mirror, and the workpiece is moved in a direction orthogonal to the one-dimensional direction after the scanning. A laser processing apparatus that repeatedly moves and scans a pulsed laser beam in a one-dimensional direction again is disclosed.

  In a conventional optical processing apparatus such as a laser processing apparatus, it is desired to shorten the processing time.

  In order to solve the above-described problems, the present invention provides a plurality of optical processing apparatuses that scan a processing light and process an object to be processed, wherein light output from a light source is modulated independently from each other based on processing data. It has a processing light generating means for generating processing light.

  According to the present invention, there is an excellent effect that the processing time can be shortened.

It is a schematic diagram which shows the structure of the principal part of the laser patterning apparatus in embodiment. It is explanatory drawing which shows the structure of the irradiation optical system in the laser patterning apparatus. It is explanatory drawing which shows the structure of the scanning optical system in the laser patterning apparatus. It is a block diagram which shows the structure of the light source drive part in the laser patterning apparatus. It is a timing chart of various signals related to light source driving. It is explanatory drawing which shows the scanning line on a workpiece | work when the laser beam from a single light source is scanned conventionally. In embodiment, it is explanatory drawing which shows the scanning line on a workpiece | work when the laser beam from two light sources is scanned. FIG. 10 is an explanatory diagram showing a scanning line on a workpiece when laser beams from two light sources are scanned once in Modification 1. In modification 1, it is explanatory drawing which shows the position of the irradiation area | region of each laser beam irradiated to a workpiece | work at the same time. FIG. 11 is an explanatory diagram showing a scanning line on a workpiece when laser beams from four light sources are scanned once in Modification 2. It is explanatory drawing which shows an example of a structure of the irradiation optical system in the modification 2.

Hereinafter, an embodiment in which an optical processing apparatus according to the present invention is applied to a laser patterning apparatus will be described.
An object to be processed in the laser patterning apparatus of the present embodiment is a work in which an ITO thin film is formed on a base material used for a touch panel, and the ITO thin film on the work is irradiated with laser light (machining light). By removing the ITO thin film, the ITO thin film is patterned. However, the optical processing apparatus according to the present invention is not limited to the laser patterning apparatus according to the present embodiment, but includes other patterning processes such as silver paste processing, cutting processes (light guide plate processing, etc.), etc. The present invention can also be applied to an apparatus that performs other processing, an apparatus that uses non-laser light as processing light, and the like.

FIG. 1 is a schematic diagram showing a configuration of a main part of a laser patterning apparatus according to the present embodiment.
The laser patterning apparatus of the present embodiment mainly includes an irradiation optical system 10, a scanning optical system 20, a work transport unit 30, a light source unit 40, and a control unit 50.

  The light source unit 40 includes two light sources 41A and 41B made of laser oscillators. The two light sources 41 </ b> A and 41 </ b> B are controlled by the light source driving unit 42 so that they can be modulated independently of each other. Specifically, the light source driving unit 42 controls the lighting and extinguishing timings of the two light sources 41A and 41B in conjunction with the scanning operation of the polygon mirror 21 as an optical scanning member provided in the scanning optical system 20. For example, a pulsed fiber laser (picosecond fiber laser) with a pulse oscillation of 100 picoseconds or less, which is less damaged by the heat effect on the base material, is used as the laser oscillator constituting the two light sources 41A and 41B. May be used.

  The two light sources 41A and 41B both emit laser light having a wavelength sensitive to the ITO thin film (working material) on the work 35, and a necessary light quantity (image surface light quantity) on the work 35. The laser beam with the obtained intensity is output. The two light sources 41A and 41B in the present embodiment are independent light sources provided separately from each other, but may be configured by two laser arrays mounted on the same substrate.

  Each laser beam (each laser beam) output from the two light sources 41A and 41B is incident on the irradiation optical system 10. Each incident laser beam passes through collimator lenses 12A and 12B and apertures 13A and 13B, and then enters beam splitter 14 as an optical member from different directions. Each laser beam incident on the beam splitter 14 is emitted in parallel from the beam splitter 14 toward the scanning optical system 20.

  The collimating lenses 12A and 12B are coupling lenses that are arranged to efficiently propagate the laser beams LA and LB. In this embodiment, the collimating lenses 12A and 12B employ collimating lenses because they are converted into parallel light. In view of the optical design of the entire processing system including the laser patterning device, divergent light or convergent light may be more efficient than parallel light.

  Apertures 13A and 13B cut the peripheral portions of the beam cross sections of laser beams LA and LB after passing through collimating lenses 12A and 12B, thereby forming a spot diameter of a desired size on workpiece 35. The spot diameter on the workpiece 35 is an important processing condition that directly affects the processing quality, and is required to be stably formed with a desired size. In general, the spot diameters of the laser beams LA and LB are in an inversely proportional relationship that the diameter decreases as the aperture size increases. Therefore, the desired spot diameter can be designed with an aperture size.

FIG. 2 is an explanatory diagram showing a configuration of the irradiation optical system 10 in the present embodiment.
The first light source 41 </ b> A and the second light source 41 </ b> B respectively emit laser beams LA and LB in a linearly polarized state having polarization directions different from each other by 90 °. The beam splitter 14 of the present embodiment transmits light having the polarization direction of the first laser light LA emitted from the first light source 41A, and the polarization direction of the second laser light LB emitted from the second light source 41B. Reflects light with Therefore, the first laser light LA emitted from the first light source 41 </ b> A passes through the beam splitter 14 and travels straight to the scanning optical system 20. On the other hand, the second laser light LB emitted from the second light source 41B is reflected by the beam splitter 14, the optical path is bent by 90 °, and travels toward the scanning optical system 20 in parallel with the first laser light LA. The first laser beam LA and the second laser beam LB that have passed through the beam splitter 14 pass through the λ / 4 plate 16. Thereby, both laser beams LA and LB are converted into circularly polarized light.

  The irradiation optical system 10 of the present embodiment has a beam splitter moving unit 15 that displaces the position of the beam splitter 14 in the direction indicated by the white arrow in the drawing, that is, the direction in which the second laser beam LB is incident. It has. By displacing the beam splitter 14 by the beam splitter moving unit 15, the interval between the first laser beam LA and the second laser beam LB emitted from the irradiation optical system 10 (the optical axis interval in the direction corresponding to the main scanning direction) is arbitrarily set. Can be adjusted. At this time, assuming that the imaging magnification in the scanning optical system 20 is M, if it is desired to set the interval (interval in the main scanning direction) between the first laser beam LA and the second laser beam LB on the workpiece 35 to ΔD, the irradiation optical system The interval between the first laser beam LA and the second laser beam LB emitted from 10 (the interval in the direction corresponding to the main scanning direction) may be ΔD / M.

  In the present embodiment, ΔD = 0 because the positions in the main scanning direction of the irradiation areas irradiated simultaneously with the first laser beam LA and the second laser beam LB on the workpiece 35 are the same. However, the position in the sub-scanning direction of the irradiation region irradiated with the first laser beam LA and the second laser beam LB on the workpiece 35 is shifted by the line interval P of the scanning lines.

  The scanning optical system 20 reflects the first laser light LA and the second laser light LB incident from the irradiation optical system 10 by an optical deflector using a polygon mirror 21 that is a light deflection member, and passes through the scanning lens 22. Irradiate the work surface of the workpiece 35. In the present embodiment, a polygon mirror is used as the light deflection member, but other light deflection members such as a galvanometer mirror may be used. The scanning optical system 20 of the present embodiment is a raster scanning method, but may be another scanning method such as a vector scanning method.

  In the present embodiment, the first laser beam LA and the second laser beam LB that are parallel to each other are incident on different positions (different positions on the same reflecting surface) of the polygon mirror 21 of the scanning optical system 20. Thereby, with rotation of the polygon mirror 21, the first laser light LA and the second laser light LB remain on the work 35 while keeping the distance between the first laser light LA and the second laser light LB on the work 35. Are scanned in the main scanning direction (X-axis direction).

FIG. 3 is an explanatory diagram showing the configuration of the scanning optical system 20 in the present embodiment.
In the scanning optical system 20, a cylindrical lens 23 is disposed on the light source side of the polygon mirror 21, and a scanning lens 22, a surface tilt correction lens 24, and the like are disposed on the workpiece side of the polygon mirror 21. Further, the scanning optical system 20 includes a folding mirror 25 disposed at a position outside the effective scanning area where exposure (laser machining) is performed according to exposure data based on the machining data, and laser light reflected by the folding mirror 25. And a synchronous detection sensor 26 for receiving LA and LB.

The polygon mirror 21 is obtained by processing the side surface of a regular polygonal column into a reflecting mirror, and is rotated by a driving unit around the central axis of the regular polygonal column. By reflecting the laser beams LA and LB that are incident on the side surfaces (reflection surfaces) of the polygon mirror 21 that is rotationally driven, the traveling directions of the laser beams LA and LB are temporally changed, and the laser beam is irradiated on the workpiece 35. Scan LA and LB.
The cylindrical lens 23 imparts a lens action only in the sub-scanning direction, condenses incident laser beams LA and LB only in the sub-scanning direction, and forms an image on the reflection surface of the polygon mirror 21.
The scanning lens 22 is mainly composed of one or more lenses that correct the laser beams LA and LB scanned by the rotation of the polygon mirror 21 so as to be scanned at a constant speed on the workpiece 35. Since the polygon mirror 21 is driven to rotate at a constant angular velocity, if the scanning lens 22 is not provided, the image height on the workpiece 35 is H, the focal length of the scanning lens 22 is f, and the rotation angle of the polygon mirror 21 is θ. In this case, the image height H is H = f × tan θ. That is, as the image height increases away from the scanning line center position on the workpiece 35, the scanning speed of the laser beams LA and LB on the workpiece 35 increases. On the other hand, in the present embodiment, correction is performed by the scanning lens 22 so that the relationship of H = f × θ is satisfied, and the laser beams LA and LB are condensed at a position in the main scanning direction proportional to the rotation angle θ of the polygon mirror 21. Can be made.

  The synchronization detection sensor 26 aligns the start points (processing start positions) of the scanning lines L1 and L2 obtained by scanning with the respective reflecting surfaces (polygon surfaces) on the polygon mirror 21 at the same main scanning direction position on the workpiece 35. Used. The main scanning direction position of the laser beams LA and LB may vary from scanning line to scanning line due to uneven rotation of the polygon mirror 21 and variations in processing accuracy for each reflecting surface (polygon surface). In the present embodiment, when the laser beams LA and LB scanned on the respective reflecting surfaces of the polygon mirror 21 pass through the synchronization detection sensor 26 outside the effective scanning region, the synchronization detection signal s1 is output from the synchronization detection sensor 26 to the light source driving unit 42. Is output. The light source driving unit 42 determines the emission timing of each of the light sources 41A and 41B with reference to the synchronization detection signal s1. As a result, the start points (processing start positions) of the scanning lines L1 and L2 obtained by scanning with the respective reflecting surfaces (polygon surfaces) on the polygon mirror 21 are aligned on the same main scanning direction position on the workpiece 35, and processed data ( High-precision processing along exposure data) is possible.

  The workpiece transport unit 30 includes a table 31 on which the workpiece 35 is placed and a moving stage 32 that moves the table 31 in the sub-scanning direction (Y-axis direction). The workpiece 35 on the table 31 is moved in the sub-scanning direction (Y-axis). Direction).

  The control unit 50 is configured by a computer that manages and controls the entire laser patterning apparatus. The control unit 50 is connected to the light source driving unit 42, the stage driving unit 33, and the like, and manages each status and controls the processing sequence.

  The basic processing conditions of this laser patterning apparatus are: the wavelengths of the laser beams LA and LB having sensitivity to the ITO thin film (material to be processed) on the workpiece, and the beam spot diameters (diameters) of the laser beams LA and LB on the workpiece 35. The light amounts of the laser beams LA and LB on the workpiece 35, the lighting times of the laser beams LA and LB, and the like. Among these processing conditions, the beam spot diameter is a particularly important condition, and the beam spot diameter in the present embodiment is set to about several μm to 100 μm. In general, the smaller the beam spot diameter is, the higher the cost is, but the processing quality is improved. Therefore, it is required to grasp the relationship between the beam spot diameter and the processing quality and to realize the necessary processing quality at low cost and at high speed.

FIG. 4 is a block diagram illustrating a configuration of the light source driving unit 42.
The light source driving unit 42 mainly includes a control circuit unit 42A and a light source driving circuit unit 42B. The control circuit unit 42A includes a reference clock generation circuit 43, a pixel clock generation circuit 44, a light source modulation data generation circuit 45, a light source distribution circuit 46, and an exposure timing signal generation circuit 47.

The reference clock generation circuit 43 generates a high frequency clock signal that serves as a reference for driving the light source.
The pixel clock generation circuit 44 mainly includes a phase synchronization circuit, and generates a pixel clock signal based on the synchronization signal s1 from the synchronization detection sensor 26 and the high-frequency clock signal from the reference clock generation circuit. The pixel clock signal has the same frequency as that of the high-frequency clock signal and has a phase that matches the synchronization signal s1. Therefore, by synchronizing the processed data (processed image data) with this pixel clock signal, it is possible to align the processing position (main scanning direction position) for each scanning line. The pixel clock signal generated here is supplied to the light source drive circuit unit 42B and is also supplied to the light source modulation data generation circuit 45 to be used as a clock signal for the exposure data s3.

  The light source modulation data generation circuit 45 receives the processing data from the control unit 50, and generates exposure data s3 obtained by modulating the pixel clock signal from the pixel clock generation circuit 44 based on the processing data. The processing data input from the control unit 50 includes an exposure position where the laser light LA, LB is irradiated (exposure) on the processing surface on the workpiece 35 and a non-exposure position where the laser light LA, LB is not irradiated (exposure). It is image data which shows an exposure pattern. The light source modulation data generation circuit 45 modulates the pixel clock signal from the pixel clock generation circuit 44 at ON and OFF timings based on the processed data.

  Here, in the present embodiment, as described above, the two light sources 41A and 41B are configured to be able to modulate independently of each other, and simultaneously expose positions on the workpiece that are shifted from each other in the sub-scanning direction. That is, in the present embodiment, two scanning lines are simultaneously laser processed by the laser beams LA and LB from the two light sources 41A and 41B. Specifically, the first laser light LA of the first light source 41A laser-processes odd-numbered scanning lines, and the second laser light LB of the second light source 41B laser-processes even-numbered scanning lines. Therefore, in this embodiment, the exposure data generated by the light source modulation data generation circuit 45 is input to the light source distribution circuit 46, and the light source distribution circuit 46 and the exposure data s3-1 corresponding to the odd-numbered scanning lines and the even-numbered lines. Is divided into exposure data s3-2 corresponding to the scan line. Then, the light source distribution circuit 46 outputs the exposure data s3-1 and the exposure data s3-2 to the light source drive circuit unit 42B.

  The exposure timing signal generation circuit 47 generates an exposure timing signal s2 based on the synchronization signal s1 from the synchronization detection sensor 26. The exposure timing signal s2 determines a period corresponding to the effective scanning area, and is supplied to the light source driving circuit unit 42B.

FIG. 5 is a timing chart of various signals related to light source driving.
First, the first light source 41A and the second light source 41B are both turned on at the scanning end timing determined with reference to the input timing of the synchronization detection signal s1 from the synchronization detection sensor 26. Thereafter, the laser beams LA and LB from the first light source 41A and the second light source 41B enter the next reflecting surface (polygon surface) of the polygon mirror 21, and the laser beams LA and LB are detected by the synchronization detection sensor 26. Then, a new synchronization detection signal s1 is input. When the synchronization detection signal s1 is input, the pixel clock signal is generated by the pixel clock generation circuit 44, and the light source modulation data generation circuit 45 modulates the pixel clock signal with the processing data for the corresponding two scanning lines. Exposure data s3 for one scanning line is generated.

  The exposure data s3 generated in this way is distributed by the light source distribution circuit 46 as exposure data s3-1 for the first light source 41A, corresponding to the odd-numbered scan lines, and corresponding to the even-numbered scan lines. The exposure data to be distributed is distributed as exposure data s3-2 for the second light source 41B. The two exposure data s3-1 and s3-2 distributed in this way are supplied to the light source drive circuit unit 42B. The light source drive circuit unit 42B controls the ON / OFF timing of the first light source 41A based on the input first exposure data s3-1 in synchronization with the exposure timing signal s2 from the exposure timing signal generation circuit 47, The ON / OFF timing of the second light source 41B is controlled based on the input second exposure data s3-2.

FIG. 6 is an explanatory diagram showing a scanning line on the workpiece 35 when a laser beam from a single light source is scanned in the related art.
FIG. 7 is an explanatory diagram showing scanning lines on the work 35 when the laser beams LA and LB from the two light sources 41A and 41B are scanned in the present embodiment.
6 and 7, the shape (spot shape) of the laser light irradiation area on the work 35 corresponds to one pixel of image data corresponding to the processing data, and is shown as a circle for convenience.

  Conventionally, as shown in FIG. 6, the number of scanning lines that can be exposed (laser processing) by one scanning is only one, and the number of scanning lines required for the laser processing of the workpiece 35 is required. become. On the other hand, in this embodiment, two scanning lines can be exposed (laser processing) by one scanning, so that the number of scannings is half of the number of scanning lines necessary for laser processing of the workpiece 35, and the processing time is reduced. Can be shortened.

[Modification 1]
Next, a modification of the laser patterning apparatus according to the present embodiment (hereinafter, this modification is referred to as “modification 1”) will be described.
In laser processing using pulsed laser light as in the present embodiment, plasma may be generated by irradiating the workpiece 35 with laser light. The laser light applied to the workpiece 35 when this plasma is generated has poor energy utilization efficiency because the plasma electrons absorb the laser light. Further, since the laser beam does not directly reach the workpiece 35 due to the generation of plasma and indirectly strikes the workpiece 35, there may be a problem that the processing quality is deteriorated. For this reason, if the irradiation areas on the workpiece irradiated with the laser beams LA and LB from the two light sources 41A and 41B overlap each other at the same time, one laser beam is generated during processing by the other laser beam. There is a possibility that the energy utilization efficiency may be lowered or the processing quality may be lowered by the plasma. In the first modification, the irradiation areas on the workpiece irradiated with the laser beams LA and LB from the two light sources 41A and 41B are not overlapped at the same time.

FIG. 8 is an explanatory diagram showing scanning lines on the workpiece 35 when the laser beams LA and LB from the two light sources 41A and 41B are scanned once in the first modification.
In FIG. 8, the spot shapes of the laser beams LA and LB on the work 35 are shown as circles for convenience, and the numbers in them indicate the exposure time.
In the first modification, as shown in FIG. 8, the irradiation region of the second laser light LB from the second light source 41B scans in the main scanning direction more than the irradiation region of the first laser light LA from the first light source 41A. It is shifted by one pixel upstream in the direction. Therefore, the irradiation region of the second laser light LB at time 2 takes the same position in the main scanning direction as the irradiation region of the first laser light LA at time 1.

FIG. 9 is an explanatory diagram showing the positions of the irradiation areas of the laser beams LA and LB irradiated onto the work 35 at the same time.
When the line interval P between the scanning lines L1 and L2 is smaller than the spot diameters (diameters) BS of the laser beams LA and LB, the irradiation region where the two laser beams LA and LB are irradiated simultaneously as in the above-described embodiment. If the positions in the main scanning direction are the same, these irradiation regions overlap each other at the same time. In such a case, in order to prevent these irradiation regions from overlapping each other at the same time, it is possible to set the irradiation regions irradiated with the two laser beams LA and LB at positions shifted in the main scanning direction. preferable.

At this time, if the amount of deviation ΔD in the scanning direction of the two laser beams LA and LB on the workpiece 35 satisfies the following conditional expression (1), the laser beams LA and LB from the two light sources 41A and 41B. It is possible to prevent the irradiation areas on the workpiece to be irradiated from overlapping each other at the same time, and to suppress various problems caused by the generation of plasma. Here, the spot diameter BS has a threshold level that is ½ of the peak intensity of the laser beams LA and LB.
BS ² ≦ P ² + ΔD ² (1)

  In the first modification, the irradiation region of the second laser light LB irradiated at time 2 overlaps with the irradiation region irradiated with the first laser light LA at time 1. The generation time of the plasma is approximately 10 picoseconds to 10 microseconds after the laser beam irradiation although it depends on the material characteristics of the material to be processed (in this embodiment, the ITO thin film). In the first modification, the time required for the laser beams LA and LB to scan a distance corresponding to the pixel pitch in the main scanning direction on the work 35 (the time difference between time 1 and time 2) is the above-described plasma generation. Longer than time. Therefore, with respect to one of the laser beams, it is possible to suppress a problem that the energy use efficiency is lowered or the machining quality is lowered due to the plasma generated during the processing by the other laser beam. If the laser beams LA and LB are scanned over a distance corresponding to the pixel pitch in the main scanning direction on the work 35 (the time difference between time 1 and time 2) is shorter than the plasma generation time described above. In this case, the position in the main scanning direction of the irradiation area irradiated with the laser beams LA and LB may be shifted by two pixels or more.

[Modification 2]
Next, another modified example of the laser patterning apparatus in the present embodiment (hereinafter, this modified example is referred to as “modified example 2”) will be described.
In the above-described embodiment, the number of light sources that can be modulated independently from each other is two examples. However, the number of light sources that can be modulated independently from each other may be three or more. In the second modification, an example in which the number of light sources that can be modulated independently from each other is three or more will be described.

FIG. 10 is an explanatory diagram showing scanning lines on the workpiece 35 when the laser beams LA, LB, LC, and LD from the four light sources are scanned once in the second modification.
In FIG. 10, the spot shapes of the laser beams LA, LB, LC, and LD on the work 35 are shown as circles for convenience, and the numbers therein indicate the exposure time.
In the second modification, since the number of scanning lines that can be exposed (laser processing) by one scan is four, the number of scans can be ¼ of the number of scan lines necessary for laser processing of the workpiece 35. Further reduction of processing time can be realized.

Also in the second modification example, as in the first modification example, as shown in FIG. 10, the irradiation areas irradiated with the laser beams LA, LB, LC, and LD simultaneously are one pixel in the main scanning direction. There is a gap. In general, when the scanning speed of the laser beams LA and LB on the work 35 is v and the oscillation frequency is f, the pixel interval Int on the work 35 in the main scanning direction can be expressed by Int = v / f. Therefore, the deviation ΔDm in the main scanning direction position of the m-th (m ≧ 2) laser beams LB, LC, LD after the second laser beam with respect to the first first laser beam LA is expressed by the following conditional expression ( By satisfying 2), it is possible to prevent the irradiation areas on the workpiece irradiated with the laser beams LA, LB, LC, and LD from the four light sources from overlapping at the same time.
(ΔDm− (m−2) × v / f) ² ≧ BP ² −P ² (2)

FIG. 11 is an explanatory diagram showing a configuration of the irradiation optical system 10 in the second modification.
The example in FIG. 11 is an example in which the number of light sources that can be modulated independently from each other is three.
The first light source 41A, the second light source 41B, and the third light source 41C respectively emit laser beams LA, LB, and LC in a linearly polarized state with polarization directions different from each other by 90 °. The beam splitter 14 of the second modification transmits light having the polarization direction of the first laser light LA emitted from the first light source 41A and is emitted from the second light source 41B, as in the above-described embodiment. The light having the polarization direction of the second laser beam LB and the third laser beam LC emitted from the third light source 41C is reflected. Therefore, the first laser light LA emitted from the first light source 41 </ b> A passes through the beam splitter 14 and travels straight to the scanning optical system 20.

  On the other hand, the second laser light LB emitted from the second light source 41B is reflected toward the beam splitter 14 by the mirror surface of the mirror member 17, further reflected by the beam splitter 14, and scanned in parallel with the first laser light LA. Go to the optical system 20. Further, the third laser light LC emitted from the third light source 41C is reflected toward the beam splitter 14 by the other mirror surface of the mirror member 17, and further reflected by the beam splitter 14, and the first laser light LA and the first laser light LC are reflected. It goes to the scanning optical system 20 in parallel with the two laser beams LB. Each laser beam LA, LB, LC that has passed through the beam splitter 14 passes through the λ / 4 plate 16 and is converted into circularly polarized light.

What was demonstrated above is an example, and there exists an effect peculiar for every following aspect.
(Aspect A)
In an optical processing apparatus such as a laser patterning apparatus that scans processing light such as laser beams LA and LB to process an object to be processed such as the workpiece 35, the light output from the front light sources 41A and 41B is based on the processing data. It is characterized by having processing light generating means such as a light source driving unit 42 for generating a plurality of processing light LA and LB modulated independently.
Conventional optical processing devices perform modulation control such as controlling the timing of turning on and off the light emitted from the light source using the modulation signal generated from the processing data associated with the processing location on the workpiece. Do. Then, the processing object modulated in this way is scanned by the optical scanning means to process the processing object for each scanning line, and finally the processing object is processed according to the processing data. In the conventional optical processing apparatus, a single processing light modulated according to each processing location is scanned and all processing locations are processed sequentially, so that the processing light only finishes scanning over the entire processing location. Processing time is required.
According to this aspect, since processing is performed using a plurality of processing lights obtained by independently modulating light output from the light source by the processing light generation means, different processing locations (for example, a plurality of scanning lines, or Different locations on the same scanning line) can be processed at the same time, and the processing time can be shortened.
Moreover, according to this aspect, it is also possible to simultaneously scan the same location (the same location on the same scan line) with a plurality of processing lights that have been modulated differently. Therefore, it is possible to shorten the processing time for a processing process that conventionally requires a single processing light to scan the same scanning line twice or more with different modulations.
With such an embodiment, it is possible to increase the throughput without increasing the laser power by fine processing using a short pulse laser.

(Aspect B)
In the aspect A, the irradiation optical system 10 and the scanning optical system 20 that guide the plurality of processing lights to the processing object so that the plurality of processing lights are irradiated to different positions on the processing object. It has the light guide means.
According to this, different portions on the workpiece can be simultaneously processed by the processing light that has been modulated differently.

(Aspect C)
In the aspect B, the different part is a part having a different position in a direction (sub-scanning direction) orthogonal to a scanning direction (main scanning direction) of the plurality of processing lights.
According to this, it is possible to simultaneously process two or more scanning lines that are respectively processed by the processing light that has been modulated differently.

(Aspect D)
In the aspect B or C, the light guiding means applies the plurality of processing lights to the processing target so that the irradiation areas on the processing target irradiated with the plurality of processing lights do not overlap each other at the same time. It is characterized by guiding to things.
According to this, for one machining light, it is possible to suppress a problem that energy utilization efficiency is lowered or machining quality is lowered due to plasma generated during machining by other machining light.
If it is such an aspect, the pattern area processing of the ITO electrode used in a touch panel, silver paste processing, light guide plate processing, etc., the processing area ratio is high, the target processing depth is uniform, and there are many isolated points. It is possible to process an object to be processed at high speed and with high definition.

(Aspect E)
In the aspect D, the light guide means has P <BS, where P is a line interval of scanning lines by the plurality of processing lights, and BS is a spot diameter of the processing light on the processing object. In addition, the plurality of processing lights are guided to the processing object so that a deviation amount ΔD of the plurality of processing lights in the scanning direction on the processing object satisfies the following conditional expression (1). It is characterized by that.
BS ² ≦ P ² + ΔD ² (1)
According to this, even when the line interval P of the scanning lines is smaller than the spot diameter BS of each processing light, the irradiation areas on the processing target irradiated with the processing light do not overlap each other at the same time. be able to.
With such an aspect, it is possible to set the optimum distance between the main scanning directions of a plurality of beams so that the beams do not overlap at the same time by fine processing using a short pulse laser. As a result, it is possible to increase the throughput and improve the processing quality.

(Aspect F)
In any one of the above aspects B to E, the light guiding means causes the plurality of processing lights to enter the different positions of the same optical scanning member such as the polygon mirror 21 at the same time, thereby causing the plurality of processing lights to enter the plurality of processing lights. It is characterized by guiding to a processing object.
Thereby, a plurality of processing lights can be scanned with one optical scanning member.

(Aspect G)
In the aspect F, the light guiding means includes an optical member such as a beam splitter 14 that emits the plurality of processing lights incident from different directions to different positions of the optical scanning member.
This facilitates realization of a configuration in which a plurality of processing lights are scanned by one optical scanning member.

(Aspect H)
In the aspect G, the optical member is an optical member such as a beam splitter 14 that transmits the first processing light incident from one direction and reflects the second processing light incident from the other direction. And by displacing the optical member in a direction in which the second processing light is incident, an interval between the irradiation region of the first processing light and the irradiation region of the second processing light on the processing object is set. It is characterized by having an interval adjusting means such as a beam splitter moving unit 15 to be adjusted.
Thereby, the space | interval of the irradiation area | region of the 1st process light and the irradiation area | region of the 2nd process light on a workpiece can be adjusted easily.

(Aspect I)
In any one of the aspects A to H, the light source includes a plurality of laser light sources that emit processing light including pulsed laser light.
According to this, shortening of the processing time of laser processing is realizable.

(Aspect J)
In an optical processing method such as a laser processing method for processing a processing target such as a workpiece 35 by scanning processing light such as laser beams LA and LB, the light output from the light sources 41A and 41B is independent from each other based on the processing data. Then, a plurality of machining lights are generated, and the machining objects are irradiated with the plurality of machining lights.
According to this aspect, it is possible to perform processing with a plurality of processing lights obtained by modulating the light output from the light source independently of each other by the processing light generation means. Therefore, processing time can be shortened.

DESCRIPTION OF SYMBOLS 10 Irradiation optical system 12A, 12B Collimating lens 13A, 13B Aperture 14 Beam splitter 15 Beam splitter moving part 16 (lambda) / 4 board 20 Scan optical system 21 Polygon mirror 22 Scan lens 23 Cylindrical lens 24 Correction lens 25 Folding mirror 26 Synchronization detection sensor 30 Work transport unit 31 Table 32 Moving stage 33 Stage drive unit 35 Work 40 Light source unit 41A, 41B Light source 42 Light source drive unit 42A Control circuit unit 42B Light source drive circuit unit 43 Reference clock generation circuit 44 Pixel clock generation circuit 45 Light source modulation data generation circuit 46 Light Source Distribution Circuit 47 Exposure Timing Signal Generation Circuit 50 Control Unit

Japanese Patent No. 5632662

Claims (10)

In an optical processing apparatus that processes a processing object by scanning processing light,
An optical processing apparatus comprising processing light generation means for generating a plurality of processing lights obtained by independently modulating light output from a light source based on processing data. The optical processing apparatus according to claim 1,
An optical processing apparatus comprising light guide means for guiding the plurality of processing lights to the processing object so that the plurality of processing lights are irradiated to different portions on the processing object. The optical processing apparatus according to claim 2,
The said different location is a location where the position of the direction orthogonal to the scanning direction of these process light differs, The optical processing apparatus characterized by the above-mentioned. In the optical processing apparatus according to claim 2 or 3,
The light guiding means guides the plurality of processing lights to the processing target so that the irradiation areas on the processing target irradiated with the plurality of processing light do not overlap each other at the same time. Optical processing equipment. The optical processing apparatus according to claim 4,
The light guiding means is P <BS, where P is a line interval of scanning lines by the plurality of processing lights, and BS is a spot diameter on the processing object of the plurality of processing lights, and The plurality of processing lights are guided to the processing target so that a deviation amount ΔD in the scanning direction of the processing light on the processing target satisfies the following conditional expression (1). Optical processing equipment.
BS ² ≦ P ² + ΔD ² (1) The optical processing apparatus according to any one of claims 2 to 5,
The optical processing apparatus, wherein the light guiding means guides the plurality of processing lights to the processing object by causing the plurality of processing lights to simultaneously enter the different positions of the same optical scanning member. The optical processing apparatus according to claim 6,
The optical processing apparatus, wherein the light guiding means includes an optical member that emits the plurality of processing light incident from different directions to different positions of the optical scanning member. The optical processing apparatus according to claim 7,
The optical member is an optical member that transmits the first processing light incident from one direction and reflects the second processing light incident from the other direction,
The distance between the irradiation region of the first processing light and the irradiation region of the second processing light on the processing object is adjusted by displacing the optical member in the direction in which the second processing light is incident. An optical processing apparatus having an interval adjusting means. In the optical processing device according to any one of claims 1 to 8,
An optical processing apparatus comprising: a plurality of laser light sources that emit processing light composed of pulsed laser light as the light source. In an optical processing method for processing a processing object by scanning processing light,
A plurality of processed lights are generated by independently modulating the light output from the light source based on the processed data,
An optical processing method, wherein the processing object is irradiated with the plurality of processing lights.

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