JP2015506276A5 - - Google Patents

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Publication number
JP2015506276A5
JP2015506276A5 JP2014549222A JP2014549222A JP2015506276A5 JP 2015506276 A5 JP2015506276 A5 JP 2015506276A5 JP 2014549222 A JP2014549222 A JP 2014549222A JP 2014549222 A JP2014549222 A JP 2014549222A JP 2015506276 A5 JP2015506276 A5 JP 2015506276A5
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JP
Japan
Prior art keywords
laser
passages
inner diameter
diameter
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014549222A
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English (en)
Japanese (ja)
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JP2015506276A (ja
JP6433295B2 (ja
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Publication date
Priority claimed from US13/331,472 external-priority patent/US9289858B2/en
Application filed filed Critical
Publication of JP2015506276A publication Critical patent/JP2015506276A/ja
Publication of JP2015506276A5 publication Critical patent/JP2015506276A5/ja
Application granted granted Critical
Publication of JP6433295B2 publication Critical patent/JP6433295B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014549222A 2011-12-20 2012-12-19 硬化したシリコン中に微少なテーパー付の穴をあける方法 Expired - Fee Related JP6433295B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/331,472 US9289858B2 (en) 2011-12-20 2011-12-20 Drilling holes with minimal taper in cured silicone
US13/331,472 2011-12-20
PCT/US2012/070470 WO2013096372A1 (en) 2011-12-20 2012-12-19 Drilling holes with minimal taper in cured silicone

Publications (3)

Publication Number Publication Date
JP2015506276A JP2015506276A (ja) 2015-03-02
JP2015506276A5 true JP2015506276A5 (enExample) 2016-02-12
JP6433295B2 JP6433295B2 (ja) 2018-12-05

Family

ID=48609323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014549222A Expired - Fee Related JP6433295B2 (ja) 2011-12-20 2012-12-19 硬化したシリコン中に微少なテーパー付の穴をあける方法

Country Status (6)

Country Link
US (1) US9289858B2 (enExample)
JP (1) JP6433295B2 (enExample)
KR (2) KR102240327B1 (enExample)
CN (1) CN104010760B (enExample)
TW (1) TWI623368B (enExample)
WO (1) WO2013096372A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012111771B4 (de) * 2012-12-04 2020-12-03 Ewag Ag Verfahren zur Bearbeitung eines Werkstücks unter Verwendung einer Laserbearbeitungsvorrichtung zur Herstellung eines Schneidwerkzeugs
JP2014130962A (ja) * 2012-12-28 2014-07-10 Ibiden Co Ltd キャビティの形成方法、キャビティの形成装置、プログラム、配線板の製造方法、及び配線板
US9414498B2 (en) * 2013-09-20 2016-08-09 Coherent, Inc. Via-hole drilling in a printed circuit board using a carbon monoxide laser
US9950392B2 (en) 2014-03-04 2018-04-24 Rohr, Inc. Forming one or more apertures in a fiber-reinforced composite object with a laser
GB2529153A (en) * 2014-08-06 2016-02-17 Bae Systems Plc Substrate manufacture
US10274806B2 (en) 2015-11-06 2019-04-30 Coherent, Inc. Pulse-dividing method and apparatus for a pulsed carbon monoxide laser
US10423047B2 (en) 2016-07-27 2019-09-24 Coherent, Inc. Laser machining method and apparatus
US10592006B2 (en) 2017-01-13 2020-03-17 Microsoft Technology Licensing, Llc Pattern for increased coefficient of friction of input devices
GB2574111A (en) 2018-04-05 2019-11-27 British Polythene Ltd Improvements in or relating to container carriers
CN113523613B (zh) * 2020-04-29 2023-10-24 中国科学院宁波材料技术与工程研究所 激光加工锥孔的装置和方法
JP7427248B2 (ja) * 2020-07-21 2024-02-05 Uht株式会社 レーザー加工方法及びレーザー加工装置
CN113441852B (zh) * 2021-06-24 2022-07-19 中国科学院西安光学精密机械研究所 一种激光螺旋扫描盲孔制造方法
DE102021005297A1 (de) 2021-10-25 2023-04-27 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zur Erzeugung angesenkter Löcher
CN114833472A (zh) * 2022-05-26 2022-08-02 苏州思萃声光微纳技术研究所有限公司 用于航空发动机火焰筒的无锥度冷却气膜孔激光加工方法
DE102022124202A1 (de) * 2022-09-21 2024-03-21 TRUMPF Werkzeugmaschinen SE + Co. KG Stanz-Laser-Kombinationsverfahren und Stanz-Laser-Kombinationsmaschine zum Bearbeiten eines Werkstücks sowie Computerprogramm und computerlesbares Speichermedium
CN116833594A (zh) * 2023-08-01 2023-10-03 泰州职业技术学院 雾化器金属基片的微锥孔激光加工方法
CN117444429A (zh) * 2023-12-25 2024-01-26 西安晟光硅研半导体科技有限公司 一种基于微射流技术螺旋加工孔的工艺方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227965B (en) 1988-10-12 1993-02-10 Rolls Royce Plc Apparatus for drilling a shaped hole in a workpiece
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5841099A (en) * 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5731047A (en) 1996-11-08 1998-03-24 W.L. Gore & Associates, Inc. Multiple frequency processing to improve electrical resistivity of blind micro-vias
DE19741029A1 (de) 1997-09-18 1999-04-08 Bosch Gmbh Robert Optische Vorrichtung zum Bohren mittels Laserstrahls
US6275250B1 (en) * 1998-05-26 2001-08-14 Sdl, Inc. Fiber gain medium marking system pumped or seeded by a modulated laser diode source and method of energy control
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
US6720567B2 (en) * 2001-01-30 2004-04-13 Gsi Lumonics Corporation Apparatus and method for focal point control for laser machining
US8497450B2 (en) 2001-02-16 2013-07-30 Electro Scientific Industries, Inc. On-the fly laser beam path dithering for enhancing throughput
DE10125397B4 (de) 2001-05-23 2005-03-03 Siemens Ag Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl
US6811888B2 (en) 2001-09-07 2004-11-02 Siemens Vdo Automotive Corporation Anti-spatter coating for laser machining
DE10145184B4 (de) 2001-09-13 2005-03-10 Siemens Ag Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske
CN1295052C (zh) * 2001-11-30 2007-01-17 松下电器产业株式会社 激光铣削方法及系统
US6627844B2 (en) 2001-11-30 2003-09-30 Matsushita Electric Industrial Co., Ltd. Method of laser milling
US6897405B2 (en) 2001-11-30 2005-05-24 Matsushita Electric Industrial Co., Ltd. Method of laser milling using constant tool path algorithm
DE10207288B4 (de) * 2002-02-21 2005-05-04 Newson Engineering Nv Verfahren zum Bohren von Löchern mittels eines Laserstrahls in einem Substrat, insbesondere in einem elektrischen Schaltungsubstrat
US20040017430A1 (en) * 2002-07-23 2004-01-29 Yosuke Mizuyama Laser processing method and laser processing apparatus
US6749285B2 (en) * 2002-07-25 2004-06-15 Matsushita Electric Industrial Co., Ltd. Method of milling repeatable exit holes in ink-jet nozzles
CN100374000C (zh) * 2002-10-04 2008-03-05 电子科学工业公司 在小型元件载体的弹性遮罩中形成尺寸精确的狭槽的方法
GB2395157B (en) 2002-11-15 2005-09-07 Rolls Royce Plc Laser driliing shaped holes
JP2004243404A (ja) 2003-02-17 2004-09-02 Internatl Business Mach Corp <Ibm> 穴形成方法および穴形成装置
US7057133B2 (en) * 2004-04-14 2006-06-06 Electro Scientific Industries, Inc. Methods of drilling through-holes in homogenous and non-homogenous substrates
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
KR101164847B1 (ko) * 2005-07-06 2012-07-11 미쓰보시 다이야몬도 고교 가부시키가이샤 취성재료용 스크라이빙 휠, 및 이를 이용한 스크라이브 방법, 스크라이브 장치 및 스크라이브 공구
US7884315B2 (en) 2006-07-11 2011-02-08 Apple Inc. Invisible, light-transmissive display system
JP2007207898A (ja) * 2006-01-31 2007-08-16 Arai Pump Mfg Co Ltd キャリアプレートおよびその製造方法
JP2007268576A (ja) * 2006-03-31 2007-10-18 Hitachi Via Mechanics Ltd レーザ加工方法
US8394301B2 (en) 2006-06-02 2013-03-12 Electro Scientific Industries, Inc. Process for forming panel with an optically transmissive portion and products related thereto
US7968820B2 (en) 2006-06-02 2011-06-28 Electro Scientific Industries, Inc. Method of producing a panel having an area with light transmissivity
US8481887B2 (en) * 2007-05-03 2013-07-09 Electro Scientific Industries, Inc. Method for machining tapered micro holes
US8237080B2 (en) * 2008-03-27 2012-08-07 Electro Scientific Industries, Inc Method and apparatus for laser drilling holes with Gaussian pulses
US8526473B2 (en) 2008-03-31 2013-09-03 Electro Scientific Industries Methods and systems for dynamically generating tailored laser pulses
US8093532B2 (en) 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
US8119949B2 (en) * 2008-11-26 2012-02-21 Honeywell International Inc. Laser cutting shaped holes by trepanning on the fly
DE102009006179B4 (de) * 2009-01-26 2010-12-30 Continental Automotive Gmbh Schaltungsanordnung zur Ansteuerung eines Einspritzventils
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing

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