JP2013529137A5 - - Google Patents

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Publication number
JP2013529137A5
JP2013529137A5 JP2013509220A JP2013509220A JP2013529137A5 JP 2013529137 A5 JP2013529137 A5 JP 2013529137A5 JP 2013509220 A JP2013509220 A JP 2013509220A JP 2013509220 A JP2013509220 A JP 2013509220A JP 2013529137 A5 JP2013529137 A5 JP 2013529137A5
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JP
Japan
Prior art keywords
pulse
laser
pulses
laser pulses
energy
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JP2013509220A
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English (en)
Japanese (ja)
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JP2013529137A (ja
JP6073780B2 (ja
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Priority claimed from PCT/US2011/035207 external-priority patent/WO2011140229A1/en
Publication of JP2013529137A publication Critical patent/JP2013529137A/ja
Publication of JP2013529137A5 publication Critical patent/JP2013529137A5/ja
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Publication of JP6073780B2 publication Critical patent/JP6073780B2/ja
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JP2013509220A 2010-05-04 2011-05-04 連続レーザパルス列を用いて穿孔する方法及び装置 Active JP6073780B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33124210P 2010-05-04 2010-05-04
US61/331,242 2010-05-04
PCT/US2011/035207 WO2011140229A1 (en) 2010-05-04 2011-05-04 Method and apparatus for drilling using a series of laser pulses

Publications (3)

Publication Number Publication Date
JP2013529137A JP2013529137A (ja) 2013-07-18
JP2013529137A5 true JP2013529137A5 (enExample) 2014-06-05
JP6073780B2 JP6073780B2 (ja) 2017-02-01

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JP2013509220A Active JP6073780B2 (ja) 2010-05-04 2011-05-04 連続レーザパルス列を用いて穿孔する方法及び装置

Country Status (6)

Country Link
US (1) US8816246B2 (enExample)
JP (1) JP6073780B2 (enExample)
KR (1) KR101866579B1 (enExample)
CN (1) CN102939184A (enExample)
TW (2) TWI611857B (enExample)
WO (1) WO2011140229A1 (enExample)

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KR102214508B1 (ko) 2014-04-28 2021-02-09 삼성전자 주식회사 적층형 반도체 패키지의 제조방법
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JP6455021B2 (ja) * 2014-08-22 2019-01-23 オムロン株式会社 接合構造体の製造方法
JP6417786B2 (ja) * 2014-08-22 2018-11-07 オムロン株式会社 接合構造体の製造方法
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JP6451370B2 (ja) * 2015-02-09 2019-01-16 オムロン株式会社 接合構造体の製造方法
JP6451421B2 (ja) * 2015-03-12 2019-01-16 オムロン株式会社 接合構造体の製造方法
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US10615044B1 (en) * 2018-10-18 2020-04-07 Asm Technology Singapore Pte Ltd Material cutting using laser pulses
CN109648192A (zh) * 2018-12-10 2019-04-19 成都莱普科技有限公司 激光钻孔机能量控制方法
DE102018221365A1 (de) * 2018-12-10 2020-06-10 Trumpf Laser Gmbh Verfahren zum Abtragen von Material von einem Werkstück und Laserbearbeitungsanlage
CN111438447A (zh) * 2018-12-29 2020-07-24 东泰高科装备科技有限公司 一种薄膜开孔方法、太阳能电池封装膜及开孔方法
US12304001B2 (en) * 2019-04-02 2025-05-20 Asmpt Singapore Pte. Ltd. Optimised laser cutting
JP7421951B2 (ja) * 2020-02-26 2024-01-25 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
DE102020106734A1 (de) * 2020-03-12 2021-09-16 Precitec Gmbh & Co. Kg Verfahren und Vorrichtung zum Einstechen in ein Werkstück mittels eines Laserstrahls
CN112570897B (zh) * 2020-11-17 2023-03-24 华东师范大学重庆研究院 飞秒脉冲簇产生方法及石英微流控芯片制造装置
KR102477657B1 (ko) * 2021-03-18 2022-12-14 주식회사 이오테크닉스 레이저 드릴링 방법
JP7724443B2 (ja) * 2021-06-16 2025-08-18 パナソニックＩｐマネジメント株式会社 素子チップの製造方法、および、基板の加工方法
JP7726752B2 (ja) * 2021-11-16 2025-08-20 大船企業日本株式会社 プリント基板における炭酸ガスレーザによるホール加工方法
CN114769847A (zh) * 2022-05-25 2022-07-22 英诺激光科技股份有限公司 一种激光精密加工设备及激光精密加工方法
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CN117483983B (zh) * 2023-11-08 2024-07-23 武汉华日精密激光股份有限公司 一种群孔激光加工方法
CN119368947A (zh) * 2024-11-26 2025-01-28 英诺激光科技股份有限公司 一种激光钻孔方法和系统

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