CN102939184A - 用于使用激光脉冲序列钻孔的方法和装置 - Google Patents

用于使用激光脉冲序列钻孔的方法和装置 Download PDF

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Publication number
CN102939184A
CN102939184A CN2011800220237A CN201180022023A CN102939184A CN 102939184 A CN102939184 A CN 102939184A CN 2011800220237 A CN2011800220237 A CN 2011800220237A CN 201180022023 A CN201180022023 A CN 201180022023A CN 102939184 A CN102939184 A CN 102939184A
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CN
China
Prior art keywords
pulse
laser
sequence
energy
group
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Pending
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CN2011800220237A
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English (en)
Chinese (zh)
Inventor
理察·慕里森
马修·瑞考
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ESI Pyrophotonics Lasers Inc
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ESI Pyrophotonics Lasers Inc
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Publication of CN102939184A publication Critical patent/CN102939184A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN2011800220237A 2010-05-04 2011-05-04 用于使用激光脉冲序列钻孔的方法和装置 Pending CN102939184A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33124210P 2010-05-04 2010-05-04
US61/331,242 2010-05-04
PCT/US2011/035207 WO2011140229A1 (en) 2010-05-04 2011-05-04 Method and apparatus for drilling using a series of laser pulses

Publications (1)

Publication Number Publication Date
CN102939184A true CN102939184A (zh) 2013-02-20

Family

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Family Applications (1)

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CN2011800220237A Pending CN102939184A (zh) 2010-05-04 2011-05-04 用于使用激光脉冲序列钻孔的方法和装置

Country Status (6)

Country Link
US (1) US8816246B2 (enExample)
JP (1) JP6073780B2 (enExample)
KR (1) KR101866579B1 (enExample)
CN (1) CN102939184A (enExample)
TW (2) TWI647045B (enExample)
WO (1) WO2011140229A1 (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106536169A (zh) * 2014-08-22 2017-03-22 欧姆龙株式会社 接合结构体的制造方法以及接合结构体
CN106573342A (zh) * 2014-08-22 2017-04-19 欧姆龙株式会社 接合结构体的制造方法以及接合结构体
CN107414323A (zh) * 2017-06-09 2017-12-01 西安交通大学 评估正弦调制影响高反射率材料激光焊能量耦合行为的方法
CN107520545A (zh) * 2017-09-01 2017-12-29 大族激光科技产业集团股份有限公司 激光钻孔方法
CN109648192A (zh) * 2018-12-10 2019-04-19 成都莱普科技有限公司 激光钻孔机能量控制方法
CN111085786A (zh) * 2018-10-18 2020-05-01 先进科技新加坡有限公司 使用激光脉冲进行的材料切割
CN111438447A (zh) * 2018-12-29 2020-07-24 东泰高科装备科技有限公司 一种薄膜开孔方法、太阳能电池封装膜及开孔方法
CN111496386A (zh) * 2018-12-10 2020-08-07 通快激光有限责任公司 用于从工件剥除材料的方法和激光加工设备
CN111805094A (zh) * 2019-04-02 2020-10-23 先进科技新加坡有限公司 优化的激光切割
CN114769847A (zh) * 2022-05-25 2022-07-22 英诺激光科技股份有限公司 一种激光精密加工设备及激光精密加工方法
CN115210974A (zh) * 2020-02-26 2022-10-18 浜松光子学株式会社 激光加工装置及激光加工方法
CN115279540A (zh) * 2020-03-12 2022-11-01 普雷茨特两合公司 用于借助激光束刺入到工件中的方法和设备
CN117483983A (zh) * 2023-11-08 2024-02-02 武汉华日精密激光股份有限公司 一种群孔激光加工方法
CN119368947A (zh) * 2024-11-26 2025-01-28 英诺激光科技股份有限公司 一种激光钻孔方法和系统

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WO2011140229A1 (en) * 2010-05-04 2011-11-10 Esi-Pyrophotonics Lasers Inc. Method and apparatus for drilling using a series of laser pulses
CN103582329B (zh) * 2012-07-24 2016-08-03 富泰华工业（深圳）有限公司 壳体及其制造方法
DE102013004679B4 (de) * 2013-03-19 2017-11-23 Skybrain Vermögensverwaltung GmbH Vorrichtung und Verfahren zum Bearbeiten von Leiterplatten
JP6362130B2 (ja) * 2013-04-26 2018-07-25 ビアメカニクス株式会社 レーザ加工方法及びレーザ加工装置
US9808885B2 (en) * 2013-09-04 2017-11-07 Siemens Energy, Inc. Method for forming three-dimensional anchoring structures on a surface
JP6320799B2 (ja) * 2014-03-07 2018-05-09 住友重機械工業株式会社 半導体装置の製造方法
KR102214508B1 (ko) 2014-04-28 2021-02-09 삼성전자 주식회사 적층형 반도체 패키지의 제조방법
DE102014108133B4 (de) * 2014-06-10 2016-03-03 Jenoptik Automatisierungstechnik Gmbh Verfahren zur Herstellung einer Schwächungslinie in ein Abdeckelement durch Materialabtrag
KR102356592B1 (ko) 2014-11-03 2022-01-28 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
JP6451370B2 (ja) * 2015-02-09 2019-01-16 オムロン株式会社 接合構造体の製造方法
JP6451421B2 (ja) * 2015-03-12 2019-01-16 オムロン株式会社 接合構造体の製造方法
US20160279737A1 (en) * 2015-03-26 2016-09-29 Pratt & Whitney Canada Corp. Laser drilling through multi-layer components
US20210069014A1 (en) * 2017-05-06 2021-03-11 Novaliq Gmbh Drop dispenser
DE102017210217A1 (de) * 2017-06-20 2018-12-20 Bundesdruckerei Gmbh Durchkontaktierung in einer beidseitig bedruckten Trägerfolie
WO2019165041A1 (en) * 2018-02-23 2019-08-29 First Solar, Inc. Photovoltaic devices with narrow scribes and methods and systems for forming the same
CN112570897B (zh) * 2020-11-17 2023-03-24 华东师范大学重庆研究院 飞秒脉冲簇产生方法及石英微流控芯片制造装置
KR102477657B1 (ko) * 2021-03-18 2022-12-14 주식회사 이오테크닉스 레이저 드릴링 방법
JP7724443B2 (ja) * 2021-06-16 2025-08-18 パナソニックＩｐマネジメント株式会社 素子チップの製造方法、および、基板の加工方法
JP7726752B2 (ja) * 2021-11-16 2025-08-20 大船企業日本株式会社 プリント基板における炭酸ガスレーザによるホール加工方法
US20240033857A1 (en) * 2022-07-28 2024-02-01 Toyota Motor Engineering & Manufacturing North America, Inc. System and method for cracking a connecting rod

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JPH10323781A (ja) * 1997-05-23 1998-12-08 Amada Co Ltd レーザ加工方法
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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106573342A (zh) * 2014-08-22 2017-04-19 欧姆龙株式会社 接合结构体的制造方法以及接合结构体
US10471660B2 (en) 2014-08-22 2019-11-12 Omron Corporation Manufacturing method of bonding structure and bonding structure
CN106536169A (zh) * 2014-08-22 2017-03-22 欧姆龙株式会社 接合结构体的制造方法以及接合结构体
CN107414323A (zh) * 2017-06-09 2017-12-01 西安交通大学 评估正弦调制影响高反射率材料激光焊能量耦合行为的方法
CN107520545A (zh) * 2017-09-01 2017-12-29 大族激光科技产业集团股份有限公司 激光钻孔方法
CN107520545B (zh) * 2017-09-01 2019-06-21 大族激光科技产业集团股份有限公司 激光钻孔方法
CN111085786A (zh) * 2018-10-18 2020-05-01 先进科技新加坡有限公司 使用激光脉冲进行的材料切割
CN111496386B (zh) * 2018-12-10 2023-09-08 通快激光有限责任公司 用于从工件剥除材料的方法和激光加工设备
CN109648192A (zh) * 2018-12-10 2019-04-19 成都莱普科技有限公司 激光钻孔机能量控制方法
CN111496386A (zh) * 2018-12-10 2020-08-07 通快激光有限责任公司 用于从工件剥除材料的方法和激光加工设备
CN111438447A (zh) * 2018-12-29 2020-07-24 东泰高科装备科技有限公司 一种薄膜开孔方法、太阳能电池封装膜及开孔方法
CN111805094A (zh) * 2019-04-02 2020-10-23 先进科技新加坡有限公司 优化的激光切割
CN115210974A (zh) * 2020-02-26 2022-10-18 浜松光子学株式会社 激光加工装置及激光加工方法
CN115210974B (zh) * 2020-02-26 2025-06-13 浜松光子学株式会社 激光加工装置及激光加工方法
CN115279540A (zh) * 2020-03-12 2022-11-01 普雷茨特两合公司 用于借助激光束刺入到工件中的方法和设备
CN114769847A (zh) * 2022-05-25 2022-07-22 英诺激光科技股份有限公司 一种激光精密加工设备及激光精密加工方法
CN117483983A (zh) * 2023-11-08 2024-02-02 武汉华日精密激光股份有限公司 一种群孔激光加工方法
CN117483983B (zh) * 2023-11-08 2024-07-23 武汉华日精密激光股份有限公司 一种群孔激光加工方法
CN119368947A (zh) * 2024-11-26 2025-01-28 英诺激光科技股份有限公司 一种激光钻孔方法和系统

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Publication number Publication date
WO2011140229A1 (en) 2011-11-10
TWI647045B (zh) 2019-01-11
KR20130069593A (ko) 2013-06-26
US20120111841A1 (en) 2012-05-10
US8816246B2 (en) 2014-08-26
KR101866579B1 (ko) 2018-06-11
JP2013529137A (ja) 2013-07-18
TWI611857B (zh) 2018-01-21
TW201634165A (zh) 2016-10-01
JP6073780B2 (ja) 2017-02-01
TW201223677A (en) 2012-06-16

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